ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Order this document by MRF373/D SEMICONDUCTOR TECHNICAL DATA The RF MOSFET Line N–Channel Enhancement–Mode Lateral MOSFETs Designed for broadband commercial and industrial applications with frequencies from 470 – 860 MHz. The high gain and broadband performance of these devices make them ideal for large–signal, common source amplifier applications in 28 volt transmitter equipment. 470 – 860 MHz, 60 W, 28 V LATERAL N–CHANNEL BROADBAND RF POWER MOSFETS • Guaranteed CW Performance at 860 MHz, 28 Volts, Narrowband Fixture Output Power – 60 Watts Power Gain – 13 dB Efficiency – 50% • Typical Performance at 860 MHz, 28 Volts, Broadband Push–Pull Fixture Output Power – 100 Watts (PEP) Power Gain – 11.2 dB Efficiency – 40% IMD – –30 dBc • Excellent Thermal Stability CASE 360B–05, STYLE 1 NI–360 MRF373R1 ARCHIVED 2005 • 100% Tested for Load Mismatch Stress at All Phase Angles with 5:1 VSWR @ 28 Vdc, 860 MHz, 60 Watts CW • In Tape and Reel. R1 = 500 units per 32 mm, 13 inch Reel. CASE 360C–05, STYLE 1 NI–360S MRF373SR1 MAXIMUM RATINGS Rating Symbol Value Unit Drain–Source Voltage VDSS 65 Vdc Gate–Source Voltage VGS ±20 Vdc ID 7 Adc PD 173 1.33 W W/°C Storage Temperature Range Tstg – 65 to +150 °C Operating Junction Temperature TJ 200 °C Drain Current – Continuous Total Device Dissipation @ TC = 25°C Derate above 25°C MRF373SR1 THERMAL CHARACTERISTICS Symbol Max Unit Thermal Resistance, Junction to Case Characteristic MRF373SR1 RθJC 0.75 °C/W Thermal Resistance, Junction to Case MRF373R1 RθJC 1 °C/W NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed. REV 6 MOTOROLA RF DEVICE DATA Motorola, Inc. 2002 MRF373R1 MRF373SR1 1 Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit V(BR)DSS 65 – – Vdc Zero Gate Voltage Drain Current (VDS = 28 Vdc, VGS = 0 Vdc) IDSS – – 1 µAdc Gate–Source Leakage Current (VGS = 20 Vdc, VDS = 0 Vdc) IGSS – – 1 µAdc Gate Threshold Voltage (VDS = 10 V, ID = 200 µA) VGS(th) 2 3 4 Vdc Gate Quiescent Voltage (VDS = 28 V, ID = 100 mA) VGS(Q) 3 4 5 Vdc Drain–Source On–Voltage (VGS = 10 V, ID = 3 A) VDS(on) – 0.6 0.8 Vdc Forward Transconductance (VDS = 10 V, ID = 3 A) gfs 2.2 2.9 – S Input Capacitance (VDS = 28 V, VGS = 0, f = 1 MHz) Ciss – 79 – pF Output Capacitance (VDS = 28 V, VGS = 0, f = 1 MHz) Coss – 46 – pF Reverse Transfer Capacitance (VDS = 28 V, VGS = 0, f = 1 MHz) Crss – 4 – pF Common Source Power Gain (VDD = 28 V, Pout = 60 W, IDQ = 200 mA, f = 860 MHz) Gps 13 14.7 – dB Drain Efficiency (VDD = 28 V, Pout = 60 W, IDQ = 200 mA, f = 860 MHz) η 50 54 – % Load Mismatch (VDD = 28 V, Pout = 60 W, IDQ = 200 mA, f = 860 MHz, Load VSWR at 5:1 at All Phase Angles) ψ OFF CHARACTERISTICS Drain–Source Breakdown Voltage (VGS = 0 Vdc, ID =1 µA) ON CHARACTERISTICS ARCHIVED 2005 DYNAMIC CHARACTERISTICS FUNCTIONAL CHARACTERISTICS, CW Operation No Degradation in Output Power TYPICAL CHARACTERISTICS, 2 Tone Operation, Push Pull Configuration (MRF373SR1), Broadband Fixture Common Source Power Gain (VDD = 28 Vdc, Pout = 100 W PEP, IDQ = 400 mA, f1 = 860.0 MHz, f2 = 866 MHz) Gps – 11.2 – dB Drain Efficiency (VDD = 28 Vdc, Pout = 100 W PEP, IDQ = 400 mA, f1 = 860.0 MHz, f2 = 866 MHz) η – 40 – % Third Order Intermodulation Distortion (VDD = 28 Vdc, Pout = 100 W PEP, IDQ = 400 mA, f1 = 860.0 MHz, f2 = 866 MHz) IMD – –30 – dBc MRF373R1 MRF373SR1 2 MOTOROLA RF DEVICE DATA Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 ARCHIVED 2005 C1 C2 C3 C4, C5, C6 C7, C8 C9 C10, C13 C11 C12 C14 C15 L1 R1 R2 4.7 pF, B Case Chip Capacitor, ATC 15 pF, B Case Chip Capacitor, ATC 6.8 pF, B Case Chip Capacitor, ATC 10 pF, B Case Chip Capacitor, ATC 47 pF, B Case Chip Capacitor, ATC 0.2 pF, B Case Chip Capacitor, ATC 300 pF, B Case Chip Capacitor, ATC, Side Mounted 2) 2.2 mF, 50 V, Kemet