56L - QFN Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 Package Weight – Site 3 Package Weight – Site 5 LY / LT 188 mg 185 mg 190 mg Body Size (mil/mm) Package Weight – Site 2 Package Weight – Site 4 Package Weight – Site 6 8x8 mm 125 mg 184 mg 195 mg SUMMARY The 56L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1 – Package Qualification Report # 031803 II. DECLARATION OF PACKAGED UNITS II. BANNED SUBSTANCES (Note 1) Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LY56-L As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 1 of 13 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substance Composition Purpose of Use Leadframe Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Fe P Zn Ag Sn Resin Ag Metal oxide Amine Gamma Butyrolactone Si Au Phenol Resin Epoxy Resin Carbon Black Silica Fused 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-22-4 7440-31-5 ------------------7440-22-4 ------------------------------------96-48-0 100.70 2.43 0.03 0.12 1.01 3.95 0.50 1.67 0.07 0.07 0.07 %weight of substan ce per Homoge neous material 96.56 2.33 0.03 0.12 0.97 100 21.01 70.17 2.94 2.94 2.94 7440-21-3 7440-57-5 (Trade secret ) (Trade secret ) (1333-86-4) 60676-86-0 14.78 1.34 4.04 5.51 0.25 51.46 100 100.00 6.6 9 0.4 84 CAS Number Weight by mg Package Weight (mg): 188 % weight of substance per package PPM 535,638 12,926 160 638 5,372 21,011 2,660 8,883 372 372 372 53.56% 1.29% 0.02% 0.07% 0.54% 2.10% 0.27% 0.89% 0.04% 0.04% 0.04% 78,617 7,128 21,489 29,309 1,330 273,723 7.86% 0.71% 2.15% 2.93% 0.13% 27.37% % Total: 100 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Tube Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 Plastic Tube End Plug End Pin Shielding bag N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 PBDE PPM Analysis Report (Note2) <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 N/A N/A N/A <5.0 N/A N/A N/A <5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M N/A N/A N/A CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 2 of 13 56L - QFN Pb-Free Package ASSEMBLY Site 2 – Package Qualification Report # 073701 II. DECLARATION OF PACKAGED UNITS II. BANNED SUBSTANCES (Note 1) Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56-AT As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 3 of 13 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substance Composition Purpose of Use Leadframe Base Material Lead finish External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation Cu Fe P Zn Ni Pd Au Silver (Ag) Epoxy Resin t-Butyl phenyl glycidyl ether Dicyadiamide Hardener Silicon Au Silica Fused Epoxy Resin Phenol Resin Carbon Black 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 9003-36-5 3101-60-8 29.83 0.77 0.05 0.06 1.29 0.10 0.02 1.50 0.32 0.22 %weight of substan ce per Homoge neous material 97.15 2.5 0.15 0.20 92.00 6.90 1.10 70.00 15.00 10.00 461-58-5 620-92-8 7440-21-3 7440-57-5 60676-86-0 1333-86-4 0.01 0.01 12.02 0.81 70.30 3.91 3.52 0.39 0.4 4.60 100.00 100.00 90.00 5.00 4.50 0.50 CAS Number Weight by mg Package Weight (mg): 125 % weight of substance per package PPM 238,253 6,131 367 490 10,289 771 123 11,998 2,571 1,714 23.83% 0.61% 0.04% 0.05% 1.03% 0.08% 0.01% 1.20% 0.26% 0.17% 68 788 96,002 6,437 561,594 31,199 28,079 3,119 0.01% 0.08% 9.60% 0.64% 56.16% 3.12% 2.81% 0.31% % Total: 100 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Tube Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 Plastic Tube End Plug End Pin Shielding bag N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 PBDE PPM Analysis Report (Note2) <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 N/A N/A N/A <5.0 N/A N/A N/A <5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M N/A N/A N/A CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 4 of 13 56L - QFN Pb-Free Package ASSEMBLY Site 3 – Package Qualification Report # 084005 II. DECLARATION OF PACKAGED UNITS II. BANNED SUBSTANCES (Note 1) Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56-AE As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 5 of 13 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substance Composition Purpose of Use Cu Fe P Zn Ni Pd Au Ag Silver (Ag) Epoxy Resin Acrylic resin Polybutadiene derivative Butadiene copolymer