INTEGRATED CIRCUITS 80C31/80C51/87C51 CMOS single-chip 8-bit microcontrollers Product specification IC20 Data Handbook 1996 Aug 16 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers DESCRIPTION 80C31/80C51/87C51 PIN CONFIGURATIONS The Philips 80C31/80C51/87C51 is a high-performance microcontroller fabricated with Philips high-density CMOS technology. The CMOS 8XC51 is functionally compatible with the NMOS 8031/8051 microcontrollers. The Philips CMOS technology combines the high speed and density characteristics of HMOS with the low power attributes of CMOS. Philips epitaxial substrate minimizes latch-up sensitivity. The 8XC51 contains a 4k × 8 ROM (80C51) EPROM (87C51), a 128 × 8 RAM, 32 I/O lines, two 16-bit counter/timers, a five-source, two-priority level nested interrupt structure, a serial I/O port for either multi-processor communications, I/O expansion or full duplex UART, and on-chip oscillator and clock circuits. P1.0 1 40 V CC P1.1 2 39 P0.0/AD0 P1.2 3 38 P0.1/AD1 P1.3 4 37 P0.2/AD2 P1.4 5 36 P0.3/AD3 P1.5 6 35 P0.4/AD4 P1.6 7 34 P0.5/AD5 P1.7 8 33 P0.6/AD6 RST 9 In addition, the device has two software selectable modes of power reduction—idle mode and power-down mode. The idle mode freezes the CPU while allowing the RAM, timers, serial port, and interrupt system to continue functioning. The power-down mode saves the RAM contents but freezes the oscillator, causing all other chip functions to be inoperative. RxD/P3.0 10 TxD/P3.1 11 CERAMIC AND PLASTIC DUAL IN-LINE PACKAGE 32 P0.7/AD7 31 EA/VPP 30 ALE/PROG INT0/P3.2 12 29 PSEN INT1/P3.3 13 28 P2.7/A15 T0/P3.4 14 27 P2.6/A14 T1/P3.5 15 26 P2.5/A13 WR/P3.6 16 25 P2.4/A12 RD/P3.7 17 24 P2.3/A11 – 4k × 8 EPROM (87C51) XTAL2 18 23 P2.2/A10 – ROMless (80C31) XTAL1 19 22 P2.1/A9 20 21 P2.0/A8 FEATURES • 8031/8051 compatible – 4k × 8 ROM (80C51) – 128 × 8 RAM VSS – Two 16-bit counter/timers – Full duplex serial channel 6 – Boolean processor • Memory addressing capability 1 40 7 39 – 64k ROM and 64k RAM CERAMIC AND PLASTIC LEAD CHIP CARRIER • Power control modes: – Idle mode – Power-down mode 17 • CMOS and TTL compatible • Five speed ranges at VCC = 5V 18 – 12MHz 29 28 34 44 – 16MHz – 24MHz 1 – 33MHz • Five package styles • Extended temperature ranges • OTP package available 33 PLASTIC QUAD FLAT PACK 11 23 12 22 SU00001 SEE PAGE 3 FOR QFP AND LCC PIN FUNCTIONS. 1996 Aug 16 2 853–0169 17187 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers CERAMIC AND PLASTIC LEADED CHIP CARRIER PIN FUNCTIONS 6 1 80C31/80C51/87C51 PLASTIC QUAD FLAT PACK PIN FUNCTIONS 44 40 7 34 39 1 33 LCC PQFP 17 11 29 18 28 12 Pin 16 17 18 Function P3.4/T0 P3.5/T1 P3.6/WR Pin 31 32 33 P1.2 P1.3 P1.4 P1.5 19 20 21 22 P3.7/RD XTAL2 XTAL1 VSS 34 35 36 37 8 9 10 11 P1.6 P1.7 RST P3.0/RxD 23 24 25 26 NC* P2.0/A8 P2.1/A9 P2.2/A10 12 13 14 15 NC* P3.1/TxD P3.2/INT0 P3.3/INT1 27 28 29 30 P2.3/A11 P2.4/A12 P2.5/A13 P2.6/A14 Pin 1 2 3 4 5 6 7 Function NC* P1.0 P1.1 * DO NOT CONNECT Function P2.7/A15 PSEN ALE/PROG Function P1.5 P1.6 P1.7 Pin 16 17 18 Function VSS NC* P2.0/A8 Pin 31 32 33 Function P0.6/AD6 P0.5/AD5 P0.4/AD4 NC* EA/VPP P0.7/AD7 P0.6/AD6 4 5 6 7 RST P3.0/RxD NC* P3.1/TxD 19 20 21 22 P2.1/A9 P2.2/A10 P2.3/A11 P2.4/A12 34 35 36 37 P0.3/AD3 P0.2/AD2 P0.1/AD1 P0.0/AD0 38 39 40 41 P0.5/AD5 P0.4/AD4 P0.3/AD3 P0.2/AD2 8 9 10 11 P3.2/INT0 P3.3/INT1 P3.4/T0 P3.5/T1 23 24 25 26 P2.5/A13 P2.6/A14 P2.7/A15 PSEN 38 39 40 41 VCC NC* P1.0 P1.1 42 43 44 P0.1/AD1 P0.0/AD0 VCC 12 13 14 15 P3.6/WR P3.7/RD XTAL2 XTAL1 27 28 29 30 ALE/PROG NC* EA/VPP P0.7/AD7 42 43 44 P1.2 P.13 P1.4 * DO NOT CONNECT LOGIC SYMBOL VSS PORT 0 XTAL1 ADDRESS AND DATA BUS PORT 1 PORT 2 RxD TxD INT0 INT1 T0 T1 WR RD PORT 3 SECONDARY FUNCTIONS XTAL2 RST EA/VPP PSEN ALE/PROG ADDRESS BUS SU00004 1996 Aug 16 22 Pin 1 2 3 SU00002 VCC 23 3 SU00003 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 ORDERING INFORMATION PHILIPS NORTH AMERICA Freq MHz DRAWING NUMBER SC87C51CCF40 0590B 0 to +70, Ceramic Dual In-line Package, UV 3.5 to 12 SC87C51CCK44 1472A 0 to +70, Ceramic Leaded Chip Carrier, UV 3.5 to 12 SC87C51CCN40 SOT129-1 SC80C31BCCN40 SC80C51BCCN40 SOT129-1 0 to +70, Plastic Dual In-line Package, OTP 3.5 to 12 SC87C51CCA44 ROMless DRAWING NUMBER TEMPERATURE RANGE oC AND PACKAGE1 EPROM ROM SOT187-2 SC80C31BCCA44 SC80C51BCCA44 SOT187-2 0 to +70, Plastic Leaded Chip Carrier, OTP 3.5 to 12 SC87C51CCB44 SOT307-2 SC80C31BCCB44 SC80C51BCCB44 SOT307-2 0 to +70, Plastic Quad Flat Pack, OTP 3.5 to 12 SC87C51ACF40 0590B –40 to +85, Ceramic Dual In-line Package, UV 3.5 to 12 SC87C51ACN40 SOT129-1 SC80C31BACN40 SC80C51BACN40 SOT129-1 –40 to +85, Plastic Dual In-line Package, OTP 3.5 to 12 SC87C51ACA44 SOT187-2 SC80C31BACA44 SC80C51BACA44 SOT187-2 –40 to +85, Plastic Leaded Chip Carrier, OTP 3.5 to 12 SC87C51ACB44 SOT307-2 SC80C31BACB44 SC80C51BACB44 SOT307-2 –40 to +85, Plastic Quad Flat Pack, OTP 3.5 to 12 SC87C51CGF40 0590B 0 to +70, Ceramic Dual In-line Package, UV 3.5 to 16 SC87C51CGK44 1472A 0 to +70, Ceramic Leaded Chip Carrier, UV 3.5 to 16 SC87C51CGN40 SOT129-1 SC80C31BCGN40 SC80C51BCGN40 SOT129-1 0 to +70, Plastic Dual In-line Package, OTP 3.5 to 16 SC87C51CGA44 SOT187-2 SC80C31BCGA44 SC80C51BCGA44 SOT187-2 0 to +70, Plastic Leaded Chip Carrier, OTP 3.5 to 16 SC87C51CGB44 SOT307-2 SC80C31BCGB44 SC80C51BCGB44 SOT307-2 0 to +70, Plastic Quad Flat Pack, OTP 3.5 to 16 SC87C51AGF40 0590B –40 to +85, Ceramic Dual In-line Package, UV 3.5 to 16 SC87C51AGN40 SOT129-1 SC80C31BAGN40 SC80C51BAGN40 SOT129-1 –40 to +85, Plastic Dual In-line Package, OTP 3.5 to 16 SC87C51AGA44 SOT187-2 SC80C31BAGA44 SC80C51BAGA44 SOT187-2 –40 to +85, Plastic Leaded Chip Carrier, OTP 3.5 to 16 SC87C51AGB44 SOT307-2 SC80C31BAGB44 SC80C51BAGB44 SOT307-2 –40 to +85, Plastic Quad Flat Pack, OTP 3.5 to 16 SC87C51CPF40 0590B 0 to +70, Ceramic Dual In-line Package, UV 3.5 to 24 SC87C51CPK44 1472A 0 to +70, Ceramic Leaded Chip Carrier, UV 3.5 to 24 SC87C51CPN40 SOT129-1 SC80C31BCPN40 SC80C51BCPN40 SOT129-1 0 to +70, Plastic Dual In-line Package, OTP 3.5 to 24 SC87C51CPA44 SOT187-2 SC80C31BCPA44 SC80C51BCPA44 SOT187-2 0 to +70, Plastic Leaded Chip Carrier, OTP 3.5 to 24 SC87C51APF40 0590B SC87C51APN40 SOT129-1 SC80C31BAPN40 SC80C51BAPN40 SOT129-1 –40 to +85, Plastic Dual In-line Package, OTP 3.5 to 24 SC87C51APA44 SOT187-2 SC80C31BAPA44 SC80C51BAPA44 SOT187-2 –40 to +85, Plastic Leaded Chip Carrier, OTP 3.5 to 24 SC87C51CYF40 0590B 0 to +70, Ceramic Dual In-line Package, UV 3.5 to 33 SC87C51CYK44 1472A 0 to +70, Ceramic Leaded Chip Carrier, UV 3.5 to 33 SC87C51CYN40 SOT129-1 SC80C31BCYN40 SC80C51BCYN40 SOT129-1 0 to +70, Plastic Dual In-line Package, OTP 3.5 to 33 SC87C51CYA44 SOT187-2 SC80C31BCYA44 SC80C51BCYA44 SOT187-2 0 to +70, Plastic Leaded Chip Carrier, OTP 3.5 to 33 –40 to +85, Ceramic Dual In-line Package, UV 1. OTP = One Time Programmable EPROM. UV = UV Erasable EPROM 2. SOT311 replaced by SOT307-2. 