TOSHIBA MP6404_07

MP6404
Silicon N&P Channel MOS Type (Six L2-π-MOSV
TOSHIBA Power MOS FET Module
inOne)
MP6404
Industrial Applications
High Power High Speed Switching Applications
3-Phase Motor Drive and Stepping Motor Drive
Applications
•
•
•
•
•
•
•
Unit: mm
4-V gate drivability
Small package by full molding (SIP 12 pins)
High drain power dissipation (6-device operation)
: PT = 36 W (Tc = 25°C)
Low drain-source ON resistance: RDS (ON) = 120 mΩ (typ.) (Nch)
160 mΩ (typ.) (Pch)
High forward transfer admittance: |Yfs| = 5.0 S (typ.) (Nch)
4.0 S (typ.) (Pch)
Low leakage current: IGSS = ±10 μA (max) (VGS = ±16 V)
IDSS = 100 μA (max) (VDS = 60 V)
Enhancement-mode: Vth = 0.8 V to 2.0 V (VDS = 10 V, ID = 1 mA)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Nch
Pch
Unit
JEDEC
―
V
JEITA
―
V
TOSHIBA
A
Weight: 3.9 g (typ.)
Drain-source voltage
VDSS
60
−60
V
Drain-gate voltage (RGS = 20 kΩ)
VDGR
60
−60
Gate-source voltage
VGSS
±20
±20
DC
ID
5
−5
Pulse
IDP
20
−20
Drain power dissipation
(1-device operation, Ta = 25°C)
PD
Drain power dissipation Ta = 25°C
(6-device operation)
Tc = 25°C
PDT
Single pulse avalanche energy
(Note 1)
EAS
129
273
mJ
Avalanche current
IAR
5
−5
A
Drain current
1 device
operation
Repetitive avalanche
energy
(Note 2) 6 device
operation
2.2
W
4.4
W
36
EAR
0.22
EART
0.44
2-32C1K
mJ
Channel temperature
Tch
150
°C
Storage temperature range
Tstg
−55 to 150
°C
Note 1: Condition for avalanche energy (single pulse)
Nch: VDD = 25 V, starting Tch = 25°C, L = 7 mH, RG = 25 Ω, IAR = 5 A
Pch: VDD = −25 V, starting Tch = 25°C, L = 14.84 mH, RG = 25 Ω, IAR = −5 A
Note 2: Repetitive rating; pulse width limited by maximum channel temperature
Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Please handle with caution.
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MP6404
Array Configuration
5
4
2
12
6
11
3
7
8
9
10
1
Thermal Characteristics
Characteristics
Thermal resistance of channel to
ambient
Symbol
Max
Unit
ΣRth (ch-a)
28.4
°C/W
ΣRth (ch-c)
3.47
°C/W
TL
260
°C
(6-device operation, Ta = 25°C)
Thermal resistance of channel to case
(6-device operation, Tc = 25°C)
Maximum lead temperature for
soldering purposes
(3.2 mm from case for t = 10 s)
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2006-10-27
MP6404
Electrical Characteristics (Ta = 25°C) (Nch MOS FET)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±16 V, VDS = 0 V
―
―
±10
μA
Drain cut-off current
IDSS
VDS = 60 V, VGS = 0 V
―
―
100
μA
V (BR) DSS
ID = 10 mA, VGS = 0 V
60
―
―
V
Vth
VDS = 10 V, ID = 1 mA
0.8
―
2.0
V
VGS = 4 V, ID = 2.5 A
―
0.21
0.32
VGS = 10 V, ID = 2.5 A
―
0.12
0.16
VDS = 10 V, ID = 2.5 A
3.0
5.0
―
S
―
370
―
pF
―
60
―
pF
―
180
―
pF
―
18
―
―
25
―
Drain source breakdown voltage
Gate threshold voltage
Drain-source ON resistance
RDS (ON)
Forward transfer admittance
|Yfs|
Input capacitance
Ciss
Reverse transfer capacitance
Crss
Output capacitance
Coss
