CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT QUARTER 1, 1998 PERFORM PER THE REQUIREMENT OF 25-00008, RELIABILITY MONITOR PROGRAM SPECIFICATION Marc Hartranft Reliability Manager CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 1, 1998 Issued: 5/28/98 STANDARD STRESS TEST DESCRIPTIONS TEST DESCRIPTION HTOL HTOL2 HTSSL HTSSL2 DRET DRET2 PCT HAST TC TC2 HTS TEV High Temp Op Life, 150ºC, 5.75V High Temp Op Life, 125ºC, 5.75V High Temp Steady State Life, 150ºC, 5.75V High Temp Steady State Life, 125ºC, 5.75V Data Retension Test, Data Bake 165ºC, Plastic Data Retension Test, Data Bake 250ºC, Hermetic Pressure Cooker Test, 121ºC, 100%RH, No Bias Hi-Accel Saturation Test, 140ºC, 85%RH, 5.5V Bias Temp Cycle, 125ºC to -40ºC Temp Cycle, 150ºC to -65ºC High Temp Storage, 165ºC, No Bias Temperature Extreme Verification Page 2 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 1, 1998 Issued: 5/28/98 WAFER FAB AREAS FAB # LOCATION CA TX MN FR San Jose, California Round Rock, Texas Bloomington, Minnesota MHS, France ASSEMBLY LOCATION ID COMPANY/LOCATION KOREA-A ASAT-B USA-C PHIL-D USA-E INDNS-F TAIWAN-G KOREA-H MALAY-J THLAND-K KOREA-L PHIL-M USA-N INDNS-O USA-P KOREA-Q PHIL-R USA-S TAIWAN-T MALAY-U USA-V USA-W ALPHA-X ALPHA-Y THLAND-Z Anam-Buchon/Korea Asat/Hongkong Cypress/USA Dynesem/Philippines Cypress-Minnesota/USA Astra/Indonesia ASE/Taiwan Hyundai/Korea ASE/Malaysia TMS/Thailand Anam-Seoul/Korea Anam/Philippines Express/USA Omedata/Indonesia Pantronix/USA Anam-Bupyong/Korea Cypress/Philippines ATM/USA OSE/Taiwan Unisem/Malaysia Aplus/USA Toshiba/USA Cypress Bangkok/Thailand Alphatech/Thailand Hana/Thailand Page 3 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 1, 1998 Issued: 5/28/98 DESCRIPTION OF DATA TABLE COLUMN HEADINGS COLUMN HEADING DESCRIPTION OF COLUMN CONTENTS Division Test Test Condition Device ID Date Code Lot Number Function Description Technology Process Pkg Material Pkg Type Pkg Location # Pins Duration # Test # Failed Fail Mode Cypress Manufacturing Division Common code for the stress performed. See table on previous page for detail. Tem/humidity/bias condition for the stress. See table on previous for detail Cypress part number Week in which specific lot was marked/sealed/molded. Manufacturing (assembly) lot number Generic product family at Cypress Brief description of device function Fabrication process technology. Generic fabrication process Generic packaging material Common code for standard package configuration (PDIP=Plastic Dual-In-Line-Package). Country Location + Initial of assembly house (see table on prvious page for detail). Pin cont of package in which device is assembled. Data Readpoint of stress. For Temp Cycle (TC) = Cycles; all other stresses=Hours. Quantity of devices submitted to this stress/test. Quantity of devices failing at this specific readpoint. Failure analysis results from this test, if any. Page 4 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 1, 1998 Issued: 5/28/98 RELIABILITY DATA SUMMARY (Q198) LONG TERM FAILURE RATE SUMMARY PROCESS DEVICE HOURS 125C 150C FAILED FAMOS TOTAL 8,832 0 TOTAL @ 150C 8,832 0 FLASH TOTAL 68,332 0 68,332 0 2,467,116 1,902,000 3,087,168 5 BICMOS TOTAL 0 0 LFR TOTAL 2,544,280 1,902,000 SRAM/LOGIC TOTAL FAILURE MODE 1 NO DATA 2 NON VISUAL, 1 OTHER, 1 TOPSIDE CRACKS, 1 LIFTING BOND NODATA 3,164,332 5 --- FAILED FAILURE MODE EARLY FAILURE RATE SUMMARY PROCESS UNITS TESTED 125C 150C FAMOS TOTAL TOTAL NO DATA 0 0 528 0 528 0 26,504 1,858 28,362 9 BICMOS TOTAL 0 1,474 1,474 0 EFR TOTAL 27,032 3,332 30,364 9 --- FAILED FAILURE MODE FLASH TOTAL SRAM/LOGIC TOTAL NO DATA 2 NON VISUAL, 3 OTHERS, 1 TOPSIDE SCRATCHES, 1 BROKEN BOND, 1 CHIPOUTS, 1 TOPSIDE CRACKS HTSSL FAILURE RATE SUMMARY PROCESS 150C DEVICE HOURS 125C TOTAL1 @ 150C 239,000 77,914 FAMOS TOTAL 0 FLASH TOTAL 0 28,560 9,311 0 199,256 2,320,576 955,764 1 0 232,000 75,632 0 199,256 2,820,136 1,118,620 1 SRAM/LOGIC TOTAL BICMOS TOTAL HTSSL TOTAL 0 1 PARTICLE --- TEMP CYCLE FAILURE RATE SUMMARY PROCESS FAILED FAILURE