1996 Aug 16 4 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 ORDERING INFORMATION (Continued) PHILIPS ROMless ROMless (ORDER NUMBER) (MARKING NUMBER) PCB80C31-2 N PCB80C31BH2-12P PCB80C31-2 A ROM TEMPERATURE RANGE oC AND PACKAGE1 Freq MHz SOT129-1 0 to +70, Plastic Dual In-line Package, OTP 0.5 to 12 PCB80C31BH2-12WP PCB80C51BH-2WP SOT187-2 0 to +70, Plastic Leaded Chip Carrier, OTP 0.5 to 12 PCB80C31BH2-12H PCB80C51BH-2H SOT307-22 0 to +70, Plastic Quad Flat Pack, OTP 0.5 to 12 PCB80C31-3 N PCB80C31BH3-16P PCB80C51BH-3P SOT129-1 0 to +70, Plastic Dual In-line Package, OTP 1.2 to 16 PCB80C31-3 A PCB80C31BH3-16WP PCB80C51BH-3WP SOT187-2 0 to +70, Plastic Leaded Chip Carrier, OTP 1.2 to 16 PCB80C31BH3-16H PCB80C51BH-3H SOT307-22 0 to +70, Plastic Quad Flat Pack, OTP 1.2 to 16 PCF80C31-3 N PCF80C31BH3-16P PCF80C51BH-3P SOT129-1 –40 to +85, Plastic Dual In-line Package, OTP 1.2 to 16 PCF80C31-3 A PCF80C31BH3-16WP PCF80C51BH-3WP SOT187-2 –40 to +85, Plastic Leaded Chip Carrier, OTP 1.2 to 16 PCF80C31BH3-16H PCF80C51BH-3H SOT307-22 –40 to +85, Plastic Quad Flat Pack, OTP 1.2 to 16 PCA80C31BH3-16P PCA80C51BH-3P SOT129-1 –40 to +125, Plastic Dual In-line Package 1.2 to 16 PCA80C31BH3-16WP PCA80C51BH-3WP SOT187-2 –40 to +125, Plastic Leaded Chip Carrier 1.2 to 16 PCB80C31-4 N PCB80C31BH4-24P SOT129-1 0 to +70, Plastic Dual In-line Package, OTP 1.2 to 24 PCB80C31-4 A PCB80C31BH4-24WP PCB80C51BH-4WP SOT187-2 0 to +70, Plastic Leaded Chip Carrier, OTP 1.2 to 24 PCB80C31BH4-24H PCB80C51BH-4H SOT307-22 0 to +70, Plastic Quad Flat Pack, OTP 1.2 to 24 PCF80C31-4 N PCF80C31BH4-24P PCF80C51BH-4P SOT129-1 –40 to +85, Plastic Dual In-line Package, OTP 1.2 to 24 PCF80C31-4 A PCF80C31BH4-24WP PCF80C51BH-4WP SOT187-2 –40 to +85, Plastic Leaded Chip Carrier, OTP 1.2 to 24 PCF80C31BH4-24H PCF80C51BH-4H SOT307-22 –40 to +85, Plastic Leaded Chip Carrier, OTP 1.2 to 24 PCB80C31-5 N PCB80C31BH5-30P PCB80C51BH-5P SOT129-1 0 to +70, Plastic Dual In-line Package 1.2 to 33 PCB80C31-5 A PCB80C31BH5-30WP PCB80C51BH-5WP SOT187-2 0 to +70, Plastic Leaded Chip Carrier 1.2 to 33 PCB80C31-5 B PCB80C31BH5-30H SOT307-22 0 to +70, Plastic Quad Flat Pack 1.2 to 33 1996 Aug 16 PCB80C51BH-2P DRAWING NUMBER PCB80C51BH-4P PCB80C51BH-5H 5 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 BLOCK DIAGRAM P0.0–P0.7 P2.0–P2.7 PORT 0 DRIVERS PORT 2 DRIVERS VCC VSS RAM ADDR REGISTER PORT 0 LATCH RAM B REGISTER PORT 2 LATCH ROM/EPROM STACK POINTER ACC PROGRAM ADDRESS REGISTER TMP1 TMP2 PCON ALU SCON TMOD TCON TH0 TL0 TH1 SBUF IE IP BUFFER TL1 PSW INTERRUPT, SERIAL PORT AND TIMER BLOCKS PC INCREMENTER PSEN ALE/PROG EA/VPP TIMING AND CONTROL RST INSTRUCTION REGISTER PROGRAM COUNTER PD DPTR PORT 1 LATCH PORT 3 LATCH PORT 1 DRIVERS PORT 3 DRIVERS P1.0–P1.7 P3.0–P3.7 OSCILLATOR XTAL1 XTAL2 SU00005 1996 Aug 16 6 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 PIN DESCRIPTION PIN NO. MNEMONIC DIP LCC QFP TYPE VSS 20 22 16 I Ground: 0V reference. VCC 40 44 38 I Power Supply: This is the power supply voltage for normal, idle, and power-down operation. 39–32 43–36 37–30 I/O Port 0: Port 0 is an open-drain, bidirectional I/O port. Port 0 pins that have 1s written to them float and can be used as high-impedance inputs. Port 0 is also the multiplexed low-order address and data bus during accesses to external program and data memory. In this application, it uses strong internal pull-ups when emitting 1s. Port 0 also outputs the code bytes during program verification in the 87C51. External pull-ups are required during program verification. P1.0–P1.7 1–8 2–9 40-44, 1–3 I/O Port 1: Port 1 is an 8-bit bidirectional I/O port with internal pull-ups. Port 1 pins that have 1s written to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 1 pins that are externally pulled low will source current because of the internal pull-ups. (See DC Electrical Characteristics: IIL). Port 1 also receives the low-order address byte during program memory verification. P2.0–P2.7 21–28 24–31 18–25 I/O Port 2: Port 2 is an 8-bit bidirectional I/O port with internal pull-ups. Port 2 pins that have 1s written to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 2 pins that are externally being pulled low will source current because of the internal pull-ups. (See DC Electrical Characteristics: IIL). Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX @DPTR). In this application, it uses strong internal pull-ups when emitting 1s. During accesses to external data memory that use 8-bit addresses (MOV @Ri), port 2 emits the contents of the P2 special function register. P3.0–P3.7 10–17 11, 13–19 5, 7–13 I/O 10 11 12 13 14 15 16 17 11 13 14 15 16 17 18 19 5 7 8 9 10 11 12 13 I O I I I I O O Port 3: Port 3 is an 8-bit bidirectional I/O port with internal pull-ups. Port 3 pins that have 1s written to them are pulled high by the internal pull-ups and can be used as inputs. As inputs, port 3 pins that are externally being pulled low will source current because of the pull-ups. (See DC Electrical Characteristics: IIL). Port 3 also serves the special features of the 80C51 family, as listed below: RxD (P3.0): Serial input port TxD (P3.1): Serial output port INT0 (P3.2): External interrupt INT1 (P3.3): External interrupt T0 (P3.4): Timer 0 external input T1 (P3.5): Timer 1 external input WR (P3.6): External data memory write strobe RD (P3.7): External data memory read strobe RST 9 10 4 I Reset: A high on this pin for two machine cycles while the oscillator is running, resets the device. An internal diffused resistor to VSS permits a power-on reset using only an external capacitor to VCC. ALE/PROG 30 33 27 I/O Address Latch Enable/Program Pulse: Output pulse for latching the low byte of the address during an access to external memory. In normal operation, ALE is emitted at a constant rate of 1/6 the oscillator frequency, and can be used for external timing or clocking. Note that one ALE pulse is skipped during each access to external