Rise time
VDS = 10 V, VGS = 0 V, f = 1 MHz
tr
ID = 2.5 A
10 V
ton
Fall time
Turn-off time
Total gate charge
(gate-source plus gate-drain)
50 Ω
Switching time
tf
toff
VOUT
RL = 12 Ω
Turn-on time
VGS
0V
Qgs
Gate-drain (“miller”) charge
Qgd
ns
―
55
―
―
170
―
―
12
―
nC
―
8
―
nC
―
4
―
nC
VDD ≈ 30 V
VIN: tr, tf < 5 ns, duty ≤ 1%, tw = 10 μs
Qg
Gate-source charge
Ω
VDD ≈ 48 V, VGS = 10 V, ID = 5 A
Source-Drain Diode Ratings and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Continuous drain reverse current
IDR
―
―
―
5
A
Pulse drain reverse current
IDRP
―
―
―
20
A
Diode forward voltage
VDSF
IDR = 5 A, VGS = 0 V
―
―
−1.7
V
Reverse recovery time
trr
IDR = 5 A, VGS = 0 V
―
70
―
ns
Reverse recovery charge
Qrr
dIDR/dt = 50 A/μs
―
0.1
―
μC
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2006-10-27
MP6404
Electrical Characteristics (Ta = 25°C) (Pch MOS FET)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±16 V, VDS = 0 V
―
―
±10
μA
Drain cut-off current
IDSS
VDS = −60 V, VGS = 0 V
―
―
−100
μA
V (BR) DSS
ID = −10 mA, VGS = 0 V
−60
―
―
V
Vth
VDS = −10 V, ID = −1 mA
−0.8
―
−2.0
V
VGS = −4 V, ID = −2.5 A
―
0.24
0.28
VGS = −10 V, ID = −2.5 A
―
0.16
0.19
VDS = −10 V, ID =−2.5 A
2.0
4.0
―
S
―
630
―
pF
―
95
―
pF
―
290
―
pF
―
25
―
―
45
―
Gate threshold voltage
Drain-source ON resistance
RDS (ON)
Forward transfer admittance
|Yfs|
Input capacitance
Ciss
Reverse transfer capacitance
Crss
Output capacitance
Coss
Rise time
VDB = −10 V, VGS = 0 V, f = 1 MHz
tr
ID = −2.5 A
0V
Turn-on time
ton
VGS
−10 V
Fall time
4.7 Ω
Switching time
tf
Ω
VOUT
RL = 12 Ω
Drain source breakdown voltage
ns
―
55
―
―
200
―
―
22
―
nC
―
16
―
nC
―
6
―
nC
VDD ≈ −30 V
Turn-off time
toff
Total gate charge
VIN: tr, tf < 5 ns, duty ≤ 1%, tw = 10 μs
Qg
(gate-source plus gate-drain)
Gate-source charge
Qgs
Gate-drain (“miller”) charge
Qgd
VDD ≈ −48 V, VGS = −10 V, ID = −5 A
Source-Drain Diode Ratings and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Continuous drain reverse current
IDR
―
―
―
−5
A
Pulse drain reverse current
IDRP
―
―
―
−20
A
Diode forward voltage
VDSF
IDR = −5 A, VGS = 0 V
―
―
1.7
V
Reverse recovery time
trr
IDR = −5 A, VGS = 0 V
―
80
―
ns
Reverse recovery charge
Qrr
dIDR/dt = 50 A/μs
―
0.1
―
μC
Marking
MP6404
JAPAN
Part No. (or abbreviation code)
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
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2006-10-27
MP6404
Nch MOS FET
ID – VDS
5
10
3.5
4
10
8
4
16
3.3
Drain current ID (A)
Drain current ID (A)
6
ID – VDS
20
3
3
2
Common source
Tc = 25°C
1
6
Common source
Tc = 25°C
8
12
4.5
4
8
3.5
4
VGS = 2.5 V
3
VGS = 2.5 V
0
0
0.4
0.8
1.2
Drain-source voltage
1.6
0
0
2.0
4
VDS (V)
8
12
16
Drain-source voltage
ID – VGS
VDS (V)
VDS – VGS
2.0
10
Common source
Common source
VDS (V)
VDS = 10 V
8
6
Drain-source voltage
Drain current ID (A)
20
4
25
2
Tc = −55°C
Tc = 25°C
1.6
1.2
8
0.8
5
0.4
ID = 2.5 A
100
0
0
2
4
6
Gate-source voltage