MODE 0 50,000 0 50,000 0 1,382,800 310,500 1,463,530 2 2 UNKOWN BICMOS TOTAL 44,300 0 44,300 1 1 SPEED DEGRATION TC TOTAL 1,587,200 310,500 1,667,930 3 FAMOS TOTAL FLASH TOTAL SRAM/LOGIC TOTAL 1 DEVICE CYCLE 125C TOTAL1 @ 150C 0 110,100 150C 110,100 Equivalent Total Device Hours/cycle. Derating factors are used for lower stress condition. Page 5 of 34 --- CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 1, 1998 Issued: 5/28/98 RELIABILITY DATA SUMMARY (Q198) HAST FAILURE RATE SUMMARY PROCESS DEVICE HOURS 130C 140C FAMOS TOTAL FAILED TOTAL @ 140C NO DATA 0 0 6,400 0 6,400 0 12,619,640 0 12,619,640 22 BICMOS TOTAL 0 0 HAST TOTAL 12,626,040 0 FLASH TOTAL SRAM/LOGIC TOTAL FAILURE MODE 1 NO DATA 12,626,040 NO DATA 4 LIFTED BOND, 2 SPEED DEGRATION, 2 UNKNOWN, 1 OTHER, 13 POPCORN NO DATA 22 --- LTOL FAILURE RATE SUMMARY DEVICE HOURS FAILED NO DATA NO DATA PROCESS FAMOS TOTAL FLASH TOTAL NO DATA SRAM/LOGIC TOTAL NO DATA 62,000 BICMOS TOTAL NO DATA LTOL TOTAL 62,000 FAILURE MODE 0 NO DATA 0 --- PCT FAILURE RATE SUMMARY DEVICE HOURS FAILED NO DATA NO DATA PROCESS FAMOS TOTAL FLASH TOTAL FAILURE MODE NO DATA NO DATA 146,028 9 2 UNKNOWN, 7 TOPSIDE CRACKS BICMOS TOTAL 38,976 3 3 UNKNOWN PCT TOTAL 185,004 12 SRAM/LOGIC TOTAL PROCESS FAMOS TOTAL DRET FAILURE RATE SUMMARY PLASTIC (165C) HERMETIC(250C) DHR REJ DHR REJ 78,000 0 77,000 0 FLASH TOTAL 124,920 0 NO DATA NO DATA SRAM/LOGIC TOTAL 360,168 0 NO DATA NO DATA BICMOS 141,872 0 NO DATA NO DATA 704,960 0 DRET TOTAL 77,000 Page 6 of 34 0 --- FAILURE MODE --- CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- BICMOS-SM1 CHNL CY7B991-JC M80154 9746 219711890 PSCB BiCMOS TX PLCC ALPHA-X 32 168 1000 116 116 0 0 ENET CY7B8392-JC M74075 9716 519704354 TRANSCEIVER BiCMOS TX PLCC INDNS-O 28 168 76 0 M74088 9708 519701901 TRANSCEIVER BiCMOS TX PLCC INDNS-O 28 168 78 0 DRET 165C/NO BIAS DCD No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/6.5V DCD ENET CY7B4663-JC 97482 9746 519712273 TRANSCEIVER BiCMOS TX PLCC INDNS-O 28 48 375 0 519712421 TRANSCEIVER BiCMOS TX PLCC INDNS-O 28 48 379 0 9806 219800826 TRANSCEIVER BiCMOS TX PLCC ALPHA-X 28 48 360 0 9809 219801540 TRANSCEIVER BiCMOS TX PLCC ALPHA-X 28 48 360 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V DCD CHNL CY7B991-JC M74067 9733 219708729 PSCB BiCMOS TX PLCC ALPHA-X 32 96 500 1000 2000 116 116 116 116 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH DCD CHNL ENET CY7B991-JC CY7B8392-JC M74069 9733 219708729 PSCB BiCMOS TX PLCC ALPHA-X 32 96 168 77 77 0 3 3 UNKOWN M80155 9746 219711890 PSCB BiCMOS TX PLCC ALPHA-X 32 96 168 77 77 0 0 M74089 9708 519701901 TRANSCEIVER BiCMOS TX PLCC INDNS-O 28 96 168 78 78 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C DCD CHNL CY7B991-JC M80157 9746 219711890 Page 7 of 34 PSCB BiCMOS TX PLCC ALPHA-X 32 300 500 45 44 1 1 SPEED DEGRADATION 0 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- BICMOS-SM1 CY7B991-JC TC2 -65C TO 150C DCD CHNL M80157 9746 219711890 PSCB BiCMOS TX PLCC ALPHA-X No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------32 1000 44 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV 0 READ POINT DCD ENET CY7B8392-JC M74072 9716 519704354 TRANSCEIVER BiCMOS TX PLCC INDNS-O 28 -5 25 85 94 118 94 0 24 24 OTHERS 0 M74086 9708 519701901 TRANSCEIVER BiCMOS TX PLCC INDNS-O 28 -5 25 85 105 116 105 0 11 11 OTHERS 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 8 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- FAMOS-P20 CY7C341-25JI HTSSL2 125C/5.75V PLD MAX M73073 9724 619703645 REPROG.PAL CMOS TX PLCC KOREA-A No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------84 96 96 500 500 1000 1000 2000 2000 41 79 41 79 41 79 40 79 0 0 0 0 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C PLD MAX CY7C341-JI M72056 9711 619700872 REPROG.PAL CMOS TX PLCC KOREA-A 84 300 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 9 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- FAMOS-P26 CY27C010-PC DRET 165C/NO BIAS MPD PROM M80170 9738 619707247 128K x 8 CMOS TX PDIP KOREA-H