data memory. This pin is also the program pulse input (PROG) during EPROM programming. PSEN 29 32 26 O Program Store Enable: The read strobe to external program memory. When the device is executing code from the external program memory, PSEN is activated twice each machine cycle, except that two PSEN activations are skipped during each access to external data memory. PSEN is not activated during fetches from internal program memory. EA/VPP 31 35 29 I External Access Enable/Programming Supply Voltage: EA must be externally held low to enable the device to fetch code from external program memory locations 0000H to 0FFFH. If EA is held high, the device executes from internal program memory unless the program counter contains an address greater than 0FFFH. This pin also receives the 12.75V programming supply voltage (VPP) during EPROM programming. XTAL1 19 21 15 I Crystal 1: Input to the inverting oscillator amplifier and input to the internal clock generator circuits. XTAL2 18 20 14 O Crystal 2: Output from the inverting oscillator amplifier. P0.0–0.7 1996 Aug 16 NAME AND FUNCTION 7 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers Table 1. SYMBOL 80C31/80C51/87C51 80C52/80C54/80C58 Special Function Registers DESCRIPTION DIRECT ADDRESS BIT ADDRESS, SYMBOL, OR ALTERNATIVE PORT FUNCTION MSB LSB RESET VALUE ACC* Accumulator E0H E7 E6 E5 E4 E3 E2 E1 E0 00H AUXR# Auxiliary 8EH – – – – – – – AO xxxxxxx0B AUXR1# Auxiliary 1 (Note 2) A2H – – – – WUPD 0 – DPS xxxx00x0B B* B register F0H F7 F6 F5 F4 F3 F2 F1 F0 DPTR: DPH DPL Data Pointer (2 bytes) Data Pointer High Data Pointer Low 83H 82H IE* Interrupt Enable A8H IP* Interrupt Priority B8H IPH# Interrupt Priority High B7H P0* Port 0 80H 00H 00H 00H AF AE AD AC AB AA A9 A8 EA EC ET2 ES ET1 EX1 ET0 EX0 BF BE BD BC BB BA B9 B8 – – PT2 PS PT1 PX1 PT0 PX0 B7 B6 B5 B4 B3 B2 B1 B0 – – PT2H PSH PT1H PX1H PT0H PX0H 87 86 85 84 83 82 81 80 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 97 96 95 94 93 92 91 90 – – – – – T2EX T2 P1* Port 1 90H – A7 A6 A5 A4 A3 A2 A1 A0 P2* Port 2 A0H AD15 AD14 AD13 AD12 AD11 AD10 AD9 AD8 B7 B6 B5 B4 B3 B2 B1 B0 00H x0000000B x0000000B FFH FFH FFH P3* Port 3 B0H RD WR T1 T0 INT1 INT0 TxD RxD FFH PCON#1 Power Control 87H SMOD1 SMOD0 – – GF1 GF0 PD IDL 00xx0000B D7 D6 D5 D4 D3 D2 D1 D0 PSW* Program Status Word D0H CY AC F0 RS1 RS0 OV – P SADDR# SADEN# Slave Address Slave Address Mask A9H B9H SBUF Serial Data Buffer 99H SCON* Serial Control 98H SP Stack Pointer 81H TCON* Timer Control 88H T2MOD# TH0 TH1 TL0 TL1 Timer 2 Mode Control Timer High 0 Timer High 1 Timer Low 0 Timer Low 1 C9H 8CH 8DH 8AH 8BH 00H 00H xxxxxxxxB 9F 9E 9D 9C 9B 9A 99 98 SM0/FE SM1 SM2 REN TB8 RB8 TI RI 8F 8E 8D 8C 8B 8A 89 88 TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 CF CE CD CC CB CA C9 C8 – – – – – – T2OE DCEN C/T M1 M0 GATE C/T M1 M0 00H 07H TMOD Timer Mode 89H GATE * SFRs are bit addressable. # SFRs are modified from or added to the 80C51 SFRs. – Reserved bits. 1. Reset value depends on reset source. 2. Available only on SC80C51. 1996 Aug 16 00H 8 00H xxxxxx00B 00H 00H 00H 00H 00H Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 OSCILLATOR CHARACTERISTICS IDLE MODE XTAL1 and XTAL2 are the input and output, respectively, of an inverting amplifier. The pins can be configured for use as an on-chip oscillator, as shown in the logic symbol. In idle mode, the CPU puts itself to sleep while all of the on-chip peripherals stay active. The instruction to invoke the idle mode is the last instruction executed in the normal operating mode before the idle mode is activated. The CPU contents, the on-chip RAM, and all of the special function registers remain intact during this mode. The idle mode can be terminated either by any enabled interrupt (at which time the process is picked up at the interrupt service routine and continued), or by a hardware reset which starts the processor in the same manner as a power-on reset. To drive the device from an external clock source, XTAL1 should be driven while XTAL2 is left unconnected. There are no requirements on the duty cycle of the external clock signal, because the input to the internal clock circuitry is through a divide-by-two flip-flop. However, minimum and maximum high and low times specified in the data sheet must be observed. POWER-DOWN MODE RESET In the power-down mode, the oscillator is stopped and the instruction to invoke power-down is the last instruction executed. Only the contents of the on-chip RAM are preserved. A hardware reset is the only way to terminate the power-down mode. the control bits for the reduced power modes are in the special function register PCON. A reset is accomplished by holding the RST pin high for at least two machine cycles (24 oscillator periods), while the oscillator is running. To insure a good power-up reset, the RST pin must be high long enough to allow the oscillator time to start up (normally a few milliseconds) plus two machine cycles. Table 2 shows the state of I/O ports during low current operating modes. Table 2. External Pin Status During Idle and Power-Down Modes MODE PROGRAM MEMORY ALE PSEN PORT 0 PORT 1 PORT 2 PORT 3 Idle Internal 1 1 Data Data Data Data Idle External 1 1 Float Data Address Data Power-down Internal 0 0 Data Data Data Data Power-down External 0 0 Float Data Data Data ROM CODE SUBMISSION When submitting ROM code for the 80C51, the following must be specified: 1. 4k byte user ROM data 2. 64 byte ROM encryption key (SC80C51 only) 3. ROM security bits (SC80C51 only). ADDRESS CONTENT BIT(S) COMMENT 0000H to 0FFFH DATA 7:0 User ROM Data 1000H to 101FH KEY 7:0 ROM Encryption Key 1020H SEC 0 ROM Security Bit 1 1020H SEC 1 ROM Security Bit 2 Security Bit 1: When programmed, this bit has two effects on masked ROM parts: 1. External MOVC is disabled, and 2. EA# is latched on Reset. Security Bit 2: When programmed, this bit inhibits Verify User ROM. 1996 Aug 16 9 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 Electrical Deviations from Commercial Specifications for Extended Temperature Range (87C51) DC and AC parameters not included here are the same as in the commercial temperature range table. DC ELECTRICAL CHARACTERISTICS Tamb = –40°C to +85°C, VCC = 5V ±10%, VSS = 0V (Philips North America SC87C51); For SC87C51 (33MHz only), Tamb = 0°C to +70°C, VCC = 5V ±5% Tamb = –40°C to +85°C, VCC = 5V ±10%, VSS = 0V (PCB80C31/51 and PCF80C31/51 