HGTG30N60B3D, HGT4E30N60B3DS Data Sheet December 2001 60A, 600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode Packaging JEDEC STYLE TO-247 E The HGTG30N60B3D, and HGT4E30N60B3DS are MOS gated high voltage switching devices combining the best features of MOSFETs and bipolar transistors. These devices have the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The much lower on-state voltage drop varies only moderately between 25oC and 150oC. The IGBT used is the development type TA49170. The diode used in anti-parallel with the IGBT is the development type TA49053. C G TO-268AA The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors. C Formerly Developmental Type TA49172. G Ordering Information PART NUMBER E PACKAGE BRAND HGTG30N60B3D TO-247 G30N60B3D HGT4E30N60B3DS TO-268AA G30N60B3D Symbol C NOTE: When ordering, use the entire part number. Features G • 60A, 600V, TC = 25oC • 600V Switching SOA Capability E • Typical Fall Time. . . . . . . . . . . . . . . . . 90ns at TJ = 150oC • Short Circuit Rating • Low Conduction Loss • Hyperfast Anti-Parallel Diode FAIRCHILD CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS 4,364,073 4,598,461 4,682,195 4,803,533 4,888,627 4,417,385 4,605,948 4,684,413 4,809,045 4,890,143 ©2001 Fairchild Semiconductor Corporation 4,430,792 4,620,211 4,694,313 4,809,047 4,901,127 4,443,931 4,631,564 4,717,679 4,810,665 4,904,609 4,466,176 4,639,754 4,743,952 4,823,176 4,933,740 4,516,143 4,639,762 4,783,690 4,837,606 4,963,951 4,532,534 4,641,162 4,794,432 4,860,080 4,969,027 4,587,713 4,644,637 4,801,986 4,883,767 HGTG30N60B3D, HGT4E30N60B3DS Rev. B1 HGTG30N60B3D, HGT4E30N60B3DS Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified HGTG30N60B3D, HGT4E30N60B3DS UNITS 600 V Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BVCES Collector Current Continuous At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 60 A At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC110 30 A Average Diode Forward Current at 110oC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IEC(AVG) 25 A Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM 220 A Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES ±20 V Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM ±30 V Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA 60A at 600V Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 208 W Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.67 W/oC Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 150 oC Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 260 oC Short Circuit Withstand Time (Note 2) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC 4 µs Short Circuit Withstand Time (Note 2) at VGE = 10V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC 10 µs CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) = 360V, TJ = 125oC, R G = 3Ω. Electrical Specifications TC = 25oC, Unless Otherwise Specified PARAMETER Collector to Emitter Breakdown Voltage Collector to Emitter Leakage Current Collector to Emitter Saturation Voltage Gate to Emitter Threshold Voltage Gate to Emitter