56L - QFN 001-04327

56L - QFN
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
Package Weight – Site 5
LY / LT
188 mg
185 mg
190 mg
Body Size (mil/mm)
Package Weight – Site 2
Package Weight – Site 4
Package Weight – Site 6
8x8 mm
125 mg
184 mg
195 mg
SUMMARY
The 56L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1 – Package Qualification Report # 031803
II.
DECLARATION OF PACKAGED UNITS
II.
BANNED SUBSTANCES
(Note 1)
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LY56-L
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 1 of 13
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substance
Composition
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
Fe
P
Zn
Ag
Sn
Resin
Ag
Metal oxide
Amine
Gamma
Butyrolactone
Si
Au
Phenol Resin
Epoxy Resin
Carbon Black
Silica Fused
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-22-4
7440-31-5
------------------7440-22-4
------------------------------------96-48-0
100.70
2.43
0.03
0.12
1.01
3.95
0.50
1.67
0.07
0.07
0.07
%weight
of
substan
ce per
Homoge
neous
material
96.56
2.33
0.03
0.12
0.97
100
21.01
70.17
2.94
2.94
2.94
7440-21-3
7440-57-5
(Trade secret )
(Trade secret )
(1333-86-4)
60676-86-0
14.78
1.34
4.04
5.51
0.25
51.46
100
100.00
6.6
9
0.4
84
CAS Number
Weight by
mg
Package Weight (mg):
188
% weight of
substance
per
package
PPM
535,638
12,926
160
638
5,372
21,011
2,660
8,883
372
372
372
53.56%
1.29%
0.02%
0.07%
0.54%
2.10%
0.27%
0.89%
0.04%
0.04%
0.04%
78,617
7,128
21,489
29,309
1,330
273,723
7.86%
0.71%
2.15%
2.93%
0.13%
27.37%
% Total:
100
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Tube
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
Plastic Tube
End Plug
End Pin
Shielding bag
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
PBDE
PPM
Analysis Report
(Note2)
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
N/A
N/A
N/A
<5.0
N/A
N/A
N/A
<5.0
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
N/A
N/A
N/A
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 2 of 13
56L - QFN
Pb-Free Package
ASSEMBLY Site 2 – Package Qualification Report # 073701
II.
DECLARATION OF PACKAGED UNITS
II.
BANNED SUBSTANCES
(Note 1)
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56-AT
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 3 of 13
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substance
Composition
Purpose of Use
Leadframe
Base Material
Lead finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Cu
Fe
P
Zn
Ni
Pd
Au
Silver (Ag)
Epoxy Resin
t-Butyl phenyl
glycidyl ether
Dicyadiamide
Hardener
Silicon
Au
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
9003-36-5
3101-60-8
29.83
0.77
0.05
0.06
1.29
0.10
0.02
1.50
0.32
0.22
%weight
of
substan
ce per
Homoge
neous
material
97.15
2.5
0.15
0.20
92.00
6.90
1.10
70.00
15.00
10.00
461-58-5
620-92-8
7440-21-3
7440-57-5
60676-86-0
1333-86-4
0.01
0.01
12.02
0.81
70.30
3.91
3.52
0.39
0.4
4.60
100.00
100.00
90.00
5.00
4.50
0.50
CAS Number
Weight by
mg
Package Weight (mg):
125
% weight of
substance
per
package
PPM
238,253
6,131
367
490
10,289
771
123
11,998
2,571
1,714
23.83%
0.61%
0.04%
0.05%
1.03%
0.08%
0.01%
1.20%
0.26%
0.17%
68
788
96,002
6,437
561,594
31,199
28,079
3,119
0.01%
0.08%
9.60%
0.64%
56.16%
3.12%
2.81%
0.31%
% Total:
100
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Tube
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
Plastic Tube
End Plug
End Pin
Shielding bag
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
PBDE
PPM
Analysis Report
(Note2)
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
N/A
N/A
N/A
<5.0
N/A
N/A
N/A
<5.0
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
N/A
N/A
N/A
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 4 of 13
56L - QFN
Pb-Free Package
ASSEMBLY Site 3 – Package Qualification Report # 084005
II.
DECLARATION OF PACKAGED UNITS
II.
