Document No.001-68890 Rev. *A ECN # 4352343 Cypress Semiconductor Package Qualification Report QTP# 110908 VERSION *A April 2014 20Ld / 24Ld QSOP Standard and Pb-Free NiPdAu, MSL3, 260C Reflow JCET-China (JT) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Rene Rodgers (RT) MTS Reliability Engineer Reviewed By: Loren R. Zapanta (ILZ) Reliability Manager Approved By: Richard Oshiro(RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-68890 Rev. *A ECN # 4352343 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 110908 Qualify New Assembly Site (JCET) Qual – for QSOP 20L/24L, PbFree and Standard Package Using KEG3000, QMI-509, 0.9 mil Gold Wire and NiPdAu Lead Finish Apr 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No.001-68890 Rev. *A ECN # 4352343 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: SQ24 Package Outline, Type, or Name: 24L QSOP Mold Compound Name/Manufacturer: KEG3000 / Kyocera Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% N/A Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer saw Die Attach Supplier: Henkel Die Attach Material: QMI 509 Bond Diagram Designation 001-06591, 10-05961, 10-06219 Wire Bond Method: Thermosonic Wire Material/Size: 0.9mil / Au Thermal Resistance Theta JA C/W: 11.3 C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-64160 Name/Location of Assembly (prime) facility: JT-JCET China MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-68890 Rev. *A ECN # 4352343 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F P High Temp Storage 130 C, 85%RH, 5.50V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 150 C, no bias Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy (2200V) JEDEC EIA/JESD22-A114-B (500V) JESD22-C101 Cypress Spec. 25-00104 P Ball Shear Cypress Spec. 12-00292, Cpk : 1.33, Ppk : 1.66 P Bond Pull Cypress Spec. 12-00292, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Cypress Spec. 25-20035 P Die Shear Cypress Spec. 12-00292, Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Dye Penetrant Test Cypress Spec. 25-20027-No Crack P Internal Visual Cypress Spec. 12-00292 P Final Visual Inspection Cypress Spec. 12-00292 P Lead Integrity JESD22-B105, MIL STD 883 P Physical Dimension Cypress Spec. 25-00031, MIL-STD-1835, JESD22-B100 P Thermal Shock Cypress Spec. 25-00014 P Pressure Cooker Test Temperature Cycle Solderability, Steam Aged Cypress Spec. 25-00018, J-STD-002, JESD22-B102 P P P P P P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 P Document No.001-68890 Rev. *A ECN # 4352343 Reliability Test Data QTP #: 110908 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 15 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 15 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 15 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 30 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 30 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 30 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 30 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 30 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 30 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 5 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 5 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 5 0 STRESS: DYE PENETRATION TEST CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 15 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 15 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 15 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 30 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 30 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 30 0 JT-CHINA COMP 9 0 COMP 8 0 STRESS: DIE SHEAR STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY7C63743C (7C637402A) 6037010 611104402 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-68890 Rev. *A ECN # 4352343 Reliability Test Data QTP #: 110908 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 5.50V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA 128 80 0 6037010 611104402 JT-CHINA 500 80 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 5 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 5 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 5 0 STRESS: HIGH TEMP STORAGE, 150C CY7C63743C (7C637402A) STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA 168 80 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA 288 80 0 STRESS: PHYSICAL DIMENSION CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 30 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 30 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 30 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 3 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 3 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA 500 80 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA 500 74 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA 500 80 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA 200 80 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA 1000 80 0 CY7C63743C (7C637402A) 6037010 611104402 JT-CHINA COMP 30 0 CY7C63101C (7C631012G) 6035000 611104400 JT-CHINA COMP 30 0 CY7C60223 (7C638515A) 5040020 611104401 JT-CHINA COMP 30 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-68890 Rev. *A ECN # 4352343 Document History Page Document Title: Document Number: Rev. ECN No. ** 3218981 *A 4352343 QTP 110908:20L/24L QSOP, NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT) 001-68890 Orig. of Change NSR RT Description of Change Initial spec release Sunset ReviewAlign spec with current qual report template. Corrected assembly process flow spec number Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7