Q1 - 1998

CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
QUARTER 1, 1998
PERFORM PER THE REQUIREMENT OF 25-00008, RELIABILITY MONITOR PROGRAM SPECIFICATION
Marc Hartranft
Reliability Manager
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Quarter 1, 1998
Issued: 5/28/98
STANDARD STRESS TEST DESCRIPTIONS
TEST
DESCRIPTION
HTOL
HTOL2
HTSSL
HTSSL2
DRET
DRET2
PCT
HAST
TC
TC2
HTS
TEV
High Temp Op Life, 150ºC, 5.75V
High Temp Op Life, 125ºC, 5.75V
High Temp Steady State Life, 150ºC, 5.75V
High Temp Steady State Life, 125ºC, 5.75V
Data Retension Test, Data Bake 165ºC, Plastic
Data Retension Test, Data Bake 250ºC, Hermetic
Pressure Cooker Test, 121ºC, 100%RH, No Bias
Hi-Accel Saturation Test, 140ºC, 85%RH, 5.5V Bias
Temp Cycle, 125ºC to -40ºC
Temp Cycle, 150ºC to -65ºC
High Temp Storage, 165ºC, No Bias
Temperature Extreme Verification
Page 2 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Quarter 1, 1998
Issued: 5/28/98
WAFER FAB AREAS
FAB #
LOCATION
CA
TX
MN
FR
San Jose, California
Round Rock, Texas
Bloomington, Minnesota
MHS, France
ASSEMBLY LOCATION
ID
COMPANY/LOCATION
KOREA-A
ASAT-B
USA-C
PHIL-D
USA-E
INDNS-F
TAIWAN-G
KOREA-H
MALAY-J
THLAND-K
KOREA-L
PHIL-M
USA-N
INDNS-O
USA-P
KOREA-Q
PHIL-R
USA-S
TAIWAN-T
MALAY-U
USA-V
USA-W
ALPHA-X
ALPHA-Y
THLAND-Z
Anam-Buchon/Korea
Asat/Hongkong
Cypress/USA
Dynesem/Philippines
Cypress-Minnesota/USA
Astra/Indonesia
ASE/Taiwan
Hyundai/Korea
ASE/Malaysia
TMS/Thailand
Anam-Seoul/Korea
Anam/Philippines
Express/USA
Omedata/Indonesia
Pantronix/USA
Anam-Bupyong/Korea
Cypress/Philippines
ATM/USA
OSE/Taiwan
Unisem/Malaysia
Aplus/USA
Toshiba/USA
Cypress Bangkok/Thailand
Alphatech/Thailand
Hana/Thailand
Page 3 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Quarter 1, 1998
Issued: 5/28/98
DESCRIPTION OF DATA TABLE COLUMN HEADINGS
COLUMN HEADING
DESCRIPTION OF COLUMN CONTENTS
Division
Test
Test Condition
Device ID
Date Code
Lot Number
Function
Description
Technology
Process
Pkg Material
Pkg Type
Pkg Location
# Pins
Duration
# Test
# Failed
Fail Mode
Cypress Manufacturing Division
Common code for the stress performed. See table on previous page for detail.
Tem/humidity/bias condition for the stress. See table on previous for detail
Cypress part number
Week in which specific lot was marked/sealed/molded.
Manufacturing (assembly) lot number
Generic product family at Cypress
Brief description of device function
Fabrication process technology.
Generic fabrication process
Generic packaging material
Common code for standard package configuration (PDIP=Plastic Dual-In-Line-Package).
Country Location + Initial of assembly house (see table on prvious page for detail).
Pin cont of package in which device is assembled.
Data Readpoint of stress. For Temp Cycle (TC) = Cycles; all other stresses=Hours.
Quantity of devices submitted to this stress/test.
Quantity of devices failing at this specific readpoint.
Failure analysis results from this test, if any.
Page 4 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Quarter 1, 1998
Issued: 5/28/98
RELIABILITY DATA SUMMARY
(Q198)
LONG TERM FAILURE RATE SUMMARY
PROCESS
DEVICE HOURS
125C
150C
FAILED
FAMOS TOTAL
8,832
0
TOTAL @ 150C
8,832
0
FLASH TOTAL
68,332
0
68,332
0
2,467,116
1,902,000
3,087,168
5
BICMOS TOTAL
0
0
LFR TOTAL
2,544,280
1,902,000
SRAM/LOGIC TOTAL
FAILURE MODE
1
NO DATA
2 NON VISUAL, 1 OTHER, 1 TOPSIDE
CRACKS, 1 LIFTING BOND
NODATA
3,164,332
5
---
FAILED
FAILURE MODE
EARLY FAILURE RATE SUMMARY
PROCESS
UNITS TESTED
125C
150C
FAMOS TOTAL
TOTAL
NO DATA
0
0
528
0
528
0
26,504
1,858
28,362
9
BICMOS TOTAL
0
1,474
1,474
0
EFR TOTAL
27,032
3,332
30,364
9
---
FAILED
FAILURE MODE
FLASH TOTAL
SRAM/LOGIC TOTAL
NO DATA
2 NON VISUAL, 3 OTHERS, 1 TOPSIDE
SCRATCHES, 1 BROKEN BOND, 1 CHIPOUTS, 1 TOPSIDE CRACKS
HTSSL FAILURE RATE SUMMARY
PROCESS
150C
DEVICE HOURS
125C
TOTAL1 @ 150C
239,000
77,914
FAMOS TOTAL
0
FLASH TOTAL
0
28,560
9,311
0
199,256
2,320,576
955,764
1
0
232,000
75,632
0
199,256
2,820,136
1,118,620
1
SRAM/LOGIC TOTAL
BICMOS TOTAL
HTSSL TOTAL
0
1 PARTICLE
---
TEMP CYCLE FAILURE RATE SUMMARY
PROCESS
FAILED
FAILURE MODE
0
50,000
0
50,000
0
1,382,800
310,500
1,463,530
2
2 UNKOWN
BICMOS TOTAL
44,300
0
44,300
1
1 SPEED DEGRATION
TC TOTAL
1,587,200
310,500
1,667,930
3
FAMOS TOTAL
FLASH TOTAL
SRAM/LOGIC TOTAL
1
DEVICE CYCLE
125C
TOTAL1 @ 150C
0
110,100
150C
110,100
Equivalent Total Device Hours/cycle. Derating factors are used for lower stress condition.
