4 Pole (2 FORM C+ 2 FORM A) Signal Relay for Central Switching/ Data Transmission FTR-B2 SERIES D n Features IS RoHS compliant 4 POLE MINIATURE RELAY Mounting space of 175mm2 with 4 pole relay, suitable for high density mounting. l SAFETY STANDARD - UL/CSA recognized - Conforms to Bellcore specification & FCC part 68 - Conforms to IEC 60950 / UL1950 / EN60950 spacing and high breakdown voltage Clearance: 1.0mm Creepage: 1.6mm l HIGH RELIABILITY Bifurcated gold overlay silver alloy l HIGH HEAT RESISTANCE, FLAMMABILITY Flammability grade of 94V-0 materials employed l AIR TIGHT CONSTRUCTION Air tight construction allows high resistance to various environments and to clean the relay l SMT VERSION Surface mount type available on request l RoHS compliant since date code: 0430B8 Please see page 7 for more information l C O N TI N U ED nORDERING INFORMATION [Example] FTR-B2 M A 012 Z – ** (a) ( b)(c) (d) (e) (f ) Remarks: Actual marking on relay would not carry code FTR and be as below: Ordering code Actual marking FTR-B2MA012Z → B2MA012Z FTR-B2 Series nSAFETY STANDARD AND FILE NUMBERS UL508, 1950 (File No. E63615) C22.2 No. 14, No. 950 (File No. LR40304) Please request when the approval markings are required on the cover. Nominal voltage 4.5 to 12 VDC D Clearance 0.2 A 125 VAC 1 A 30 VDC 0.3 A 110 VDC IS resistive Creepage C 1.0mm coil a- contacts Contact rating Remarks - working voltage: 150V - relay inside and outside - pollution degree "2" 1.6mm coil - contacts n COIL DATA CHART O MODEL FTR-F2 Ser i es FTR-H2 Ser i es FTR-F2AK005T FTR-F2AK006T FTR-F2AK009T FTR-F2AK012T FTR-F2AK024T FTR-F2AK048T FTR-H2AK005T FTR-H2AK006T FTR-H2AK009T FTR-H2AK012T FTR-H2AK024T FTR-H2AK048T N TI No m i n al V o l t ag e 5VDC 6VDC 9VDC 12VDC 24VDC 48VDC N Co i l Res i s t an c e (± 10%) Mu s t Op er at e Vo l t ag e Mu s t Rel eas e V o l t ag e 47 Ω 68 Ω 155 Ω 3.5VDC 4.2VDC 6.3VDC 8.4VDC 16.8VDC 33.6VDC 0.25VDC 0.3VDC 0.45VDC 0.6VDC 1.2VDC 2.4VDC U ED 27 0 Ω 1,200 Ω 4,400 Ω FTR-B2 Series n specifications It em FTR-B 2 Ser i es Contact D Arrangement 2 Form C + 2 Form A Material Gold overlay Silver alloy Resistance (initial) Maximum 75mΩ (at 1A 6VDC) IS Time Value Rating (resistive) 30VDC 1A / 125VAC 0.2A Maximum Switching Power 30W / 25VA Maximum Switching Voltage 110VDC / 125VAC Maximum Switching Current 1A Maximum Carrying Current 1.25A C O N TI Operate Time (at nominal voltage) Maximum 10ms Release Time (at nominal voltage) Maximum 5ms Coil Operating Temperature Insulation Resistance (at 500VDC) Dielectric Strength Life Vibration Shock Weight N -40° C to +85° C (no frost) U Minimum 1,000 MΩ ED 750 VAC 1 Min. (open contacts) 500 VAC 1 Min. (adjacent contacts) 1,500 VAC 1 Min. (coil-contacts) Mechanical 10 x 106 operations minimum Electrical 50 x 103 operations minimum at 30VDC 1A 100 x 103 operations minimum at 125VDC 0.2A Misoperation 10-55 Hz (double amplitude of 1.5mm) Endurance 10-55 Hz (double amplitude of 1.5mm) Misoperation 100m/s2 (11±1ms) Endurance 500m/s2 (6±1ms) Approximately 3.9g FTR-B2 Series nCHARACTERISTIC DATA Time (ms) 8 D 6 4 2 0 Operation time IS Release 0 0.2 0.4 C tac n Co 20 DC Resistive arr tc Co 0 nta N AC Resistive ct 10 30 50 in rry 0A nt: rre u gc 0.4 0.6 0.8 TI N 50 30 20 10 2.4 