FAIRCHILD FGH50T65UPD

FGH50T65UPD
650 V, 50 A Field Stop Trench IGBT
Features
• Maximum Junction Temperature : TJ = 175oC
General Description
• Positive Temperaure Co-efficient for easy Parallel Operating
Using innovative field stop trench IGBT technology, Fairchild®’s
new series of field stop trench IGBTs offer optimum performance for solar inverter, UPS, welder, and digital power generator where low conduction and switching losses are essential.
• High Current Capability
• Low Saturation Voltage: VCE(sat) = 1.65 V(Typ.) @ IC = 50 A
• 100% of Parts Tested ILM(2)
• High Input Impedance
Applications
• Tightened Parameter Distribution
• RoHS Compliant
• Solar Inverter, UPS, Welder, Digital Power Generator
• Short-circuit Ruggedness > 5us @25oC
• Telecom, ESS
E
C
C
G
G
COLLECTOR
(FLANGE)
E
Absolute Maximum Ratings
Symbol
Description
VCES
Collector to Emitter Voltage
VGES
Gate to Emitter Voltage
IC
ICM (1)
Collector Current
@ TC = 25oC
Collector Current
@ TC = 100oC
Unit
650
V
± 25
V
100
A
50
A
150
A
25oC
150
A
60
A
Pulsed Collector Current
ILM (2)
Clamped Inductive Load Current
@ TC =
IF
Diode Forward Current
@ TC = 25oC
Diode Forward Current
o
IFM(1)
Ratings
@ TC = 100 C
Pulsed Diode Maximum Forward Current
30
A
150
A
Maximum Power Dissipation
@ TC = 25oC
340
W
Maximum Power Dissipation
@ TC = 100oC
170
W
SCWT
Short Circuit Withstand Time
@ TC = 25oC
5
us
TJ
Operating Junction Temperature
-55 to +175
oC
Tstg
Storage Temperature Range
-55 to +175
o
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
PD
C
oC
300
Notes:
1: Repetitive rating: Pulse width limited by max. junction temperature
2: Ic = 150A, Vce = 400V, Rg = 10Ω
Thermal Characteristics
Typ.
Max.
Unit
RθJC(IGBT)
Symbol
Thermal Resistance, Junction to Case
Parameter
-
0.44
oC/W
RθJC(Diode)
Thermal Resistance, Junction to Case
-
1.2
o
C/W
RθJA
Thermal Resistance, Junction to Ambient
-
40
o
C/W
©2012 Fairchild Semiconductor Corporation
FGH50T65UPD Rev. C0
1
www.fairchildsemi.com
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
April 2013
Device Marking
Device
Package
FGH50T65UPD
FGH50T65UPD
TO-247
Eco Status
Packing Type
Qty per Tube
-
30ea
-
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Electrical Characteristics of the IGBT
Symbol
Parameter
TC = 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Unit
650
-
-
V
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage VGE = 0V, IC = 1mA
ΔBVCES
ΔTJ
Temperature Coefficient of Breakdown
Voltage
VGE = 0V, IC = 1mA
-
0.6
-
V/oC
ICES
Collector Cut-Off Current
VCE = VCES, VGE = 0V
-
-
250
μA
IGES
G-E Leakage Current
VGE = VGES, VCE = 0V
-
-
±400
nA
IC = 50mA, VCE = VGE
4.0
6.0
7.5
V
IC = 50A, VGE = 15V
-
1.65
2.3
V
IC = 50A, VGE = 15V,
TC = 175oC
-
2.1
-
V
-
3540
4710
pF
On Characteristics
VGE(th)
G-E Threshold Voltage
VCE(sat)
Collector to Emitter Saturation Voltage
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
VCE = 30V, VGE = 0V,
f = 1MHz
-
110
146
pF
-
60
90
pF
Switching Characteristics
td(on)
Turn-On Delay Time
-
32
41
ns
tr
Rise Time
-
59
77
ns
td(off)
Turn-Off Delay Time
-
160
208
ns
tf
Fall Time
-
22
29
ns
Eon
Turn-On Switching Loss
-
2.7
3.5
mJ
Eoff
Turn-Off Switching Loss
-
0.74
0.96
mJ
VCC = 400V, IC = 50A,
RG = 6.0Ω, VGE = 15V,
Inductive Load, TC = 25oC
Ets
Total Switching Loss
-
3.44
4.46
mJ
td(on)
Turn-On Delay Time
-
29
-
ns
tr
Rise Time
-
72
-
ns
td(off)
Turn-Off Delay Time
-
166
-
ns
tf
Fall Time
Eon
Turn-On Switching Loss
Eoff
Turn-Off Switching Loss
-
1.2
-
mJ
Ets
Total Switching Loss
-
4.7
-
mJ
TSC
Short Circuit Withstand Time
5
-
-
us
©2012 Fairchild Semiconductor Corporation
FGH50T65UPD Rev. C0
VCC = 400V, IC = 50A,
RG = 6.0Ω, VGE = 15V,
Inductive Load, TC = 175oC
VGE = 15V, VCC =400V,
RG = 10Ω
2
-
19
-
ns
-
3.5
-
mJ
www.fairchildsemi.com
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
Package Marking and Ordering Information
Symbol
Qg
Parameter
(Continued)
Test Conditions
Total Gate Charge
Qge
Gate to Emitter Charge
Qgc
Gate to Collector Charge
VCE = 400V, IC = 50A,
VGE = 15V
Electrical Characteristics of the Diode
Symbol
Parameter
VFM
Diode Forward Voltage
Erec
Reverse Recovery Energy
trr
Diode Reverse Recovery Time
Qrr
Diode Reverse Recovery Charge
©2012 Fairchild Semiconductor Corporation
FGH50T65UPD Rev. C0
Min.
