160L -TQFP PB-FREE Package Material Declaration Datasheet.pdf

160L -TQFP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
AZ
1,869.3010 mg
Body Size (mil/mm)
Package Weight – Site 2
24x24x1.4 mm
1,865.6340 mg
SUMMARY
The 160L- TQFP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing
an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS)
requirement.
ASSEMBLY Site 1 : Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 034101 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ160ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05085 Rev. *F
Page 1 of 5
160L -TQFP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Leadframe
Lead Finish
Die Attach
Purpose of
Use
Base Material
External
Plating
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper
Nickel
Silicon
7440-50-8
7440-02-0
7440-21-3
461.511
14.349
3.103
% weight of
substance per
Homogenous
material
95.2000%
2.9600%
0.6400%
Magnesium
Silver
Sn
7439-95-4
7440-22-4
7440-31-5
0.727
5.090
18.700
0.1500%
1.0500%
100.0000%
389
2,723
10,004
0.0389%
0.2723%
1.0004%
Silver
Epoxy Resin
Copper
GammaButyrolactone
Aromatic
Hydrocarbons
Silicon
Au
Epoxy Resin
Phenol Resin
Aromatic
Phosphate
Silica
Others
7440-22-4
Trade Secret
7440-50-8
96-48-0
2.490
0.700
0.110
0.110
70.7400%
19.8900%
3.1300%
3.1300%
1,332
375
59
59
0.1332%
0.0375%
0.0059%
0.0059%
Trade Secret
0.110
3.1300%
59
0.0059%
7440-21-3
7440-57-5
85954-11-6
26834-02-6
139189-30-3
16.800
7.200
66.915
53.532
20.075
100.0000%
100.0000%
5.0000%
4.0000%
1.5000%
8,987
3,852
35,797
28,637
10,739
0.8987%
0.3852%
3.5797%
2.8637%
1.0739%
60676-86-0
Trade Secret
1184.396
13.383
88.5000%
1.0000%
633,604
7,159
63.3604%
0.7159%
Substance
Composition
CAS Number
Package Weight (mg):
Weight by
mg
1,869.3010
PPM
% weight of
substance
per package
246,889
7,676
1,660
24.6889%
0.7676%
0.1660%
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Lead
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Cadmium
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Cr VI
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05085 Rev. *F
Page 2 of 5
160L -TQFP
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Bupyeong Korea
Package Qualification Report # 064701 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-AZ160Amkor Bupyeong
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05085 Rev. *F
Page 3 of 5
160L -TQFP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Leadframe
Lead Finish
Substance
Compositio
n
Purpose of
Use
Base Material
Frame Plating
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
Cr
Sn
Zn
Ag
Sn
7440-50-8
7440-47-3
7440-31-5
7440-66-6
7440-22-4
7440-31-5
Anhydride
Epoxy Resin
Ag
Si
Au
Epoxy Resin
Phenol resin
Silica Fused
Carbon
Black
Trade Secret
Trade Secret
7440-22-4
7440-21-3
7440-57-5
Trade Secret
Trade Secret
60676-86-0
1333-86-4
Package Weight (mg):
361.6179
1.0980
0.7320
0.7320
1.4640
8.7300
98.8000%
0.3000%
0.2000%
0.2000%
0.4000%
100.0000%
193831
589
392
392
785
4679
% weight
of
substance
per
package
19.3831%
0.0589%
0.0392%
0.0392%
0.0785%
0.4679%
0.4210
0.8391
2.9499
30.4100
6.6900
115.9960
50.7483
1275.9560
7.2498
10.0000%
19.9300%
70.0700%
100.0000%
100.0000%
8.0000%
3.5000%
88.0000%
0.5000%
226
450
1581
16300
3586
62175
27202
683926
3886
0.0226%
0.0450%
0.1581%
1.6300%
0.3586%
6.2175%
2.7202%
68.3926%
0.3886%
Weight by
mg
CAS Number
% weight of
substance per
Homogeneou
s material
1865.6340
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Lead
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Cadmium
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Cr VI
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order
to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05085 Rev. *F
Page 4 of 5
160L -TQFP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
160L-TQFP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-05085
**
*A
ECN No. Orig. of
Change
399798
YXP
644157
EBZ
*B
2614560 HLR
*C
Dcon
3492974 HLR
*D
4043504 YUM
*E
*F
4644633 HLR
5123002 HLR
SLLO
Description of Change
New specification.
Changed Cypress Logo.
Added Amkor Korea (Q) as alternate site.
Added ASSEMBLY Site 2 – Package Qualification Report #
064701 (See Note 1)
Changed CAS Number of Gold on Assembly Site 1.
Deleted Ion Impurities on Assembly Site 1.
Added the %weight of homogenous on material composition table
on Assembly Site 1.
Completed the RoHS substance on Indirect Material table for
Assembly Site 1 and Changed the value of RoHS Substances for
Assembly Site 2.
Replaced CML with WEB in distribution list.
Updated the material composition table for Assembly Sites 1 and
2 to reflect 4 decimal places on values.
Added Assembly site name in the Assembly heading in site 1 and
2.
Changed Assembly code to Assembly Site Name in site 1 and 2.
Sunset due – No Change
Changed the substances with “------------- “to “Trade Secret
Removed Distribution and Posting from the document history
page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No.001-05085 Rev. *F
Page 5 of 5