Philips Parts Only) TEST SYMBOL PARAMETER CONDITIONS LIMITS MIN MAX UNIT VIL Input low voltage, except EA (Philips North America) –0.5 0.2VCC–0.15 V VIL Input low voltage, except EA (Philips) –0.5 0.2VCC–0.25 V VIL1 Input low voltage to EA –0.5 0.2VCC–0.45 V VIH Input high voltage, except XTAL1, RST 0.2VCC+1 VCC+0.5 V VIH1 Input high voltage to XTAL1, RST 0.7VCC+0.1 VCC+0.5 V IIL Logical 0 input current, ports 1, 2, 3 VIN = 0.45V –75 µA ITL Logical 1-to-0 transition current, ports 1, 2, 3 VIN = 2.0V –750 µA ICC Power supply current: Active mode1 @ 16MHz (Philips PCB80C31/51, PCF80C31/51) Active mode @ 12MHz (Philips North America SC87C51) Idle mode2 @ 16MHz (Philips PCB80C31/51, PCF80C31/51) Idle mode @ 12MHz (Philips North America SC87C51) Power-down mode3 (Philips PCB80C31/51, PCF80C31/51) Power-down mode (Philips North America SC87C51) 25 20 6.5 5 75 50 mA mA mA mA µA µA VCC = 4.5–5.5V NOTES: 1. The operating supply current is measured with all output pins disconnected; XTAL1 driven with tr = tf = 10ns; VIL = VSS + 0.5V; VIH = VCC – 0.5V; XTAL2 not connected; EA = RST = Port 0 = VCC. 2. The idle mode supply current is measured with all output pins disconnected; XTAL1 driven with tr = tf = 10ns; VIL = VSS + 0.5V; VIH = VCC – 0.5V; XTAL2 not connected; EA = Port 0 = VCC; RST = VSS. 3. The power-down current is measured with all output pins disconnected, XTAL2 not connected, EA = Port 0 = VCC; RST = VSS. ABSOLUTE MAXIMUM RATINGS1, 2, 3 PARAMETER RATING UNIT 0 to +70 or –40 to +85 °C –65 to +150 °C 0 to +13.0 V –0.5 to +6.5 V Maximum IOL per I/O pin 15 mA Power dissipation (based on package heat transfer limitations, not device power consumption) 1.5 W Operating temperature under bias Storage temperature range Voltage on EA/VPP pin to VSS Voltage on any other pin to VSS NOTES: 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section of this specification is not implied. 2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. 3. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. 1996 Aug 16 10 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 DC ELECTRICAL CHARACTERISTICS Tamb = 0°C to +70°C or –40°C to +85°C, VCC = 5V ±20%, VSS = 0V (PCB80C31/51 and PCF80C31/51) (12, 16, and 24MHz versions) Tamb = 0°C to +70°C or –40°C to +85°C, VCC = 5V ±10%, VSS = 0V (87C51 12, 16, and 24MHz versions) (PCB80C31/51 33MHz version); For SC87C51 (33MHz only) Tamb = 0°C to +70°C, VCC = 5V ±5% TEST SYMBOL VIL PARAMETER Input low voltage, except CONDITIONS EA7 EA7 VIL1 Input low voltage to VIH Input high voltage, except XTAL1, RST7 VIH1 Input high voltage, XTAL1, RST7 311 VOL Output low voltage, ports 1, 2, VOL1 Output low voltage, port 0, ALE, PSEN11 TYPICAL1 MAX UNIT –0.5 0.2VCC–0.1 V 0 0.2VCC–0.3 V 0.2VCC+0.9 VCC+0.5 V 0.7VCC VCC+0.5 V 1.6mA2 0.45 V IOL = 3.2mA2 0.45 V IOL = PSEN3 LIMITS MIN VOH Output high voltage, ports 1, 2, 3, ALE, VOH1 Output high voltage (port 0 in external bus mode) IIL Logical 0 input current, ports 1, 2, 37 VIN = 0.45V –50 µA ITL Logical 1-to-0 transition current, ports 1, 2, 37 See note 4 –650 µA ILI Input leakage current, port 0 VIN = VIL or VIH ±10 µA 18 19 4.4 4 50 mA mA mA mA µA 300 150 kΩ kΩ ICC RRST IOH = –60µA, IOH = –25µA IOH = –10µA 2.4 0.75VCC 0.9VCC V V V IOH = –800µA, IOH = –300µA IOH = –80µA 2.4 0.75VCC 0.9VCC V V V current:7 Power supply Active mode @ 12MHz8 (Philips) Active mode @ 12MHz5 (Philips North America) Idle mode @ 12MHz9 (Philips) Idle mode @ 12MHz (Philips North America) Power-down mode10 (Philips and Philips North America) See note 6 11.5 1.3 3 Internal reset pull-down resistor (Philips North America) (Philips) 50 50 CIO Pin capacitance12 10 pF NOTES: 1. Typical ratings are not guaranteed. The values listed are at room temperature, 5V. 2. Capacitive loading on ports 0 and 2 may cause spurious noise to be superimposed on the VOLs of ALE and ports 1 and 3. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during bus operations. In the worst cases (capacitive loading > 100pF), the noise pulse on the ALE pin may exceed 0.8V. In such cases, it may be desirable to qualify ALE with a Schmitt Trigger, or use an address latch with a Schmitt Trigger STROBE input. IOL can exceed these conditions provided that no single output sinks more than 5mA and no more than two outputs exceed the test conditions. 3. Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily fall below the 0.9VCC specification when the address bits are stabilizing. 4. Pins of ports 1, 2 and 3 source a transition current when they are being externally driven from 1 to 0. The transition current reaches its maximum value when VIN is approximately 2V. 5. ICCMAX at other frequencies (for Philips North America parts) is given by: Active mode: ICCMAX = 1.43 X FREQ + 1.90; Idle mode: ICCMAX = 0.14 X FREQ +2.31, where FREQ is the external oscillator frequency in MHz. ICCMAX is given in mA. See Figure 8. 6. See Figures 9 through 12 for ICC test conditions. 7. For Philips North America parts when Tamb = –40°C to +85°C or Philips parts when Tamb = –40°C to +125°C, see DC Electrical Characteristics table on previous page. 8. The operating supply current is measured with all output pins disconnected; XTAL1 driven with tr = tf = 10ns; VIL = VSS + 0.5V; VIH = VCC – 0.5V; XTAL2 not connected; EA = RST = Port 0 = VCC. 9. The idle mode supply current is measured with all output pins disconnected; XTAL1 driven with tr = tf = 10ns; VIL = VSS + 0.5V; VIH = VCC – 0.5V; XTAL2 not connected; EA = Port 0 = VCC; RST = VSS. 10. The power-down current is measured with all output pins disconnected, XTAL2 not connected, EA = Port 0 = VCC; RST = VSS. 11. Under steady state (non-transient) conditions, IOL must be externally limited as follows: 15mA Maximum IOL per port pin: 26mA Maximum IOL per 8-bit port: 67mA Maximum IOL total for all outputs: If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test conditions. 12. Pin capacitance for the ceramic DIP package is 15pF maximum. 