No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------32 168 1000 78 78 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------DRET2 250C/NO BIAS MPD PROM CY27H010-WC M73065 9726 219706752 128K x 8 CMOS TX WCER ALPHA-X 32 168 1000 77 77 0 1 EOS 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/5.75V CPD USB CY7C63413-WSC 97394 9738 219709761 USB CMOS TX WSBR ALPHA-X 48 184 48 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C CPD USB CY7C63413-WSC 97394 9738 219709761 USB CMOS TX WSBR ALPHA-X 48 100 1000 48 47 0 0 MPD PROM CY27C010-PC M80171 9738 619707247 128K x 8 CMOS TX PDIP KOREA-H 32 300 500 1000 48 48 48 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV 0 READ POINT MPD PROM CY27C010-PC M80167 9738 619707247 128K x 8 CMOS TX PDIP KOREA-H 32 -5 25 85 118 118 118 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 10 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- FLASH-FL28 CY7C371I-JC DRET 165C/NO BIAS PLD FLASH 98116 9744 219711475 32-MCEL FL CMOS TX PLCC ALPHA-X No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------44 168 552 85 85 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HAST 140C/5.5V PLD FLASH CY7C371I-JC 98116 9744 219711475 32-MCEL FL CMOS TX PLCC ALPHA-X 44 128 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/5.75V PLD FLASH CY7C371I-JC 98116 9744 219711475 32-MCEL FL CMOS TX PLCC ALPHA-X 44 48 80 500 528 119 119 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.75V PLD FLASH CY7C371I-JC 98116 9744 219711475 32-MCEL FL CMOS TX PLCC ALPHA-X 44 80 168 336 85 85 85 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C PLD FLASH CY7C371I-JC 98116 9744 219711475 32-MCEL FL CMOS TX PLCC ALPHA-X 44 300 1000 50 50 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 11 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- FLASH-FL28D CY7C374I-JC DRET 165C/NO BIAS PLD FLASH M74052 9722 349611012 128 MCEL FL CMOS TX PLCC KOREA-A No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------84 168 1000 78 78 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/5.75V PLD FLASH CY7C374I-YMB 97451 9737 219709957 128 MCEL FL CMOS TX CLCC ALPHA-X 84 184 48 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV 0 READ POINT PLD FLASH CY7C374I-JC M74050 9722 349611012 128 MCEL FL CMOS TX PLCC KOREA-A 84 -5 25 85 116 116 116 0 0 0 M80172 9728 219707333 128 MCEL FL CMOS TX PLCC ALPHA-X 84 -5 25 85 116 116 116 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 12 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- SRAM/LOGIC-C2AN VIC068A-BC 144 DRET 165C/NO BIAS CPD VME M80165 9746 349705554 VME INTERF. CMOS MN PPGA PHIL-M 168 1000 77 77 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 13 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- SRAM/LOGIC-L20 CY7C611A-NC DRET 165C/NO BIAS CPD VME M74064 9728 349703682 RISC CONTRL CMOS TX PQFP HK-B 160 168 1000 76 76 0 0 M80183 9731 349704147 RISC CONTRL CMOS TX PQFP HK-B 160 168 1000 78 78 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC -40C TO 125C CPD VME CY7C611A-NC M74062 9728 349703682 RISC CONTRL CMOS TX PQFP HK-B 160 500 1500 46 40 0 0 16 EXTERNAL CONTAMINATION ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 14 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-L28 CY2273APVC DRET 165C/NO BIAS CPD TTECH 97403 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 9740 619708289/ CLOCK SYN. CMOS TX SSOP CSPI-R 48 168 552 78 78 0 0 9745 619709731 CLOCK SYN. CMOS TX SSOP CSPI-R 48 168 552 78 78 0 0 619709732 CLOCK SYN. CMOS TX SSOP CSPI-R 48 168 552 78 78 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HAST 140C/3.63V CPD TTECH CY2273APVC 97403 9740 619708289/ CLOCK SYN. CMOS TX SSOP CSPI-R 48 128 256 44 44 0 0 9745 619709732 CMOS TX SSOP CSPI-R 48 128 45 0 CLOCK SYN. ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/3.65V CPD TTECH CY2273APVC 97403 9740 619708289/ CLOCK SYN. CMOS TX SSOP CSPI-R 48 48 48 48 80 500 30 150 150 116 116 0 0 0 0 0 9745 619709731 CLOCK SYN. CMOS TX SSOP CSPI-R 48 48 48 48 80 500 100 120 120 120 116 0 0 0 0 0 619709732 CLOCK SYN. CMOS TX SSOP CSPI-R 48 48 48 80 500 116 214 116 115 0 0 0 0 1 EOS ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS CPD TTECH CY2273APVC 97403 9740 619708289/ CLOCK SYN. CMOS TX SSOP CSPI-R 48 336 500 1000 45 45 45 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 15 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-L28 CY2273APVC LTOL -30C/6.5V CPD TTECH 97403 9740 619708289/ CLOCK SYN. CMOS TX SSOP CSPI-R No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------48 500 1000 45 45 0 0 1 EOS ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C CPD TTECH CY2273APVC 97403 9740 619708289/ CLOCK SYN. CMOS TX SSOP CSPI-R 48 300 1000 45 45 0 0 9745 619709731 CLOCK SYN. CMOS TX SSOP CSPI-R 48 300 1000 48 48 0 0 619709732 CLOCK SYN. CMOS TX SSOP CSPI-R 48 300 1000 47 47 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 16 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R21 HAST 140C/5.5V MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C185-VC M80147 9745 619709631 SML/64K CMOS TX SOJ CSPI-R No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------28 128 76 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/5.75V MPD COMDTY CY7C185-VI M74027 9734 519708252 SML/64K CMOS TX SOJ INDNS-O 28 96 500 1000 2000 115 115 115 115 0 0 0 0 CY7C186-ZC M74010 9725 619704309 SML/64K CMOS TX TSOP KOREA-Q 32 96 500 1000 2000 116 116 116 116 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V MPD COMDTY CY7C185-45PC CY7C185-VI M73029 9723 219705968 SML/64K CMOS TX PDIP ALPHA-X 28 96 500 1000 2000 120 116 116 116 0 4 EOS 0 0 0 M74028 9734 519708252 SML/64K CMOS TX SOJ 28 96 500 1000 2000 115 115 115 115 0 0 0 0 INDNS-O ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV 0 READ POINT MPD COMDTY CY7C185-VC M80144 9745 619709631 SML/64K CMOS TX SOJ CSPI-R 28 -5 25 85 116 116 116 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 17 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R28 HAST No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 140C/3.63 DCD SPCM CY7C4245-JC 97272 9749 349705972 4Kx18 FIFO CMOS MN PLCC PHIL-M 32 128 48 0 140C/5.5V DCD SPCM CY7C136-JC M80124 9742 519713305 2K x 8 DP CMOS MN PLCC INDNS-O 52 128 77 1 1 LIFTING BOND/S CY7C4245-AC M74060 9729 619705320 4Kx18 FIFO CMOS MN TQFP KOREA-Q 64 128 78 0 M80149 9728 619704566 4Kx18 FIFO CMOS MN TQFP KOREA-Q 64 128 76 0 M80129 9741 619708282 256K x 4 CMOS MN SOJ CSPI-R 32 128 77 0 CY7C188-VC M80137 9745 349705798 32K x 9 CMOS MN SOJ PHIL-M 32 128 67 0 CY7C199-VC M80115 9746 619709733 32K x 8 CMOS TX SOJ CSPI-R 28 128 77 2 2 SPEED DEGRADATION M80197 9808 619802072 32K x 8 CMOS TX SOJ CSPI-R 28 128 76 0 M80198 9808 619801874 32K x 8 CMOS TX SOJ CSPI-R 28 128 76 0 MPD COMDTY CY7C1009-VC ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/3.8V DCD SPCM CY7C4245-JC 150C/5.75V MPD COMDTY CY7C199-VC 97272 9749 349705972 98082 4Kx18 FIFO CMOS MN PLCC PHIL-M 32 48 80 500 1532 130 130 0 0 0 9803 619800042N 32K x 8 CMOS TX SOJ CSPI-R 28 48 1373 0 619800397N 32K x 8 CMOS TX SOJ CSPI-R 28 48 1445 0 9804 619800236N 32K x 8 CMOS TX SOJ CSPI-R 28 48 1459 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/5.75V MPD COMDTY CY7C1009-VC CY7C109-VC M74015 9732 619705971 256K x 4 CMOS MN SOJ CSPI-R 32 96 500 1000 2000 116 114 114 114 1 1 TOPSIDE SCRATCHES 0 1 ESD 0 0 2 EOS M74021 9734 519708340 128K x 8 CMOS MN SOJ INDNS-O 32 96 115 0 Page 18 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R28 HTOL2 125C/5.75V MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C109-VC M74021 9734 519708340 128K x 8 CMOS MN SOJ INDNS-O CY7C199-ZI M74033 9730 619705361 32K x 8 CMOS MN TSOP CSPI-R No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------32 500 1000 2000 115 115 115 0 0 0 28 96 500 1000 2000 116 115 115 115 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL 150C/3.63V DCD SPCM CY7C4245-JC 97272 9749 349705972 4Kx18 FIFO CMOS MN PLCC PHIL-M 32 80 168 78 78 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V 125C/5.5V MPD MPD COMDTY CY7C109-VC