STMICROELECTRONICS 145

PRODUCT/PROCESS
CHANGE NOTIFICATION
PCN DSG-COM/03/145
PCN LEADFREE PLATING FOR SO8
PACKAGE IN MUAR first lines
2003/02/7
PCN DSG-COM/03/145
Product Family /Commercial Product
STANDARD LINEAR products in SO8 package
Type Of Change
Package assembly process change
Reason For Change
Environmental directive
Description of the change
To remove lead from plating by using
preplating nickel palladium gold leadframe
NiPdAu. This change will not affect
ELECTRICAL & MECHANICAL
parameters. Samples available:
LM393DT/LM358DT. Other samples: on
request. PLEASE BOOK YOUR SAMPLE ORDER IN
NON-STANDARD WITH THE FOLLOWING COMMENT "AS
PER LEADFREE PCN DSG-COM/03/145".
Forecasted date of change
07-May-2003
Forecasted date of samples for customer
07-Feb-2003
Forecasted date for STMicroelectronics change
qualification report availability
07-Feb-2003
Marking to identify changed product
"E" letter on the package close to ST LOGO
Description of qualification program
See Attached Qualification Plan
Product Line(s) and/or Part Number(s)
See Attached List
Manufacturing Location(s)
Estimated Date of first shipment
07-May-2003
Division Product Manager
Jean Claude KAIRE
Date: Jan.29 ,03
Division Q.A. Manager
Francoise PACCARD
Date: Jan.29 ,03
Customer Acknowledgement of Receipt
PCN DSG-COM/03/145
Please sign and return to STMicroelectronics Sales Office
Qualification Plan Denied
Name:
Qualification Plan Approved
Title:
Company:
Change Denied
Date:
Change Approved
Signature:
Remark
.......................................................................................................................................................................................................................
.......................................................................................................................................................................................................................
.......................................................................................................................................................................................................................
.......................................................................................................................................................................................................................
.......................................................................................................................................................................................................................
2003/02/7
Process Change/ Transfer
Qualification report n° QASO8N91
PROCESS CHANGE / TRANSFER
QUALIFICATION REPORT
PCN reference: DSG-COM/03/145
Qualification Report n°: QASO8N91
Qualification Type: Material change
Process: Leadfree plating
New glue Hitachi 4900
Date of issue: 22th January 2003
Reference documents:
SOP 2.5.9
Process critical and key parameters
0076604 Process Qualification and release to production
0078588 Reliability requirements for product qualification
0046008 Process control plan for Front End
0060531 FMEA procedure
0061050 Back end qualification procedure
0091984 Construction analysis
0037709 Package construction analysis
7006451 Management of manufacturing source change
0033689 Process flow chart
Prepared by JM Bugnard
Page 1/9
Process Change/ Transfer
Qualification report n° QASO8N91
Content
1 PROCESS MAIN SPECIFICATION CHANGE
1.1 Process change description
1.2 Process main specification change
1.3 Possible effects of change on Parametric, Electrical, Quality or Reliability
2 QUALIFICATION PLAN
2.1 Test vehicle description
2.2 Process qualification requirements
2.3 E WS qualification requirements
2.4 Final Test qualification requirements
2.5 Bench Test requirements
2.6 Reliability qualification requirements
3 QUALIFICATION RESULTS
3.1 Process qualification results
3.2 EWS qualification results
3.3 Final Test qualification results
3.4 Bench Test qualification results
3.5 Reliability qualification results
4 PROCESS CHANGE QUALIFICATION CERTIFICATE
Prepared by JM Bugnard
Page 2/9
Process Change/ Transfer
Qualification report n° QASO8N91
1. PROCESS MAIN SPECIFI CATION CHANGE
1.1 Process change description.
1.1.1 Nature of Change: Leadfree plating NiPdAu preplated leadframe and glue change (Hitachi
4900)
1.1.2
Reason for Change: To be compliant with Environmental directives.
1.1.3
Affected process: SO8 assembled in ST Muar
1.1.4 Affected products: All standard linear devices assembled in SO8
1.1.5
Implementation date: April 2003
1.2 DETAILLED DESCRIPTION OF CHANGE
Assembly site
Assembly flow + Control Plan
Frame (material)
Die attach material
Wire material
Wire diameter
Mold compound
Wire bond method
Lead finishing
New Process
Current Process
ST Muar (Malaysia)
7124337
Copper +
NiPdAu preplating
Hitachi 4900ST
Gold
1 MIL
MP8000 CH4
Thermosonic
NiPdAu (preplated)
ST Muar (Malaysia)
7071671
Copper
Ablebond 8390
Gold
1 MIL
MP8000 CH4
Thermosonic
Tin plating (SnPb85/15)
LEAD-FREE components are defined by STMicroelectronics as ECOPACK® components.
The implementation of the ECOPACK specification includes the suppression of lead (Pb) in those alloys used
the lead finishing of components.
The identification of ECOPACK products will be achieved through specific labelling on component boxes.
Whenever possible, the letter “E” will be added in the marking pattern beside the ST logo on the package
body.