2.2 Co 2.0 nta 1.8 Co nta ct ct c 1.6 1.4 1.2 ca rry in gc arr y ing cur r urr en t: 0 ent : A 1A Operating Voltage (hot coil) 1.0 0.8 Operating Voltage (cool coil) 0.6 0 20 40 60 80 100 Ambient Temperature (°C) U 0.2 0.4 ED 30 VDC Resistive 125 VAC Resistive 0 100 200 (maximum applied voltage, operating voltage characteristics) Life Curve 5 5 gc ca 0.2 100 0.2 1 yin e urr nt: 1A Coil Power (W) 1 0.1 40 Operation (x104) Contact Current (A) 3 0.5 0.4 0.3 60 0.8 Maximum Switching Power 2 80 O 0.6 Coil Power (W) Ambient Temperature Coil Temperature Rise Nominal Voltage Multiplying Factor (%) 10 Coil Temperature Rise (°C) Operation (return time characteristics) 0.6 0.8 1.0 1.2 Contact Current (A) Contact Voltage (V) nREFERENCE DATA Distribution of Operate and Release Voltage 80 60 40 20 100 Maximum Switching Power 3 FTR-B2MA4.5Z n=100 Operate Release 80 Contact Current (A) FTR-B2MA4.5Z n=100 Operate Release Distribution (%) Distribution (%) 100 Distribution of Operate and Release Time 60 40 20 0 10 20 30 40 50 60 70 80 90 100 Nominal Voltage Multiplying Factor (%) 1 0.5 0.4 0.3 1 2 3 4 Time (ms) 5 6 AC Resistive 0.2 0.1 0 DC Resistive 2 1 5 10 30 50 100 200 Contact Voltage (V) FTR-B2 Series D 1.0 Initial1 Release Voltage FBR-B2MA4.5Z n=10 1200 operations/min. IS 5 10 C Make Break 50 100 Operation (x104) nDIMENSIONS l Dimensions Through hole type O 500 1000 N 4.0 Operating Voltage 3.0 2.0 Release Voltage 1.0 FBR-B2MA4.5Z n=10 30 operations/min. 125 VAC 0.2A (resistive load) 0 500 200 100 50 20 10 5 2 Make Break Initial TI 10 Operation (x104) N l Schematics (BOTTOM VIEW) U Nominal Voltage Multiplying Factor (%) 2.0 Electrical Life Test Contact Resistance (m‰) Operating Voltage 3.0 0 500 200 100 50 20 10 5 2 Nominal Voltage Multiplying Factor (%) Mechanical Life Test 4.0 Contact Resistance (m‰) Contact Nominal Voltage Resistance (m‰) Multiplying Factor (%) nREFERENCE DATA ED Electrical Life Test 4.0 Operating Voltage 3.0 2.0 Release Voltage 1.0 FBR-B2MA4.5Z n=10 30 operations/min. 30 VDC 1A (resistive load) 0 500 200 100 50 20 10 5 2 Make Break Initial 5 Operation (x104) l PC board mounting hole layout (BOTTOM VIEW) Orientation mark l Dimensions Surface mount type l Schematics (TOP VIEW) l PC board mounting hole layout (TOP VIEW) Orientation mark FTR-B2 Series nRECOMMENDED CONDITION (Temperature Profile) VPS(Vapor Phase Soldering) soldering T3 T2 T3 = 245C max. T 2 =200Cmax. cooling T =165Cmax. D preheating T IS 0 C 120secmaximum Temperature (C) Temperature (C) IRS (Infrared Reflow Soldering) 25C maximum soldering T3 cooling T2 preheating T 30sec Max. 0 O T3 =200Cmaximum T 2 =165Cmaximum T =100Cmaximum 60secMax. 60secMax. 90secMax. Note: 1.Temperature profiles show the temperature of PC board surface. 2.Please perform soldering test with your actual PC board before mass production, since the temperatures of PC board surfaces vary according to the size of PC board, status of parts mounting and heating method. N Tape dimensions ø 1.55 ø 2.2 2 4 N U ED 0.4 17.9 32 28.4 14.2 16 TI 1.75 nPACKAGING 10.7 11.7 Tape feeding ø 380 Reel Dimensions Top cover tape Embossed carrying tape Perforation Parts box ø 13 Dimensions: mm General tolerance: ±0.2 Quantity of one reel: 250 pieces FTR-B2 Series RoHS