COMDTY CY7C1009-VC CY7C199-ZI M73035 9722 519705873 128K x 8 CMOS MN SOJ TAIWN-G 32 96 500 1000 2000 120 120 120 120 0 0 0 0 M74022 9734 519708340 128K x 8 CMOS MN SOJ INDNS-O 32 96 500 1500 2000 116 116 116 116 0 0 0 0 M74016 9732 619705971 256K x 4 CMOS MN SOJ CSPI-R 32 96 500 1000 2000 116 115 115 113 0 1 EOS 0 1 1 PARTICLE 0 1 EOS M74034 9730 619705361 32K x 8 CMOS MN TSOP CSPI-R 28 96 500 1000 2000 116 116 116 116 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH DCD SPCM CY7C136-JC M80123 9742 519713305 Page 19 of 34 2K x 8 DP CMOS MN PLCC INDNS-O 52 96 168 77 77 0 0 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R28 CY7C4245-AC PCT 121C/100%RH DCD SPCM MPD COMDTY CY7C199-ZI No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- M80148 9728 619704566 4Kx18 FIFO CMOS MN TQFP KOREA-Q 64 96 168 77 77 0 0 M74035 9730 619705361 32K x 8 CMOS MN TSOP CSPI-R 28 96 168 77 58 0 3 EOS 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C DCD MPD SPCM CY7C136-JC M74001 9716 349616269 2K x 8 DP CMOS MN PLCC PHIL-M 52 300 500 1000 46 46 46 0 0 2 2 UNKNOWN M80125 9742 519713305 2K x 8 DP CMOS MN PLCC INDNS-O 52 300 500 1000 46 46 46 0 0 0 CY7C4221-AC 97272 9801 619711520 1Kx9 FIFO CMOS MN TQFP KOREA-A 32 300 55 0 CY7C4221-JC 97272 9751 219713130 1Kx9 FIFO CMOS MN PLCC ALPHA-X 32 300 1000 48 48 0 0 CY7C4235-JC 97272 9805 619800785 2Kx18 FIFO CMOS MN PLCC KOREA-A 32 300 54 0 CY7C4245-AC M80150 9728 619704566 4Kx18 FIFO CMOS MN TQFP KOREA-Q 64 300 500 1000 48 48 48 0 0 0 M80186 9749 519713657 128K x 8 CMOS MN SOJ 32 300 500 1000 45 45 45 0 0 0 COMDTY CY7C109-VC INDNS-O ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV 0 READ POINT DCD SPCM CY7C136-JC MPD COMDTY CY7C1009-VC M80120 9742 519713305 2K x 8 DP CMOS MN PLCC INDNS-O 52 -5 25 85 116 116 116 0 0 0 M80126 9741 619708282 256K x 4 CMOS MN SOJ 32 -5 117 0 Page 20 of 34 CSPI-R CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R28 TEV 0 READ POINT MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1009-VC No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- M80126 9741 619708282 256K x 4 CMOS MN SOJ CSPI-R 32 25 85 117 117 0 0 CY7C188-VC M80134 9745 349705798 32K x 9 CMOS MN SOJ PHIL-M 32 -5 25 85 116 116 116 0 0 0 CY7C199-VC M80179 9748 619710553 32K x 8 CMOS MN SOJ PHIL-GW 28 -5 25 85 117 117 117 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 21 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R3 HAST 140C/3.63V 140C/5.5V MPD MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1021-BSC 97354 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 9739 349705285 64K x16 CMOS MN MBGA TAIWN-G 48 36 128 52 52 0 0 349705286 64K x16 CMOS MN MBGA TAIWN-G 48 36 128 52 51 0 0 COMDTY CY7C1021-ZSC 97491 9746 619708845L 64K x16 CMOS MN TSOP TAIWN-T 44 128 54 0 SYNC 98093 9740 519710279 64K x 18 CMOS MN PLCC INDNS-O 52 128 256 46 44 2 2 LIFTED BOND 0 519710280 64K x 18 CMOS MN PLCC INDNS-O 52 128 46 1 1 LIFTED BOND M74099 9737 519709659 64K x 18 CMOS MN PLCC INDNS-O 52 128 128 22 54 0 1 1 EOS/1 OTHERS M80161 9742 519710953 64K x 18 CMOS MN PLCC INDNS-O 52 128 128 27 50 0 1 EOS 0 1 EOS CY7C1031-JC ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/5.75V MPD SYNC CY7C1031-JC 98093 9727 519706959 64K x 18 CMOS MN PLCC INDNS-O 52 80 500 1000 116 115 115 1 1 NON VISUAL 0 1 1 EOS/1 NON VISUAL 9731 519708075 64K x 18 CMOS MN PLCC INDNS-O 52 80 500 116 116 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/5.75V MPD COMDTY CY7C1021-BSC CY7C199-VC 97354 9739 349705284/ 64K x16 CMOS MN MBGA TAIWN-G 48 96 96 96 96 168 500 11 96 147 240 120 120 1 1 3 1 0 0 M74045 9729 619705121 CMOS MN SOJ 28 96 500 1000 2000 116 116 116 116 0 0 0 0 Page 22 of 34 256K CSPI-R 1 1 1 1 CHIP-OUTS BROKEN BOND OTHER TOPSIDE CRACKS/2 OTHERS NON VISUAL CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------SRAM/LOGIC-R3 HTS 165C/NO BIAS MPD COMDTY CY7C1021-BSC 97354 9739 349705284 64K x16 CMOS MN MBGA TAIWN-G 48 336 500 1000 50 50 50 0 0 0 CY7C1021-ZSC 97491 9746 619708845L 64K x16 CMOS MN TSOP TAIWN-T 44 336 50 