1.3 MAJOR EFFECTS OF CHANGE ON QUALITY, PARAMETRIC, ELECTRICAL OR
RELIABILITY DATA
No effect on solderability: ECOPACK components a re solderable with both current SnPb and AgSnCu lead free PCB assembly processes.
Reliability improvement: In addition to the change of connection coating, a change in materials (glue) occurs
in SO Narrow in order to meet the higher soldering tem perature constraints required for lead-free soldering using,
in particular, the IPC/JEDEC JSTD020B standard as reference.
Prepared by JM Bugnard
Page 3/9
Process Change/ Transfer
Qualification report n° QASO8N91
2. QUALIFICATION PLAN
2.1 PROCESS QUALIFICATION REQUIREMENTS
2.1.1 Flow Chart comparison (1)
yes [ X ]
no [ ]
N/A [ ]
2.1.2 Control Plan comparison (1)
yes [ X ]
no [ ]
N/A [ ]
2.1.3 FMEA study (1)
yes [ X ]
no [ ]
N/A [ ]
2.1.4 Process construction analysis (1)
yes [ X ]
no [ ]
N/A [ ]
2.1.5 Quantity of qualification lots
[ ]1
[ ]2
2.1.6 Critical parametric parameters analysis (Cpk)
[X ]3
[ ]4
yes [X ]
no [ ]
N/A [ ]
yes [X ]
no [ ]
N/A [ ]
Bond pull test, Bond shear test.
2.1.7 Non critical parameters analysis (Mean)
Note 1: as described in related ADCS procedure
2.2 Test Vehicles (TV) description.
Line
Sales Type
P&L
Dice size
Package
Assy
Reliab plant
0431*
0158*
0082*
TL431CD
LM358D
TL082CD
71
71
71
1.38x1.12mm
1.07x 1.01
1.74x1.48
SO8
SO8
SO8
ST Muar
ST Muar
ST Muar
Grenoble +Muar
Grenoble
Muar
Lot #
1
1
1
* shrinked die version
2.3 FINAL TEST QUALIFICATION REQUIREMENTS
[ x ] yes
[ ] no
2.3.1 Quantity of qualification lots
[]1
[X ] 2
[]3
2.3.2 Lot average yield data:
[]1
[X ]2
[]3
2.3.3 Package type
SO8
2.3.4 Parameter distributions
[X ] N/A
[ ] LotA [ ] LotB
[ ] Lot C
2.3.4.1List of parameters:
2.3.4.2 Qualification criteria: N/A
2.4 BENCH MEASUREMENTS QUALIFICATION REQUIREMENTS
[ X] yes
[ ] no
[ ]N/A
Construction analysis conforms to ST specification.
2.5 SPECIFIC TESTS QUALIFICATION REQUIREMENTS [] yes
2.5.1 ESD
[] yes
[ x ] no
2.5.1 Latch-up
[] yes
[ x ] no
Prepared by JM Bugnard
[ ] no
[x] N/A
Page 4/9
Process Change/ Transfer
Qualification report n° QASO8N91
2.6 RELIABILITY QUALIFICATION REQUIREMENTS
2.6.1 Reliability tests performed on
[x] LotA [x] LotB
[x] yes
[] no
[x] LotC
2.6.2 Reliability tests:
Tests
HTB
Environment
Sequence
THB
Conditions
Ta=125°C
Vs=absolute max
rating
PPT 3 atm. +
TMC
Ta=85C RH=85pct
Vs=nominal
Test
1000h
48h
100 cy.
1000h
LotA LotB LotC
Comments
X
X
X Purpose: to point out problems connected
to electrical stress related with the field
application condition
X
X
X
X
X
X
TMC
Ta= -65/+150C
1000c
X
X
X
PPT
Ta=121°C P=2atm
480h
X
X
X
Jedel level
determination
Jedel level 1
168h 85°C /
85%RH + 3IR
reflow soldering
Ta= -65/+150C
X*
X**
X**
TMSK
500shk
X
X
Purpose: To point out failure mechanism
mainly due to electrochemical effects
developped inside the device for
contamination ions and electrical field
applied
Purpose: to point out the
thermomechanical mismatch among the
different materials employed
Purpose: to point out critical water entry
path with consequential electrolytic and
galvanic corrosion.
Purpose: To point out problem connected
to the reflow soldering.
Purpose: to point out the
thermomechanical mismatch among the
different materials employed
* With 260°C reflow peak (see Appendix 1)
** With 245°C reflow peak (see Appendix 1)
2.6.3 Drift analysis on Vio parameter (HTB & THB)
2.6.4 Qu alification criteria:
Prepared by JM Bugnard
[x yes
[ ] no
no reject after reliability.