8
0
0
10
4
VGS (V)
12
16
20
VGS (V)
RDS (ON) – ID
0.5
20
Common source
10
VDS = 10 V
Drain-source on resistance
RDS (ON) (Ω)
|Yfs| (S)
|Yfs| – ID
Forward transfer admittance
8
Gate-source voltage
Tc = −55°C
5
25
3
100
1
0.3
VGS = 4 V
10
0.1
0.05
Common source
Tc = 25°C
0.5
0.3
0.5
1
3
5
10
0.03
0.3
30
Drain current ID (A)
0.5
1
3
5
10
Drain current ID (A)
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2006-10-27
MP6404
Nch MOS FET
RDS (ON) – Tc
IDR – VDS
20
(A)
Common source
0.3
Drain reverse current IDR
Drain-source on resistance RDS(ON)
(Ω)
0.4
2.5
1.3
ID = 4 A
0.2
4
VGS = 4 V
2.5, 1.3
0.1
VGS = 10 V
10
5
10
3
3
1
1
0.5
VGS = 0, −1 V
0.3
Common source
Tc = 25°C
0
−80
−40
0
40
80
120
0.1
0
160
Case temperature Tc (°C)
−0.4
−0.8
−1.2
Drain-source voltage
Capacitance – VDS
−1.6
−2.0
−2.4
VDS (V)
Vth – Tc
3000
2.5
Vth (V)
Common source
500
Ciss
300
Gate threshold voltage
Capacitance C
(pF)
1000
Coss
100
50 Common source
30 VGS = 0 V
f = 1 MHz
Tc = 25°C
10
0.3 0.5
0.1
Crss
1
3
5
Drain-source voltage
10
30 50
100
VDS = 10 V
2.0
1.5
1.0
0.5
0
−80
VDS (V)
ID = 1 mA
−40
0
40
80
120
160
Case temperature Tc (°C)
Dynamic Input/Output Characteristics
80
16
12
Tc = 25°C
60
12
24
VDS
VDD = 48 V
VDD = 48 V
40
8
24
20
4
12
0
0
VGS
20
40
60
VGS (V)
ID = 5 mA
Gate-source voltage
Drain-source voltage
VDS (V)
Common source
0
80
Total gate charge Qg (nC)
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2006-10-27
MP6404
Pch MOS FET
ID – VDS
ID – VDS
−5
−10
Common source
−6
Tc = 25°C
−6
Common source
Tc = 25°C
−8
−4
−4
−8 −8
−10
Drain current ID (A)
Drain current ID (A)
−10
−3.5
−4
−3
−3
−2
−6
−3.5
−4
−3
−2.5
−1
−2
−2.5
VGS = −2V
0
0
−0.4
−0.8
−1.2
Drain-source voltage
−1.6
VGS = −2V
0
0
−2.0
−2
VDS (V)
−4
−8
Drain-source voltage
ID – VGS
−10
VDS (V)
VDS – VGS
−2.0
−10
Common source
100
Common source
VDS = −10 V
VDS (V)
Tc = −55°C
25
−8
−6
−4
−2
Tc = 25°C
−1.6
−1.2
Drain-source voltage
Drain current ID (A)
−6
−0.8
ID = −5 A
−4
−3
−0.4
−2
)
−1
0
0
−2
−4
−6
Gate-source voltage
−8
0
0
−10
−4
−8
VGS (V)
−16
−20
VGS (V)
RDS (ON) – ID
30
3
Common source
Common source
VDS = −10 V
Drain-source ON resistance
RDS (ON) (Ω)
|Yfs| (S)
|Yfs| – ID
Forward transfer admittance
−12
Gate-source voltage
10
5
Tc = −55°C
3
25
100
1
Tc = 25°C
1
0.5
0.3
−10
0.1
0.5
0.05
0.3
−0.1
0.03
−0.1
−0.3 −0.5
−1
−3
−5
−10
−30
Drain current ID (A)
VGS = −4 V
−0.3 −0.5
−1
−3
−5
−10
−30
Drain current ID (A)
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2006-10-27
MP6404
Pch MOS FET
IDR – VDS
−30
Common source
(A)
Common source
0.8
Drain reverse current IDR
Drain-source on resistance RDS (ON)
(Ω)
RDS (ON) – Tc
1.0
0.6
ID = −5 A
0.4
−2.5
−1.2
VGS = −4 V
0.2
ID = −5, −2.5, −1.2 A
VGS = −10 V
0
−80
−40
0
40
80
120
−10
−5
−3
−1
−0.5
−10
−3
−1
VGS = 0, 1 V
−0.3
−0.1
0
160
Tc = 25°C
Case temperature Tc (°C)
0.4
0.8
1.2
Drain-source voltage
Capacitance – VDS
1.6
2.0
VDS (V)
Vth – Tc