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL 150C/5.75V MPD SYNC CY7C1031-JC 98093 9727 519706959 64K x 18 CMOS MN PLCC INDNS-O 52 80 168 76 76 0 0 9731 519708075 64K x 18 CMOS MN PLCC INDNS-O 52 80 168 77 77 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V 125C/5.5V MPD SYNC CY7C1031-JC MPD COMDTY CY7C199-VC M74097 9737 519709659 64K x 18 CMOS MN PLCC INDNS-O 52 96 500 1000 2000 116 116 116 116 0 4 EOS 0 0 0 M74046 9729 619705121 256K CMOS MN SOJ 28 96 500 1000 2000 116 116 116 116 0 0 0 0 CSPI-R ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH MPD COMDTY CY62256V-ZC CY7C199-VC M73081 9650 349613775 32K x 8 CMOS CA TSOP PHIL-M 28 96 168 79 69 7 7 TOPSIDE CRACKS 0 2 EOS M74092 9705 349700731 32K x 8 CMOS CA TSOP PHIL-M 28 96 168 76 76 0 1 1 UNKNOWN M80189 9802 619711953 256K CMOS MN SOJ 28 54 96 168 81 81 81 0 0 0 Page 23 of 34 CSPI-R CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- SRAM/LOGIC-R3 PCT 121C/100%RH MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C199-VC SYNC CY7C1031-JC M80190 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 256K CMOS MN SOJ CSPI-R 28 54 96 168 75 75 75 0 0 0 CSPI-R 28 54 96 168 99 99 99 0 0 1 1 TOPSIDE CRACKS M80191 9750 619710984 256K CMOS MN SOJ M74098 9737 519709659 64K x 18 CMOS MN PLCC INDNS-O 52 96 77 0 M80162 9742 519710953 64K x 18 CMOS MN PLCC INDNS-O 52 96 168 77 74 0 3 EXTERNAL CONTAMINATION 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------T/S -55C TO 150C MPD COMDTY CY7C1021-BSC 97354 9739 349705284 64K x16 CMOS MN MBGA TAIWN-G 48 100 200 50 50 0 0 CY7C1021-ZSC 97491 9746 619708845L 64K x16 CMOS MN TSOP TAIWN-T 44 100 200 50 50 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC -40C TO 125C MPD COMDTY CY7C1021-BSC 97354 9739 349705284 64K x16 CMOS MN MBGA TAIWN-G 48 500 1000 1500 55 55 55 0 0 0 349705285 64K x16 CMOS MN MBGA TAIWN-G 48 500 1000 1500 55 55 55 0 0 0 349705286 64K x16 CMOS MN MBGA TAIWN-G 48 500 1000 1500 55 55 55 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD COMDTY CY7C1021-ZSC 97491 9746 619708843L 64K x16 CMOS MN TSOP TAIWN-T 44 300 1000 50 50 0 0 619708844L 64K x16 CMOS MN TSOP TAIWN-T 44 300 50 0 Page 24 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R3 TC2 -65C TO 150C MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1021-ZSC SYNC CY7C1031-JC 97491 98093 No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 9746 619708844L 64K x16 CMOS MN TSOP TAIWN-T 44 1000 50 0 619708845L 64K x16 CMOS MN TSOP TAIWN-T 44 300 1000 50 50 0 0 9731 519708075 64K x 18 CMOS MN PLCC INDNS-O 52 300 86 0 9740 519710280 64K x 18 CMOS MN PLCC INDNS-O 52 300 46 0 519710281 64K x 18 CMOS MN PLCC INDNS-O 52 300 46 0 M74100 9737 519709659 64K x 18 CMOS MN PLCC INDNS-O 52 300 500 1000 1500 2000 3000 46 46 46 46 46 46 0 0 0 0 0 0 M80163 9742 519710953 64K x 18 CMOS MN PLCC INDNS-O 52 300 500 1000 46 46 46 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV 0 READ POINT MPD COMDTY CY7C199-VC M80192 9802 619711953 256K CMOS MN SOJ SYNC M80158 9742 519710953 64K x 18 CMOS MN PLCC INDNS-O CY7C1031-JC CSPI-R 28 -5 25 85 117 117 115 1 1 UNKNOWN 0 0 52 -5 25 85 116 116 116 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 25 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R31 HAST No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 140C/3.0V MPD SYNC CY7C1399-ZC M73001 9645 349613772 32K x 8 CMOS CA TSOP PHIL-M 28 128 128 8 72 1 1 UNKNOWN 0 140C/3.3V MPD SYNC CY7C1399-VC M80111 9744 619709194 32K x 8 CMOS MN SOJ 28 128 128 21 56 0 0 PHIL-M ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/3.80V MPD SYNC CY7C1399-VC M74039 9727 619704667 32K x 8 CMOS MN SOJ PHIL-M 28 96 500 1000 2000 116 116 116 116 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/3.63V MPD SYNC CY7C1399-VC M74040 9727 619704667 32K x 8 CMOS MN SOJ PHIL-M 28 96 500 1000 2000 116 116 116 116 0 0 0 0 2 EOS ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 26 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R32 CY6157R202V0-ZA 97294 HAST 140C/3.3V MPD SYNC 140C/5.5V MPD COMDTY