Page 5 of 34
---
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Quarter 1, 1998
Issued: 5/28/98
RELIABILITY DATA SUMMARY
(Q198)
HAST FAILURE RATE SUMMARY
PROCESS
DEVICE HOURS
130C
140C
FAMOS TOTAL
FAILED
TOTAL @ 140C
NO DATA
0
0
6,400
0
6,400
0
12,619,640
0
12,619,640
22
BICMOS TOTAL
0
0
HAST TOTAL
12,626,040
0
FLASH TOTAL
SRAM/LOGIC TOTAL
FAILURE MODE
1
NO DATA
12,626,040
NO DATA
4 LIFTED BOND, 2 SPEED DEGRATION, 2
UNKNOWN, 1 OTHER, 13 POPCORN
NO DATA
22
---
LTOL FAILURE RATE SUMMARY
DEVICE HOURS
FAILED
NO DATA
NO DATA
PROCESS
FAMOS TOTAL
FLASH TOTAL
NO DATA
SRAM/LOGIC TOTAL
NO DATA
62,000
BICMOS TOTAL
NO DATA
LTOL TOTAL
62,000
FAILURE MODE
0
NO DATA
0
---
PCT FAILURE RATE SUMMARY
DEVICE HOURS
FAILED
NO DATA
NO DATA
PROCESS
FAMOS TOTAL
FLASH TOTAL
FAILURE MODE
NO DATA
NO DATA
146,028
9
2 UNKNOWN, 7 TOPSIDE CRACKS
BICMOS TOTAL
38,976
3
3 UNKNOWN
PCT TOTAL
185,004
12
SRAM/LOGIC TOTAL
PROCESS
FAMOS TOTAL
DRET FAILURE RATE SUMMARY
PLASTIC (165C)
HERMETIC(250C)
DHR
REJ
DHR
REJ
78,000
0
77,000
0
FLASH TOTAL
124,920
0
NO DATA
NO DATA
SRAM/LOGIC TOTAL
360,168
0
NO DATA
NO DATA
BICMOS
141,872
0
NO DATA
NO DATA
704,960
0
DRET TOTAL
77,000
Page 6 of 34
0
---
FAILURE MODE
---
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
BICMOS-SM1
CHNL
CY7B991-JC
M80154
9746 219711890
PSCB
BiCMOS TX
PLCC ALPHA-X
32
168
1000
116
116
0
0
ENET
CY7B8392-JC
M74075
9716 519704354
TRANSCEIVER BiCMOS TX
PLCC INDNS-O
28
168
76
0
M74088
9708 519701901
TRANSCEIVER BiCMOS TX
PLCC INDNS-O
28
168
78
0
DRET
165C/NO BIAS
DCD
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2
125C/6.5V
DCD
ENET
CY7B4663-JC
97482
9746 519712273
TRANSCEIVER BiCMOS TX
PLCC INDNS-O
28
48
375
0
519712421
TRANSCEIVER BiCMOS TX
PLCC INDNS-O
28
48
379
0
9806 219800826
TRANSCEIVER BiCMOS TX
PLCC ALPHA-X
28
48
360
0
9809 219801540
TRANSCEIVER BiCMOS TX
PLCC ALPHA-X
28
48
360
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V
DCD
CHNL
CY7B991-JC
M74067
9733 219708729
PSCB
BiCMOS TX
PLCC ALPHA-X
32
96
500
1000
2000
116
116
116
116
0
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT
121C/100%RH
DCD
CHNL
ENET
CY7B991-JC
CY7B8392-JC
M74069
9733 219708729
PSCB
BiCMOS TX
PLCC ALPHA-X
32
96
168
77
77
0
3 3 UNKOWN
M80155
9746 219711890
PSCB
BiCMOS TX
PLCC ALPHA-X
32
96
168
77
77
0
0
M74089
9708 519701901
TRANSCEIVER BiCMOS TX
PLCC INDNS-O
28
96
168
78
78
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
DCD
CHNL
CY7B991-JC
M80157
9746 219711890
Page 7 of 34
PSCB
BiCMOS TX
PLCC ALPHA-X
32
300
500
45
44
1 1 SPEED DEGRADATION
0
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
BICMOS-SM1
CY7B991-JC
TC2
-65C TO 150C
DCD
CHNL
M80157
9746 219711890
PSCB
BiCMOS TX
PLCC ALPHA-X
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------32 1000
44
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV
0 READ POINT
DCD
ENET
CY7B8392-JC
M74072
9716 519704354
TRANSCEIVER BiCMOS TX
PLCC INDNS-O
28
-5
25
85
94
118
94
0
24 24 OTHERS
0
M74086
9708 519701901
TRANSCEIVER BiCMOS TX
PLCC INDNS-O
28
-5
25
85
105
116
105
0
11 11 OTHERS
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 8 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
FAMOS-P20
CY7C341-25JI
HTSSL2 125C/5.75V
PLD
MAX
M73073
9724 619703645
REPROG.PAL
CMOS
TX
PLCC KOREA-A
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------84
96
96
500
500
1000
1000
2000
2000
41
79
41
79
41
79
40
79
0
0
0
0
0
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
PLD
MAX
CY7C341-JI
M72056
9711 619700872
REPROG.PAL
CMOS
TX
PLCC KOREA-A
84
300
50
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 9 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
FAMOS-P26
CY27C010-PC
DRET
165C/NO BIAS
MPD
PROM
M80170
9738 619707247
128K x 8
CMOS
TX
PDIP KOREA-H
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------32
168
1000
78
