REVISIONS LTR DESCRIPTION A Update paragraphs to current requirements. - ro DATE APPROVED 13-04-04 C. SAFFLE CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV A A A A A A A A A A A A A A PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER Original date of drawing YY-MM-DD CHECKED BY RAJESH PITHADIA 07-12-18 TITLE MICROCIRCUIT, LINEAR, DC/DC POWER SWITCHING REGULATOR, MONOLITHIC SILICON APPROVED BY ROBERT M. HEBER SIZE A REV AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CODE IDENT. NO. DWG NO. V62/08608 16236 A PAGE 1 OF 14 5962-V055-13 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance DC/DC power switching regulator microcircuit, with an operating temperature range of -55°C to +125°C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V62/08608 - Drawing number 01 X B Device type (See 1.2.1) Case outline (See 1.2.2) Lead finish (See 1.2.3) 1.2.1 Device type(s). Device type Generic 01 ISL8560 Circuit function DC/DC power switching regulator 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Number of pins X 20 JEDEC PUB 95 Package style MO-220 Plastic quad leadless package 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator A B C D E Z DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Material Hot solder dip Tin-lead plate Gold plate Palladium Gold flash palladium Other SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 2 1.3 Absolute maximum ratings. 1/ Input voltage (VIN) ...................................................................................................... GND – 0.3 V to 72 V Voltage at BOOT pin .................................................................................................. GND – 0.3 V to 82 V LX and RTCT pins ...................................................................................................... GND – 0.3 V to 60 V REF, FB, SS, EN , SYNC, PGOOD pins .................................................................... VCC5 pin .................................................................................................................... Power dissipation (PD) : At +25°C ................................................................................................................. At +125°C ............................................................................................................... Junction temperature (TJ) .......................................................................................... 8V GND – 0.3 V to 5.5 V 3W 0.5 W +150°C Storage temperature range (TSTG) ............................................................................ -65°C to +150°C Thermal resistance, junction to case (θJC) ................................................................. 1.5°C/W 2/ Thermal resistance, junction to ambient (θJA) ............................................................ 30°C/W 3/ 1.4 Recommended operating conditions. 4/ Supply voltage range (VCC) ....................................................................................... 9.0 V to 60 V Ambient temperature range (TA) ................................................................................ -55°C to +125°C 1/ 2/ 3/ 4/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. For θJC, the case temperature location is the center of the exposed metal pad on the package underside. The θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with direct attach features. See manufacturer’s technical brief TB379. Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 3 2. APPLICABLE DOCUMENTS JEDEC Solid State Technology Association JEDEC PUB 95 – Registered and Standard Outlines for Semiconductor Devices (Applications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http://www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as follows: A. B. C. Manufacturer’s name, CAGE code, or logo Pin 1 identifier ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2. 3.5.3 Block diagram. The block diagram shall be as shown in figure 3. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 4 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions 2/ Temperature, TA Device type Limits Unit Min Max 9.0 60 V 62 µA VIN supply section Input voltage range VIN -55°C to +125°C 01 -55°C to +125°C 01 VIN supply current section Shut down current IDD VIN = 9 V, EN = high 145 VIN = 60 V, EN = high Operating current IDD 01 -55°C to +125°C VIN = 9 V, VFB = 1.5 V 4 8.0 VIN = 60 V, VFB = 1.5 V VCC5 supply section VCC5 output voltage mA A 1 µF capacitor is needed from VCC5 to GND -55°C to +125°C 01 -55°C to +125°C 01 Rising UV threshold -55°C to +125°C 01 UV threshold hysteresis -55°C to +125°C VIN = 9.0 V to 60 V, 4.9 5.1 V 1.4 mA 7.76 8.91 V 01 0.17 0.55 V