QTP#150201 - 32L TQFP (7X7X1.0/1.4MM) PURE SN LEADFINISH, CUPD WIRE MSL3, 260C REFLOW AMKOR-PHILIPPINES (M).pdf

Document No.001-97417 Rev. *B
ECN # 4882971
Cypress Semiconductor
Package Qualification Report
QTP# 150201 VERSION *B
September 2015
32L TQFP (7x7x1.0/1.4mm)
Pure Sn Leadfinish, CuPd Wire
MSL3, 260C Reflow
Amkor-Philippines (M)
FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] :
OR VIA LINK A CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Don Darling
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 9
Document No.001-97417 Rev. *B
ECN # 4882971
PACKAGE QUALIFICATION HISTORY
QTP
Number
150201
Description of Qualification Purpose
Qualification of 32L TQFP (7x7x1.0/1.4mm) Package, using 1.0mil
CuPd wire, G631 mold compound, AP4200 die attach material and
Pure Sn leadfinish at MSL3, 260C Reflow Temperature.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 9
Date
Apr
2015
Document No.001-97417 Rev. *B
ECN # 4882971
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
AE32
Package Outline, Type, or Name:
32L TQFP (7x7x1.0mm)
Mold Compound Name/Manufacturer:
G631HQ / Sumitomo
Mold Compound Flammability Rating:
V-0 / UL94
Mold Compound Alpha Emission Rate:
N/A (not low alpha mold compound)
Oxygen Rating Index: >28%
>28% typical value
Lead Frame Designation:
Full Metal Pad
Lead Frame Material:
C194
Substrate Material:
N/A
Lead Finish, Composition / Thickness:
Pure Sn
Die Backside Preparation Method/Metallization:
Grinding
Die Separation Method:
Wafer Saw
Die Attach Supplier:
Evertech Enterprise
Die Attach Material:
AP4200
Bond Diagram Designation
001-91284
Wire Bond Method:
Thermosonic
Wire Material/Size:
CuPd / 1.0 mil
Thermal Resistance Theta JA C/W:
76°C/W
Package Cross Section Yes/No:
No
Assembly Process Flow:
001-97022
Name/Location of Assembly (prime) facility:
Amkor-Philippines (M)
MSL LEVEL
3
REFLOW PROFILE
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R
Note: Please contact a Cypress Representative for other package availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 9
Document No.001-97417 Rev. *B
ECN # 4882971
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
High Temperature Operating Life
Latent Failure Rate (LFR)
Pressure Cooker Test
Temperature Cycle
Acoustic Microscopy
Test Condition (Temp/Bias)
Dynamic Operating Condition, 150°C, 2.3V, 500 Hours
JESD22-A-108-B
JESD22-A102, 121 C, 100%RH, 15 PSIG
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
Result
P/F
P
P
P
P
Constructional Analysis
Criteria: Meet external and internal
characteristics of package
P
High Temp Storage
JESD22-A103: 150 C, no bias
P
X-Ray
MIL-STD-883 – 2012
P
Internal Visual
MIL-STD-883-2014
P
Final Visual Inspection
JESD22-B101B
P
Bond Pull
MIL-STD-883 – Method 2011
P
Ball Shear
JESD22-B116A
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110, 130 C, 85%RH, 3.63V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C°, 60% RH, 260C Reflow)
No Package Crack
Dye Penetrant Test
P
P
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Physical Dimension
500V, JESD22-C101
MIL-STD-1835, JESD22-B100
P
Solderability
J-STD-002, JESD22-B102
P
Post Stress Ball Shear
JESD22-A116
P
Post Stress Bond Pull
MIL-STD-883 – Method 2011
P
Die Shear
MIL-STD-883, Method 2019
Per die size:

<3000 sq. mils = 1.2 kgf

30001-5000 sq. mils = 1.2 kgf

>5001 sq. mils = 1.2 kgf
P
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 9
P
Document No.001-97417 Rev. *B
ECN # 4882971
Reliability Test Data
QTP #: 150201
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
150
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
150
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
150
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
150
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
150
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
150
0
STRESS: BALL SHEAR
STRESS: BOND PULL
STRESS: CONSTRUCTIONAL ANALYSIS
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
5
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
15
0
STRESS: DIE SHEAR
STRESS: DYE PENETRANT
STRESS: ESD-CHARGE DEVICE MODEL
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
500
9
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
1000
3
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
1250
3
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 9
Document No.001-97417 Rev. *B
ECN # 4882971
Reliability Test Data
QTP #: 150201
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: FINAL VISUAL INSPECTION
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
946
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
997
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