1996 Aug 16 11 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 DC ELECTRICAL CHARACTERISTICS FOR PHILIPS NORTH AMERICA DEVICES (SC80C31 AND SC80C51) Tamb = 0°C to +70°C or –40°C to +85°C, VCC = 5V ±10%; VSS = 0V SYMBOL TEST CONDITIONS PARAMETER VIL Input low voltage VIH Input high voltage (ports 0, 1, 2, 3, EA) VIH1 Input high voltage, XTAL1, RST VOL Output low voltage, ports 1, 2, 38 VOL1 MIN TYP1 UNIT MAX –0.5 0.2VCC–0.1 V 0.2VCC+0.9 VCC+0.5 V 0.7VCC VCC+0.5 V VCC = 4.5V IOL = 1.6mA2 0.4 V Output low voltage, port 0, ALE, PSEN8, 7 VCC = 4.5V IOL = 3.2mA2 0.4 V VOH Output high voltage, ports 1, 2, 3 3 VCC = 4.5V IOH = –30µA VCC – 0.7 V VOH1 Output high voltage (port 0 in external bus mode), ALE9, PSEN3 VCC = 4.5V IOH = –3.2mA VCC – 0.7 V IIL Logical 0 input current, ports 1, 2, 3 VIN = 0.4V –1 ITL Logical 1-to-0 transition current, ports 1, 2, 36 ILI Input leakage current, port 0 ICC Power supply current (see Figure 8): Active mode @ 16MHz5 Idle mode @ 16MHz5 Power-down mode RRST Internal reset pull-down resistor CIO Pin capacitance10 (except EA) 4.5V < VCC < 5.5V LIMITS –50 µA VIN = 2.0V See note 4 –650 µA 0.45 < VIN < VCC – 0.3 ±10 µA 32 5 50 75 µA µA µA µA 225 kΩ 15 pF See note 5 11.5 1.3 3 Tamb = 0 to +70°C Tamb = –40 to +85°C 40 NOTES: 1. Typical ratings are not guaranteed. The values listed are at room temperature, 5V. 2. Capacitive loading on ports 0 and 2 may cause spurious noise to be superimposed on the VOLs of ALE and ports 1 and 3. The noise is due to external bus capacitance discharging into the port 0 and port 2 pins when these pins make 1-to-0 transitions during bus operations. In the worst cases (capacitive loading > 100pF), the noise pulse on the ALE pin may exceed 0.8V. In such cases, it may be desirable to qualify ALE with a Schmitt Trigger, or use an address latch with a Schmitt Trigger STROBE input. IOL can exceed these conditions provided that no single output sinks more than 5mA and no more than two outputs exceed the test conditions. 3. Capacitive loading on ports 0 and 2 may cause the VOH on ALE and PSEN to momentarily fall below the (VCC–0.7) specification when the address bits are stabilizing. 4. Pins of ports 1, 2 and 3 source a transition current when they are being externally driven from 1 to 0. The transition current reaches its maximum value when VIN is approximately 2V. 5. See Figures 9 through 12 for ICC test conditions. Active Mode: ICC = 1.5 × FREQ + 8.0; Idle Mode: ICC = 0.14 × FREQ +2.31; See Figure 8. 6. This value applies to Tamb = 0°C to +70°C. For Tamb = –40°C to +85°C, ITL = –750µA. 7. Load capacitance for port 0, ALE, and PSEN = 100pF, load capacitance for all other outputs = 80pF. 8. Under steady state (non-transient) conditions, IOL must be externally limited as follows: 15mA (*NOTE: This is 85°C specification.) Maximum IOL per port pin: Maximum IOL per 8-bit port: 26mA 71mA Maximum total IOL for all outputs: If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test conditions. 9. ALE is tested to VOH1, except when ALE is off then VOH is the voltage specification. 10. Pin capacitance is characterized but not tested. Pin capacitance is less than 25pF. Pin capacitance of ceramic package is less than 15pF (except EA it is 25pF). 1996 Aug 16 12 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 AC ELECTRICAL CHARACTERISTICS FOR SC87C51 12–33MHz PHILIPS NORTH AMERICA DEVICES Tamb = 0°C to +70°C or –40°C to +85°C, VCC = 5V ±10%, VSS = 0V (SC87C51 12, 16 and 24MHz versions); For SC87C51 (33MHz only) Tamb = = 0°C to +70°C, VCC = 5V ±5% VARIABLE CLOCK3 SYMBOL FIGURE 1/tCLCL Oscillator frequency: SC87C51 PARAMETER MIN MAX UNIT Speed Versions C G P Y 3.5 3.5 3.5 3.5 12 16 24 33 MHz MHz MHz MHz tLHLL 1 ALE pulse width 2tCLCL–40 ns tAVLL 1 Address valid to ALE low tCLCL–13 ns tLLAX 1 Address hold after ALE low tCLCL–20 ns tLLIV 1 ALE low to valid instruction in tLLPL 1 ALE low to PSEN low tCLCL–13 ns tPLPH 1 PSEN pulse width 3tCLCL–20 ns tPLIV 1 PSEN low to valid instruction in tPXIX 1 Input instruction hold after PSEN tPXIZ 1 Input instruction float after PSEN tCLCL–10 ns tAVIV 1 Address to valid instruction in 5tCLCL–55 ns tPLAZ 1 PSEN low to address float 10 ns 4tCLCL–65 3tCLCL–45 0 ns ns ns Data Memory tRLRH 2, 3 RD pulse width 6tCLCL–100 ns tWLWH 2, 3 WR pulse width 6tCLCL–100 ns tRLDV 2, 3 RD low to valid data in tRHDX 2, 3 Data hold after RD tRHDZ 2, 3 Data float after RD 2tCLCL–28 ns tLLDV 2, 3 ALE low to valid data in 8tCLCL–150 ns tAVDV 2, 3 Address to valid data in 9tCLCL–165 ns tLLWL 2, 3 ALE low to RD or WR low 3tCLCL–50 3tCLCL+50 ns tAVWL 2, 3 Address valid to WR low or RD low 4tCLCL–75 ns tQVWX 2, 3 Data valid to WR transition tCLCL–20 ns tWHQX 2, 3 Data hold after WR tCLCL–20 ns tRLAZ 2, 3 RD low to address float tWHLH 2, 3 RD or WR high to ALE high 5tCLCL–90 0 tCLCL–20 ns ns 0 ns tCLCL+25 ns External Clock tCHCX 5 High time 12 ns tCLCX 5 Low time 12 ns tCLCH 5 Rise time 20 ns tCHCL 5 Fall time 20 ns NOTES: 1. Parameters are valid over operating temperature range unless otherwise specified. 2. Load capacitance for port 0, ALE, and PSEN = 100pF, load capacitance for all other outputs = 80pF. 3. For all Philips North America speed versions only. 4. Interfacing the 87C51 to devices with float times up to 50ns is permitted. This limited bus contention will not cause damage to port 0 drivers. 1996 Aug 16 13 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 AC ELECTRICAL CHARACTERISTICS FOR PHILIPS DEVICES Tamb = 0°C to +70°C, VCC = 5V ±20%, VSS = 0V (PCB80C31/51, PCF80C31/51)1, 2, 4, 5 VARIABLE CLOCK3 SYMBOL FIGURE 1/tCLCL PARAMETER MIN MAX UNIT Oscillator frequency: Speed Versions PCB8031/51 –2 PCA/PCB/PCF80C31/51 –3 PCB/PCF80C31/51 –4 PCB/FB80C31/51 –5 0.5 1.2 1.2 1.2 12 16 24 33 MHz MHz MHz MHz tLHLL 1 ALE pulse width 2tCLCL–40 ns tAVLL 1 Address valid to ALE low tCLCL–25 ns tLLAX 1 Address hold after ALE low tCLCL–25 ns tLLIV 1 ALE low to valid instruction in tLLPL 1 ALE low to PSEN low tCLCL–25 ns tPLPH 1 PSEN pulse width 3tCLCL–45 ns tPLIV 1 PSEN low to valid instruction in tPXIX 1 Input instruction hold after PSEN tPXIZ 1 Input instruction float after PSEN tCLCL–25 ns tAVIV 1 Address to valid instruction in 5tCLCL–80 ns tPLAZ 1 PSEN low to address float 10 ns 4tCLCL–65 3tCLCL–60 0 ns ns ns Data Memory tRLRH 2, 3 RD pulse width 6tCLCL–100 ns tWLWH 2, 3 WR pulse width 6tCLCL–100 ns tRLDV 2, 3 RD low to valid data in tRHDX 2, 3 Data hold after RD tRHDZ 2, 3 Data float after RD 2tCLCL–28 ns tLLDV 2, 3 ALE low to valid data in 8tCLCL–150 ns tAVDV 2, 3 Address to valid data in 9tCLCL–165 ns tLLWL 2, 3 ALE low to RD or WR low 3tCLCL–50 3tCLCL+50 ns tAVWL 2, 3 Address valid to WR low or RD low 4tCLCL–75 ns tQVWX 2, 3 Data valid to WR transition tCLCL–30 ns tWHQX 2, 3 Data hold after WR tCLCL–25 tRLAZ 2, 3 RD low to address float tWHLH 2, 3 RD or WR high to ALE high 5tCLCL–90 0 tCLCL–25 ns ns ns 0 ns tCLCL+25 ns External Clock tCHCX 5 High time 15 ns tCLCX 5 Low time 15 ns tCLCH 5 Rise time 20 ns tCHCL 5 Fall time 20 ns NOTES: 1. Parameters are valid over operating temperature range unless otherwise specified. 