PD - 97703A AUTOMOTIVE GRADE AUIRLR3105 Features HEXFET® Power MOSFET Advanced Planar Technology l Logic-Level Gate Drive l Dynamic dV/dT Rating l Low On-Resistance l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated l Repetitive Avalanche Allowed up to Tjmax l Lead-Free, RoHS Compliant l Automotive Qualified* l V(BR)DSS RDS(on) typ. max ID D G S 55V 30mΩ 37mΩ 25A D Description S Specifically designed for Automotive applications, this Stripe Planar design of HEXFET® Power MOSFETs utilizes the latest processing techniques to achieve low on-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in Automotive and a wide variety of other applications. G D-Pak AUIRLR3105 G D S Gate Drain Source Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified. Max. Parameter Units ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 25 ID @ TC = 100°C Continuous Drain Current, VGS @ 10V Pulsed Drain Current c 18 100 PD @TC = 25°C Power Dissipation Linear Derating Factor VGS Gate-to-Source Voltage 57 0.38 ± 16 W W/°C V mJ IDM d EAS Single Pulse Avalanche Energy (Thermally Limited) 61 EAS (tested ) Single Pulse Avalanche Energy Tested Value 94 IAR Avalanche Current EAR dv/dt TJ TSTG d i A See Fig. 12a, 12b, 15, 16 Repetitive Avalanche Energy d Peak Diode Recovery dv/dt e mJ V/ns 3.4 -55 to + 175 Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds (1.6mm from case ) A °C 300 Thermal Resistance Typ. Max. ––– 2.65 Junction-to-Ambient (PCB Mount) ––– 50 Junction-to-Ambient ––– 110 RθJC Junction-to-Case RθJA RθJA k Parameter j Units °C/W HEXFET® is a registered trademark of International Rectifier. *Qualification standards can be found at http://www.irf.com/ www.irf.com 1 11/1/11 AUIRLR3105 Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units V(BR)DSS ΔV(BR)DSS/ΔTJ RDS(on) Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance VGS(th) Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current gfs IDSS IGSS Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage 55 ––– ––– ––– 1.0 15 ––– ––– ––– ––– ––– 0.056 30 35 ––– ––– ––– ––– ––– ––– ––– ––– 37 43 3.0 ––– 20 250 200 -200 Conditions V VGS = 0V, ID = 250μA V/°C Reference to 25°C, ID = 1mA VGS = 10V, ID = 15A mΩ VGS = 5.0V, ID = 13A V VDS = VGS, ID = 250μA S VDS = 25V, ID = 15A μA VDS = 55V, VGS = 0V VDS = 44V, VGS = 0V, TJ = 150°C nA VGS = 16V VGS = -16V f f f Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions Qg Qgs Qgd td(on) tr td(off) tf LD Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– ––– 8.0 57 25 37 4.5 20 5.6 9.0 ––– ––– ––– ––– ––– LS Internal Source Inductance ––– 7.5 ––– 6mm (0.25in.) from package Ciss Coss Crss Coss Coss Coss eff. Input Capacitance Output Capacitance Reverse Transfer Capacitance Output Capacitance Output Capacitance Effective Output Capacitance ––– ––– ––– ––– ––– ––– 710 150 28 890 110 210 ––– ––– ––– ––– ––– ––– S and center of die contact VGS = 0V VDS = 25V ƒ = 1.0MHz, See Fig. 5 VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz VGS = 0V, VDS = 44V, ƒ = 1.0MHz VGS = 0V, VDS = 0V to 44V nC ns nH g pF ID = 15A VDS = 44V VGS = 5.0V, See Fig. 6 & 13 VDD = 28V ID = 15A RG = 24 Ω RD = 5.0Ω, See Fig. 18 Between lead, f f D G Diode Characteristics Parameter IS Continuous Source Current ISM (Body Diode) Pulsed Source Current VSD trr Qrr ton (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time c Notes: Repetitive rating; pulse width limited by max. junction temperature. Limited by TJmax, starting TJ = 25°C, L = 0.55mH, RG = 25Ω, IAS = 15A, VGS =10V. ISD ≤ 25A, di/dt ≤ 290A/μs, VDD ≤ V(BR)DSS, TJ ≤ 175°C. Pulse width ≤ 300μs; duty cycle ≤ 2%. 2 Min. Typ. Max. Units ––– ––– A ––– ––– ––– ––– ––– ––– 52 82 Conditions MOSFET symbol 25 D 100 showing the integral reverse 1.3 78 120 S p-n junction diode. TJ = 25°C, IS = 15A, VGS = 0V TJ = 25°C, IF = 15A, VDD = 28V di/dt = 100A/μs V ns nC G f f Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD) Coss eff. is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS . Limited by TJmax ' see Fig 12a, 12b, 15, 16 for typical repetitive avalanche performance. This value determined from sample failure population. 