TOSHIBA 2SJ537_09

2SJ537
2
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (L −π−MOSVI)
2SJ537
Chopper Regulator, DC−DC Converter and Motor Drive
Applications
z Low drain−source ON resistance
: RDS (ON) = 0.16 Ω (typ.)
z High forward transfer admittance
: |Yfs| = 3.5 S (typ.)
z Low leakage current
z Enhancement mode
Unit: mm
: IDSS = −100 μA (VDS = −50 V)
: Vth = −0.8 to −2.0 V (VDS = −10 V, ID = −1 mA)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Drain−source voltage
VDSS
−50
V
Drain−gate voltage (RGS = 20 kΩ)
VDGR
−50
V
Gate−source voltage
VGSS
±20
V
(Note 1)
ID
−5
A
JEDEC
Pulse (Note 1)
IDP
−15
A
JEITA
Drain power dissipation
PD
0.9
W
TOSHIBA
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55~150
°C
Drain current
DC
TO-92MOD
―
2-5J1C
Weight: 0.36 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Thermal resistance, channel to ambient
Symbol
Max
Unit
Rth (ch−a)
138
°C / W
Note 1: Please use devices on condition that the channel temperature is below 150°C.
This transistor is an electrostatic sensitive device.
Please handle with caution.
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2SJ537
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±16 V, VDS = 0 V
—
—
±10
μA
Drain cut−off current
IDSS
VDS = −50 V, VGS = 0 V
—
—
−100
μA
V (BR) DSS
ID = −10 mA, VGS = 0 V
−50
—
—
V
Vth
VDS = −10 V, ID = −1 mA
−0.8
—
−2.0
V
VGS = −4 V, ID = −1.3 A
—
0.27
0.34
VGS = −10 V, ID = −2.5 A
—
0.16
0.19
VDS = −10 V, ID = −2.5 A
1.5
3.5
—
—
470
—
VDS = −10 V, VGS = 0 V, f = 1 MHz
—
60
—
Drain−source breakdown
voltage
Gate threshold voltage
Drain−source ON resistance
RDS (ON)
Forward transfer admittance
|Yfs|
Input capacitance
Ciss
Reverse transfer capacitance
Crss
Output capacitance
Coss
—
210
—
tr
—
25
—
ton
—
35
—
tf
—
20
—
toff
—
120
—
—
18
—
—
13
—
—
5
—
Rise time
Turn−on time
Switching time
Ω
S
pF
ns
Fall time
Turn−off time
Total gate charge (Gate−source
plus gate−drain)
Qg
Gate−source charge
Qgs
Gate−drain (“miller”) charge
Qgd
VDD ≈ −40 V, VGS = −10 V,
ID = −5 A
nC
Source−Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Continuous drain reverse current
(Note 1)
IDR
—
—
—
−5
A
Pulse drain reverse current
(Note 1)
IDRP
—
—
—
−15
A
Forward voltage (diode)
VDSF
—
—
1.5
V
IDR = −5 A, VGS = 0 V
Marking
J537
Note 2: A line under a Lot No. identifies the indication of product
Labels.
Part No. (or abbreviation code)
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
Lot No.
Note 2
Please contact your TOSHIBA sales representative for details as to
environmental matters such as the RoHS compatibility of Product.
The RoHS is the Directive 2002/95/EC of the European Parliament
and of the Council of 27 January 2003 on the restriction of the use of
certain hazardous substances in electrical and electronic equipment.
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2SJ537
ID – VDS
Drain current
ID
−3
−10
−4
−5
−8
−8
−6
(A)
(A)
−4
−5
−10
ID
Common
source
Ta = 25°C
Pulse Test
ID – VDS
−10
−8
−3.5
Drain current
−5
−6
−2
−3
−1
Common source
Ta = 25°C
Pulse Test
−6
−4
−4
−3.5
−2
−3
VGS = −2.5V
0
0
−0.4
−0.8
−1.2
Drain-source voltage
−1.6
VDS
VGS = −2.5 V
0
−2.0
0
(V)
−2
−4
Drain-source voltage
ID – VGS
−10
−4
−2
0
−2
−4
−6
Gate-source voltage
−8
Common source
Ta = 25℃
Pulse Test
−1.6
VGS
−1.2
ID = −5 A
−0.8
−2.5
−0.4
0
0
−10
(V)
−1.3
−4
−8
|Yfs| – ID
25
100
1
Common source
VDS = −10 V
Pulse Test
−10
Drain-source ON resistance
RDS (ON) (Ω)
Ta = −55°C
Forward transfer admittance
⎪Yfs⎪ (S)
VGS
−16
−20
(V)
RDS (ON) – ID
10
−1
−12
Gate-source voltage
10
0.1
−0.1
(V)
VDS
−6
Drain-source voltage
ID (A)
Drain current
100
0
VDS
−10
VDS – VGS
(V)
25
−8
−8
−2.0
Common source
VDS = −10 V
Pulse Test
Ta = −55°C
−6
1
VGS = −4 V
−10
0.1
0.01
−0.1
−100
Drain current ID (A)
Common source
Ta = 25°C
Pulse Test
−1
−10
−100
Drain current ID (A)
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RDS (ON) − Ta
−100
Common source
Pulse Test
Drain reverse current IDR (A)
Drain-source ON resistance
RDS (ON) ( Ω)
1.0
IDR − VDS
0.8
0.6
1.3
ID = 2.5A
0.4
VGS = 4 V
5
0.2
−2.5
−1.3
0
−80
Common source
Ta = 25°C
Pulse Test
−10
−5
−10
−1
−3
VGS = 10 V
−40
0
40
80
120
−1
VGS = 0 V
0.4
0.8
−0.1
160
0
Ambient temperature Ta (°C)
Drain-source voltage
Common source
VGS = 0 V
f = 1 MHz
Ta = 25°C
1000
Ciss
Coss
100
Crss
−2.0
Gate threshold voltage
Vth (V)
(pF)
Capacitance C
1.6
(V)
Vth − Ta
Capacitance – VDS
10000
1.2
VDS
−1.6
−1.2
−0.8
Common source
−0.4
VDS = −10 V
ID = −1mA
−10
Drain-source voltage
0
−80
−100
Pulse Test
−40
VDS (V)
40
80
120
160
Ambient temperature Ta (°C)
Dynamic input / output
characteristics
PD − Ta
−80
VDS
Drain-source voltage
1.2
0.8
0.4
−20
Common source
ID = −5 A
Ta = 25°C
Pulse Test
(V)
1.6
Drain power dissipation
PD (W)
0
−60
−15
VDS
−40
VDD = −40V
−10V
−10
−20V
−20
−5
VGS (V)
−1
Gate-source voltage
10
−0.1
VGS
0
0
40
80
120
0
160
Ambient temperature Ta (°C)
0
10
20
30
0
Total gate charge Qg (nC)
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2SJ537
rth − tw
Normalized transient thermal impedance
rth (t)/Rth (ch-a)
10
1
0.1
0.01
Duty=t/T
Rth(ch-a)=138℃/W
Single Pulse
0.001
100μ
1m
10m
100m
Pulse width
1
10
100
tw (S)
SAFE OPERATING AREA
−100
ID max (pulse)*
−10
(A)
Drain current ID
100 μs *
IDmax (continuous)
1 ms *
DC OPEATION
−1
Ta =25°C
−0.1
※ Single pulse
Ta=25℃
Curves must be derated linearly
with increase
−0.01
−0.01
VDSS max
in temperature.
−0.1
−1
Drain-source voltage
−10
VDS
−100
(V)
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2SJ537
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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