Page 5/9
Process Change/ Transfer
Qualification report n° QASO8N91
3. QUALIFICATION RESULTS
3.1 Process qualification results.
Bond Pull Test
Device
Wire size
Min
Max
Average
Stdev
Cpk
TL431CD
LM358CD
1.0mil
1.0 mil
8.3g
8.5g
14.4g
12.7g
10.9
10.5
1.34
1.26
1.72
1.71
Device
Wire size
Min
Max
Average
Stdev
Cpk
TL431CD
LM358CD
1.0mil
1.0 mil
45.0g
43.2g
65.4g
60.8g
57.2
53.1
5.72
5.04
1.94
1.92
comments
Minimum specification: 4g
Bond shear test
comments
Minimum specification: 32g
3.2 Bench Test qualification results
3.2.1 X-ray analysis
Wire sweeping conform
No glue void
3.2.2 External visual
NiPdAu plating: No exposed copper
Surface finish: Uniform stains free & uniform print
Cracks: Not visible at x10
Resin holes: not visible at x10
Other: No other visual defect
3.2.3 Scanning acoustic microscopy
No delamination.
3.2.4 Microsection
Resin holes: no void
Glue thickness: conform (min: 11.3µm, max 11.8µm)
Glue voids: no void
Die tilt: conform (0.5µm)
Die scribing: conform
NiPdAu plating thickness: conform
Package alignment : conform
3.2.5 Decapped devices
Loop height: conform
Ball size variation: conform
Bond shape: conform:
Bond centering: conform
Weld shape: conform
Weld centering: conform
Die scribing: conform
Die chipping: conform
Prepared by JM Bugnard
Page 6/9
Process Change/ Transfer
Qualification report n° QASO8N91
3.2.6 External dimension measurement
Conform
3.2.7 Solderability
Conform (both after 24h steam aging and 24 hours dry air) on 80 units
3.3 FINAL TEST QUALIFICATION
TL431CD
99.75%
Test Yield
LM358D
99.91
3.4 Reliability qualification results
Conditions
Duration
Steps
TMC
-65/+150°C
1000 cy
TMSK
-65/+150°C
500 shks
PPT
121°C, 2atm.
480 hours
Envir. Sequ.
TMC + PPT
100cy + 48h
HTB
125°C
1000 h
THB
85°C, 85%HR
1000 h
100cy
1000cy
100 shks
500shks
168h
240h
480h
100cy
48h
168
1000h
168
1000h
Test
RSM 245°C
RSM 260°C
Lot 1
TL431CD
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/20 + 0/15
0/20
Lot 2
LM358D
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/15
Lot 3
TL082CD
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/78
0/60
0/60
0/60
0/60
0/20
0/20
Test marked in blue performed in ST Muar
3.4.1 Drift analysis
HTB (mean Vref drift) TL431CD
THB (mean Vref drift) TL431CD
HTB (mean Vio drift) LM358D
THB (mean Vio drift) LM358D
HTB (mean Vio drift) TL082CD
THB (mean Vio drift) TL082CD
Prepared by JM Bugnard
168h
2.57mV
0.54mV
0.047mV
-0.01mV
0.32mV
0.20mV
1000
1.88mV
1.17mV
0.108
0.05
0.29mV
0.15mV
Page 7/9
Process Change/ Transfer
Qualification report n° QASO8N91
PROCESS CHANGE QUALIFICATION CERTIFICATE (7420046)
PROCESS or PACKAGE: SO8 NRS
NiPdAu preplated frame qualification
CERTIFICATE NUMBER
PLANT: Muar Malaysia
C212SON1
GROUPS INVOLVED
DSG
DIVISION INVOLVED
Standard linear IC’s
TRANSFER TO PLANT
TRANSFER FROM PLANT
DESIGN RULE MANUAL
0018063
PROCESS FMEA
7141456
PROCESS FLOW CHART
7124337
PROCESS CONTROL PLAN
7124337
PARAMETRIC TESTING DOCUMENTATION
N/A
WLR
N/A
RELIABILITY REPORT
QASONIP1
CONSTRUCTION ANALYSIS REPORT
NO 09/02
ASSEMBLY REPORT
Muar ASM PPF Qual. run
QUALIFICATION REPORT
QASONIP1
TEST VEHICLE PROCESS
Bipolar
TEST VEHICLE PACKAGE
SO8
TEST VEHICLE SALES TYPE
TL0431CD, LM358D, TL082CD
Approval
Group
DSG PROD.ENG. STD LINEAR
DSG PROD.ENG. MANAGER
STD LINEAR
DSG QUALITY MANAGT GNB
QA DIRECTOR ST MUAR
Prepared by JM Bugnard
Name
N ATHALIE BANCHERI
ALAIN CHASSAGNEUX
Date
24-DEC-2002
20-DEC-2002
FRANCOISE PACCARD
RICHARD WONG
07-JAN -2003
24-DEC-2002
Page 8/9
Process Change/ Transfer
Qualification report n° QASO8N91
APPENDIX 1
INFRARED REFLOW SOLDERING
Prepared by JM Bugnard
Page 9/9
Information furnished is believed to be accurate and reliable . However, STMicroelectronics assumes no responsibility for the consequences of use of
such information nor for any infringement of patents or other rights of third parties, which may result from it’s use. No license is granted by implication or
otherwise under any patents or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.This
publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorised for use as critical components in life support devices or systems without express written approval of
STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
c 2002 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - Finland - France - Germany
Hongkong - India - Israel - Italy - Japan - Malaysia - Malta - Morroco - Singapore
Spain - Sweden - Switzerland - United Kingdom - United States
http://www.st.com
2003/02/7