Leakage Current Switching SOA Gate to Emitter Plateau Voltage On-State Gate Charge Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time SYMBOL BVCES ICES VCE(SAT) VGE(TH) IGES SSOA VGEP QG(ON) td(ON)I trI td(OFF)I Current Fall Time tfI Turn-On Energy EON Turn-Off Energy (Note 3) EOFF ©2001 Fairchild Semiconductor Corporation TEST CONDITIONS IC = 250µA, VGE = 0V MIN TYP MAX UNITS 600 - - V TC = 25oC - - 250 µA TC = 150oC - - 3 mA TC = 25oC - 1.45 1.9 V TC = 150oC - 1.7 2.1 V 4.2 5 6 V - - ±250 nA VCE (PK) = 480V 200 - - A VCE (PK) = 600V 60 - - A IC = IC110, VCE = 0.5 BVCES - 7.2 - V IC = IC110 , VCE = 0.5 BVCES VGE = 15V - 170 190 nC VGE = 20V - 230 250 nC - 36 - ns - 25 - ns - 137 - ns - 58 - ns - 550 800 µJ - 680 900 µJ VCE = BVCES IC = IC110 , VGE = 15V IC = 250µA, VCE = VGE VGE = ±20V TJ = 150oC, RG = 3Ω, VGE = 15V, L = 100µH IGBT and Diode at TJ = 25oC, ICE = IC110 , VCE = 0.8 BVCES , VGE = 15V, RG = 3Ω , L = 1mH, Test Circuit (Figure 19) HGTG30N60B3D, HGT4E30N60B3DS Rev. B1 HGTG30N60B3D, HGT4E30N60B3DS Electrical Specifications TC = 25oC, Unless Otherwise Specified (Continued) PARAMETER SYMBOL Current Turn-On Delay Time td(ON)I Current Rise Time trI Current Turn-Off Delay Time td(OFF)I Current Fall Time tfI Turn-On Energy EON Turn-Off Energy (Note 3) EOFF Diode Forward Voltage VEC Diode Reverse Recovery Time trr Thermal Resistance Junction To Case RθJC TEST CONDITIONS MIN TYP MAX UNITS - 32 - ns - 24 - ns - 275 320 ns - 90 150 ns - 1300 1550 µJ - 1600 1900 µJ IEC = 30A - 1.95 2.5 V IEC = 1A, dIEC/dt = 200A/µs - 32 40 ns IEC = 30A, dIEC/dt = 200A/µs - 45 55 ns IGBT - - 0.6 oC/W Diode - - 1.3 oC/W IGBT and Diode at TJ = 150oC, ICE = IC110 , VCE = 0.8 BVCES , VGE = 15V, RG = 3Ω , L = 1mH, Test Circuit (Figure 19) NOTE: 3. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. Unless Otherwise Specified ICE , DC COLLECTOR CURRENT (A) 60 VGE = 15V 50 40 30 20 10 0 25 50 75 100 125 TC , CASE TEMPERATURE (oC) FIGURE 1. DC COLLECTOR CURRENT vs CASE TEMPERATURE ©2001 Fairchild Semiconductor Corporation 150 ICE, COLLECTOR TO EMITTER CURRENT (A) Typical Performance Curves 225 TJ = 150 oC, RG = 3Ω, VGE = 15V, L = 100µH 200 175 150 125 100 75 50 25 0 0 100 200 300 400 500 600 700 VCE , COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA HGTG30N60B3D, HGT4E30N60B3DS Rev. B1 HGTG30N60B3D, HGT4E30N60B3DS TJ = 150oC, RG = 3Ω, L = 1mH, V CE = 480V 100 10 TC f = 0.05 / (td(OFF)I + td(ON)I) 1 MAX1 75oC fMAX2 = (PD - PC) / (EON + EOFF ) 75oC PC = CONDUCTION DISSIPATION 110oC (DUTY FACTOR = 50%) 110oC RθJC = 0.6oC/W, SEE NOTES 0.1 10 5 20 VGE 15V 10V 15V 10V 40 60 20 18 450 400 16 ISC 14 350 12 300 10 200 8 150 6 10 11 TC = 150oC 125 TC = 25oC 75 50 25 0 0 2 4 6 8 10 ICE, COLLECTOR TO EMITTER CURRENT (A) ICE , COLLECTOR TO EMITTER CURRENT (A) DUTY CYCLE <0.5%, VGE = 10V 200 PULSE DURATION = 250µs 100 DUTY CYCLE <0.5%, VGE = 15V PULSE DURATION = 250µs 300 250 TC = -55oC 200 TC = 150 oC 150 100 TC = 25 oC 50 0 0 TJ = 25 oC, TJ = 150oC, VGE = 10V 4 3 2 1 TJ = 25oC, TJ = 150oC, VGE = 15V 40 50 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 