78
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------DRET2
250C/NO BIAS
MPD
PROM
CY27H010-WC
M73065
9726 219706752
128K x 8
CMOS
TX
WCER ALPHA-X
32
168
1000
77
77
0 1 EOS
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/5.75V
CPD
USB
CY7C63413-WSC
97394
9738 219709761
USB
CMOS
TX
WSBR ALPHA-X
48
184
48
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
CPD
USB
CY7C63413-WSC
97394
9738 219709761
USB
CMOS
TX
WSBR ALPHA-X
48
100
1000
48
47
0
0
MPD
PROM
CY27C010-PC
M80171
9738 619707247
128K x 8
CMOS
TX
PDIP KOREA-H
32
300
500
1000
48
48
48
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV
0 READ POINT
MPD
PROM
CY27C010-PC
M80167
9738 619707247
128K x 8
CMOS
TX
PDIP KOREA-H
32
-5
25
85
118
118
118
0
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 10 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
FLASH-FL28
CY7C371I-JC
DRET
165C/NO BIAS
PLD
FLASH
98116
9744 219711475
32-MCEL FL
CMOS
TX
PLCC ALPHA-X
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------44
168
552
85
85
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HAST
140C/5.5V
PLD
FLASH
CY7C371I-JC
98116
9744 219711475
32-MCEL FL
CMOS
TX
PLCC ALPHA-X
44
128
50
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/5.75V
PLD
FLASH
CY7C371I-JC
98116
9744 219711475
32-MCEL FL
CMOS
TX
PLCC ALPHA-X
44
48
80
500
528
119
119
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.75V
PLD
FLASH
CY7C371I-JC
98116
9744 219711475
32-MCEL FL
CMOS
TX
PLCC ALPHA-X
44
80
168
336
85
85
85
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
PLD
FLASH
CY7C371I-JC
98116
9744 219711475
32-MCEL FL
CMOS
TX
PLCC ALPHA-X
44
300
1000
50
50
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 11 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
FLASH-FL28D
CY7C374I-JC
DRET
165C/NO BIAS
PLD
FLASH
M74052
9722 349611012
128 MCEL FL CMOS
TX
PLCC KOREA-A
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------84
168
1000
78
78
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/5.75V
PLD
FLASH
CY7C374I-YMB
97451
9737 219709957
128 MCEL FL CMOS
TX
CLCC ALPHA-X
84
184
48
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV
0 READ POINT
PLD
FLASH
CY7C374I-JC
M74050
9722 349611012
128 MCEL FL CMOS
TX
PLCC KOREA-A
84
-5
25
85
116
116
116
0
0
0
M80172
9728 219707333
128 MCEL FL CMOS
TX
PLCC ALPHA-X
84
-5
25
85
116
116
116
0
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 12 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
SRAM/LOGIC-C2AN
VIC068A-BC
144
DRET
165C/NO BIAS
CPD
VME
M80165
9746 349705554
VME INTERF. CMOS
MN
PPGA PHIL-M
168
1000
77
77
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 13 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
SRAM/LOGIC-L20
CY7C611A-NC
DRET
165C/NO BIAS
CPD
VME
M74064
9728 349703682
RISC CONTRL CMOS
TX
PQFP HK-B
160
168
1000
76
76
0
0
M80183
9731 349704147
RISC CONTRL CMOS
TX
PQFP HK-B
160
168
1000
78
78
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC
-40C TO 125C
CPD
VME
CY7C611A-NC
M74062
9728 349703682
RISC CONTRL CMOS
TX
PQFP HK-B
160
500
1500
46
40
0
0 16 EXTERNAL CONTAMINATION
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 14 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
SRAM/LOGIC-L28
CY2273APVC
DRET
165C/NO BIAS
CPD
TTECH
97403
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
9740 619708289/ CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
168
552
78
78
0
0
9745 619709731
CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
168
552
78
78
0
0
619709732
CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
168
552
78
78
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HAST
140C/3.63V
CPD
TTECH
CY2273APVC
97403
9740 619708289/ CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
128
256
44
44
0
0
9745 619709732
CMOS
TX
SSOP CSPI-R
48
128
45
0
CLOCK SYN.