BANNED SUBSTANCES
(Note 1)
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56-AE
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 5 of 13
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substance
Composition
Purpose of Use
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Silver (Ag)
Epoxy Resin
Acrylic resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Au
Pd
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Base Material
Leadframe
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
9003-36-5
proprietary
proprietary
68.58
1.64
0.02
0.11
0.86
0.04
0.02
0.01
1.65
0.05
0.17
0.11
%weight
of
substan
ce per
Homoge
neous
material
97.48
2.33
0.03
0.16
92.47
4.30
2.15
1.08
77.00
2.50
8.00
5.00
proprietary
0.02
1.00
108
0.01%
proprietary
proprietary
proprietary
7440-21-3
7440-57-5
7440-05-3
60676-86-0
proprietary
proprietary
1333-86-4
0.11
0.01
0.02
16.63
0.86
0.01
81.38
7.53
4.70
0.47
5.00
0.50
1.00
100.00
99.00
1.00
86.50
8.00
5.00
0.50
595
54
108
89,892
4,649
54
439,892
40,703
25,405
2,541
0.06%
0.01%
0.01%
8.99%
0.46%
0.01%
43.99%
4.07%
2.54%
0.25%
CAS Number
Weight by
mg
Package Weight (mg):
185
% weight of
substance
per
package
PPM
370,703
8,865
108
595
4,649
216
108
54
8,919
270
919
595
37.07%
0.89%
0.01%
0.06%
0.46%
0.02%
0.01%
0.01%
0.89%
0.03%
0.09%
0.06%
% Total:
100
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Tube
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
Plastic Tube
End Plug
End Pin
Shielding bag
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
PBDE
PPM
Analysis Report
(Note2)
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
N/A
N/A
N/A
<5.0
N/A
N/A
N/A
<5.0
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
N/A
N/A
N/A
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 6 of 13
56L - QFN
Pb-Free Package
ASSEMBLY Site 4 – Package Qualification Report # 092006
II.
DECLARATION OF PACKAGED UNITS
II.
BANNED SUBSTANCES
(Note 1)
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56-RA
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 7 of 13
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substance
Composition
Purpose of Use
Cu
Ni
Si
Mg
Ni
Pd
Au
Silver
Proprietary
Bismaleimide
Proprietary
Polymer
Methacrylate
Acrylate Ester
Organic Peroxide
Silicon
Au
Pd
Silica Fused
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Base Material
Leadframe
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
--------------
80.48
2.51
0.54
0.13
1.68
0.03
0.03
0.947
0.11
%weight of
substance per
Homogeneous
material
96.20
3.00
0.65
0.15
96.52
1.73
1.74
80.00
9.00
--------------
0.06
5.00
322
0.03
---------------------------------------7440-21-3
7440-57-5
7440-05-3
60676-86-0
1309-42-8
--------------------------------1333-86-4
0.02
0.02
0.02
16.57
3.07
0.03
68.80
2.33
3.11
3.11
0.39
2.00
2.00
2.00
100.00
99.00
1.00
88.50
3.00
4.00
4.00
0.50
129
129
129
90,068
16,705
169
373,907
12,675
16,900
16,900
2,112
0.01
0.01
0.01
9.01
1.67
0.02
37.39
1.27
1.69
1.69
0.21
CAS Number
Weight by
mg
Package Weight (mg):
184
PPM
% weight of
substance
per package
437,390
13,640
2,955
682
9,134
164
165
5,147
579
43.74
1.36
0.30
0.07
0.91
0.02
0.02
0.51
0.06
% Total:
100
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Tube
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
Plastic Tube
End Plug
End Pin
Shielding bag
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
PBDE
PPM
Analysis Report
(Note2)
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
N/A
N/A
N/A
<5.0
N/A
N/A
N/A
<5.0
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
N/A
N/A
N/A
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 8 of 13
56L - QFN
Pb-Free Package
ASSEMBLY Site 5 – Package Qualification Report #094101 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56-MB
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 9 of 13
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substance
Composition
Purpose of Use
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Silver (Ag)
Acrylate
Bismaleimide
Methacrylate
Ester
Polymer
Silicon
Au
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Crystallin silica
Metal hydro
oxide
Base Material
Leadframe
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
proprietary
proprietary
proprietary
107.70
2.60
0.03
0.13
1.45
0.03
0.01
%weight
of
substan
ce per
Homoge
neous
material
97.50
2.35
0.03
0.12
97.51
2.09
0.40
1.95
0.26
0.07
0.07
82.00
11.00
3.00
3.00
10,261
1,377
375
375
1.03%
0.14%
0.04%
0.04%
proprietary
7440-21-3
7440-57-5
60676-86-0
proprietary
proprietary
1333-86-4
14808-60-7
proprietary
0.02
14.79
0.86
39.14
5.42
5.42
0.30
1.20
8.73
1.00
100.00
100.00
65.00
9.00
9.00
0.50
2.00
14.5
125
77,766
4,522
205,779
28,492
28,492
1,583
6,332
45,905
0.01%
7.78%
0.45%
20.58%
2.85%
2.85%
0.16%
0.63%
4.59%
CAS Number
Weight by
mg
Package Weight (mg):
190
% weight of
substance
per
package
PPM
566,290
13,650
174
699
7,608
163
32
56.63%
1.36%
0.02%
0.07%
0.76%
0.02%
0.00%
% Total:
100
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Tube
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
Plastic Tube
End Plug
End Pin
Shielding bag
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
PBDE
PPM
Analysis Report
(Note2)
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
N/A
N/A
N/A
<5.0
N/A
N/A
N/A
<5.0
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
N/A
N/A
N/A
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 10 of 13
56L - QFN
Pb-Free Package
ASSEMBLY Site 6 – Package Qualification Report # 083804
II.