7. TURN-ON ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT ©2001 Fairchild Semiconductor Corporation 2 3 4 6 5 7 FIGURE 6. COLLECTOR TO EMITTER ON-STATE VOLTAGE EOFF, TURN-OFF ENERGY LOSS (mJ) EON , TURN-ON ENERGY LOSS (mJ) 5 30 1 4.5 RG = 3Ω, L = 1mH, VCE = 480V 20 15 VCE , COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 5. COLLECTOR TO EMITTER ON-STATE VOLTAGE 0 10 14 350 VCE , COLLECTOR TO EMITTER VOLTAGE (V) 6 13 FIGURE 4. SHORT CIRCUIT WITHSTAND TIME 225 TC = -55oC 12 VGE , GATE TO EMITTER VOLTAGE (V) FIGURE 3. OPERATING FREQUENCY vs COLLECTOR TO EMITTER CURRENT 150 250 tSC ICE , COLLECTOR TO EMITTER CURRENT (A) 175 500 VCE = 360V, R G = 3Ω, TJ = 125oC I SC , PEAK SHORT CIRCUIT CURRENT (A) Unless Otherwise Specified (Continued) tSC , SHORT CIRCUIT WITHSTAND TIME (µs) fMAX, OPERATING FREQUENCY (kHz) Typical Performance Curves 60 RG = 3Ω, L = 1mH, VCE = 480V 4.0 3.5 3.0 2.5 TJ = 150 oC, VGE = 10V OR 15V 2.0 1.5 1.0 TJ = 25oC, VGE = 10V OR 15V 0.5 0 10 20 30 40 50 60 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 8. TURN-OFF ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT HGTG30N60B3D, HGT4E30N60B3DS Rev. B1 HGTG30N60B3D, HGT4E30N60B3DS Typical Performance Curves Unless Otherwise Specified (Continued) 250 55 RG = 3Ω, L = 1mH, VCE = 480V TJ = 25 oC, TJ = 150oC, VGE = 10V 50 200 trI , RISE TIME (ns) tdI , TURN-ON DELAY TIME (ns) RG = 3Ω, L = 1mH, VCE = 480V 45 TJ = 25oC, TJ = 150 oC, VGE = 10V 40 35 TJ = 25oC, TJ = 150 oC, VGE = 15V 150 100 50 30 TJ = 25 oC, TJ = 150oC, VGE = 15V 0 10 25 10 20 30 50 40 60 FIGURE 9. TURN-ON DELAY TIME vs COLLECTOR TO EMITTER CURRENT tfI , FALL TIME (ns) td(OFF)I , TURN-OFF DELAY TIME (ns) 120 RG = 3Ω, L = 1mH, VCE = 480V TJ = 150oC, VGE = 10V, VGE = 15V TJ = 25 oC, VGE = 10V, VGE = 15V 200 20 30 40 50 80 VGE, GATE TO EMITTER VOLTAGE (V) ICE, COLLECTOR TO EMITTER CURRENT (A) 30 40 50 60 FIGURE 12. FALL TIME vs COLLECTOR TO EMITTER CURRENT DUTY CYCLE <0.5%, VCE = 10V PULSE DURATION = 250µs TC = -55oC 200 TC = 25 oC TC = 150 oC 50 0 20 ICE , COLLECTOR TO EMITTER CURRENT (A) 300 100 TJ = 25 oC, VGE = 10V AND 15V 40 10 60 FIGURE 11. TURN-OFF DELAY TIME vs COLLECTOR TO EMITTER CURRENT 150 60 TJ = 150oC, VGE = 10V AND 15V 100 ICE , COLLECTOR TO EMITTER CURRENT (A) 250 50 RG = 3Ω, L = 1mH, VCE = 480V 60 150 10 40 FIGURE 10. TURN-ON RISE TIME vs COLLECTOR TO EMITTER CURRENT 250 100 30 ICE , COLLECTOR TO EMITTER CURRENT (A) ICE , COLLECTOR TO EMITTER CURRENT (A) 300 20 16 Ig (REF) = 1mA, RL = 10Ω, TC = 25 oC 14 12 VCE = 600V 10 8 6 VCE = 200V 4 VCE = 400V 2 0 4 5 6 7 8 9 10 VGE , GATE TO EMITTER VOLTAGE (V) FIGURE 13. TRANSFER CHARACTERISTIC ©2001 Fairchild Semiconductor Corporation 11 0 50 100 150 200 QG, GATE CHARGE (nC) FIGURE 14. GATE CHARGE WAVEFORMS HGTG30N60B3D, HGT4E30N60B3DS Rev. B1 HGTG30N60B3D, HGT4E30N60B3DS Typical Performance Curves Unless Otherwise Specified (Continued) 10 FREQUENCY = 1MHz C, CAPACITANCE (nF) 8 CIES 6 4 COES 2 CRES 0 0 5 10 15 20 25 VCE, COLLECTOR TO EMITTER VOLTAGE (V) ZθJC , NORMALIZED THERMAL RESPONSE FIGURE 15. CAPACITANCE vs COLLECTOR