VISHAY SUM40N15-38

SUM40N15-38
New Product
Vishay Siliconix
N-Channel 150-V (D-S) 175_C MOSFET
FEATURES
D
D
D
D
PRODUCT SUMMARY
V(BR)DSS (V)
150
rDS(on) (W)
ID (A)
0.038 @ VGS = 10 V
40
0.042 @ VGS = 6 V
38
TrenchFETr Power MOSFETS
175_C Junction Temperature
New Low Thermal Resistance Package
PWM Optimized
APPLICATIONS
D Primary Side Switch
D
TO-263
G
G
D S
Top View
Ordering Information: SUM40N15-38
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 175_C)
TC = 25_C
TC = 125_C
Pulsed Drain Current
Avalanche Current
Repetitive Avalanche Energya
L = 0.1 mH
TC = 25_C
Maximum Power Dissipationa
TA = 25_Cc
Operating Junction and Storage Temperature Range
Symbol
Limit
VDS
150
VGS
"20
ID
V
40
23
IDM
80
IAR
40
EAR
Unit
80
A
mJ
166b
PD
3.75
W
TJ, Tstg
- 55 to 175
_C
Symbol
Limit
Unit
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient (PCB Mount
TO-263c)
Junction-to-Case (Drain)
RthJA
40
RthJC
0.9
_C/W
Notes
a. Duty cycle v 1%.
b. See SOA curve for voltage derating.
c. When mounted on 1” square PCB (FR-4 material).
Document Number: 72155
S-03534—Rev. A, 24-Mar-03
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SUM40N15-38
New Product
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
V(BR)DSS
VDS = 0 V, ID = 250 mA
150
VGS(th)
VDS = VGS, ID = 250 mA
2
IGSS
VDS = 0 V, VGS = "20 V
"100
VDS = 120 V, VGS = 0 V
1
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage
g Drain Current
On-State Drain Currenta
Drain Source On-State
Drain-Source
On State Resistancea
IDSS
VDS = 120 V, VGS = 0 V, TJ = 125_C
50
VDS = 120 V, VGS = 0 V, TJ = 175_C
250
VDS w 5 V, VGS = 10 V
ID(on)
rDS(on)
DS( )
V
4
80
VGS = 10 V, ID = 15 A
0.030
0.038
VGS = 6 V, ID = 10 A
0.033
0.042
VGS = 10 V, ID = 15 A, TJ = 125_C
gfs
VDS = 15 V, ID = 15 A
mA
m
A
0.076
VGS = 10 V, ID = 15 A, TJ = 175_C
Forward Transconductancea
nA
W
0.100
10
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
2500
VGS = 0 V, VDS = 25 V, f = 1 MHz
290
pF
190
W
Gate Resistance
Rg
2
Total Gate Chargec
Qg
38
Gate-Source Chargec
Qgs
Gate-Drain Chargec
Qgd
13
Turn-On Delay Timec
td(on)
15
25
130
200
30
45
90
140
Rise
Timec
Turn-Off Delay Timec
Fall Timec
tr
td(off)
VDS = 75 V,, VGS = 10 V,, ID = 40 A
VDD = 75 V, RL = 1.80 W
ID ^ 40 A, VGEN = 10 V, RG = 2.5 W
tf
Source-Drain Diode Ratings and Characteristics (TC =
Continuous Current
60
13
nC
25_C)b
IS
40
Pulsed Current
ISM
80
Forward Voltagea
VSD
Reverse Recovery Time
Peak Reverse Recovery Current
Reverse Recovery Charge
IF = 40 A, VGS = 0 V
trr
IRM(REC)
Qrr
ns
IF = 40 A,, di/dt = 100 A/ms
m
A
1.0
1.5
V
100
150
ns
5
8
A
0.25
0.6
mC
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
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Document Number: 72155
S-03534—Rev. A, 24-Mar-03
SUM40N15-38
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
80
80
6V
60
I D - Drain Current (A)
I D - Drain Current (A)
VGS = 10 thru 7 V
40
20
60
40
TC = 125_C
20
5V
25_C
- 55_C
0
0
0
2
4
6
8
10
0
VDS - Drain-to-Source Voltage (V)
1
2
3
4
5
6
7
VGS - Gate-to-Source Voltage (V)
Transconductance
On-Resistance vs. Drain Current
80
0.08
TC = - 55_C
r DS(on) - On-Resistance ( W )
g fs - Transconductance (S)
25_C
60
125_C
40
20
0
0.06
VGS = 6 V
VGS = 10 V
0.04
0.02
0.00
0
10
20
30
40
0
20
ID - Drain Current (A)
60
80
ID - Drain Current (A)
Capacitance
Gate Charge
20
V GS - Gate-to-Source Voltage (V)
4000
3200
C - Capacitance (pF)
40
Ciss
2400
1600
800
Crss
Coss
0
VDS = 75 V
ID = 40 A
16
12
8
4
0
0
25
50
75
100
125
VDS - Drain-to-Source Voltage (V)
Document Number: 72155
S-03534—Rev. A, 24-Mar-03
150
0
15
30
45
60
75
Qg - Total Gate Charge (nC)
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SUM40N15-38
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
2.7
VGS = 10 V
ID = 15 A
2.1
I S - Source Current (A)
r DS(on) - On-Resistance (W)
(Normalized)
2.4
100
1.8
1.5
1.2
0.9
TJ = 150_C
TJ = 25_C
10
0.6
0.3
- 50
- 25
0
25
50
75
100
125
150
1
0
175
0.3
TJ - Junction Temperature (_C)
0.6
0.9
1.2
VSD - Source-to-Drain Voltage (V)
Drain Source Breakdown vs.
Junction Temperature
195
V(BR)DSS (V)
185
ID = 1 mA
175
165
155
145
- 50
- 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (_C)
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Document Number: 72155
S-03534—Rev. A, 24-Mar-03
SUM40N15-38
New Product
Vishay Siliconix
THERMAL RATINGS
Maximum Avalanche and Drain Current
vs. Case Temperature
Safe Operating Area
1000
45
Limited
by rDS(on)
36
I D - Drain Current (A)
I D - Drain Current (A)
100
27
18
10 ms
100 ms
10
1 ms
10 ms
1
9
0
TC = 25_C
Single Pulse
dc, 100 ms
0.1
0
25
50
75
100
125
150
175
0.1
1
10
100
1000
VDS - Drain-to-Source Voltage (V)
TC - Ambient Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
10
Square Wave Pulse Duration (sec)
Document Number: 72155
S-03534—Rev. A, 24-Mar-03
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