VIN - 5 V IL = 0 mA to 5 mA Maximum output current VIN = 24 V Input undervoltage (UV) section Buck threshold section Output voltage 3/ IOUT = 2 A -55°C to +125°C 01 1.2 Maximum duty cycle F = 300 kHz -55°C to +125°C 01 90 Minimum controllable on time F = 300 kHz +25°C 01 % 150 typical ns See footnotes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 5 TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions 2/ Temperature, TA Device type Limits Min Unit Max Oscillator section Total variation on set frequency Over the VIN range with frequency set by external resistor and capacitor at RTCT +25°C 01 ±10 typical % Frequency range (set by RTCT) fOSC -55°C to +125°C 01 100 600 kHz SYNC range fOSC -55°C to +125°C 01 100 600 kHz Tested oscillation frequency fOSC +25°C 01 VIN = 9 V to 60 V, 60 typical kHz RT = 100 kΩ, CT = 1200 pF 275 typical VIN = 9 V to 60 V, RT = 27.4 kΩ, CT = 220 pF Maximum ramp amplitude ∆VOSC Modular gain VVIN / VIN = 9 V +25°C 01 1 typical +25°C 01 9 typical -55°C to +125°C 01 +25°C 01 1.21 typical V µA VP ∆VOSC Minimum off time 300 ns Reference and soft start section Internal reference voltage VREF Soft start current ISS -55°C to +125°C 01 8 Soft start threshold VSOFT -55°C to +125°C 01 0.8 12 V See footnotes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 6 TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions 2/ Temperature, TA Device type Limits Unit Min Max 3.9 7.2 Error amplifier section Transconductance gm -55°C to +125°C 01 Gain bandwidth product GBW +25°C 01 6 typical MHz Slew rate SR +25°C 01 15 typical V/µs COMP pin drive ICOMP +25°C 01 ±200 typical µA Internal feedback voltage VFB VIN = 9.0 V to 60 V -55°C to +125°C 01 Internal feedback bias current IFB VFB = 1.20 V -55°C to +125°C 01 1.194 mMho 1.222 V ±100 nA Overcurrent protection section Dynamic current limit on time tOCON +25°C 01 16 typical Clock pulse Dynamic current limit off time tOCOFF +25°C 01 4 typical SS cycle Switch current limit ILIMIT +25°C 01 3.2 4.8 A -55°C to +125°C 01 85 89 % 111 115 Power good (open drain) section Power good lower threshold VPG- Fraction of the VOUT set point, ∼3 µs noise filter VPG+ PGOOD leakage current IPGLKG PGOOD voltage low VPULLUP = 5.5 V -55°C to +125°C 01 1 µA IPGOOD = 4 mA -55°C to +125°C 01 0.5 V See footnotes at end of table. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 7 TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions 2/ Temperature, TA Device type Limits Min Unit Max MOSET section Switch on resistance rDS(ON) IOUT = 2 A, VBOOT = VIN + 5.0 V, tested at wafer level -55°C to +125°C 01 0.355 Ω EN section Input high level (asserted) VINHIGH -55°C to +125°C 01 2.6 V Input low level (unasserted) VINLOW -55°C to +125°C 01 1.2 V Input current high IENHIGH VIN = 24 V -55°C to +125°C 01 30 µA Input current low IENLOW VIN = 24 V -55°C to +125°C 01 30 µA SYNC section Input high level (asserted) VINHIGH -55°C to +125°C 01 2.6 V Input low level (unasserted) VINLOW -55°C to +125°C 01 1.2 V Input current high ISYNCHIGH -55°C to +125°C 01 0.2 µA Input current low ISYNCLOW -55°C to +125°C 01 0.2 µA +25°C 01 150 typical °C +25°C 01 15 typical °C Thermal shut down section Thermal shut down temperature Rising threshold Thermal shut down hysteresis 1/ Testing and other quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization and/or design. 2/ Unless otherwise specified, VIN = 48 V, VOUT = 5.0 V, and IOUT = 0 A. 3/ Additional heat sinking may be required to insure that the junction temperature does not exceed above +125°C. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 8 Case X FIGURE 1. Case outline. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 9 Case X - continued Dimensions Inches Symbol Millimeters Notes Min Max Min Max A .031 .039 0.80 1.00 A1 --- .001 --- 0.05 A2 --- .039 --- 1.00 6 b .011 .014 0.28 0.38 3, 5 D .236 BSC 6.00 BSC D1 .226 BSC 5.75 BSC E .236 BSC 6.00 BSC E1 .226 BSC 5.75 BSC e .031 BSC 0.80 BSC e1 .125 BSC 3.20 BSC S --- .024 --- 6 6 0.60 6 NOTES: 1. Controlling dimensions are millimeter, inch dimensions are given for reference only. 2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994. 3. Dimension “b” lead width applies to the metallized terminal and is measured between 0.15 mm ( .005 inch ) and 0.30 mm ( .011 inch ) from the terminal tip. 4. The configuration of the pin 1 identifier is optional, but must be located within the zone indicated. The pin 1 identifier may be either a mold or mark feature. 5. Nominal dimensions are provide to assist with printed circuit board land pattern design efforts, see manufacturer’s technical brief TB389. 6. Features and dimensions A2, D1, E1 and S are present when anvil singulation method is used and not present for saw singulation. 