988
0
STRESS: HIGH ACCELERATED SATURATION TEST 130C, 3.63V, 85%RH, PRE COND 192 HR 30C/60%RH (MSL3)
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
96
32
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
192
22
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
96
30
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
192
30
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
96
30
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
192
30
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
5
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
5
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
5
0
STRESS: INTERNAL VISUAL
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.3V, Vcc Max
7C08323CC
AZ120 4430901
611438709
AMKOR-M
500
80
0
7C08323CC
AZ120 4430901
611438708
AMKOR-M
500
80
0
7C08323CC
AZ120 4430901
611438707
AMKOR-M
500
80
0
STRESS: HIGH TEMPERATURE STORAGE
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
500
79
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
79
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423693
AMKOR-M
1000
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
500
80
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423692
AMKOR-M
1000
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 9
Document No.001-97417 Rev. *B
ECN # 4882971
Reliability Test Data
QTP #: 150201
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: PRESSURE COOKER TEST
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
168
82
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
168
79
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
288
78
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
168
80
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
288
80
0
STRESS: PHYSICAL DIMENSION
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
30
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
30
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
30
0
96
5
0
STRESS: POST HIGH ACCELERATED SATURATION TEST BALL SHEAR TEST
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
STRESS: POST HIGH ACCELERATED SATURATION TEST BOND PULL
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
96
5
0
4324993
611443725
AMKOR-M
COMP
1
0
4324993
611443725
AMKOR-M
COMP
1
0
611443725
AMKOR-M
COMP
1
0
STRESS: POST MSL BALL SHEAR
CY2DP1510AXC (7C85500AC)
AE32
STRESS: POST MSL BOND PULL
CY2DP1510AXC (7C85500AC)
AE32
STRESS: POST MSL CONSTRUCTIONAL ANALYSIS
CY2DP1510AXC (7C85500AC)
AE32
4324993
STRESS: POST PRESSURE COOKER TEST BALL SHEAR
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
168
5
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
288
5
0
STRESS: POST PRESSURE COOKER TEST BOND PULL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
168
5
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
288
5
0
STRESS: POST TEMPERATURE CYCLE BALL SHEAR
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
500
5
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
5
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 9
Document No.001-97417 Rev. *B
ECN # 4882971
Reliability Test Data
QTP #: 150201
Device
Package
Fab Lot #
Assy Lot #
Assy Loc
Duration Samp Rej Failure Mechanism
STRESS: POST TEMPERATURE CYCLE BOND PULL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
500
5
0
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
5
0
AMKOR-M
1000
5
0
STRESS: POST HIGH TEMPERATURE STORAGE BALL SHEAR TEST
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
STRESS: POST HIGH TEMPERATURE STORAGE BOND PULL
CY8C27543 (8C27543BC)
AZ44
4405950
611423694
AMKOR-M
1000
5
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
3
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
3
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
3
0
STRESS: SOLDERABILITY
STRESS: TEMPERATURE CYCLE
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
500
82
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
1000
72
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
500
80
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
1000
80
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
500
79
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
1000
79
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443725
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443726
AMKOR-M
COMP
15
0
CY2DP1510AXC (7C85500AC)
AE32
4324993
611443727
AMKOR-M
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 9
Document No.001-97417 Rev. *B
ECN # 4882971
Document History Page
Document Title: QTP#150201: 32L TQFP (7X7X1.0/1.4MM) PURE SN LEADFINISH, CUPD WIRE MSL3, 260C
REFLOW AMKOR-PHILIPPINES (M)
Document Number:
001-97417
Rev. ECN
No.