Acrylate Peroxide Additive Silicon Au Pd Silica Fused Epoxy Resin Phenol Resin Carbon Black Base Material Leadframe External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 9003-36-5 proprietary proprietary 68.58 1.64 0.02 0.11 0.86 0.04 0.02 0.01 1.65 0.05 0.17 0.11 %weight of substan ce per Homoge neous material 97.48 2.33 0.03 0.16 92.47 4.30 2.15 1.08 77.00 2.50 8.00 5.00 proprietary 0.02 1.00 108 0.01% proprietary proprietary proprietary 7440-21-3 7440-57-5 7440-05-3 60676-86-0 proprietary proprietary 1333-86-4 0.11 0.01 0.02 16.63 0.86 0.01 81.38 7.53 4.70 0.47 5.00 0.50 1.00 100.00 99.00 1.00 86.50 8.00 5.00 0.50 595 54 108 89,892 4,649 54 439,892 40,703 25,405 2,541 0.06% 0.01% 0.01% 8.99% 0.46% 0.01% 43.99% 4.07% 2.54% 0.25% CAS Number Weight by mg Package Weight (mg): 185 % weight of substance per package PPM 370,703 8,865 108 595 4,649 216 108 54 8,919 270 919 595 37.07% 0.89% 0.01% 0.06% 0.46% 0.02% 0.01% 0.01% 0.89% 0.03% 0.09% 0.06% % Total: 100 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Tube Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 Plastic Tube End Plug End Pin Shielding bag N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 PBDE PPM Analysis Report (Note2) <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 N/A N/A N/A <5.0 N/A N/A N/A <5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M N/A N/A N/A CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 6 of 13 56L - QFN Pb-Free Package ASSEMBLY Site 4 – Package Qualification Report # 092006 II. DECLARATION OF PACKAGED UNITS II. BANNED SUBSTANCES (Note 1) Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56-RA As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 7 of 13 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substance Composition Purpose of Use Cu Ni Si Mg Ni Pd Au Silver Proprietary Bismaleimide Proprietary Polymer Methacrylate Acrylate Ester Organic Peroxide Silicon Au Pd Silica Fused Metal OH Phenol Resin Epoxy Resin Carbon Black Base Material Leadframe External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-02-0 7440-05-3 7440-57-5 7440-22-4 -------------- 80.48 2.51 0.54 0.13 1.68 0.03 0.03 0.947 0.11 %weight of substance per Homogeneous material 96.20 3.00 0.65 0.15 96.52 1.73 1.74 80.00 9.00 -------------- 0.06 5.00 322 0.03 ---------------------------------------7440-21-3 7440-57-5 7440-05-3 60676-86-0 1309-42-8 --------------------------------1333-86-4 0.02 0.02 0.02 16.57 3.07 0.03 68.80 2.33 3.11 3.11 0.39 2.00 2.00 2.00 100.00 99.00 1.00 88.50 3.00 4.00 4.00 0.50 129 129 129 90,068 16,705 169 373,907 12,675 16,900 16,900 2,112 0.01 0.01 0.01 9.01 1.67 0.02 37.39 1.27 1.69 1.69 0.21 CAS Number Weight by mg Package Weight (mg): 184 PPM % weight of substance per package 437,390 13,640 2,955 682 9,134 164 165 5,147 579 43.74 1.36 0.30 0.07 0.91 0.02 0.02 0.51 0.06 % Total: 100 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Tube Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 Plastic Tube End Plug End Pin Shielding bag N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 PBDE PPM Analysis Report (Note2) <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 N/A N/A N/A <5.0 N/A N/A N/A <5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M N/A N/A N/A CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 8 of 13 56L - QFN Pb-Free Package ASSEMBLY Site 5 – Package Qualification Report #094101 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56-MB As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 9 of 13 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substance Composition Purpose of Use Cu Fe P Zn Ni Pd Au Ag Silver (Ag) Acrylate Bismaleimide Methacrylate Ester Polymer Silicon Au Silica Fused Epoxy Resin Phenol Resin Carbon Black Crystallin silica Metal hydro oxide Base Material Leadframe External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 7440-22-4 proprietary proprietary proprietary 107.70 2.60 0.03 0.13 1.45 0.03 0.01 %weight of substan ce per Homoge neous material 97.50 2.35 0.03 0.12 97.51 2.09 0.40 1.95 0.26 0.07 0.07 82.00 11.00 3.00 3.00 10,261 1,377 375 375 1.03% 0.14% 0.04% 0.04% proprietary 7440-21-3 7440-57-5 60676-86-0 proprietary proprietary 1333-86-4 14808-60-7 proprietary 0.02 