7. Falls within JEDEC MO-220VJJB. FIGURE 1. Case outline - Continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 10 Device type 01 Case outline X Terminal number Terminal symbol 1 LX 2 LX 3 BOOT 4 EN 5 VCC5 6 SYNC 7 RTCT 8 SGND 9 FB 10 COMP 11 REF 12 PGOOD 13 PGND 14 SS 15 LX 16 LX 17 VIN 18 VIN 19 VIN 20 VIN FIGURE 2. Terminal connections. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 11 Terminal symbol LX BOOT Description There are four output pins that must be connected together externally in normal operation. A capacitor is connected from this pin to the output pin. An internal 10 V supply and an internal schottky diode provide the high side voltage to drive the gate of the output DMOS device. The EN input will disable the part and shut down all function when it is held high or left EN open. The EN current will be 10 µA typical. An internal pull up resistor will hold the pin high. When EN = low, the part is enabled. Connect to GND for auto start up. VCC5 VCC5 is the +5.0 V output pin which provides an output of an internal supply for supply filtering purposes. A 1 µF capacitor should be connected from this pin to GND. Internal VDD supply is set at 5.0 V (not planned that the user would use this supply). SYNC This pin provides a digital input pin to synchronize the internal oscillator to an external signal. When the sync function is not used, this pin can be left open or tied to GND. If the sync function is used, the RTCT timing must be set to a frequency lower than the sync input frequency. The termination of the ramp is synchronized with the rising edge of the sync input signal. There are no duty cycle restrictions on the input sync signal. Input thresholds are TTL compatible. RTCT A resistor to VIN and a capacitor to GND determine the frequency of the saw tooth oscillator. Resistor range, R = 20 kΩ to 100 kΩ. Capacitor range, C = 470 pF to 1.2 nF. The oscillator amplitude will vary from approximately 0.9 V to 10 V as VIN changes from 8.5 V to 60 V to maintain constant frequency and provide feed forward. The oscillator will have a fixed off time, which will establish the maximum on time for the regulator. This off time will be < 200 ns. The maximum duty cycle for a 500 kHz system will therefore be approximately 90% as the frequency of the maximum duty cycle will increase (95% for 25 kHz system). The minimum duty cycle is zero. SGND The SGND terminal of the device provides the return path for the control and monitor portions of the integrated circuit. FB COMP REF PGOOD PGND This is the feedback pin. The feedback ratio is set by an external resistor divider connected to the load. This pin is connected to the output of the error amplifier and is used to compensate the loop. The error amplifier is a GM amplifier. 1.20 V reference output. Bypass to GND with 0.01 µF capacitor. This pin is open drain output that is turned on when the feedback voltage is more than ±10 % from the reference voltage, indicating that the output is not within 10% of set point. This pin is used as the ground connection of the power train. SS A capacitor is connected from this pin to GND to determine the soft start timing. The soft start pin internal charging current is 10 µA. VIN The input supply for the pulse width modulator (PWM) regulator power stage. Connected to drain of the high side MOSFET. FIGURE 2. Terminal connections –continued. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 12 FIGURE 3. Block diagram. DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 13 4. VERIFICATION 4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices, classification, packaging, and labeling of moisture sensitive devices, as applicable. 5. PREPARATION FOR DELIVERY 5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial practices for electrostatic discharge sensitive devices. 6. NOTES 6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum. 6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book. The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided. 6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guarantee of present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Vendor item drawing administrative control number 1/ Device manufacturer CAGE code Vendor part number 2/ V62/08608-01XB 34371 ISL8560MREP 1/ The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation. 2/ Add –TK suffix to vendor part number for 1000 piece quantity with tape and reel packing option. CAGE code 34371 DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Source of supply Intersil Corporation 1001 Murphy Ranch Road Milpitas, CA 95035-6803 SIZE A CODE IDENT NO. 16236 REV A DWG NO. V62/08608 PAGE 14