STP19N06L STP19N06LFI N - CHANNEL ENHANCEMENT MODE LOW THRESHOLD POWER MOS TRANSISTOR TYPE STP19N06L STP19N06LFI ■ ■ ■ ■ ■ ■ ■ ■ VDSS R DS(on) ID 60 V 60 V < 0.1 Ω < 0.1 Ω 19 A 13 A TYPICAL RDS(on) = 0.085 Ω AVALANCHE RUGGED TECHNOLOGY 100% AVALANCHE TESTED REPETITIVE AVALANCHE DATA AT 100oC LOW GATE CHARGE LOGIC LEVEL COMPATIBLE INPUT 175 oC OPERATING TEMPERATURE APPLICATION ORIENTED CHARACTERIZATION 3 1 3 2 1 TO-220 APPLICATIONS ■ HIGH CURRENT, HIGH SPEED SWITCHING ■ SOLENOID AND RELAY DRIVERS ■ REGULATORS ■ DC-DC & DC-AC CONVERTERS ■ MOTOR CONTROL, AUDIO AMPLIFIERS ■ AUTOMOTIVE ENVIRONMENT (INJECTION, ABS, AIR-BAG, LAMPDRIVERS, Etc.) 2 ISOWATT220 INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value STP19N06L V DS V DGR V GS Unit STP19N06LFI Drain-source Voltage (V GS = 0) 60 V Drain- gate Voltage (R GS = 20 kΩ) 60 V ± 15 V Gate-source Voltage o ID Drain Current (continuous) at T c = 25 C 19 13 A ID Drain Current (continuous) at T c = 100 o C 13 9 A Drain Current (pulsed) 76 76 A 80 35 W 0.53 0.23 W/o C 2000 I DM (•) P tot o Total Dissipation at T c = 25 C Derating Factor V ISO T stg Tj Insulation Withstand Voltage (DC) Storage Temperature Max. Operating Junction Temperature V -65 to 175 o C 175 o C (•) Pulse width limited by safe operating area February 1995 1/7 STP19N06L/FI THERMAL DATA R thj-case R thj-amb R t hc-sink Tl Thermal Resistance Junction-case TO-220 ISOWATT220 1.88 4.29 Max Thermal Resistance Junction-ambient Max Thermal Resistance Case-sink Typ Maximum Lead Temperature For Soldering Purpose o C/W 62.5 0.5 300 o C/W C/W o C Max Value Unit o AVALANCHE CHARACTERISTICS Symbol Parameter IA R Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T j max, δ < 1%) 19 A E AS Single Pulse Avalanche Energy (starting T j = 25 o C, I D = I AR , V DD = 25 V) 76 mJ E AR Repetitive Avalanche Energy (pulse width limited by T j max, δ < 1%) 19 mJ IA R Avalanche Current, Repetitive or Not-Repetitive (T c = 100 o C, pulse width limited by T j max, δ < 1%) 13 A ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified) OFF Symbol V(BR)DSS Parameter Drain-source Breakdown Voltage Test Conditions I D = 250 µA VGS = 0 I DS S Zero Gate Voltage V DS = Max Rating Drain Current (V GS = 0) V DS = Max Rating x 0.8 I GSS Gate-body Leakage Current (V DS = 0) Min. Typ. Max. 60 Unit V T c = 125 o C V GS = ± 15 V 250 1000 µA µA ± 100 nA ON (∗) Symbol Parameter Test Conditions V GS(th) Gate Threshold Voltage V DS = V GS R DS(on) Static Drain-source On Resistance I D(on) I D = 250 µA V GS = 5 V I D = 9.5 A V GS = 5 V I D = 9.5 A Min. Typ. Max. Unit 1 1.7 2.5 V 0.085 0.1 0.2 Ω Ω T c = 100o C On State Drain Current V DS > I D(on) x R DS(on)max V GS = 10 V 19 A DYNAMIC Symbol gfs (∗) C iss C oss C rss 2/7 Parameter Test Conditions Forward Transconductance V DS > I D(on) x R DS(on)max I D = 9.5 A Input Capacitance Output Capacitance Reverse Transfer Capacitance V DS = 25 V VGS = 0 f = 1 MHz Min. Typ. 7 9 700 230 80 Max. Unit S 900 300 100 pF pF pF STP19N06L/FI ELECTRICAL CHARACTERISTICS (continued) SWITCHING ON Symbol t d(on) tr (di/dt) on Qg Q gs Q gd Parameter Test Conditions Min. Typ. Max. Unit 21 230 ns ns Turn-on Time Rise Time V DD = 30 V ID = 9.5 A R G = 4.7 Ω V GS = 5 V (see test circuit, figure 3) 15 165 Turn-on Current Slope V DD = 40 V ID = 19 A R G = 47 Ω VGS = 5 V (see test circuit, figure 5) 70 Total Gate Charge Gate-Source Charge Gate-Drain Charge V DD = 40 V 18 7 9 26 nC nC nC Typ. Max. Unit 50 95 165 70 135 230 ns ns ns Typ. Max. Unit 19 76 A A 1.6 V ID = 19 A V GS = 5 V A/µs SWITCHING OFF Symbol t r(Vof f) tf tc Parameter Off-voltage Rise Time Fall Time Cross-over Time Test Conditions Min. V DD = 40 V ID = 19 A R G = 47 Ω VGS = 5 V (see test circuit, figure 5) SOURCE DRAIN DIODE Symbol Parameter Test Conditions IS D I SDM (•) Source-drain Current Source-drain Current (pulsed) VS D (∗) Forward On Voltage I SD = 19 A Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current I SD = 19 A di/dt = 100 A/µs V DD = 30 V T j = 150 o C (see test circuit, figure 5) t rr Q rr I RRM Min. V GS = 0 60 ns 0.13 µC 4.6 A (∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 % (•) Pulse width limited by safe operating area 3/7 STP19N06L/FI Fig. 1: Unclamped Inductive Load Test Circuits Fig. 2: Unclamped Inductive Waveforms Fig. 3: Switching Times Test Circuits For Resistive Load Fig. 4: Gate Charge Test Circuit Fig. 5: Test Circuit For Inductive Load Switching And Diode Reverse Recovery Time 4/7 STP19N06L/FI TO-220 MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 D1 1.27 0.050 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067 G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 L2 16.4 0.645 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154 DIA. 3.75 3.85 0.147 0.151 D1 C D A E L4 H2 G G1 F1 L2 F2 F Dia. L5 L9 L7 L6 L4 P011C 5/7 STP19N06L/FI ISOWATT220 MECHANICAL DATA mm DIM. MIN. inch TYP. MAX. MIN. TYP. MAX. A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.4 0.7 0.015 0.027 F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067 G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106 H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 9 9.3 0.354 0.366 Ø 3 3.2 0.118 0.126 B D A E L7 L3 L6 F2 H G G1 Ø F F1 L7 1 2 3 L2 6/7 L4 P011G STP19N06L/FI Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. © 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 7/7