MOTOROLA MRF9130L

MOTOROLA
Freescale Semiconductor, Inc.
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by MRF9130L/D
SEMICONDUCTOR TECHNICAL DATA
The RF Sub - Micron MOSFET Line
MRF9130LR3
MRF9130LSR3
RF Power Field Effect Transistors
Freescale Semiconductor, Inc...
N - Channel Enhancement - Mode Lateral MOSFETs
Designed for GSM and GSM EDGE base station applications with
frequencies from 921 to 960 MHz, the high gain and broadband performance
of these devices make them ideal for large - signal, common - source amplifier
applications in 28 volt base station equipment.
• Typical Performance for GSM Frequencies, 921 to 960 MHz, 28 Volts
Output Power @ P1dB — 135 Watts
Power Gain — 16.5 dB @ 130 Watts Output Power
Efficiency — 48% @ 130 Watts Output Power
• Internally Matched, Controlled Q, for Ease of Use
• High Gain, High Efficiency and High Linearity
• Integrated ESD Protection
• Designed for Maximum Gain and Insertion Phase Flatness
• Capable of Handling 5:1 VSWR, @ 28 Vdc, All Frequency Band,
130 Watts CW Output Power
• Excellent Thermal Stability
• Characterized with Series Equivalent Large - Signal Impedance Parameters
• Low Gold Plating Thickness on Leads, 40µ″ Nominal.
• In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
GSM/GSM EDGE
921 - 960 MHz, 130 W, 28 V
LATERAL N - CHANNEL
RF POWER MOSFETs
CASE 465 - 06, STYLE 1
NI - 780
MRF9130LR3
CASE 465A - 06, STYLE 1
NI - 780S
MRF9130LSR3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Drain - Source Voltage
VDSS
65
Vdc
Gate - Source Voltage
VGS
- 0.5, +15
Vdc
Total Device Dissipation @ TC = 25°C
Derate above 25°C
PD
298
1.7
Watts
W/°C
Storage Temperature Range
Tstg
- 65 to +200
°C
Operating Junction Temperature
TJ
200
°C
Symbol
Value
Unit
RθJC
0.6
°C/W
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
ESD PROTECTION CHARACTERISTICS
Test Conditions
Human Body Model
Class
1 (Minimum)
Machine Model
M2 (Minimum)
Charge Device Model
C7 (Minimum)
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
REV 2
MOTOROLA
RF DEVICE DATA
 Motorola,
Inc. 2004
For More Information On This Product,
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MRF9130LR3 MRF9130LSR3
1
Freescale Semiconductor, Inc.
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Zero Gate Voltage Drain Leakage Current
(VDS = 65 Vds, VGS = 0 Vdc)
IDSS
—
—
10
µAdc
Zero Gate Voltage Drain Leakage Current
(VDS = 28 Vds, VGS = 0 Vdc)
IDSS
—
—
1
µAdc
Gate - Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
IGSS
—
—
1
µAdc
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 450 µAdc)
VGS(th)
2
3
4
Vdc
Gate Quiescent Voltage
(VDS = 28 Vdc, ID = 1000 mAdc)
VGS(Q)
—
3.6
—
Vdc
Drain - Source On - Voltage
(VGS = 10 Vdc, ID = 3 Adc)
VDS(on)
—
0.2
0.4
Vdc
Forward Transconductance
(VDS = 10 Vdc, ID = 9 Adc)
gfs
—
12
—
S
Output Capacitance
(VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Coss
—
110
—
pF
Reverse Transfer Capacitance
(VDS = 28 Vdc ± 30 mV(rms)ac @ 1 MHz, VGS = 0 Vdc)
Crss
—
4.4
—
pF
P1dB
120
135
—
W
Common - Source Amplifier Power Gain
(VDD = 28 Vdc, Pout = 130 W, IDQ = 1000 mA, f = 921 and 960 MHz)
Gps
15.5
16.5
—
dB
Drain Efficiency
(VDD = 28 Vdc, Pout = 130 W, IDQ = 1000 mA, f = 921 and 960 MHz)
η
43
48
—
%
Input Return Loss
(VDD = 28 Vdc, Pout = 130 W, IDQ = 1000 mA, f = 921 and 960 MHz)
IRL
—
- 12
-9
dB
Output Mismatch Stress
(VDD = 28 Vdc, Pout = 130 W CW, IDQ = 1000 mA,
f = 921 MHz, VSWR = 5:1, All Phase Angles at Frequency of Tests)
Ψ
OFF CHARACTERISTICS
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ON CHARACTERISTICS
DYNAMIC CHARACTERISTICS (1)
FUNCTIONAL TESTS (In Motorola Test Fixture)
Power Output, 1 dB Compression Point
(VDD = 28 Vdc, IDQ = 1000 mA, f = 921 and 960 MHz)
No Degradation In Output Power
Before and After Test
(1) Part is internally input matched.