100% tested to this value in production. When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. Rθ is measured at TJ of approximately 90°C. www.irf.com AUIRLR3105 Qualification Information† Automotive (per AEC-Q101) Qualification Level Moisture Sensitivity Level Machine Model ESD †† Comments: This part number(s) passed Automotive qualification. IR’s Industrial and Consumer qualification level is granted by extension of the higher Automotive level. D-Pak N/A ††† Class M2(+/- 200V ) (per AEC-Q101-002) Human Body Model Class H1A(+/- 500V ) (per AEC-Q101-001) Charged Device Model Class C5(+/- 2000V ) (per AEC-Q101-005) RoHS Compliant ††† ††† Yes † Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/ †† ††† Exceptions (if any) to AEC-Q101 requirements are noted in the qualification report. Highest passing voltage www.irf.com 3 AUIRLR3105 1000 100 VGS 15V 10V 5.0V 3.0V 2.7V 2.5V 2.25V BOTTOM 2.0V VGS 15V 10V 5.0V 3.0V 2.7V 2.5V 2.25V BOTTOM 2.0V TOP 100 10 ID, Drain-to-Source Current (A) ID, Drain-to-Source Current (A) TOP 1 0.1 2.0V 0.01 0.1 1 20μs PULSE WIDTH Tj = 25°C 10 10 2.0V 1 20μs PULSE WIDTH Tj = 175°C 0.1 0.1 100 Fig 1. Typical Output Characteristics 100 Fig 2. Typical Output Characteristics 30 1000.00 T J = 25°C Gfs, Forward Transconductance (S) ID, Drain-to-Source Current (A) 10 VDS, Drain-to-Source Voltage (V) VDS, Drain-to-Source Voltage (V) 100.00 T J = 175°C 10.00 1.00 0.10 VDS = 25V 20μs PULSE WIDTH 0.01 2.0 4.0 6.0 VGS , Gate-to-Source Voltage (V) Fig 3. Typical Transfer Characteristics 4 1 T J = 175°C 25 20 T J = 25°C 15 10 5 VDS = 25V 20μs PULSE WIDTH 0 8.0 0 10 20 30 40 ID, Drain-to-Source Current (A) Fig 4. Typical Forward Transconductance Vs. Drain Current www.irf.com nce AUIRLR3105 VGS = 0V, f = 1 MHZ Ciss = C gs + Cgd, C ds Crss = Cgd Coss = Cds + Cgd 1200 C, Capacitance (pF) 20 ID= 15A SHORTED VGS , Gate-to-Source Voltage (V) 1600 Ciss 800 Coss 400 Crss VDS= 44V VDS= 28V VDS= 11V 16 12 8 4 FOR TEST CIRCUIT SEE FIGURE 13 0 0 1 10 0 100 100.0 1000 ID, Drain-to-Source Current (A) T J = 175°C 10.0 TJ = 25°C VGS = 0V 0.1 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 VSD, Source-toDrain Voltage (V) Fig 7. Typical Source-Drain Diode Forward Voltage www.irf.com 30 40 Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1.0 20 Q G Total Gate Charge (nC) VDS, Drain-to-Source Voltage (V) ISD, Reverse Drain Current (A) 10 100 10 100μsec 1msec 1 0.1 1.8 OPERATION IN THIS AREA LIMITED BY RDS(on) 10msec Tc = 25°C Tj = 175°C Single Pulse 1 10 100 1000 VDS , Drain-toSource Voltage (V) Fig 8. Maximum Safe Operating Area 5 AUIRLR3105 3.0 25 2.5 ID , Drain Current (A) 20 15 10 5 0 25 50 75 100 125 150 I D = 25A 2.0 (Normalized) RDS(on) , Drain-to-Source On Resistance 30 1.5 1.0 0.5 V GS = 10V 0.0 -60 175 -40 TC , Case Temperature ( °C) -20 0 20 40 60 80 100 120 140 160 180 ( ° C) TJ , Junction Temperature Fig 10. Normalized On-Resistance Vs. Temperature Fig 9. Maximum Drain Current Vs. Case Temperature (Z thJC ) 10 D = 0.50 1 Thermal Response 0.20 0.10 0.05 0.1 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) P DM t1 t2 Notes: 1. Duty factor D = 2. Peak T 0.01 0.00001 0.0001 0.001 t1 / t 2 J = P DM x Z thJC +TC 0.01 0.1 t 1, Rectangular Pulse Duration (sec) Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case 6 www.irf.com AUIRLR3105 15V 100 DRIVER L VDS D.U.T RG + V - DD IAS VGS 20V A 0.01Ω tp Fig 12a. Unclamped Inductive Test Circuit V(BR)DSS tp EAS , Single Pulse Avalanche Energy (mJ) 80 TOP ID 6.1A 11A BOTTOM 15A 60 40 20 0 25 50 75 100 125 Starting Tj, Junction Temperature 150 175 ( ° C) I AS Fig 12c. Maximum Avalanche Energy Vs. Drain Current Fig 12b. Unclamped Inductive Waveforms QG 10 V QGS QGD 2.0 Charge Fig 13a. Basic Gate Charge Waveform Current Regulator Same Type as D.U.T. 50KΩ 12V .2μF VGS(th) Gate threshold Voltage (V) VG ID = 