160L -TQFP Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 AZ 1,869.3010 mg Body Size (mil/mm) Package Weight – Site 2 24x24x1.4 mm 1,865.6340 mg SUMMARY The 160L- TQFP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1 : Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 034101 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ160ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05085 Rev. *F Page 1 of 5 160L -TQFP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Lead Finish Die Attach Purpose of Use Base Material External Plating Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Copper Nickel Silicon 7440-50-8 7440-02-0 7440-21-3 461.511 14.349 3.103 % weight of substance per Homogenous material 95.2000% 2.9600% 0.6400% Magnesium Silver Sn 7439-95-4 7440-22-4 7440-31-5 0.727 5.090 18.700 0.1500% 1.0500% 100.0000% 389 2,723 10,004 0.0389% 0.2723% 1.0004% Silver Epoxy Resin Copper GammaButyrolactone Aromatic Hydrocarbons Silicon Au Epoxy Resin Phenol Resin Aromatic Phosphate Silica Others 7440-22-4 Trade Secret 7440-50-8 96-48-0 2.490 0.700 0.110 0.110 70.7400% 19.8900% 3.1300% 3.1300% 1,332 375 59 59 0.1332% 0.0375% 0.0059% 0.0059% Trade Secret 0.110 3.1300% 59 0.0059% 7440-21-3 7440-57-5 85954-11-6 26834-02-6 139189-30-3 16.800 7.200 66.915 53.532 20.075 100.0000% 100.0000% 5.0000% 4.0000% 1.5000% 8,987 3,852 35,797 28,637 10,739 0.8987% 0.3852% 3.5797% 2.8637% 1.0739% 60676-86-0 Trade Secret 1184.396 13.383 88.5000% 1.0000% 633,604 7,159 63.3604% 0.7159% Substance Composition CAS Number Package Weight (mg): Weight by mg 1,869.3010 PPM % weight of substance per package 246,889 7,676 1,660 24.6889% 0.7676% 0.1660% % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05085 Rev. *F Page 2 of 5 160L -TQFP Pb-Free Package ASSEMBLY Site 2: Amkor Technology Bupyeong Korea Package Qualification Report # 064701 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AZ160Amkor Bupyeong As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05085 Rev. *F Page 3 of 5 160L -TQFP Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Lead Finish Substance Compositio n Purpose of Use Base Material Frame Plating External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Cr Sn Zn Ag Sn 7440-50-8 7440-47-3 7440-31-5 7440-66-6 7440-22-4 7440-31-5 Anhydride Epoxy Resin Ag Si Au Epoxy Resin Phenol resin Silica Fused Carbon Black Trade Secret Trade Secret 7440-22-4 7440-21-3 7440-57-5 Trade Secret Trade Secret 60676-86-0 1333-86-4 Package Weight (mg): 361.6179 1.0980 0.7320 0.7320 1.4640 8.7300 98.8000% 0.3000% 0.2000% 0.2000% 0.4000% 100.0000% 193831 589 392 392 785 4679 % weight of substance per package 19.3831% 0.0589% 0.0392% 0.0392% 0.0785% 0.4679% 0.4210 0.8391 2.9499 30.4100 6.6900 115.9960 50.7483 1275.9560 7.2498 10.0000% 19.9300% 70.0700% 100.0000% 100.0000% 8.0000% 3.5000% 88.0000% 0.5000% 226 450 1581 16300 3586 62175 27202 683926 3886 0.0226% 0.0450% 0.1581% 1.6300% 0.3586% 6.2175% 2.7202% 68.3926% 0.3886% Weight by mg CAS Number % weight of substance per Homogeneou s material 1865.6340 PPM % Total: 100.0000 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Lead PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cadmium PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Cr VI PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Mercury PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 PBB PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 PBDE PPM <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 <5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05085 Rev. *F Page 4 of 5 160L -TQFP Pb-Free Package Document History Page Document Title: Document Number: Rev. 160L-TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-05085 ** *A ECN No. Orig. of Change 399798 YXP 644157 EBZ *B 2614560 HLR *C Dcon 3492974 HLR *D 4043504 YUM *E *F 4644633 HLR 5123002 HLR SLLO Description of Change New specification. Changed Cypress Logo. Added Amkor Korea (Q) as alternate site. Added ASSEMBLY Site 2 – Package Qualification Report # 064701 (See Note 1) Changed CAS Number of Gold on Assembly Site 1. Deleted Ion Impurities on Assembly Site 1. Added the %weight of homogenous on material composition table on Assembly Site 1. Completed the RoHS substance on Indirect Material table for Assembly Site 1 and Changed the value of RoHS Substances for Assembly Site 2. Replaced CML with WEB in distribution list. Updated the material composition table for Assembly Sites 1 and 2 to reflect 4 decimal places on values. Added Assembly site name in the Assembly heading in site 1 and 2. Changed Assembly code to Assembly Site Name in site 1 and 2. Sunset due – No Change Changed the substances with “------------- “to “Trade Secret Removed Distribution and Posting from the document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No.001-05085 Rev. *F Page 5 of 5