TO EMITTER VOLTAGE 10 0 0.50 0.20 10-1 0.10 0.05 0.02 t1 0.01 PD DUTY FACTOR, D = t1 / t2 10-2 SINGLE PULSE 10-5 t2 PEAK TJ = (PD X ZθJC X RθJC) + TC 10-4 10 -3 10 -2 10-1 100 101 t1 , RECTANGULAR PULSE DURATION (s) FIGURE 16. NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE 50 TC = 25oC, dIEC/dt = 200A/µs 175 t , RECOVERY TIMES (ns) IEC , FORWARD CURRENT (A) 200 150 125 25 oC 100 75 100oC 50 -55oC 40 trr 30 ta 20 tb 10 25 0 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VEC , FORWARD VOLTAGE (V) FIGURE 17. DIODE FORWARD CURRENT vs FORWARD VOLTAGE DROP ©2001 Fairchild Semiconductor Corporation 4.0 1 2 5 10 20 30 IEC , FORWARD CURRENT (A) FIGURE 18. RECOVERY TIME vs FORWARD CURRENT HGTG30N60B3D, HGT4E30N60B3DS Rev. B1 HGTG30N60B3D, HGT4E30N60B3DS Test Circuit and Waveforms HGTG30N60B3D 90% 10% VGE EON EOFF L = 1mH VCE RG = 3Ω 90% + - ICE VDD = 480V FIGURE 19. INDUCTIVE SWITCHING TEST CIRCUIT 10% td(OFF)I tfI trI td(ON)I FIGURE 20. SWITCHING TEST WAVEFORMS Handling Precautions for IGBTs Operating Frequency Information Insulated Gate Bipolar Transistors are susceptible to gate-insulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler’s body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: Operating frequency information for a typical device (Figure 3) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 5, 6, 7, 8, 9 and 11. The operating frequency plot (Figure 3) of a typical device shows fMAX1 or fMAX2; whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as “ECCOSORBD™ LD26” or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM . Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate open-circuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection - These devices do not have an internal monolithic Zener diode from gate to emitter. If gate protection is required an external Zener is recommended. ©2001 Fairchild Semiconductor Corporation fMAX1 is defined by fMAX1 = 0.05/(td(OFF)I+ td(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on-state time for a 50% duty factor. Other definitions are possible. td(OFF)I and td(ON)I are defined in Figure 20. Device turn-off delay can establish an additional frequency limiting condition for an application other than TJM . td(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJM - TC)/RθJC . The sum of device switching and conduction losses must not exceed PD . A 50% duty factor was used (Figure 3) and the conduction losses (PC) are approximated by PC = (VCE x ICE)/2. EON and EOFF are defined in the switching waveforms shown in Figure 20. E ON is the integral of the instantaneous power loss (ICE x V CE) during turn-on and E OFF is the integral of the instantaneous power loss (ICE x VCE) during turn-off. All tail losses are included in the calculation for EOFF; i.e., the collector current equals zero (ICE = 0). HGTG30N60B3D, HGT4E30N60B3DS Rev. B1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER SMART START™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET VCX™ STAR*POWER is used under license DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H4