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/3.65V
CPD
TTECH
CY2273APVC
97403
9740 619708289/ CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
48
48
48
80
500
30
150
150
116
116
0
0
0
0
0
9745 619709731
CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
48
48
48
80
500
100
120
120
120
116
0
0
0
0
0
619709732
CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
48
48
80
500
116
214
116
115
0
0
0
0 1 EOS
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS
165C/NO BIAS
CPD
TTECH
CY2273APVC
97403
9740 619708289/ CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
336
500
1000
45
45
45
0
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 15 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
SRAM/LOGIC-L28
CY2273APVC
LTOL
-30C/6.5V
CPD
TTECH
97403
9740 619708289/ CLOCK SYN.
CMOS
TX
SSOP CSPI-R
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------48
500
1000
45
45
0
0 1 EOS
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
CPD
TTECH
CY2273APVC
97403
9740 619708289/ CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
300
1000
45
45
0
0
9745 619709731
CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
300
1000
48
48
0
0
619709732
CLOCK SYN.
CMOS
TX
SSOP CSPI-R
48
300
1000
47
47
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 16 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R21
HAST
140C/5.5V
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY7C185-VC
M80147
9745 619709631
SML/64K
CMOS
TX
SOJ
CSPI-R
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------28
128
76
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2
125C/5.75V
MPD
COMDTY CY7C185-VI
M74027
9734 519708252
SML/64K
CMOS
TX
SOJ
INDNS-O
28
96
500
1000
2000
115
115
115
115
0
0
0
0
CY7C186-ZC
M74010
9725 619704309
SML/64K
CMOS
TX
TSOP KOREA-Q
32
96
500
1000
2000
116
116
116
116
0
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V
MPD
COMDTY CY7C185-45PC
CY7C185-VI
M73029
9723 219705968
SML/64K
CMOS
TX
PDIP ALPHA-X
28
96
500
1000
2000
120
116
116
116
0 4 EOS
0
0
0
M74028
9734 519708252
SML/64K
CMOS
TX
SOJ
28
96
500
1000
2000
115
115
115
115
0
0
0
0
INDNS-O
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV
0 READ POINT
MPD
COMDTY CY7C185-VC
M80144
9745 619709631
SML/64K
CMOS
TX
SOJ
CSPI-R
28
-5
25
85
116
116
116
0
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 17 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
SRAM/LOGIC-R28
HAST
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
140C/3.63
DCD
SPCM
CY7C4245-JC
97272
9749 349705972
4Kx18 FIFO
CMOS
MN
PLCC PHIL-M
32
128
48
0
140C/5.5V
DCD
SPCM
CY7C136-JC
M80124
9742 519713305
2K x 8 DP
CMOS
MN
PLCC INDNS-O
52
128
77
1 1 LIFTING BOND/S
CY7C4245-AC
M74060
9729 619705320
4Kx18 FIFO
CMOS
MN
TQFP KOREA-Q
64
128
78
0
M80149
9728 619704566
4Kx18 FIFO
CMOS
MN
TQFP KOREA-Q
64
128
76
0
M80129
9741 619708282
256K x 4
CMOS
MN
SOJ
CSPI-R
32
128
77
0
CY7C188-VC
M80137
9745 349705798
32K x 9
CMOS
MN
SOJ
PHIL-M
32
128
67
0
CY7C199-VC
M80115
9746 619709733
32K x 8
CMOS
TX
SOJ
CSPI-R
28
128
77
2 2 SPEED DEGRADATION
M80197
9808 619802072
32K x 8
CMOS
TX
SOJ
CSPI-R
28
128
76
0
M80198
9808 619801874
32K x 8
CMOS
TX
SOJ
CSPI-R
28
128
76
0
MPD
COMDTY CY7C1009-VC
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/3.8V
DCD
SPCM
CY7C4245-JC
150C/5.75V
MPD
COMDTY CY7C199-VC
97272
9749 349705972
98082
4Kx18 FIFO
CMOS
MN
PLCC PHIL-M
32
48
80
500
1532
130
130
0
0
0
9803 619800042N 32K x 8
CMOS
TX
SOJ
CSPI-R
28
48
1373
0
619800397N 32K x 8
CMOS
TX
SOJ
CSPI-R
28
48
1445
0
9804 619800236N 32K x 8
CMOS
TX
SOJ
CSPI-R
28
48
1459
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2
125C/5.75V
MPD
COMDTY CY7C1009-VC
CY7C109-VC
M74015
9732 619705971
256K x 4
CMOS
MN
SOJ
CSPI-R
32
96
500
1000
2000
116
114
114
114
1 1 TOPSIDE SCRATCHES
0 1 ESD
0
0 2 EOS
M74021
9734 519708340
128K x 8
CMOS
MN
SOJ
INDNS-O
32
96
115
0
Page 18 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R28
HTOL2
125C/5.75V
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY7C109-VC
M74021
9734 519708340
128K x 8
CMOS
MN
SOJ
INDNS-O
CY7C199-ZI
M74033
9730 619705361
32K x 8
CMOS
MN
TSOP CSPI-R
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------32
500
1000
2000
115
115
115
0
0
0
28
96
500
1000