CY62256-SNC CY7C109-VC No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 9744 349705604L 256K/2M ROM CMOS MN STSO TAIWAN-T 32 128 48 0 M73012 9720 519705368 32K x 8 CMOS CA NSOI INDNS-O 28 128 77 0 1 EOS M80119 9744 519710283 32K x 8 CMOS CA NSOI INDNS-O 28 128 76 M80133 9745 519712223 128K x 8(5) CMOS MN SOJ 32 128 75 INDNS-O 0 14 13 POPCORN/1 UNKNOWN ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/3.45V MPD SYNC CY6157R202V0-ZA 97294 150C/3.80V MPD COMDTY CY62128V-SC 150C/4.45V MPD SYNC 150C/5.75V MPD COMDTY CY62128-SC 97499 CY6157R202V0-ZA 97294 CY62256-SNC 97499 9744 349705604L 256K/2M ROM CMOS MN STSO TAIWAN-T 32 48 80 500 759 117 117 9751 719710244 CMOS MN SOIC TAIWAN-G 32 48 1747 0 9747 619710102L 256K/2M ROM CMOS MN STSO TAIWAN-T 32 48 80 500 757 118 118 0 0 0 9743 619708508D 128K x 8 CMOS MN SOIC TAIWAN-G 32 48 1267 0 1 EOS 128K x 8 0 0 0 1 MIXED AT BIN 619708595 128K x 8 CMOS MN SOIC TAIWAN-G 32 48 1265 0 619708666 128K x 8 CMOS MN SOIC TAIWAN-G 32 48 1278 0 9746 619709300 128K x 8 CMOS MN SOIC TAIWAN-G 32 48 913 0 97329 9735 519709032/ 32K x 8 CMOS MN NSOI INDNS-O 28 48 48 48 80 500 513 513 513 380 379 0 0 0 0 0 1 EOS 97468 9740 519710622D 32K x 8 CMOS MN NSOI INDNS-O 28 48 1195 0 1 EOS 9803 519800538/ 32K x 8 CMOS MN NSOI INDNS-O 28 48 3522 1 1 OTHERS Page 27 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- SRAM/LOGIC-R32 HTOL 150C/5.75V MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- COMDTY CY62256-SNC 98076 9805 519801105/ 32K x 8 CMOS MN NSOI INDNS-O 28 48 3783 0 CY62256-SNI 97468 9741 519710876/ 32K x 8 CMOS MN NSOI INDNS-O 28 48 1140 1 1 NON VISUAL 519710879/ 32K x 8 CMOS MN NSOI INDNS-O 28 48 1200 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/5.75V MPD COMDTY CY62256-SNC M74005 9732 519707894 32K x 8 CMOS CA NSOI INDNS-O 28 96 500 1000 2000 116 114 114 114 0 0 1 EOS 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL 150C/3.3V MPD SYNC CY6157R202V0-ZA 97294 9744 349705604L 256K/2M ROM CMOS MN STSO TAIWAN-T 32 80 168 78 78 0 0 9747 619710102L 256K/2M ROM CMOS MN STSO TAIWAN-T 32 80 168 78 78 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL2 125C/5.50V MPD COMDTY CY62256-SNC M74006 9732 519707894 32K x 8 CMOS CA NSOI INDNS-O 28 96 500 1000 2000 116 115 115 115 0 1 EOS 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH MPD COMDTY CY62256-SNC M80188 9744 519710283 32K x 8 CMOS CA NSOI INDNS-O 28 96 168 76 76 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD COMDTY CY62256-SNC M80187 9744 519710283 Page 28 of 34 32K x 8 CMOS CA NSOI INDNS-O 28 300 500 1000 45 45 45 0 0 0 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- SRAM/LOGIC-R32 CY6157R202V0-ZA 97294 TC2 -65C TO 150C MPD SYNC No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 9744 349705604L 256K/2M ROM CMOS MN STSO TAIWAN-T 32 300 1000 48 48 0 0 9747 619710102L 256K/2M ROM CMOS MN STSO TAIWAN-T 32 300 1000 48 48 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV 0 READ POINT MPD COMDTY CY62256-SNC M80116 9744 519710283 32K x 8 CMOS CA NSOI INDNS-O 28 -5 25 85 117 117 117 0 0 0 CY62256V-ZC M80138 9749 619710170 32K x 8 CMOS MN TSOP CSPI-G 28 -5 25 85 116 116 116 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 29 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R32D HAST 140C/5.5V MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1049-VC M80104 9747 619709647 512K x 8 CMOS MN SOJ KOREA-L No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------36 128 78 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------PCT 121C/100%RH MPD COMDTY CY7C1049-VC M80106 9747 619709647 512K x 8 CMOS MN SOJ KOREA-L 36 96 79 0 1 LASER FUSE INC. SERVER ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD COMDTY CY7C1049-VC M80105 9747 619709647 512K x 8 CMOS MN SOJ KOREA-L 36 300 500 48 48 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TEV 0 READ POINT MPD COMDTY CY7C1049-VC M80101 9747 619709647 512K x 8 CMOS MN SOJ KOREA-L 36 -5 25 85 118 119 118 0 1 1 OTHERS 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 30 