2. Load capacitance for port 0, ALE, and PSEN = 100pF, load capacitance for all other outputs = 80pF. 3. For all Philips speed versions only. 4. Interfacing the 80C31/51 to devices with float times up to 30ns is permitted. This limited bus contention will not cause damage to port 0 drivers. 5. VCC = 5V ±10% for 33MHz. 1996 Aug 16 14 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 AC ELECTRICAL CHARACTERISTICS FOR PHILIPS NORTH AMERICA DEVICES (SC80C31 AND SC80C51) Tamb = 0°C to +70°C or –40°C to +85°C, VCC = 5V ±10%, VSS = 0V1, 2, 3 16MHz CLOCK SYMBOL FIGURE PARAMETER MIN MAX VARIABLE CLOCK MIN MAX UNIT 3.5 16 MHz 1/tCLCL 1 Oscillator frequency Speed versions : C, G tLHLL 1 ALE pulse width 85 2tCLCL–40 ns tAVLL 1 Address valid to ALE low 22 tCLCL–40 ns tLLAX 1 Address hold after ALE low 32 tLLIV 1 ALE low to valid instruction in tLLPL 1 ALE low to PSEN low 32 tCLCL–30 ns tPLPH 1 PSEN pulse width 142 3tCLCL–45 ns tCLCL–30 150 in4 ns 4tCLCL–100 82 tPLIV 1 PSEN low to valid instruction tPXIX 1 Input instruction hold after PSEN tPXIZ 1 Input instruction float after PSEN 37 tCLCL–25 ns tAVIV 1 Address to valid instruction in4 207 5tCLCL–105 ns tPLAZ 1 PSEN low to address float 10 10 ns 0 3tCLCL–105 ns 0 ns ns Data Memory tRLRH 2, 3 RD pulse width 275 6tCLCL–100 ns tWLWH 2, 3 WR pulse width 275 6tCLCL–100 ns tRLDV 2, 3 RD low to valid data in tRHDX 2, 3 Data hold after RD tRHDZ 2, 3 Data float after RD 65 2tCLCL–60 ns tLLDV 2, 3 ALE low to valid data in 350 8tCLCL–150 ns tAVDV 2, 3 Address to valid data in 397 9tCLCL–165 ns tLLWL 2, 3 ALE low to RD or WR low 137 3tCLCL+50 ns tAVWL 2, 3 Address valid to WR low or RD low 122 4tCLCL–130 ns tQVWX 2, 3 Data valid to WR transition 13 tCLCL–50 ns tWHQX 2, 3 Data hold after WR 13 tCLCL–50 ns Data valid to WR high 287 147 0 tQVWH 3 tRLAZ 2, 3 RD low to address float tWHLH 2, 3 RD or WR high to ALE high 23 5tCLCL–165 0 239 3tCLCL–50 ns 7tCLCL–150 0 103 tCLCL–40 ns ns 0 ns tCLCL+40 ns External Clock tCHCX 5 High time 20 20 tCLCL–tCLCX ns tCLCX 5 Low time 20 20 tCLCL–tCHCX ns tCLCH 5 Rise time 20 20 ns tCHCL 5 Fall time 20 20 ns tXLXL 4 Serial port clock cycle time 750 12tCLCL ns tQVXH 4 Output data setup to clock rising edge 492 10tCLCL–133 ns tXHQX 4 Output data hold after clock rising edge 8 2tCLCL–117 ns tXHDX 4 Input data hold after clock rising edge 0 0 ns Shift Register tXHDV 4 Clock rising edge to input data valid 492 10tCLCL–133 ns NOTES: 1. Parameters are valid over operating temperature range unless otherwise specified. 2. Load capacitance for port 0, ALE, and PSEN = 100pF, load capacitance for all other outputs = 80pF. 3. Interfacing the 80C31/51 to devices with float times up to 45ns is permitted. This limited bus contention will not cause damage to Port 0 drivers. 4. See application note AN457 for external memory interfacing. 1996 Aug 16 15 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 AC ELECTRICAL CHARACTERISTICS FOR PHILIPS NORTH AMERICA DEVICES (SC80C31 AND SC80C51) Tamb = 0°C to +70°C or –40°C to +85°C, VCC = 5V ±10%, VSS = 0V1, 2, 3 24MHz CLOCK SYMBOL FIGURE 1/tCLCL 1 PARAMETER MIN Oscillator frequency Speed versions : P (24MHz) : Y (33MHz) 3.5 MAX VARIABLE CLOCK4 MIN MAX 3.5 33 33MHz CLOCK MIN MAX 3.5 33 24 UNIT MHz tLHLL 1 ALE pulse width 43 2tCLCL–40 21 ns tAVLL 1 Address valid to ALE low 17 tCLCL–25 5 ns tLLAX 1 Address hold after ALE low 17 tLLIV 1 ALE low to valid instruction in tLLPL 1 ALE low to PSEN low 17 tPLPH 1 PSEN pulse width 80 tPLIV 1 PSEN low to valid instruction in tPXIX 1 Input instruction hold after PSEN tPXIZ 1 Input instruction float after PSEN 17 tCLCL–25 5 ns tAVIV 1 Address to valid instruction in 128 5tCLCL–80 70 ns tPLAZ 1 PSEN low to address float 10 10 10 ns tCLCL–25 102 ns 4tCLCL–65 tCLCL–25 5 3tCLCL–45 65 0 55 ns 45 3tCLCL–60 0 ns ns 30 0 ns ns Data Memory tRLRH 2, 3 RD pulse width 150 6tCLCL–100 82 tWLWH 2, 3 WR pulse width 150 tRLDV 2, 3 RD low to valid data in tRHDX 2, 3 Data hold after RD tRHDZ 2, 3 Data float after RD 55 2tCLCL–28 32 ns tLLDV 2, 3 ALE low to valid data in 183 8tCLCL–150 90 ns tAVDV 2, 3 Address to valid data in 210 9tCLCL–165 105 ns tLLWL 2, 3 ALE low to RD or WR low 75 140 ns tAVWL 2, 3 Address valid to WR low or RD low 92 4tCLCL–75 45 ns tQVWX 2, 3 Data valid to WR transition 12 tCLCL–30 0 ns tWHQX 2, 3 Data hold after WR 17 tCLCL–25 5 ns tQVWH 3 Data valid to WR high 162 7tCLCL–130 80 ns tRLAZ 2, 3 RD low to address float tWHLH 2, 3 RD or WR high to ALE high 17 6tCLCL–100 118 0 82 5tCLCL–90 0 175 3tCLCL–50 0 67 ns 60 0 3tCLCL+50 40 0 tCLCL–25 ns tCLCL+25 5 ns ns 0 ns 55 ns External Clock tCHCX 5 High time 17 17 tCLCL–tCLCX ns tCLCX 5 Low time 17 17 tCLCL–tCHCX ns tCLCH 5 Rise time 5 5 ns tCHCL 5 Fall time 5 5 ns tXLXL 4 Serial port clock cycle time 505 12tCLCL 360 ns tQVXH 4 Output data setup to clock rising edge 283 10tCLCL–133 167 ns tXHQX 4 Output data hold after clock rising edge 3 2tCLCL–80 tXHDX 4 Input data hold after clock rising edge 0 0 Shift Register ns 0 ns tXHDV 4 Clock rising edge to input data valid 283 10tCLCL–133 167 ns NOTES: 1. Parameters are valid over operating temperature range unless otherwise specified. 2. Load capacitance for port 0, ALE, and PSEN = 100pF, load capacitance for all other outputs = 80pF. 3. Interfacing the SC80C31/51 to devices with float times up to 45ns is permitted. This limited bus contention will not cause damage to Port 0 drivers. 4. Variable clock is specified for oscillator frequencies greater than 16MHz to 33MHz. For frequencies equal or less than 16MHz, see 16MHz “AC Electrial Characteristics”, page 15. 