2000
116
115
115
115
0
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL
150C/3.63V
DCD
SPCM
CY7C4245-JC
97272
9749 349705972
4Kx18 FIFO
CMOS
MN
PLCC PHIL-M
32
80
168
78
78
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V
125C/5.5V
MPD
MPD
COMDTY CY7C109-VC
COMDTY CY7C1009-VC
CY7C199-ZI
M73035
9722 519705873
128K x 8
CMOS
MN
SOJ
TAIWN-G
32
96
500
1000
2000
120
120
120
120
0
0
0
0
M74022
9734 519708340
128K x 8
CMOS
MN
SOJ
INDNS-O
32
96
500
1500
2000
116
116
116
116
0
0
0
0
M74016
9732 619705971
256K x 4
CMOS
MN
SOJ
CSPI-R
32
96
500
1000
2000
116
115
115
113
0 1 EOS
0
1 1 PARTICLE
0 1 EOS
M74034
9730 619705361
32K x 8
CMOS
MN
TSOP CSPI-R
28
96
500
1000
2000
116
116
116
116
0
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT
121C/100%RH
DCD
SPCM
CY7C136-JC
M80123
9742 519713305
Page 19 of 34
2K x 8 DP
CMOS
MN
PLCC INDNS-O
52
96
168
77
77
0
0
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
SRAM/LOGIC-R28
CY7C4245-AC
PCT
121C/100%RH
DCD
SPCM
MPD
COMDTY CY7C199-ZI
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
M80148
9728 619704566
4Kx18 FIFO
CMOS
MN
TQFP KOREA-Q
64
96
168
77
77
0
0
M74035
9730 619705361
32K x 8
CMOS
MN
TSOP CSPI-R
28
96
168
77
58
0 3 EOS
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
DCD
MPD
SPCM
CY7C136-JC
M74001
9716 349616269
2K x 8 DP
CMOS
MN
PLCC PHIL-M
52
300
500
1000
46
46
46
0
0
2 2 UNKNOWN
M80125
9742 519713305
2K x 8 DP
CMOS
MN
PLCC INDNS-O
52
300
500
1000
46
46
46
0
0
0
CY7C4221-AC
97272
9801 619711520
1Kx9 FIFO
CMOS
MN
TQFP KOREA-A
32
300
55
0
CY7C4221-JC
97272
9751 219713130
1Kx9 FIFO
CMOS
MN
PLCC ALPHA-X
32
300
1000
48
48
0
0
CY7C4235-JC
97272
9805 619800785
2Kx18 FIFO
CMOS
MN
PLCC KOREA-A
32
300
54
0
CY7C4245-AC
M80150
9728 619704566
4Kx18 FIFO
CMOS
MN
TQFP KOREA-Q
64
300
500
1000
48
48
48
0
0
0
M80186
9749 519713657
128K x 8
CMOS
MN
SOJ
32
300
500
1000
45
45
45
0
0
0
COMDTY CY7C109-VC
INDNS-O
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV
0 READ POINT
DCD
SPCM
CY7C136-JC
MPD
COMDTY CY7C1009-VC
M80120
9742 519713305
2K x 8 DP
CMOS
MN
PLCC INDNS-O
52
-5
25
85
116
116
116
0
0
0
M80126
9741 619708282
256K x 4
CMOS
MN
SOJ
32
-5
117
0
Page 20 of 34
CSPI-R
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R28
TEV
0 READ POINT
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY7C1009-VC
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
M80126
9741 619708282
256K x 4
CMOS
MN
SOJ
CSPI-R
32
25
85
117
117
0
0
CY7C188-VC
M80134
9745 349705798
32K x 9
CMOS
MN
SOJ
PHIL-M
32
-5
25
85
116
116
116
0
0
0
CY7C199-VC
M80179
9748 619710553
32K x 8
CMOS
MN
SOJ
PHIL-GW
28
-5
25
85
117
117
117
0
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 21 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R3
HAST
140C/3.63V
140C/5.5V
MPD
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY7C1021-BSC
97354
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
9739 349705285
64K x16
CMOS
MN
MBGA TAIWN-G
48
36
128
52
52
0
0
349705286
64K x16
CMOS
MN
MBGA TAIWN-G
48
36
128
52
51
0
0
COMDTY CY7C1021-ZSC
97491
9746 619708845L 64K x16
CMOS
MN
TSOP TAIWN-T
44
128
54
0
SYNC
98093
9740 519710279
64K x 18
CMOS
MN
PLCC INDNS-O
52
128
256
46
44
2 2 LIFTED BOND
0
519710280
64K x 18
CMOS
MN
PLCC INDNS-O
52
128
46
1 1 LIFTED BOND
M74099
9737 519709659
64K x 18
CMOS
MN
PLCC INDNS-O
52
128
128
22
54
0
1 1 EOS/1 OTHERS
M80161
9742 519710953
64K x 18
CMOS
MN
PLCC INDNS-O
52
128
128
27
50
0 1 EOS
0 1 EOS
CY7C1031-JC
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/5.75V
MPD
SYNC
CY7C1031-JC
98093
9727 519706959
64K x 18
CMOS
MN
PLCC INDNS-O
52
80
500
1000
116
115
115
1 1 NON VISUAL
0
1 1 EOS/1 NON VISUAL
9731 519708075
64K x 18
CMOS
MN
PLCC INDNS-O
52
80
500
116
116
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2
125C/5.75V
MPD
COMDTY CY7C1021-BSC
CY7C199-VC
97354
9739 349705284/ 64K x16
CMOS
MN
MBGA TAIWN-G
48
96
96
96
96
168
500
11
96
147
240
120
120
1
1
3
1
0
0
M74045
9729 619705121
CMOS
MN
SOJ
28
96
500
1000
2000
116
116
116
116
0
0
0
0
Page 22 of 34
256K
CSPI-R
1
1
1
1
CHIP-OUTS
BROKEN BOND OTHER
TOPSIDE CRACKS/2 OTHERS
NON VISUAL
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------SRAM/LOGIC-R3
HTS
165C/NO BIAS
MPD
COMDTY CY7C1021-BSC
97354
9739 349705284
64K x16
CMOS