DECLARATION OF PACKAGED UNITS
II.
BANNED SUBSTANCES
(Note 1)
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT56-CA
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 11 of 13
56L - QFN
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substance
Composition
Purpose of Use
Cu
Fe
P
Zn
Ni
Pd
Au
Silver (Ag)
Carbocycllic
Acrylate
Bismaleimide
resin
Acrylate
Additive
Silicon
Au
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Base Material
Leadframe
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Proprietary
98.73
2.31
0.02
0.13
1.18
0.10
0.02
0.37
0.10
%weight
of
substan
ce per
Homoge
neous
material
97.56
2.28
0.02
0.13
90.91
7.91
1.19
69.25
19.51
Proprietary
0.02
2.93
80
0.01%
Proprietary
Proprietary
7440-21-3
7440-57-5
60676-86-0
proprietary
proprietary
1333-86-4
0.02
0.02
5.21
1.30
79.93
2.56
2.56
0.26
4.16
4.16
100.0
100.0
93.70
3.00
3.00
0.30
114
114
26741
6672
410234
13134
13134
1313
0.01%
0.01%
2.67%
0.67%
41.02%
1.31%
1.31%
0.13%
CAS Number
Weight by
mg
Package Weight (mg):
195
% weight of
substance
per
package
PPM
506724
11868
126
658
6050
526
79
1899
535
50.67%
1.19%
0.01%
0.07%
0.60%
0.05%
0.01%
0.19%
0.05%
% Total:
100
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape & Reel
Tray
Tube
Others
Material
Lead
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmiu
m
PPM
<20.0
<5.0
< 5.0
< 5.0
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
Plastic Tube
End Plug
End Pin
Shielding bag
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
N/A
N/A
N/A
<2.0
PBDE
PPM
Analysis Report
(Note2)
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
N/A
N/A
N/A
<5.0
N/A
N/A
N/A
<5.0
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
N/A
N/A
N/A
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 12 of 13
56L - QFN
Pb-Free Package
Document History Page
Document Title:
Document Number:
56L - QFN Pb-Free Package Material Declaration Datasheet
001-04327
Rev. ECN No. Orig. of
Change
**
390888
YXP
*A
596678
YRB
*B
2126426 DPT
*C
2134167 DPT
*D
2558465 MAHA
*E
*F
*G
2599497 DPT
2652755 HLR
2712536 HLR
*H
*I
2785767 DPT
2746946 EBZ
Description of Change
New Specification
Added column for %weight of substance per
homogeneous material in material composition.
Added column for Lead, Cr VI, PBB, PBDE in declaration
of packaging indirect materials.
Removed the following indirect materials such as
moisture barrier bag, protective band, shipping and
inner/pizza box.
Updated Cypress Logo.
Change assembly location from M to L on analysis report
column under Banned Substances.
Added LT on Cypress package code and Assembly Site 2
– Package Qualification Report # 073701.
Changed the assembly code of Assembly Site 2 from
COA-LT56-CA to COA-LT56-AT. Remove Ag substance
on Leadframe. Add CAS Number for Pd.
Corrected PPM values for Table B: Material Composition
of Assembly Site 1.
Added Assembly site 3 – QTP#084005.
Added Assembly Site 4 – QTP No. 084613
Deleted Reference QTP on Assembly Site 4 and added
QTP No. 092006.
Added Assembly site 5 – QTP#094101.
Added Assembly Site 6 – QTP No. 083804
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information.
Document No. 001-04327 Rev. *I
Page 13 of 13