MRF9130LR3 MRF9130LSR3
2
MOTOROLA RF DEVICE DATA
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R1
VDD
VGG
+
C1
R2
C2
C6
C3
C5
+
C4
R3
RF
INPUT
C10
C8
Z1
Z2
Freescale Semiconductor, Inc...
C7
DUT
C12
C16
C19
C20
Z6
Z5
C11
C21
Z4
Z3
C9
C14
C13
C15
C17
RF
OUTPUT
C22
C18
Figure 1. 921 - 960 MHz Test Circuit Schematic
Table 1. 921 - 960 MHz Test Circuit Component Designations and Values
Designators
Description
C1, C4
10 µF, 35 V Tantalum Capacitors, Vishay - Sprague #293D106X9035D
C2, C5
100 nF Chip Capacitors (1206), AVX #1206C104KATDA
C3, C8, C21, C22
22 pF, 100B Chip Capacitors, ATC #100B220C
C6
33 pF, 100B Chip Capacitor, ATC #100B330JW
C7
1.0 pF, 100B Chip Capacitor, ATC #100B1R0BW
C9
4.7 pF, 100B Chip Capacitor, ATC #100B4R7BW
C10
8.2 pF, 100B Chip Capacitor, ATC #100B8R2CW
C11
10 pF, 100B Chip Capacitor, ATC #100B100GW
C12, C13
12 pF, 100B Chip Capacitors, ATC #100B120GW
C14, C15
2.7 pF, 100B Chip Capacitors, ATC #100B2R7BW
C16, C17, C18
3.9 pF, 100B Chip Capacitors, ATC #100B3R9BW
C19
3.3 pF, 100B Chip Capacitor, ATC #100B3R3BW
C20
1.8 pF, 100B Chip Capacitor, ATC #100B1R8BW
R1
18 kW, 1/8 W Chip Resistor (1206)
R2
10 kW, 1/8 W Chip Resistor (1206)
R3
1.0 kW, 1/8 W Chip Resistor (1206)
Z1
0.117″ x 0.600″ Microstrip
Z2
0.117″ x 1.851″ Microstrip
Z3
1.074″ x 1.068″ Microstrip
Z4
1.074″ x 0.980″ Microstrip
Z5
0.117″ x 1.933″ Microstrip
Z6
0.117″ x 0.605″ Microstrip
PCB
Taconic TLX8, 0.030″, εr = 2.55
MOTOROLA RF DEVICE DATA
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MRF9130LR3 MRF9130LSR3
3
Freescale Semiconductor, Inc.
C4
C1
VBIAS
VSUPPLY
R1
C2 R2
C7
C8
C5
C6
C3
C9
R3
C10
C12 C14
C11
C13 C15
C16
C19 C20
C21
C18
C22
Freescale Semiconductor, Inc...