Compliance and Lead Free Relay Information 1. General Information Relays produced after the specific date code that is indicated on each data sheet are lead-free now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info. (http://www.fcai.fujitsu.com/pdf/LeadFreeLetter.pdf) l Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward Sn-3.0Cu-Ni will be used for FTRB3 and FTR-B4 series relays. lMost signal and some power relays also comply with RoHS. Please refer to individual data sheets. Relays that are RoHS compliant do not contain the 6 hazardous materials that are restricted by RoHS directive (lead, mercury, cadmium, chromium IV, PBB, PBDE). l It has been verified that using lead-free relays in leaded assembly process will not cause any problems (compatible). l“LF” is marked on each outer and inner carton. (No marking on individual relays). lTo avoid leaded relays (for lead-free sample, etc.) please consult with area sales office. We will ship leaded relays as long as the leaded relay inventory exists. l D IS C O N 2. Recommended Lead Free Solder Profile Recommended solder paste Sn-3.0Ag-0.5Cu and Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from February 2005) l Reflow Solder condtion TI N Peak Temp.:max.250C Temperature ( C) 250 220 Pre-heating 170 U Soldering ED Cooling Flow Solder condtion: Pre-heating: Soldering: maximum 120˚C dip within 5 sec. at 260˚C solder bath Solder by Soldering Iron: Soldering Iron Temperature: maximum 360˚C Duration: maximum 3 sec. 130 30 90~120sec. max.120sec. 20~30sec. (duration) We highly recommend that you confirm your actual solder conditions 3. Moisture Sensitivity Moisture Sensitivity Level standard is not applicable to electromechanical realys. l 4. Tin Whisker SnAgCu solder is known as low riskof tin whisker. No considerable length whisker was found by our in-house test. l FTR-B2 Series Fujitsu Components International Headquarter Offices Japan Fujitsu Component Limited Gotanda-Chuo Building 3-5, Higashigotanda 2-chome, Shinagawa-ku Tokyo 141, Japan Tel: (81-3) 5449-7010 Fax: (81-3) 5449-2626 Email: [email protected] Web: www.fcl.fujitsu.com Europe Fujitsu Components Europe B.V. Diamantlaan 25 2132 WV Hoofddorp Netherlands Tel: (31-23) 5560910 Fax: (31-23) 5560950 Email: [email protected] Web: http://www.fujitsu.com/emea/services/components/ North and South America Fujitsu Components America, Inc. 250 E. Caribbean Drive Sunnyvale, CA 94089 U.S.A. Tel: (1-408) 745-4900 Fax: (1-408) 745-4970 Email: [email protected] Web: http://www.fujitsu.com/us/services/edevices/components/ Asia Pacific Fujitsu Components Asia Ltd. 102E Pasir Panjang Road #04-01 Citilink Warehouse Complex Singapore 118529 Tel: (65) 6375-8560 Fax: (65) 6273-3021 Email: [email protected] Web: http://www.fujitsu.com/sg/services/micro/components/ D IS C O ©2006 Fujitsu Components America, Inc. All rights reserved. All trademarks or registered trademarks are the property off their respective owners. Fujitsu Components America does not warrant that the content of datasheet is error free. In a continuing effort to improve our products Fujitsu Components America, Inc. reserves the right to change specifications/datasheets without prior notice. Rev. 03/21/2006. N TI N U ED