TEMIC SUP75N06-08

SUP/SUB75N06-08
N-Channel Enhancement-Mode Transistors
Product Summary
V(BR)DSS (V)
rDS(on) ()
ID (A)
60
0.008
75a
D
TO-220AB
TO-263
G
DRAIN connected to TAB
G D S
Top View
G D S
S
SUB75N06-08
Top View
SUP75N06-08
N-Channel MOSFET
Absolute Maximum Ratings (TC = 25C Unless Otherwise Noted)
Parameter
Gate-Source Voltage
TC = 25C
Continuous Drain Current
(TJ = 175C)
TC = 125C
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche
Energyb
L = 0.1 mH
TC = 25C (TO-220AB and TO-263)
Power Dissipation
TA = 25C (TO-263)d
Operating Junction and Storage Temperature Range
Symbol
Limit
Unit
VGS
20
V
75a
ID
55
IDM
240
IAR
60
EAR
280
A
mJ
187c
PD
TJ, Tstg
3.7
–55 to 175
W
C
Thermal Resistance Ratings
Parameter
Symbol
PCB Mount (TO-263)d
Junction to Ambient
Junction-to-Ambient
Free Air (TO-220AB)
Junction-to-Case
Limit
Unit
40
RthJA
RthJC
62.5
C/W
0.8
Notes
a. Package limited.
b. Duty cycle 1%.
c. See SOA curve for voltage derating.
d. When mounted on 1” square PCB (FR-4 material).
Updates to this data sheet may be obtained via facsimile by calling Siliconix FaxBack, 1-408-970-5600. Please request FaxBack document # 70283.
A SPICE Model data sheet is available for this product (FaxBack document #70527).
Siliconix
S-47969—Rev. D, 08-Jul-96
1
SUP/SUB75N06-08
Specifications (TJ = 25C Unless Otherwise Noted)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VGS = 0 V, ID = 250 mA
60
VGS(th)
VDS = VGS, ID = 250 mA
2.0
3.0
4.0
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "20 V
VDS = 60 V, VGS = 0 V
1
Zero Gate Voltage Drain Current
IDSS
VDS = 60 V, VGS = 0 V, TJ = 125C
50
On-State Drain Currentb
ID(on)
Unit
Static
Gate Threshold Voltage
V
"100
VDS = 60 V, VGS = 0 V, TJ = 175C
VDS = 5 V, VGS = 10 V
Drain-Source On-State
rDS(on)
A
0.007
VGS = 10 V, ID = 30 A, TJ = 125C
gfs
VDS = 15 V, ID = 30 A
0.008
0.012
VGS = 10 V, ID = 30 A, TJ = 175C
Forward Transconductance b
mA
150
120
VGS = 10 V, ID = 30 A
Resistanceb
nA
W
0.016
30
S
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
270
Total Gate Chargec
Qg
85
Gate-Source
Chargec
Qgs
4800
VGS = 0 V, VDS = 25 V, f = 1 MHz
VDS = 30 V, VGS = 10 V, ID = 75 A
pF
910
120
nC
28
Gate-Drain Chargec
Qgd
26
Turn-On Delay Timec
td(on)
20
40
95
200
65
120
20
60
Rise
Timec
Turn-Off Delay Timec
Fall Timec
tr
td(off)
VDD = 30 V,, RL = 0.47 W
ID ^ 75 A,
A VGEN = 10 V,
V RG = 2.5
25W
tf
ns
Continuous Current
IS
75
Pulsed Current
ISM
240
Forward Voltageb
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 75 A , VGS = 0 V
trr
IRM(REC)
Qrr
IF = 75 A, di/dt = 100 A/ms
A
1.0
1.3
V
67
120
ns
6
8
A
0.2
0.48
mC
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test: pulse width v 300 msec, duty cycle v 2%.
c. Independent of operating temperature.
2
Siliconix
S-47969—Rev. D, 08-Jul-96
SUP/SUB75N06-08
Typical Characteristics (25C Unless Otherwise Noted)
Output Characteristics
Transfer Characteristics
200
250
VGS = 10, 9, 8 V
7V
6V
I D – Drain Current (A)
I D – Drain Current (A)
200
150
100
5V
50
150
100
TC = 125C
50
25C
4V
0
–55C
0
0
2
4
6
8
0
10
2
VDS – Drain-to-Source Voltage (V)
Transconductance
8
10
On-Resistance vs. Drain Current
0.010
TC = –55C
100
25C
80
rDS(on) – On-Resistance ( )
g fs – Transconductance (S)
6
VGS – Gate-to-Source Voltage (V)
120
125C
60
40
20
0
0.008
VGS = 10 V
0.006
VGS = 20 V
0.004
0.002
0
0
20
40
60
80
0
100
20
VGS – Gate-to-Source Voltage (V)
VGS – Gate-to-Source Voltage (V)
Ciss
5000
4000
3000
2000
Coss
Crss
60
80
100
120
Gate Charge
20
6000
1000
40
ID – Drain Current (A)
Capacitance
7000
C – Capacitance (pF)
4
0
VDS = 30 V
ID = 75 A
16
12
8
4
0
0
10
20
30
40
50
VDS – Drain-to-Source Voltage (V)
Siliconix
S-47969—Rev. D, 08-Jul-96
60
0
25
50
75
100
125
150
175
Qg – Total Gate Charge (nC)
3
SUP/SUB75N06-08
Typical Characteristics (25C Unless Otherwise Noted)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
100
VGS = 10 V
ID = 30 A
2.0
I S – Source Current (A)
rDS(on) – On-Resistance ( )
(Normalized)
2.5
1.5
1.0
TJ = 150C
TJ = 25C
10
0.5
0
–50 –25
1
0
25
50
75
100 125 150 175
0.3
TJ – Junction Temperature (C)
0.6
0.9
1.2
1.5
VSD – Source-to-Drain Voltage (V)
Thermal Ratings
Maximum Avalanche and Drain Current
vs. Case Temperature
100
Safe Operating Area
500
Limited
by rDS(on)
I D – Drain Current (A)
I D – Drain Current (A)
80
60
40
100
100 ms
1 ms
10
TC = 25C
Single Pulse
20
0
25
50
75
100
125
150
175
0.1
TC – Case Temperature (C)
100 ms
dc
100
1
10
VDS – Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
10 ms
1
0
1
10 ms
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–5
10–4
10–3
10–2
10–1
1
3
Square Wave Pulse Duration (sec)
4
Siliconix
S-47969—Rev. D, 08-Jul-96