C17
Ground
MRF9130L
Ground
Figure 2. 921 - 960 MHz Test Circuit Component Layout
MRF9130LR3 MRF9130LSR3
4
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TYPICAL CHARACTERISTICS
Gps
17
Gps, POWER GAIN (dB)
0
Pout = 60 W
−5
130 W
−10
16
−15
60 W
15
IRL
130 W
−20
14
VDD = 28 Vdc
IDQ = 1000 mA
13
900
920
940
960
980
IRL, INPUT RETURN LOSS (dB)
18
−25
1000
Figure 3. Power Gain and Input Return Loss versus
Frequency
50
17
40
Gps
16.5
30
16
20
15.5
VDD = 28 Vdc
IDQ = 1000 mA
f = 940 MHz
η
IDQ = 1200 mA
G ps , POWER GAIN (dB)
17.5
18
h, DRAIN EFFICIENCY (%)
60
Gps, POWER GAIN (dB)
18
10
1000 mA
800 mA
16
600 mA
15
VDD = 28 Vdc
f = 940 MHz
0
1
17
10
15
100
14
1000
1
10
Pout, OUTPUT POWER (dBm)
100
1000
Pout, OUTPUT POWER (WATTS)
Figure 4. Power Gain and Efficiency versus
Output Power
Figure 5. Power Gain versus Output Power
18
18
TC = −20°C
17
G ps , POWER GAIN (dB)
G ps , POWER GAIN (dB)
Freescale Semiconductor, Inc...
f, FREQUENCY (MHz)
16
15
30 V
28 V
14
25°C
17
50°C
85°C
16
15
VDD = 28 Vdc
IDQ = 1000 mA
f = 940 MHz
26 V
IDQ = 1000 mA
f = 940 MHz
VDD = 24 V
13
14
1
10
100
1000
1
10
100
Pout, OUTPUT POWER (WATTS)
Pout, OUTPUT POWER (WATTS)
Figure 6. Power Gain versus Output Power
Figure 7. Power Gain versus Output Power
MOTOROLA RF DEVICE DATA
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1000
MRF9130LR3 MRF9130LSR3
5
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TYPICAL CHARACTERISTICS
40
6
30
η
4
20
2
10
EVM
h, DRAIN EFFICIENCY (%)
VDD = 28 Vdc
IDQ = 800 mA
f = 960 MHz
8
EVM (%)
−50
50
SPECTRAL REGROWTH (dBc)
10
VDD = 28 Vdc
IDQ = 800 mA
f = 960 MHz
−55
−60
−65
@ 400 kHz
−70
−75
@ 600 kHz
−80
0
0
Freescale Semiconductor, Inc...
1
10
100
−85
1
10
Pout, OUTPUT POWER (WATTS) AVG.
Pout, OUTPUT POWER (WATTS) AVG.
Figure 8. EVM and Efficiency versus Output
Power
Figure 9. Spectral Regrowth versus Output
Power
100
NOTE: Curves on Figure 8 and 9 gathered on a GSM EDGE optimized text fixture.
MRF9130LR3 MRF9130LSR3
6
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f = 880 MHz
Zload
f = 1000 MHz
Zo = 5 Ω
Freescale Semiconductor, Inc...
f = 880 MHz
Zsource
f = 1000 MHz
VDD = 28 Vdc, IDQ = 1000 mA, Pout = 130 W CW
f
MHz
Zsource
Ω
Zload
Ω
880
0.63 - j1.66
0.82 - j0.36
920
0.67 - j1.88
0.72 - j0.30
960
0.82 - j2.18
0.74 - j0.37
1000
0.86 - j2.56
0.69 - j0.79
Zsource = Test circuit impedance as measured from
gate to ground.
Zload
= Test circuit impedance as measured
from drain to ground.
Output
Matching
Network
Device
Under Test
Input
Matching
Network
Z
source
Z
load
Figure 10. Series Equivalent Input and Output Impedance
MOTOROLA RF DEVICE DATA
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MRF9130LR3 MRF9130LSR3
7
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NOTES
MRF9130LR3 MRF9130LSR3
8
MOTOROLA RF DEVICE DATA
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Freescale Semiconductor, Inc...
NOTES
MOTOROLA RF DEVICE DATA
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MRF9130LR3 MRF9130LSR3
9
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Freescale Semiconductor, Inc...