Typ.
Max
Unit
-
230
345
nC
-
31
47
nC
-
130
195
nC
Unit
TC = 25°C unless otherwise noted
Test Conditions
IF = 30A
IF = 30A, dIF/dt = 200A/μs
3
Min.
Typ.
Max
TC = 25oC
-
2.1
2.7
TC = 175oC
-
1.78
-
TC = 175oC
-
46
-
TC =
25oC
V
uJ
-
41
53
TC = 175oC
-
144
-
TC = 25oC
-
76
106
TC = 175oC
-
486
-
ns
nC
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FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
Electrical Characteristics of the IGBT
Figure 1. Typical Output Characteristics
Figure 2. Typical Output Characteristics
150
20V
120
o
20V
12V
Collector Current, IC [A]
Collector Current, IC [A]
150
o
TC = 25 C
15V
90
60
10V
30
15V
TC = 175 C
120
12V
90
10V
60
30
VGE = 8V
VGE = 8V
0
0
2
4
6
Collector-Emitter Voltage, VCE [V]
0
8
0
Figure 3. Typical Saturation Voltage
Characteristics
150
Common Emitter
VCE = 20V
120
Collector Current, IC [A]
Common Emitter
VGE = 15V
Collector Current, IC [A]
8
Figure 4. Transfer Characteristics
150
o
TC = 25 C
o
TC = 175 C
90
60
o
120 TC = 25 C
o
TC = 175 C
90
60
30
30
0
0
0
1
2
3
Collector-Emitter Voltage, VCE [V]
3
4
Figure 5. Saturation Voltage vs. Case
Temperature at Variant Current Level
20
Collector-Emitter Voltage, VCE [V]
Common Emitter
VGE = 15V
100A
3
50A
2
IC = 25A
1
25
6
9
12
Gate-Emitter Voltage,VGE [V]
FGH50T65UPD Rev. C0
4
Common Emitter
o
TC = -40 C
16
12
8
50A
100A
4
IC = 25A
0
50
75
100
125
150
175
o
Collector-EmitterCase Temperature, TC [ C]
©2012 Fairchild Semiconductor Corporation
15
Figure 6. Saturation Voltage vs. VGE
4
Collector-Emitter Voltage, VCE [V]
2
4
6
Collector-Emitter Voltage, VCE [V]
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
www.fairchildsemi.com
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
Figure 8. Saturation Voltage vs. VGE
20
20
Common Emitter
o
TC = 25 C
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
Common Emitter
16
12
8
50A
100A
4
IC = 25A
0
o
TC = 175 C
16
12
8
50A
100A
4
IC = 25A
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
4
20
Figure 9. Capacitance Characteristics
8
12
16
Gate-Emitter Voltage, VGE [V]
20
Figure 10. Gate charge Characteristics
15
30000
Common Emitter
Gate-Emitter Voltage, VGE [V]
Capacitance [pF]
1000
Coes
Common Emitter
VGE = 0V, f = 1MHz
100
o
TC = 25 C
12
300V
VCC = 400V
9
6
3
Cres
TC = 25 C
0
30
1
10
Collector-Emitter Voltage, VCE [V]
0
30
Figure 11. SOA Characteristics
250
10μs
tr
100
Switching Time [ns]
100μs
1ms
10 ms
DC
10
1
*Notes:
o
1. TC = 25 C
td(on)
Common Emitter
VCC = 400V, VGE = 15V
IC = 50A
10
o
TC = 25 C
o
2. TJ = 175 C
3. Single Pulse
0.01
0.1
100
150
200
Gate Charge, Qg [nC]
1000
100
0.1
50
Figure 12. Turn-on Characteristics vs.
Gate Resistance
1000
Collector Current, Ic [A]
200V
o
Cies
1
10
100
Collector-Emitter Voltage, VCE [V]
©2012 Fairchild Semiconductor Corporation
FGH50T65UPD Rev. C0
o
TC = 175 C
1
1000
0
5
10
20
30
40
Gate Resistance, RG [Ω]
50
www.fairchildsemi.com
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
Typical Performance Characteristics
Figure 13. Turn-off Characteristics vs.
Gate Resistance
Figure 14. Turn-on Characteristics vs.
