STMICROELECTRONICS STS2DNFS30L

STS2DNFS30L
N-CHANNEL 30V - 0.09Ω - 3A SO-8
STripFET™ II MOSFET PLUS SCHOTTKY RECTIFIER
PRELIMINARY DATA
MAIN PRODUCT CHARACTERISTICS
MOSFET
SCHOTTKY
VDSS
RDS(on)
ID
30 V
< 0.11 Ω
3A
IF(AV)
VRRM
VF(MAX)
1A
30 V
0.46 V
DESCRIPTION
This product associates the latest low voltage
STripFET™ in n-channel version to a low drop
Schottky diode. Such configuration is extremely versatile in implementing, a large variety of DC-DC
converters for printers, portable equipment, and cellular phones.
SO-8
INTERNAL SCHEMATIC DIAGRAM
MOSFET ABSOLUTE MAXIMUM RATINGS
Symbol
VDS
VDGR
VGS
Parameter
Drain-source Voltage (VGS = 0)
Drain-gate Voltage (RGS = 20 kΩ)
Gate- source Voltage
Value
Unit
30
V
30
V
± 15
V
ID
Drain Current (continuos) at TC = 25°C
3
A
ID
Drain Current (continuos) at TC = 100°C
1.9
A
Drain Current (pulsed)
12
A
Total Dissipation at TC = 25°C
2
W
IDM (●)
PTOT
SCHOTTKY ABSOLUTE MAXIMUM RATINGS
Symbol
VRRM
IF(RMS)
Value
Unit
Repetitive Peak Reverse Voltage
Parameter
30
V
RMS Forward Current
7
A
IF(AV)
Average Forward Current
TL = 135°C
δ = 0.5
1
A
IFSM
Surge Non Repetitive Forward Current
tp = 10 ms
Sinusoidal
45
A
IRSM
Non Repetitive Peak Reverse Current
tp = 100 µs
1
A
dv/dt
Critical Rate Of Rise Of Reverse Voltage
10000
V/µs
(•)Pulse width limited by safe operating area
August 2001
1/6
STS2DNFS30L
THERMAL DATA
Rthj-amb
(*)Thermal Resistance Junction-ambient MOSFET
62.5
°C/W
Rthj-amb
(*)Thermal Resistance Junction-ambient SCHOTTKY Maximum
100
°C/W
Tstg
Tl
Storage Temperature Range
Junction Temperature
-55 to 150
°C
150
°C
(*) Mounted on FR-4 board (Steady State)
MOSFET ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
V(BR)DSS
IDSS
IGSS
Parameter
Test Conditions
Min.
Typ.
Max.
30
Unit
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
V
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
1
µA
VDS = Max Rating, TC = 125 °C
10
µA
Gate-body Leakage
Current (VDS = 0)
VGS = ± 15 V
±100
nA
Max.
Unit
ON (1)
Symbol
Parameter
Test Conditions
Min.
Typ.
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = 250µA
RDS(on)
Static Drain-source On
Resistance
VGS = 10V, ID = 1.5 A
0.09
0.11
Ω
VGS = 4.5V, ID = 1.5 A
0.13
0.15
Ω
Typ.
Max.
Unit
1
V
DYNAMIC
Symbol
gfs (1)
2/6
Parameter
Forward Transconductance
Test Conditions
VDS = 15 V , ID = 1.5 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
2.5
S
121
pF
Ciss
Input Capacitance
Coss
Output Capacitance
45
pF
Crss
Reverse Transfer
Capacitance
11
pF
STS2DNFS30L
1.
ELECTRICAL
CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol
td(on)
tr
Parameter
Turn-on Delay Time
Rise Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Test Conditions
Min.
VDD = 15 V, ID = 1.5 A
RG = 4.7 Ω VGS = 4.5 V
(see test circuit, Figure 3)
VDD = 24 V, ID = 3 A,
VGS = 4.5 V
Typ.
Max.
Unit
19
ns
20
ns
4.5
6
nC
1.7
nC
0.9
nC
SWITCHING OFF
Symbol
td(off)
tf
Parameter
Turn-off Delay Time
Fall Time
Test Conditions
Min.
VDD = 15 V, ID = 1.5 A,
RG = 4.7Ω, VGS = 4.5 V
(see test circuit, Figure 3)
Typ.
Max.
12
8
Unit
ns
ns
SOURCE DRAIN DIODE
Symbol
ISD
Parameter
Test Conditions
Min.
Typ.
Source-drain Current
ISDM (2)
Source-drain Current (pulsed)
VSD (1)
Forward On Voltage
ISD = 3 A, VGS = 0
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD = 3 A, di/dt = 100A/µs,
VDD = 30 V, Tj = 150°C
(see test circuit, Figure 5)
IRRM
Reverse Recovery Current
Max.
Unit
3
A
12
A
1.2
V
19
ns
8.1
nC
0.85
A
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
SCHOTTCKY STATIC ELETTRICAL CHARACTERISTICS
Symbol
IR(*)
VF(*)
Parameter
Reversed Leakage Current
Forward Voltage Drop
Typ.
Max.
Unit
TJ = 25 °C , VR = 30 V
TJ = 125 °C , VR = 30 V
Test Conditions
Min.
1.5
10
10
µA
mA
TJ = 25 °C , IF = 1 A
TJ = 125 °C , IF = 1 A
0.37
0.55
0.46
V
V
3/6
STS2DNFS30L
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
4/6
STS2DNFS30L
SO-8 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
A
a1
MAX.
MIN.
TYP.
1.75
0.1
0.003
0.009
1.65
0.65
MAX.
0.068
0.25
a2
a3
inch
0.064
0.85
0.025
0.033
b
0.35
0.48
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.25
0.5
0.010
0.019
D
4.8
5.0
0.188
0.196
E
5.8
6.2
0.228
0.244
c1
45 (typ.)
e
1.27
0.050
e3
3.81
0.150
F
3.8
4.0
0.14
0.157
L
0.4
1.27
0.015
0.050
M
S
0.6
0.023
8 (max.)
0016023
5/6
STS2DNFS30L
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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