NOTES
MRF9130LR3 MRF9130LSR3
10
MOTOROLA RF DEVICE DATA
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PACKAGE DIMENSIONS
B
G
Q
bbb
2X
1
T A
M
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M−1994.
2. CONTROLLING DIMENSION: INCH.
3. DELETED
4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
3
B
K
2
(FLANGE)
D
bbb
M
T A
B
M
M
M
bbb
N
Freescale Semiconductor, Inc...
R
(INSULATOR)
T A
M
M
B
M
ccc
M
T A
S
(LID)
ccc
H
M
T A
M
M
B
M
aaa
M
T A
M
(LID)
B
M
(INSULATOR)
B
M
C
F
E
A
T
A
SEATING
PLANE
DIM
A
B
C
D
E
F
G
H
K
M
N
Q
R
S
aaa
bbb
ccc
INCHES
MIN
MAX
1.335
1.345
0.380
0.390
0.125
0.170
0.495
0.505
0.035
0.045
0.003
0.006
1.100 BSC
0.057
0.067
0.170
0.210
0.774
0.786
0.772
0.788
.118
.138
0.365
0.375
0.365
0.375
0.005 REF
0.010 REF
0.015 REF
MILLIMETERS
MIN
MAX
33.91
34.16
9.65
9.91
3.18
4.32
12.57
12.83
0.89
1.14
0.08
0.15
27.94 BSC
1.45
1.70
4.32
5.33
19.66
19.96
19.60
20.00
3.00
3.51
9.27
9.53
9.27
9.52
0.127 REF
0.254 REF
0.381 REF
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
(FLANGE)
CASE 465 - 06
ISSUE F
NI - 780
MRF9130LR3
4X U
(FLANGE)
4X Z
(LID)
B
1
K
2X
2
B
(FLANGE)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M−1994.
2. CONTROLLING DIMENSION: INCH.
3. DELETED
4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
D
bbb
M
T A
M
B
M
N
ccc
M
R
(LID)
M
T A
M
B
M
ccc
M
T A
M
M
B
M
aaa
M
T A
M
S
(INSULATOR)
bbb
M
T A
(LID)
B
M
(INSULATOR)
B
M
H
C
3
E
A
A
(FLANGE)
MOTOROLA RF DEVICE DATA
F
T
SEATING
PLANE
CASE 465A - 06
ISSUE F
NI - 780S
MRF9130LSR3
For More Information On This Product,
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DIM
A
B
C
D
E
F
H
K
M
N
R
S
U
Z
aaa
bbb
ccc
INCHES
MIN
MAX
0.805
0.815
0.380
0.390
0.125
0.170
0.495
0.505
0.035
0.045
0.003
0.006
0.057
0.067
0.170
0.210
0.774
0.786
0.772
0.788
0.365
0.375
0.365
0.375
−−− 0.040
−−− 0.030
0.005 REF
0.010 REF
0.015 REF
MILLIMETERS
MIN
MAX
20.45
20.70
9.65
9.91
3.18
4.32
12.57
12.83
0.89
1.14
0.08
0.15
1.45
1.70
4.32
5.33
19.61
20.02
19.61
20.02
9.27
9.53
9.27
9.52
−−−
1.02
−−−
0.76
0.127 REF
0.254 REF
0.381 REF
STYLE 1:
PIN 1. DRAIN
2. GATE
5. SOURCE
MRF9130LR3 MRF9130LSR3
11
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Freescale Semiconductor, Inc.
Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including
“Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the
rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective
owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
E Motorola Inc. 2004
HOW TO REACH US:
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81-3-3440-3569
USA /EUROPE /LOCATIONS NOT LISTED:
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P.O. Box 5405, Denver, Colorado 80217
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2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong
852-26668334
HOME PAGE: http://motorola.com/semiconductors
MRF9130LR3 MRF9130LSR3
12
◊
MOTOROLA RF DEVICEMRF9130L/D
DATA
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