MN
MBGA TAIWN-G
48
336
500
1000
50
50
50
0
0
0
CY7C1021-ZSC
97491
9746 619708845L 64K x16
CMOS
MN
TSOP TAIWN-T
44
336
50
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL
150C/5.75V
MPD
SYNC
CY7C1031-JC
98093
9727 519706959
64K x 18
CMOS
MN
PLCC INDNS-O
52
80
168
76
76
0
0
9731 519708075
64K x 18
CMOS
MN
PLCC INDNS-O
52
80
168
77
77
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V
125C/5.5V
MPD
SYNC
CY7C1031-JC
MPD
COMDTY CY7C199-VC
M74097
9737 519709659
64K x 18
CMOS
MN
PLCC INDNS-O
52
96
500
1000
2000
116
116
116
116
0 4 EOS
0
0
0
M74046
9729 619705121
256K
CMOS
MN
SOJ
28
96
500
1000
2000
116
116
116
116
0
0
0
0
CSPI-R
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT
121C/100%RH
MPD
COMDTY CY62256V-ZC
CY7C199-VC
M73081
9650 349613775
32K x 8
CMOS
CA
TSOP PHIL-M
28
96
168
79
69
7 7 TOPSIDE CRACKS
0 2 EOS
M74092
9705 349700731
32K x 8
CMOS
CA
TSOP PHIL-M
28
96
168
76
76
0
1 1 UNKNOWN
M80189
9802 619711953
256K
CMOS
MN
SOJ
28
54
96
168
81
81
81
0
0
0
Page 23 of 34
CSPI-R
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
SRAM/LOGIC-R3
PCT
121C/100%RH
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY7C199-VC
SYNC
CY7C1031-JC
M80190
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
256K
CMOS
MN
SOJ
CSPI-R
28
54
96
168
75
75
75
0
0
0
CSPI-R
28
54
96
168
99
99
99
0
0
1 1 TOPSIDE CRACKS
M80191
9750 619710984
256K
CMOS
MN
SOJ
M74098
9737 519709659
64K x 18
CMOS
MN
PLCC INDNS-O
52
96
77
0
M80162
9742 519710953
64K x 18
CMOS
MN
PLCC INDNS-O
52
96
168
77
74
0 3 EXTERNAL CONTAMINATION
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------T/S
-55C TO 150C
MPD
COMDTY CY7C1021-BSC
97354
9739 349705284
64K x16
CMOS
MN
MBGA TAIWN-G
48
100
200
50
50
0
0
CY7C1021-ZSC
97491
9746 619708845L 64K x16
CMOS
MN
TSOP TAIWN-T
44
100
200
50
50
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC
-40C TO 125C
MPD
COMDTY CY7C1021-BSC
97354
9739 349705284
64K x16
CMOS
MN
MBGA TAIWN-G
48
500
1000
1500
55
55
55
0
0
0
349705285
64K x16
CMOS
MN
MBGA TAIWN-G
48
500
1000
1500
55
55
55
0
0
0
349705286
64K x16
CMOS
MN
MBGA TAIWN-G
48
500
1000
1500
55
55
55
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
MPD
COMDTY CY7C1021-ZSC
97491
9746 619708843L 64K x16
CMOS
MN
TSOP TAIWN-T
44
300
1000
50
50
0
0
619708844L 64K x16
CMOS
MN
TSOP TAIWN-T
44
300
50
0
Page 24 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R3
TC2
-65C TO 150C
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY7C1021-ZSC
SYNC
CY7C1031-JC
97491
98093
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
9746 619708844L 64K x16
CMOS
MN
TSOP TAIWN-T
44 1000
50
0
619708845L 64K x16
CMOS
MN
TSOP TAIWN-T
44
300
1000
50
50
0
0
9731 519708075
64K x 18
CMOS
MN
PLCC INDNS-O
52
300
86
0
9740 519710280
64K x 18
CMOS
MN
PLCC INDNS-O
52
300
46
0
519710281
64K x 18
CMOS
MN
PLCC INDNS-O
52
300
46
0
M74100
9737 519709659
64K x 18
CMOS
MN
PLCC INDNS-O
52
300
500
1000
1500
2000
3000
46
46
46
46
46
46
0
0
0
0
0
0
M80163
9742 519710953
64K x 18
CMOS
MN
PLCC INDNS-O
52
300
500
1000
46
46
46
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV
0 READ POINT
MPD
COMDTY CY7C199-VC
M80192
9802 619711953
256K
CMOS
MN
SOJ
SYNC
M80158
9742 519710953
64K x 18
CMOS
MN
PLCC INDNS-O
CY7C1031-JC
CSPI-R
28
-5
25
85
117
117
115
1 1 UNKNOWN
0
0
52
-5
25
85
116
116
116
0
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 25 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
SRAM/LOGIC-R31
HAST
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
140C/3.0V
MPD
SYNC
CY7C1399-ZC
M73001
9645 349613772
32K x 8
CMOS
CA
TSOP PHIL-M
28
128
128
8
72
1 1 UNKNOWN
0
140C/3.3V
MPD
SYNC
CY7C1399-VC
M80111
9744 619709194
32K x 8
CMOS
MN
SOJ
28
128
128
21
56
0
0
PHIL-M
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2
125C/3.80V
MPD
SYNC
CY7C1399-VC
M74039
9727 619704667
32K x 8
CMOS
MN
SOJ
PHIL-M
28
96
500
1000
2000
116
116
116
116
0
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/3.63V
MPD
SYNC
CY7C1399-VC
M74040
9727 619704667
32K x 8
CMOS
MN
SOJ
PHIL-M
28
96
500
1000
2000
116
116
116
116
0
0
0
0 2 EOS
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 26 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
SRAM/LOGIC-R32
CY6157R202V0-ZA 97294
HAST
140C/3.3V
MPD
SYNC
140C/5.5V
MPD