**
4748790
*A
4794191
*B
4882971
Orig. of
Change
HSTO
HSTO
HSTO
Description of Change
DCON
Removed distribution and posting from the document history page.
Initial spec release
Update Electrical Test/Finish Description Table
Added HAST robustness 192h readpoint test result.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 9
Similar pages
QTP 143606:Automotive 48L VFBGA (6X8X1.0MM) SAC-105 Ball Finish, CUPD WIRE MSL3, 260C Reflow CML-Philippines(RA).pdf
QTP 153701:New Package Qualification of the BKK 24 FBGA, with CuPd, KMC-3580LVA, CRM-1577DB, SAC 305, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4.pdf
QTP# 150414:48 VFBGA (6X8X1.0MM) SAC 105 SOLDER BALL FINISH, CUPD WIRE, MSL3, 260C REFLOW, CML-RA
QTP 114903:16 QFN (3X3X0.6MM) 08 DFN (5X6X0.8MM) NIPDAU-AG, 100% CU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G)
QTP 114403 :48 QFN(6X6X0.6MM) NIPDAU, CU-PD WIRE MSL3, 260C REFLOW ASEK-TAIWAN
Qtp#143604:Lq16 Qfn16 (3x3x0.6mm) Lq24 Qfn24 (4x4x0.6mm) Pure Sn, Cupd Wire Msl3, 260 Reflow.pdf
QTP 140204 - 48 VFBGA (6x8x1.0mm) SAC 105, CuPd Wire MSL3, 260C Reflow CML-RA.pdf
QTP 144202:Automotive 28L SSOP (209 Mils) NiPdAuAg (Roughened) Leadfinish, Au Wire, MSL3, 260C Reflow, CML-RA.pdf
QTP 151502:New Package Qualification Of The UTL 16LD 300-MIL SOIC, WITH CUPD, G605, 8200T, PURE SN, AT MSL3, 260C, WITH 1M NVSRAM, S8 Technology from CMI FAB4.pdf
QTP 102610:48-LEAD QFN (7X7X1.0 MM) NIPDAU, MSL3, 260C REFLOW CML-RA
QTP 114907:32 QFN (5X5X1.0MM) NIPDAU, 100% CU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G)
QTP#152916 - TSOP I 48LD (12x18.4x1.0mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow BKK-Thailand (SB).pdf
QTP# 150413:48 VFBGA (6X8X1.0MM) SAC 105 SOLDER BALL FINISH, CUPD WIRE, MSL3, 260C REFLOW, ASE-TAIWAN (G)
QTP 110909:100-LEAD TQFP (14X14X1.4 MILS),100LD / 128LD TQFP (14X20X1.4 MILS) NIPDAU, MSL3 260C REFLOW JCET- CHINA (JT)
QTP 154002:New Package Qualification of the CML 16LD 300-mil SOIC, with CuPd, KEG3000DA, QMI 509, NiPdAu, at MSL3, 260C, with 1M nvSRAM, S8 Technology from CMI Fab4.pdf
QTP 150417:Automotive 48L VGBGA (6X8X1.2MM) SAC-105 Ball Finish, AU WIRE MSL3, 260C REFLOW ASEK-TAIWAN (G).pdf
Qtp 92006 56-lead Saw Qfn (quad Flat No-lead) (8 X 8 X 1.0mm) Nipdau, Msl3, 260°c Reflow, Cml-ra.pdf
QTP 112302.pdf
QTP# 160703:Qualification of the 48 FBGA (6mm x 10mm x 1.2mm) BKK Package for nvSRAM, using KMC-3580LVA, CRM-1577DB, CuPd, and
QTP 133308 Qfn68l (8x8x1.0mm) Nipdau, Cupd Wire Msl3, 260°c Reflow Cml-ra.pdf
QTP 133309 FN68L (8x8x1.0mm) Pure Sn CuPd Wire MSL3 260C Reflow ASE-G.pdf
QTP 114404:56QFN (7X7X0.6MM) NIPDAU, CU-PD WIRE, MSL3 260C REFLOW ASEK- TAIWAN (G)