250μA 1.5 1.0 0.5 .3μF D.U.T. + V - DS 0.0 -75 -50 -25 0 25 50 75 100 125 150 175 T J , Temperature ( °C ) VGS 3mA IG ID Current Sampling Resistors Fig 14. Threshold Voltage Vs. Temperature Fig 13b. Gate Charge Test Circuit www.irf.com 7 AUIRLR3105 1000 Avalanche Current (A) Duty Cycle = Single Pulse 100 Allowed avalanche Current vs avalanche pulsewidth, tav assuming Δ Tj = 25°C due to avalanche losses. Note: In no case should Tj be allowed to exceed Tjmax 0.01 10 0.05 0.10 1 0.1 1.0E-07 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 tav (sec) Fig 15. Typical Avalanche Current Vs.Pulsewidth 70 TOP Single Pulse BOT TOM 50% Duty Cycle ID = 15A EAR , Avalanche Energy (mJ) 60 50 40 30 20 10 0 25 50 75 100 125 150 Starting TJ , Junction Temperature (°C) Notes on Repetitive Avalanche Curves , Figures 15, 16: (For further info, see AN-1005 at www.irf.com) 1. Avalanche failures assumption: Purely a thermal phenomenon and failure occurs at a temperature far in excess of T jmax. This is validated for every part type. 2. Safe operation in Avalanche is allowed as long asTjmax is not exceeded. 3. Equation below based on circuit and waveforms shown in Figures 12a, 12b. 4. PD (ave) = Average power dissipation per single avalanche pulse. 5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase during avalanche). 6. Iav = Allowable avalanche current. 7. ΔT = Allowable rise in junction temperature, not to exceed Tjmax (assumed as 25°C in Figure 15, 16). tav = Average time in avalanche. 175 D = Duty cycle in avalanche = tav ·f ZthJC(D, tav ) = Transient thermal resistance, see figure 11) PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC Iav = 2DT/ [1.3·BV·Zth] EAS (AR) = PD (ave)·tav Fig 16. Maximum Avalanche Energy Vs. Temperature 8 www.irf.com AUIRLR3105 D.U.T Driver Gate Drive + * D.U.T. ISD Waveform Reverse Recovery Current + RG • • • • dv/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test P.W. Period VGS=10V Circuit Layout Considerations • Low Stray Inductance • Ground Plane • Low Leakage Inductance Current Transformer - - D= Period P.W. + V DD + Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt Re-Applied Voltage - Body Diode VDD Forward Drop Inductor Curent Ripple ≤ 5% ISD * VGS = 5V for Logic Level Devices Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel HEXFET® Power MOSFETs V DS V GS RG RD D.U.T. + -V DD 10V Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % Fig 18a. Switching Time Test Circuit VDS 90% 10% VGS td(on) tr t d(off) tf Fig 18b. Switching Time Waveforms www.irf.com 9 AUIRLR3105 D-Pak (TO-252AA) Package Outline Dimensions are shown in millimeters (inches) D-Pak Part Marking Information Part Number AULR3105 YWWA IR Logo XX or Date Code Y= Year WW= Work Week A= Automotive, LeadFree XX Lot Code Note: For the most current drawing please refer to IR website at http://www.irf.com/package/ 10 www.irf.com AUIRLR3105 D-Pak (TO-252AA) Tape & Reel Information Dimensions are shown in millimeters (inches) TR TRR 16.3 ( .641 ) 15.7 ( .619 ) 12.1 ( .476 ) 11.9 ( .469 ) FEED DIRECTION TRL 16.3 ( .641 ) 15.7 ( .619 ) 8.1 ( .318 ) 7.9 ( .312 ) FEED DIRECTION NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. 13 INCH 16 mm NOTES : 1. OUTLINE CONFORMS TO EIA-481. www.irf.com 11 AUIRLR3105 Ordering Information 12 Base part number Package Type AUIRLR3105 Dpak Standard Pack Form Tube Tape and Reel Tape and Reel Left Tape and Reel Right Complete Part Number Quantity 75 2000 3000 3000 AUIRLR3105 AUIRLR3105TR AUIRLR3105TRL AUIRLR3105TRR www.irf.com AUIRLR3105 IMPORTANT NOTICE Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or services without notice. Part numbers designated with the AU prefix follow automotive industry and / or customer specific requirements with regards to product discontinuance and process change notification. All products are sold subject to IRs terms and conditions of sale supplied at the time of order acknowledgment. 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