Collector Current
1000
10000
tr
Switching Time [ns]
Switching Time [ns]
1000
td(off)
100
tf
Common Emitter
VCC = 400V, VGE = 15V
IC = 50A
10
100
td(on)
10
Common Emitter
VGE = 15V, RG = 6Ω,Vcc = 400V
o
TC = 25 C
o
TC = 25 C
o
TC = 175 C
o
TC = 175 C
1
0
10
20
30
Gate Resistance, RG [Ω]
40
1
20
50
40
60
80
100
Collector Current, IC [A]
Figure 15. Turn-off Characteristics vs.
Collector Current
Figure 16. Switching Loss vs.
Gate Resistance
1000
10000
Eon
Switching Loss [uJ]
Switching Time [ns]
td(off)
100
10
tf
Common Emitter
VGE = 15V, RG = 6Ω, Vcc = 400V
Eoff
1000
Common Emitter
VCC = 400V, VGE = 15V
IC = 50A
o
TC = 25 C
o
TC = 25 C
o
TC = 175 C
o
TC = 175 C
1
20
100
40
60
80
100
0
Collector Current, IC [A]
Figure 17. Switching Loss vs.
Collector Current
3
10
Collector Current, IC [A]
Switching Loss [uJ]
100
Eon
4
10
Eoff
Common Emitter
VGE = 15V, RG = 6Ω
2
10
o
TC = 25 C
10
Safe Operating Area
o
o
TC = 175 C
VGE = 15V, TC = 175 C
1
1
40
60
80
1
100
©2012 Fairchild Semiconductor Corporation
10
100
1000
Collector-Emitter Voltage, VCE [V]
Collector Current, IC [A]
FGH50T65UPD Rev. C0
50
300
5
20
20
30
40
Gate Resistance, RG [Ω]
Figure 18. Turn off Switching
SOA Characteristics
10
10
10
6
www.fairchildsemi.com
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
Typical Performance Characteristics
Figure 19. Current Derating
Figure 20. Load Current Vs. Frequence
120
150
VCC = 400V
load Current : peak of square wave
120
Collector Current, IC A]
Collector Current, Ic [A]
100
80
60
40
20
o
TC = 100 C
90
60
Duty cycle : 50%
30
o
T = 100 C
C
Powe Dissipation = 170 W
0
0
25
50
75 100 125 150
o
Case temperature, TC [ C]
175
0
1k
200
10k
100k
1M
Switching Frequency, f [Hz]
Figure 21. Forward Characteristics
Figure 22. Reverse Recovery Current
200
10
Reverse Recovery Currnet, Irr [A]
o
Forward Current, IF [A]
100
o
TC = 175 C
o
TC = 75 C
10
o
TC = 25 C
TC = 25 C
o
TC = 175 C
8
200A/μs
6
di/dt = 100A/μs
200A/μs
4
di/dt = 100A/μs
2
0
0
0.5
1.0
1.5
2.0
Forward Voltage, VF [V]
2.5
3.0
0
Figure 23. Stored Charge
20
30
IC [A]
40
50
60
Figure 24. Reverse Recovery Time
600
250
o
o
TC = 25 C
Reverse Recovery Time, trr [ns]
Stored Recovery Charge, Qrr [nC]
10
o
500
TC = 175 C
200A/μs
400
300
di/dt = 100A/μs
200
200A/μs
100
di/dt = 100A/μs
0
0
10
20
30
40
Forwad Current, IF [A]
©2012 Fairchild Semiconductor Corporation
FGH50T65UPD Rev. C0
50
TC = 25 C
o
TC = 175 C
200
100A/μs
150
di/dt = 200A/μs
100
100A/μs
50
di/dt = 200A/μs
0
60
0
10
20
30
40
50
60
Forward Current, IF [A]
7
www.fairchildsemi.com
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
Typical Performance Characteristics
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
Typical Performance Characteristics
Figure 25. Transient Thermal Impedance of IGBT
Thermal Response [Zthjc]
1
0.5
0.1
0.01
0.2
0.1
0.05
0.02
0.01
single pulse
PDM
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
1E-5
1E-4
1E-3
0.01
0.1
1
Rectangular Pulse Duration [sec]
Figure 26.Transient Thermal Impedance of Diode
Thermal Response [Zthjc]
10
1
0.5
0.2
0.1
0.1
0.05
0.02
0.01
single pulse
0.01
1E-5
1E-4
PDM
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
0.01
0.1
1
Rectangular Pulse Duration [sec]
©2012 Fairchild Semiconductor Corporation
FGH50T65UPD Rev. C0
8
www.fairchildsemi.com
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
Mechanical Dimensions
TO - 247A03
©2012 Fairchild Semiconductor Corporation
FGH50T65UPD Rev. C0
9
www.fairchildsemi.com
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY
THEREIN, WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2.
A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
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Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
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proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative / In Design
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Preliminary
First Production
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
No Identification Needed
Full Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
Obsolete
Not In Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I64
©2012 Fairchild Semiconductor Corporation
FGH50T65UPD Rev. C0
10
www.fairchildsemi.com
FGH50T65UPD 650 V 50 A Field Stop Trench IGBT
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