14.79 0.86 39.14 5.42 5.42 0.30 1.20 8.73 1.00 100.00 100.00 65.00 9.00 9.00 0.50 2.00 14.5 125 77,766 4,522 205,779 28,492 28,492 1,583 6,332 45,905 0.01% 7.78% 0.45% 20.58% 2.85% 2.85% 0.16% 0.63% 4.59% CAS Number Weight by mg Package Weight (mg): 190 % weight of substance per package PPM 566,290 13,650 174 699 7,608 163 32 56.63% 1.36% 0.02% 0.07% 0.76% 0.02% 0.00% % Total: 100 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Tube Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 Plastic Tube End Plug End Pin Shielding bag N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 PBDE PPM Analysis Report (Note2) <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 N/A N/A N/A <5.0 N/A N/A N/A <5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M N/A N/A N/A CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 10 of 13 56L - QFN Pb-Free Package ASSEMBLY Site 6 – Package Qualification Report # 083804 II. DECLARATION OF PACKAGED UNITS II. BANNED SUBSTANCES (Note 1) Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-LT56-CA As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 11 of 13 56L - QFN Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Substance Composition Purpose of Use Cu Fe P Zn Ni Pd Au Silver (Ag) Carbocycllic Acrylate Bismaleimide resin Acrylate Additive Silicon Au Silica Fused Epoxy Resin Phenol Resin Carbon Black Base Material Leadframe External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation 7440-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 7440-05-3 7440-57-5 7440-22-4 Proprietary 98.73 2.31 0.02 0.13 1.18 0.10 0.02 0.37 0.10 %weight of substan ce per Homoge neous material 97.56 2.28 0.02 0.13 90.91 7.91 1.19 69.25 19.51 Proprietary 0.02 2.93 80 0.01% Proprietary Proprietary 7440-21-3 7440-57-5 60676-86-0 proprietary proprietary 1333-86-4 0.02 0.02 5.21 1.30 79.93 2.56 2.56 0.26 4.16 4.16 100.0 100.0 93.70 3.00 3.00 0.30 114 114 26741 6672 410234 13134 13134 1313 0.01% 0.01% 2.67% 0.67% 41.02% 1.31% 1.31% 0.13% CAS Number Weight by mg Package Weight (mg): 195 % weight of substance per package PPM 506724 11868 126 658 6050 526 79 1899 535 50.67% 1.19% 0.01% 0.07% 0.60% 0.05% 0.01% 0.19% 0.05% % Total: 100 II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Tube Others Material Lead PPM Cr VI PPM Mercury PPM PBB PPM <20.0 <5.0 < 5.0 < 5.0 Cadmiu m PPM <20.0 <5.0 < 5.0 < 5.0 Cover tape Carrier tape Plastic Reel Tray <20.0 <5.0 < 5.0 < 5.0 <20.0 <10.0 < 10.0 < 10.0 Plastic Tube End Plug End Pin Shielding bag N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 N/A N/A N/A <2.0 PBDE PPM Analysis Report (Note2) <20.0 <50.0 <50.0 <50.0 <20.0 <45.0 <45.0 <45.0 N/A N/A N/A <5.0 N/A N/A N/A <5.0 CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-TRAY-M N/A N/A N/A CoA-SBAG –R CoA-SBAG –M Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 12 of 13 56L - QFN Pb-Free Package Document History Page Document Title: Document Number: 56L - QFN Pb-Free Package Material Declaration Datasheet 001-04327 Rev. ECN No. Orig. of Change ** 390888 YXP *A 596678 YRB *B 2126426 DPT *C 2134167 DPT *D 2558465 MAHA *E *F *G 2599497 DPT 2652755 HLR 2712536 HLR *H *I 2785767 DPT 2746946 EBZ Description of Change New Specification Added column for %weight of substance per homogeneous material in material composition. Added column for Lead, Cr VI, PBB, PBDE in declaration of packaging indirect materials. Removed the following indirect materials such as moisture barrier bag, protective band, shipping and inner/pizza box. Updated Cypress Logo. Change assembly location from M to L on analysis report column under Banned Substances. Added LT on Cypress package code and Assembly Site 2 – Package Qualification Report # 073701. Changed the assembly code of Assembly Site 2 from COA-LT56-CA to COA-LT56-AT. Remove Ag substance on Leadframe. Add CAS Number for Pd. Corrected PPM values for Table B: Material Composition of Assembly Site 1. Added Assembly site 3 – QTP#084005. Added Assembly Site 4 – QTP No. 084613 Deleted Reference QTP on Assembly Site 4 and added QTP No. 092006. Added Assembly site 5 – QTP#094101. Added Assembly Site 6 – QTP No. 083804 Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information. Document No. 001-04327 Rev. *I Page 13 of 13