COMDTY CY62256-SNC
CY7C109-VC
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
9744 349705604L 256K/2M ROM CMOS
MN
STSO TAIWAN-T
32
128
48
0
M73012
9720 519705368
32K x 8
CMOS
CA
NSOI INDNS-O
28
128
77
0 1 EOS
M80119
9744 519710283
32K x 8
CMOS
CA
NSOI INDNS-O
28
128
76
M80133
9745 519712223
128K x 8(5) CMOS
MN
SOJ
32
128
75
INDNS-O
0
14 13 POPCORN/1 UNKNOWN
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/3.45V
MPD
SYNC
CY6157R202V0-ZA 97294
150C/3.80V
MPD
COMDTY CY62128V-SC
150C/4.45V
MPD
SYNC
150C/5.75V
MPD
COMDTY CY62128-SC
97499
CY6157R202V0-ZA 97294
CY62256-SNC
97499
9744 349705604L 256K/2M ROM CMOS
MN
STSO TAIWAN-T
32
48
80
500
759
117
117
9751 719710244
CMOS
MN
SOIC TAIWAN-G
32
48
1747
0
9747 619710102L 256K/2M ROM CMOS
MN
STSO TAIWAN-T
32
48
80
500
757
118
118
0
0
0
9743 619708508D 128K x 8
CMOS
MN
SOIC TAIWAN-G
32
48
1267
0 1 EOS
128K x 8
0
0
0 1 MIXED AT BIN
619708595
128K x 8
CMOS
MN
SOIC TAIWAN-G
32
48
1265
0
619708666
128K x 8
CMOS
MN
SOIC TAIWAN-G
32
48
1278
0
9746 619709300
128K x 8
CMOS
MN
SOIC TAIWAN-G
32
48
913
0
97329
9735 519709032/ 32K x 8
CMOS
MN
NSOI INDNS-O
28
48
48
48
80
500
513
513
513
380
379
0
0
0
0
0 1 EOS
97468
9740 519710622D 32K x 8
CMOS
MN
NSOI INDNS-O
28
48
1195
0 1 EOS
9803 519800538/ 32K x 8
CMOS
MN
NSOI INDNS-O
28
48
3522
1 1 OTHERS
Page 27 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
SRAM/LOGIC-R32
HTOL
150C/5.75V
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
COMDTY CY62256-SNC
98076
9805 519801105/ 32K x 8
CMOS
MN
NSOI INDNS-O
28
48
3783
0
CY62256-SNI
97468
9741 519710876/ 32K x 8
CMOS
MN
NSOI INDNS-O
28
48
1140
1 1 NON VISUAL
519710879/ 32K x 8
CMOS
MN
NSOI INDNS-O
28
48
1200
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2
125C/5.75V
MPD
COMDTY CY62256-SNC
M74005
9732 519707894
32K x 8
CMOS
CA
NSOI INDNS-O
28
96
500
1000
2000
116
114
114
114
0
0 1 EOS
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL
150C/3.3V
MPD
SYNC
CY6157R202V0-ZA 97294
9744 349705604L 256K/2M ROM CMOS
MN
STSO TAIWAN-T
32
80
168
78
78
0
0
9747 619710102L 256K/2M ROM CMOS
MN
STSO TAIWAN-T
32
80
168
78
78
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V
MPD
COMDTY CY62256-SNC
M74006
9732 519707894
32K x 8
CMOS
CA
NSOI INDNS-O
28
96
500
1000
2000
116
115
115
115
0 1 EOS
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT
121C/100%RH
MPD
COMDTY CY62256-SNC
M80188
9744 519710283
32K x 8
CMOS
CA
NSOI INDNS-O
28
96
168
76
76
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
MPD
COMDTY CY62256-SNC
M80187
9744 519710283
Page 28 of 34
32K x 8
CMOS
CA
NSOI INDNS-O
28
300
500
1000
45
45
45
0
0
0
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
SRAM/LOGIC-R32
CY6157R202V0-ZA 97294
TC2
-65C TO 150C
MPD
SYNC
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
9744 349705604L 256K/2M ROM CMOS
MN
STSO TAIWAN-T
32
300
1000
48
48
0
0
9747 619710102L 256K/2M ROM CMOS
MN
STSO TAIWAN-T
32
300
1000
48
48
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV
0 READ POINT
MPD
COMDTY CY62256-SNC
M80116
9744 519710283
32K x 8
CMOS
CA
NSOI INDNS-O
28
-5
25
85
117
117
117
0
0
0
CY62256V-ZC
M80138
9749 619710170
32K x 8
CMOS
MN
TSOP CSPI-G
28
-5
25
85
116
116
116
0
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 29 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R32D
HAST
140C/5.5V
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY7C1049-VC
M80104
9747 619709647
512K x 8
CMOS
MN
SOJ
KOREA-L
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------36
128
78
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT
121C/100%RH
MPD
COMDTY CY7C1049-VC
M80106
9747 619709647
512K x 8
CMOS
MN
SOJ
KOREA-L
36
96
79
0 1 LASER FUSE INC. SERVER
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
MPD
COMDTY CY7C1049-VC
M80105
9747 619709647
512K x 8
CMOS
MN
SOJ
KOREA-L
36
300
500
48
48
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV
0 READ POINT
MPD
COMDTY CY7C1049-VC
M80101
9747 619709647
512K x 8
CMOS
MN
SOJ
KOREA-L
36
-5
25
85
118
119
118
0
1 1 OTHERS
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 30 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R33
HTOL
150C/4.3V
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY7C1021V33-BSC 97354
9738 619706882
64K x16
CMOS