1996 Aug 16 16 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 EXPLANATION OF THE AC SYMBOLS P – PSEN Q – Output data R – RD signal t – Time V – Valid W – WR signal X – No longer a valid logic level Z – Float Examples: tAVLL = Time for address valid to ALE low. tLLPL= Time for ALE low to PSEN low. Each timing symbol has five characters. The first character is always ‘t’ (= time). The other characters, depending on their positions, indicate the name of a signal or the logical status of that signal. The designations are: A – Address C – Clock D – Input data H – Logic level high I – Instruction (program memory contents) L – Logic level low, or ALE tLHLL ALE tAVLL tLLPL tPLPH tLLIV tPLIV PSEN tLLAX INSTR IN A0–A7 PORT 0 tPXIZ tPLAZ tPXIX A0–A7 tAVIV PORT 2 A0–A15 A8–A15 SU00006 Figure 1. External Program Memory Read Cycle ALE tWHLH PSEN tLLDV tLLWL tRLRH RD tAVLL tLLAX tRLAZ PORT 0 tRHDZ tRLDV tRHDX A0–A7 FROM RI OR DPL DATA IN A0–A7 FROM PCL INSTR IN tAVWL tAVDV PORT 2 P2.0–P2.7 OR A8–A15 FROM DPH A0–A15 FROM PCH SU00007 Figure 2. External Data Memory Read Cycle 1996 Aug 16 17 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 ALE tWHLH PSEN tWLWH tLLWL WR tLLAX tAVLL A0–A7 FROM RI OR DPL PORT 0 tWHQX tQVWX DATA OUT A0–A7 FROM PCL INSTR IN tAVWL PORT 2 P2.0–P2.7 OR A8–A15 FROM DPH A0–A15 FROM PCH SU00008 Figure 3. External Data Memory Write Cycle INSTRUCTION 0 1 2 3 4 5 6 7 8 ALE tXLXL CLOCK tXHQX tQVXH OUTPUT DATA 0 1 2 WRITE TO SBUF 3 4 5 6 7 tXHDX tXHDV SET TI INPUT DATA VALID VALID VALID VALID VALID VALID VALID VALID CLEAR RI SET RI SU00027 Figure 4. Shift Register Mode Timing VCC–0.5 0.45V 0.7VCC 0.2VCC–0.1 tCHCL tCHCX tCLCH tCLCX tCLCL SU00009 Figure 5. External Clock Drive 1996 Aug 16 18 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers VCC–0.5 80C31/80C51/87C51 0.2VCC+0.9 0.2VCC–0.1 0.45V NOTE: AC inputs during testing are driven at VCC –0.5 for a logic ‘1’ and 0.45V for a logic ‘0’. Timing measurements are made at VIH min for a logic ‘1’ and VIL max for a logic ‘0’. SU00010 Figure 6. AC Testing Input/Output VLOAD+0.1V VOH–0.1V TIMING REFERENCE POINTS VLOAD VLOAD–0.1V VOL+0.1V NOTE: For timing purposes, a port is no longer floating when a 100mV change from load voltage occurs, and begins to float when a 100mV change from the loaded VOH/VOL level occurs. IOH/IOL ≥ ±20mA. SU00011 Figure 7. Float Waveform MAX ACTIVE MODE (ICCMAX = 1.43 freq + 1.9) 45 40 35 30 TYP ACTIVE MODE 25 ICC mA 20 15 10 MAX IDLE MODE 5 TYP IDLE MODE 4MHz 8MHz 12MHz 16MHz 20MHz 24MHz 30MHz 33MHz FREQ AT XTAL1 SU00012 Figure 8. ICC vs. FREQ Valid only within frequency specifications of the device under test 1996 Aug 16 19 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 VCC VCC ICC ICC VCC VCC VCC VCC RST RST VCC P0 P0 EA EA (NC) XTAL2 (NC) XTAL2 CLOCK SIGNAL XTAL1 CLOCK SIGNAL XTAL1 VSS VSS SU00719 SU00720 Figure 9. ICC Test Condition, Active Mode All other pins are disconnected VCC–0.5 Figure 10. ICC Test Condition, Idle Mode All other pins are disconnected 0.7VCC 0.45V 0.2VCC–0.1 tCHCL tCHCX tCLCH tCLCX tCLCL SU00015 Figure 11. Clock Signal Waveform for ICC Tests in Active and Idle Modes tCLCH = tCHCL = 5ns VCC ICC VCC VCC RST P0 EA (NC) XTAL2 XTAL1 VSS SU00016 Figure 12. ICC Test Condition, Power Down Mode All other pins are disconnected. VCC = 2V to 5.5V 1996 Aug 16 20 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 EPROM CHARACTERISTICS Program Verification The 87C51 is programmed by using a modified Quick-Pulse Programming algorithm. It differs from older methods in the value used for VPP (programming supply voltage) and in the width and number of the ALE/PROG pulses. If security bit 2 has not been programmed, the on-chip program memory can be read out for program verification. The address of the program memory locations to be read is applied to ports 1 and 2 as shown in Figure 15. The other pins are held at the ‘Verify Code Data’ levels indicated in Table 3. The contents of the address location will be emitted on port 0. External pull-ups are required on port 0 for this operation. The 87C51 contains two signature bytes that can be read and used by an EPROM programming system to identify the device. The signature bytes identify the device as an 87C51 manufactured by Philips Corporation. If the encryption table has been programmed, the data presented at port 0 will be the exclusive NOR of the program byte with one of the encryption bytes. The user will have to know the encryption table contents in order to correctly decode the verification data. The encryption table itself cannot be read out. Table 3 shows the logic levels for reading the signature bytes, and for programming the program memory, the encryption table, and the security bits. The circuit configuration and waveforms for quick-pulse programming are shown in Figures 13 and 14. Figure 15 shows the circuit configuration for normal program memory verification. Reading the Signature Bytes The signature bytes are read by the same procedure as a normal verification of locations 030H and 031H, except that P3.6 and P3.7 need to be pulled to a logic low. The values are: (030H) = 15H indicates manufactured by Philips (031H) = 92H indicates 87C51 Quick-Pulse Programming The setup for microcontroller quick-pulse programming is shown in Figure 13. Note that the 87C51 is running with a 4 to 6MHz oscillator. The reason the oscillator needs to be running is that the device is executing internal address and program data transfers. Program/Verify Algorithms The address of the EPROM location to be programmed is applied to ports 1 and 2, as shown in Figure 13. The code byte to be programmed into that location is applied to port 0. RST, PSEN and pins of ports 2 and 3 specified in Table 3 are held at the ‘Program Code Data’ levels indicated in Table 3. The ALE/PROG is pulsed low 25 times as shown in Figure 14. Any algorithm in agreement with the conditions listed in Table 3, and which satisfies the timing specifications, is suitable. Erasure Characteristics Erasure of the EPROM begins to occur when the chip is exposed to light with wavelengths shorter than approximately 4,000 angstroms. Since sunlight and fluorescent lighting have wavelengths in this range, exposure to these light sources over an extended time (about 1 week in sunlight, or 3 years in room level fluorescent lighting) could cause inadvertent erasure. For this and secondary effects, it is recommended that an opaque label be placed over the window. For elevated temperature or environments where solvents are being used, apply Kapton tape Fluorglas part number 2345–5, or equivalent. To program the encryption table, repeat the 25 pulse programming sequence for addresses 0 through 1FH, using the ‘Pgm Encryption Table’ levels. Do not forget that after the encryption table is programmed, verification cycles will produce only encrypted data. To program the security bits, repeat the 25 pulse programming sequence using the ‘Pgm Security Bit’ levels. After one security bit is programmed, further