5000
−2.0
Vth (V)
1000
Ciss
500
Gate threshold voltage
Capacitance C
(pF)
3000
300
Coss
Common source
100
50
VGS = 0 V
Crss
f = 1MHz
Tc = 25°C
30
−0.1
−0.3
−1
−3
−10
Drain-source voltage
−30
−100
−1.6
−1.2
−0.8
Common source
−0.4
VDS = −10 V
ID = −1 mA
VDS (V)
0
−80
−40
0
40
80
120
160
Case temperature Tc (°C)
Dynamic Input/Output Characteristics
−40
−20
−16
VDS
−30
−12
−24
−20
−10
0
0
VDD = −48 V
−8
−4
VGS
8
−12
16
24
32
VGS (V)
Common source
ID = −5 A
Tc = 25°C
Gate-source voltage
Drain-source voltage
VDS (V)
−50
0
40
Total gate charge Qg (nC)
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2006-10-27
MP6404
PDT – Ta
8
Channel temperature increase
6
ΔTch (°C)
(1) 1-device operation
(2) 2-device operation
(3) 3-device operation
(4) 6-device operation
Attached on a circuit board
(W)
(4)
4
(3)
Circuit board
(2)
2 (1)
0
0
40
80
120
160
(1)
(3) (4)
80
Circuit board
Attached on a circuit board
(1) 1-device operation
(2) 2-device operation
(3) 3-device operation
(4) 6-device operation
40
0
0
200
(2)
120
Ambient temperature Ta (°C)
2
4
6
Total power dissipation
8
PDT
10
(W)
rth – tw
300
Transient thermal resistance rth (°C/W)
PDT
Total power dissipation
ΔTch – PDT
160
100
Curves should be applied in thermal
limited area. (Single nonrepetitive pulse)
The figure shows thermal resistance per
device versus pulse width.
(4)
(3)
(2)
30
(1)
10
3
1
Nch MOS FET
Pch MOS FET
-No heat sink/Attached on a circuit board(1) 1-device operation
(2) 2-device operation
(3) 3-device operation
Circuit board
(4) 6-device operation
0.3
0.1
0.001
0.01
0.1
1
Pulse width
9
10
100
1000
tw (s)
2006-10-27
MP6404
Safe Operating Area
(Applicable to Nch MOS FET)
Safe Operating Area
(Applicable to Pch MOS FET)
30
−30
ID max
10 μs*
100 μs*
10
10 ms*
100 ms*
1
3
10
30
Drain-source voltage
1 ms*
100 ms*
−3
−1
−0.3
*: Single nonrepetitive pulse
Tc = 25°C
Curves must be derated linearly with
increase in temperature.
0.1
1
100 μs*
1 ms*
3
0.3
*: Single nonrepetitive pulse
Tc = 25°C
Curves must be derated linearly with
increase in temperature.
−0.1
−1
100
−3
VDS (V)
−10
−30
Drain-source voltage
EAS – Tch
(Applicable to Nch MOS FET)
−100
VDS (V)
EAS – Tch
(Applicable to Pch MOS FET)
500
Avalanche energy EAS (mJ)
200
160
120
80
40
400
300
200
100
)
Avalanche energy EAS (mJ)
10 μs*
−10
Drain current ID (A)
10 ms*
Drain current ID (A)
ID max
0
25
50
75
100
125
Channel temperature Tch
15 V
Peak IAR = 5 A, RG = 25 Ω
VDD = 25 V, L = 7 mH
(°C)
75
15 V
IAR
VDD
50
100
125
Channel temperature Tch
BVDSS
−15 V
Test Cirdcuit
0
25
150
BVDSS
IAR
−15 V
VDD
VDS
Test Waveform
Test Circuit
Peak IAR = −5 A, RG = 25 Ω
VDD = −25 V, L = 14.84 mH
⎞
1 2 ⎛
B VDSS
⎟
Ε AS = ·L·I · ⎜⎜
⎟
2
V
−
DD ⎠
⎝ B VDSS
10
150
(°C)
VDS
Test Waveform
⎞
1 2 ⎛
B VDSS
⎟
Ε AS = ·L·I · ⎜⎜
⎟
2
V
−
DD ⎠
⎝ B VDSS
2006-10-27
MP6404
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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