MN
MBGA TAIWN-G
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------48
48
48
48
80
401
86
185
355
116
116
0
0
0
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2
125C/4.30V
MPD
COMDTY CY7C1021V33-BSC 97354
9740 619706884
64K x16
CMOS
MN
MBGA TAIWN-G
48
48
48
150
288
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 31 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R42
HAST
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
140C/3.63
MPD
COMDTY CY62256V-VC
97496
9740 619708056
32K x 8
CMOS
MN
SOJ
CSPI-R
28
128
256
45
45
0
0
140C/3.63V
MPD
COMDTY CY62256V-VC
97465
9745 619709356/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
128
256
47
47
0
0
97496
9745 619709132/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
128
45
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/3.90V
MPD
COMDTY CY62256V-VC
97465
9745 619709356/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
80
500
1000
118
116
115
0
0
0
97496
9710 619702695/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
80
500
1000
533
533
533
0
0
0
9725 619703951/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
80
500
530
530
0
0
619703998/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
80
500
530
529
1 1 OTHERS
1 1 TOPSIDE CRACKS
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS
165C/NO BIAS
MPD
COMDTY CY62256V-VC
97496
9719 619702695/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
336
1000
48
48
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL
150C/3.90V
MPD
COMDTY CY62256V-VC
97465
9745 619709356/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
80
168
78
77
97496
9710 619702695/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
80
168
157
157
0
0
9725 619703951/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
80
168
248
165
165
165
0
0
0
Page 32 of 34
0 1 EOS
0
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- ----SRAM/LOGIC-R42
HTSSL
150C/3.90V
MPD
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
COMDTY CY62256V-VC
97496
9725 619703998/ 32K x 8
CMOS
MN
SOJ
CSPI-R
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- ------------------------28
80
168
165
165
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------LTOL
-30C/4.3V
MPD
COMDTY CY62256V-VC
97496
9719 619702695/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
500
45
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
MPD
COMDTY CY62256V-VC
97465
9745 619709356/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
300
1000
90
90
0
0
97496
9710 619702695/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
300
1000
91
91
0
0
9725 619703951/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
300
1000
90
90
0
0
619703998/ 32K x 8
CMOS
MN
SOJ
CSPI-R
28
300
1000
90
90
0
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 33 of 34
CYPRESS SEMICONDUCTOR CORPORATION
PRODUCT RELIABILITY REPORT
Cypress Semiconductor Corporation
Quarterly Reliability Report
Quarter 1, 1998
Divi- FuncTechnology
Test
Test Condition
sion tion
---------------- ------ ---------------- ----- -----
Assembly
Descr
ProWfr Pkg Assy
Device
Eval#
D/C Lot No
Description cess
Loc type Loc
--------------- ------- ---- ---------- ----------- ------ --- ---- -------
No Dura Qty
Qty
Pin tion Test Fail Fail Mode
--- ---- ----- ---- -------------------------
SRAM/LOGIC-R42D
CY7C1334-AC
100
HAST
140C/3.63
MPD
SYNC
97328
9752 349706242
64K x 32
CMOS
MN
TQFP TAIWN-G
128
256
48
48
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL
150C/3.8V
MPD
SYNC
CY7C1334-AC
97328
9752 349706242
64K x 32
CMOS
MN
TQFP TAIWN-G
100
80
500
530
530
0
1 1 LIFTING BOND/S
9801 619711701
64K x 32
CMOS
MN
TQFP TAIWN-G
100
80
500
525
515
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL
150C/3.63V
MPD
SYNC
CY7C1334-AC
97328
9752 349706242
64K x 32
CMOS
MN
TQFP TAIWN-G
100
80
168
78
78
0
0
150C/63V
MPD
SYNC
CY7C1334-AC
97328
9801 619711701
64K x 32
CMOS
MN
TQFP TAIWN-G
100
80
168
78
78
0
0
------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2
-65C TO 150C
MPD
SYNC
CY7C1334-AC
97328
9752 349706242
64K x 32
CMOS
MN
TQFP TAIWN-G
100
300
1000
49
49
0
0
9801 619711701
64K x 32
CMOS
MN
TQFP TAIWN-G
100
300
49
0
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Page 34 of 34