programming of the code memory and encryption table is disabled. However, the other security bit can still be programmed. The recommended erasure procedure is exposure to ultraviolet light (at 2537 angstroms) to an integrated dose of at least 15W-sec/cm2. Exposing the EPROM to an ultraviolet lamp of 12,000µW/cm2 rating for 20 to 39 minutes, at a distance of about 1 inch, should be sufficient. Note that the EA/VPP pin must not be allowed to go above the maximum specified VPP level for any amount of time. Even a narrow glitch above that voltage can cause permanent damage to the device. The VPP source should be well regulated and free of glitches and overshoot. Erasure leaves the array in an all 1s state. Table 3. EPROM Programming Modes RST PSEN ALE/PROG EA/VPP P2.7 P2.6 P3.7 P3.6 Read signature MODE 1 0 1 1 0 0 0 0 Program code data 1 0 0* VPP 1 0 1 1 Verify code data 1 0 1 1 0 0 1 1 Pgm encryption table 1 0 0* VPP 1 0 1 0 Pgm security bit 1 1 0 0* VPP 1 1 1 1 Pgm security bit 2 1 0 0* VPP 1 1 0 0 NOTES: 1. ‘0’ = Valid low for that pin, ‘1’ = valid high for that pin. 2. VPP = 12.75V +0.25V. 3. VCC = 5V±10% during programming and verification. 4. *ALE/PROG receives 25 programming pulses while VPP is held at 12.75V. Each programming pulse is low for 100µs (±10µs) and high for a minimum of 10µs. Trademark phrase of Intel Corporation. 1996 Aug 16 21 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 +5V VCC A0–A7 P0 P1 1 RST EA/VPP 1 P3.6 ALE/PROG 1 P3.7 87C51 XTAL2 4–6MHz XTAL1 PGM DATA +12.75V 25 100µs PULSES TO GROUND PSEN 0 P2.7 1 P2.6 0 A8–A11 P2.0–P2.3 VSS SU00017 Figure 13. Programming Configuration 25 PULSES 1 ALE/PROG: 0 10µs MIN 1 ALE/PROG: 100µs+10 0 SU00018 Figure 14. PROG Waveform +5V VCC A0–A7 P0 P1 PGM DATA 1 RST EA/VPP 1 1 P3.6 ALE/PROG 1 1 P3.7 PSEN 0 87C51 XTAL2 4–6MHz XTAL1 P2.7 0 ENABLE P2.6 0 P2.0–P2.3 A8–A11 VSS SU00019 Figure 15. Program Verification 1996 Aug 16 22 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 EPROM PROGRAMMING AND VERIFICATION CHARACTERISTICS Tamb = 21°C to +27°C, VCC = 5V±10%, VSS = 0V (See Figure 16) SYMBOL PARAMETER MIN MAX UNIT 12.5 13.0 V VPP Programming supply voltage IPP Programming supply current 1/tCLCL Oscillator frequency tAVGL Address setup to PROG low 48tCLCL tGHAX Address hold after PROG 48tCLCL tDVGL Data setup to PROG low 48tCLCL tGHDX Data hold after PROG 48tCLCL tEHSH P2.7 (ENABLE) high to VPP 48tCLCL tSHGL VPP setup to PROG low 10 µs tGHSL VPP hold after PROG 10 µs tGLGH PROG width 90 tAVQV Address to data valid 48tCLCL tELQZ ENABLE low to data valid 48tCLCL tEHQZ Data float after ENABLE 0 tGHGL PROG high to PROG low 10 P1.0–P1.7 P2.0–P2.4 4 50 mA 6 MHz µs 110 48tCLCL µs PROGRAMMING* VERIFICATION* ADDRESS ADDRESS tAVQV DATA IN PORT 0 DATA OUT tDVGL tAVGL tGHDX tGHAX ALE/PROG tGLGH tSHGL tGHGL tGHSL LOGIC 1 LOGIC 1 EA/VPP LOGIC 0 tEHSH tELQV tEHQZ P2.7 ENABLE SU00020 NOTE: * FOR PROGRAMMING VERIFICATION SEE FIGURE 13. FOR VERIFICATION CONDITIONS SEE FIGURE 15. Figure 16. EPROM Programming and Verification 1996 Aug 16 23 1996 Aug 16 853–0590B 06688 24 SEATING PLANE –T– –D– 0.023 (0.58) 0.015 (0.38) 0.070 (1.78) 0.050 (1.27) T 0.100 (2.54) BSC E D 0.010 (0.254) 2.087 (53.01) 2.038 (51.77) SEE NOTE 6 0.098 (2.49) 0.040 (1.02) 0.165 (4.19) 0.125 (3.18) 0.015 (0.38) 0.010 (0.25) 0.055 (1.40) 0.020 (0.51) 0.175 (4.45) 0.145 (3.68) 0.695 (17.65) 0.600 (15.24) BSC 0.600 (15.24) (NOTE 4) 0.620 (15.75) 0.590 (14.99) (NOTE 4) 6. Denotes window location for EPROM products. 5. Pin numbers start with Pin #1 and continue counterclockwise to Pin #40 when viewed from the top. 0.225 (5.72) MAX. 0.598 (15.19) 0.571 (14.50) 2. Dimension and tolerancing per ANSI Y14. 5M-1982. 3. “T”, “D”, and “E” are reference datums on the body and include allowance for glass overrun and meniscus on the seal line, and lid to base mismatch. 4. These dimensions measured with the leads constrained to be perpendicular to plane T. NOTES: 1. Controlling dimension: Inches. Millimeters are shown in parentheses. 0590B PIN # 1 –E– 0.098 (2.49) 0.040 (1.02) Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 40-PIN (600 mils wide) CERAMIC DUAL IN-LINE (F) PACKAGE (WITH WINDOW (FA) PACKAGE) 1996 Aug 16 853-1472A 05854 25 8.13 (0.320) 7.37 (0.290) 8.13 (0.320) 7.37 (0.290) 12.7 (0.500) NOMINAL SEE DETAIL A SEATING PLANE 0.482 (0.019 + 0.002) BASE PLANE 45 ° TYP. 4 PLACES 0.73 + 0.08 (0.029 + 0.003) SEATING PLANE DETAIL A TYP. ALL SIDES mm/(inch) 1.02 + 0.25 (0.040 + 0.010) 1.52 (0.060) REF. 1.27 (0.050) TYP. 4.83 (0.190) 3.94 (0.155) 6 0.51 (0.02) X 45 ° 6 0.38 (0.015) 0.25 (0.010) 0.15 (0.006) 0.15 (0.006) MIN. 0.25 (0.010) R MIN. + 5° –10 ° DETAIL B mm/(inch) 90° 0.508 (0.020) R MIN. 0.076 (0.003) MIN. 6. Backside solder relief is optional and dimensions are for reference only. 5. All dimensions and tolerances include lead trim offset and lead plating finish. 3. Dimensions do not include glass protrusion. Glass protrusion to be 0.005 inches maximum on each side. 4. Controlling dimension millimeters. 2. UV window is optional. NOTES: 1. All dimensions and tolerances to conform to ANSI Y14.5–1982. CMOS single-chip 8-bit microcontrollers SEE DETAIL B SEATING PLANE 4.83 (0.190) 3.94 (0.155) 40X 1.27 (0.050) 17.65 (0.656) 17.40 (0.685) 3 X 0.63 (0.025) R MIN. 3 16.89 (0.665) 16.00 (0.630) 17.65 (0.695) 17.40 (0.685) 3.05 (0.120) 2.29 (0.090) 1472A 2 1.02 (0.040) X 45° CHAMFER 45 17.65 (0.695) 17.40 (0.685) 16.89 (0.665) 16.00 (0.630) 3 Philips Semiconductors Product specification 80C31/80C51/87C51 44-PIN CERQUAD J-BEND (K) PACKAGE Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers DIP40: plastic dual in-line package; 40 leads (600 mil) 1996 Aug 16 26 80C31/80C51/87C51 SOT129-1 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers PLCC44: plastic leaded chip carrier; 44 leads 1996 Aug 16 80C31/80C51/87C51 SOT187-2 27 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm 1996 Aug 16 28 SOT307-2 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers NOTES 1996 Aug 16 29 80C31/80C51/87C51 Philips Semiconductors Product specification CMOS single-chip 8-bit microcontrollers 80C31/80C51/87C51 DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Philips Semiconductors and Philips Electronics North America Corporation register eligible circuits under the Semiconductor Chip Protection Act. Copyright Philips Electronics North America Corporation 1996 All rights reserved. Printed in U.S.A.