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R33 HTOL 150C/4.3V MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY7C1021V33-BSC 97354 9738 619706882 64K x16 CMOS MN MBGA TAIWN-G No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------48 48 48 48 80 401 86 185 355 116 116 0 0 0 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL2 125C/4.30V MPD COMDTY CY7C1021V33-BSC 97354 9740 619706884 64K x16 CMOS MN MBGA TAIWN-G 48 48 48 150 288 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 31 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R42 HAST Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- 140C/3.63 MPD COMDTY CY62256V-VC 97496 9740 619708056 32K x 8 CMOS MN SOJ CSPI-R 28 128 256 45 45 0 0 140C/3.63V MPD COMDTY CY62256V-VC 97465 9745 619709356/ 32K x 8 CMOS MN SOJ CSPI-R 28 128 256 47 47 0 0 97496 9745 619709132/ 32K x 8 CMOS MN SOJ CSPI-R 28 128 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/3.90V MPD COMDTY CY62256V-VC 97465 9745 619709356/ 32K x 8 CMOS MN SOJ CSPI-R 28 80 500 1000 118 116 115 0 0 0 97496 9710 619702695/ 32K x 8 CMOS MN SOJ CSPI-R 28 80 500 1000 533 533 533 0 0 0 9725 619703951/ 32K x 8 CMOS MN SOJ CSPI-R 28 80 500 530 530 0 0 619703998/ 32K x 8 CMOS MN SOJ CSPI-R 28 80 500 530 529 1 1 OTHERS 1 1 TOPSIDE CRACKS ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTS 165C/NO BIAS MPD COMDTY CY62256V-VC 97496 9719 619702695/ 32K x 8 CMOS MN SOJ CSPI-R 28 336 1000 48 48 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL 150C/3.90V MPD COMDTY CY62256V-VC 97465 9745 619709356/ 32K x 8 CMOS MN SOJ CSPI-R 28 80 168 78 77 97496 9710 619702695/ 32K x 8 CMOS MN SOJ CSPI-R 28 80 168 157 157 0 0 9725 619703951/ 32K x 8 CMOS MN SOJ CSPI-R 28 80 168 248 165 165 165 0 0 0 Page 32 of 34 0 1 EOS 0 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----SRAM/LOGIC-R42 HTSSL 150C/3.90V MPD Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- COMDTY CY62256V-VC 97496 9725 619703998/ 32K x 8 CMOS MN SOJ CSPI-R No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------28 80 168 165 165 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------LTOL -30C/4.3V MPD COMDTY CY62256V-VC 97496 9719 619702695/ 32K x 8 CMOS MN SOJ CSPI-R 28 500 45 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD COMDTY CY62256V-VC 97465 9745 619709356/ 32K x 8 CMOS MN SOJ CSPI-R 28 300 1000 90 90 0 0 97496 9710 619702695/ 32K x 8 CMOS MN SOJ CSPI-R 28 300 1000 91 91 0 0 9725 619703951/ 32K x 8 CMOS MN SOJ CSPI-R 28 300 1000 90 90 0 0 619703998/ 32K x 8 CMOS MN SOJ CSPI-R 28 300 1000 90 90 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 33 of 34 CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Cypress Semiconductor Corporation Quarterly Reliability Report Quarter 1, 1998 Divi- FuncTechnology Test Test Condition sion tion ---------------- ------ ---------------- ----- ----- Assembly Descr ProWfr Pkg Assy Device Eval# D/C Lot No Description cess Loc type Loc --------------- ------- ---- ---------- ----------- ------ --- ---- ------- No Dura Qty Qty Pin tion Test Fail Fail Mode --- ---- ----- ---- ------------------------- SRAM/LOGIC-R42D CY7C1334-AC 100 HAST 140C/3.63 MPD SYNC 97328 9752 349706242 64K x 32 CMOS MN TQFP TAIWN-G 128 256 48 48 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTOL 150C/3.8V MPD SYNC CY7C1334-AC 97328 9752 349706242 64K x 32 CMOS MN TQFP TAIWN-G 100 80 500 530 530 0 1 1 LIFTING BOND/S 9801 619711701 64K x 32 CMOS MN TQFP TAIWN-G 100 80 500 525 515 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------HTSSL 150C/3.63V MPD SYNC CY7C1334-AC 97328 9752 349706242 64K x 32 CMOS MN TQFP TAIWN-G 100 80 168 78 78 0 0 150C/63V MPD SYNC CY7C1334-AC 97328 9801 619711701 64K x 32 CMOS MN TQFP TAIWN-G 100 80 168 78 78 0 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------TC2 -65C TO 150C MPD SYNC CY7C1334-AC 97328 9752 349706242 64K x 32 CMOS MN TQFP TAIWN-G 100 300 1000 49 49 0 0 9801 619711701 64K x 32 CMOS MN TQFP TAIWN-G 100 300 49 0 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Page 34 of 34