P/N C1825C225 22 mF, 50 V, Kemet P/N T491D226K50AS 2) 1.0 mF, 50 V, Kemet P/N C1825C105 10 mF, 35 V, Kemet P/N T491D106K35AS 22 nH, Coilcraft P/N B07T 1.2 kΩ, Vishay Dale Chip Resistor (1206) 12 kΩ, Vishay Dale Chip Resistor (1206) Connectors N–Type (female), M/A Com P/N 3052–1648–10 PCB MRF373 Printed Circuit Board Rev 01, CuClad 250 (GX–0300–55), height 30 mils, εr = 2.55 Heatsink Motorola P/N 95–11LDMOSKPS–1 LDMOS m250 3″ x 5″ Bedstead Insert Motorola P/N 95–11LDMOSKPS–2 Insert for LDMOS m250 3″ x 5″ Bedstead End Plates 2) Motorola P/N 93–3MB–9, End Plate for Type–N Connector Banana Jack and Nut 2) Johnson P/N 108–0904–001 Brass Banana Jack 2) H.H. Smith P/N SM–101 Figure 1. Single–Ended Narrowband Test Circuit Schematic (MRF373R1) MRF373 Figure 2. Single–Ended Narrowband Test Circuit Layout (Suitable for Use with MRF373R1) MOTOROLA RF DEVICE DATA MRF373R1 MRF373SR1 3 Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Figure 3. MRF373R1 Narrowband Test Fixture Photo ARCHIVED 2005 C1, C2 C3 C4, C11 C5, C10 C6 C7 C8 C9 C20, C23 C21 C24 C22 C25 L1 R1 R2 18 pF, B Case Chip Capacitor, ATC 12 pF, B Case Chip Capacitor, ATC 0.8 pF, B Case Chip Capacitor, ATC 68 pF, B Case Chip Capacitor, ATC 0.3 pF, B Case Chip Capacitor, ATC 15 pF, B Case Chip Capacitor, ATC 10 pF, B Case Chip Capacitor, ATC 1.8 pF, B Case Chip Capacitor, ATC 300 pF, B Case Chip Capacitor, ATC, Side Mounted 2) 2.2 mF, 100 V, Vishay P/N VJ3640Y225KXBAT 2) 1.0 mF, 50 V, Kemet P/N C1825C105 22 mF, 35 V, Kemet P/N T491D226K35AS 10 mF, 35 V, Kemet P/N T491D106K35AS 22 nH, Coilcraft P/N B07T 1.2 kΩ, Vishay Dale Chip Resistor (1206) 12 kΩ, Vishay Dale Chip Resistor (1206) Connectors N–Type (female), M/A Com P/N 3052–1648–10 PCB MRF373 Printed Circuit Board Rev 01, CuClad 250 (GX–0300–55), height 30 mils, εr = 2.55 (new PCB’s available from CMR) Heatsink Motorola P/N 95–11LDMOSKPS–1 LDMOS m250 3″ x 5″ Bedstead Insert Motorola P/N 95–11LDMOSKPS–2S Insert for LDMOS m250S 3″ x 5″ Bedstead End Plates 2) Motorola P/N 93–3MB–9, End Plate for Type–N Connector Banana Jack and Nut 2) Johnson P/N 108–0904–001 Brass Banana Jack 2) H.H. Smith P/N SM–101 Figure 4. Single–Ended Narrowband Test Circuit Schematic (MRF373SR1) MRF373R1 MRF373SR1 4 MOTOROLA RF DEVICE DATA Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 MRF373S ARCHIVED 2005 Figure 5. Single–Ended Narrowband Test Circuit Layout (Suitable for Use with MRF373SR1) Figure 6. MRF373SR1 Narrowband Test Circuit Photo MOTOROLA RF DEVICE DATA MRF373R1 MRF373SR1 5 Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 TYPICAL CHARACTERISTICS FOR MRF373R1 IN SINGLE–ENDED FIXTURE 3 . 3 012 / 3 - - - - - ')* + !,-" η 3 / 3 - ')* 3 + !+" $#+##!," # # ##!," $#+##!," $ Figure 7. Power Gain versus Output Power . / !012" η ###!4" Figure 8. Performance in Narrowband Circuit ARCHIVED 2005 # #!$" %&& '&& (&& ! " Figure 9. Capacitance versus Voltage Table 1. Common Source S–Parameters (VDS = 28 V, ID = 2.0 A) S11 S21 S12 S22 f MHz |S11| ∠φ |S21| ∠φ |S12| ∠φ |S22| ∠φ 400 0.921 182 2.23 52 0.009 39 0.824 184 450 0.922 181 1.95 49 0.009 53 0.832 184 500 0.924 180 1.70 46 0.010 64 0.841 184 550 0.926 179 1.49 42 0.011 72 0.851 183 600 0.929 178 1.31 38 0.013 78 0.860 183 650 0.932 177 1.16 35 0.015 81 0.870 182 700 0.936 176 1.03 31 0.017 82 0.881 182 750 0.940 176 0.93 28 0.019 82 0.892 181 800 0.945 175 0.84 26 0.021 82 0.904 180 850 0.951 174 0.78 24 0.023 80 0.917 180 900 0.957 173 0.72 24 0.025 78 0.929 179 MRF373R1 MRF373SR1 6 MOTOROLA RF DEVICE DATA Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 MRF373S ARCHIVED 2005 Vertical Balun Mounting Detail )*$)* !> '9- -%:('&*(%$" 0'*'('86 7(*%:68 012 68)< '=7(& ! -%8 *9%:;" )*$)* !> '9- -%:('&*(%$" )5&*(6*7 ! -%8 *9%:;" '*7? (%- 68)< &' *96* 6 -%8 @*65A .%*& %<*' *97 -6%< @&8'*A (7&)8*%<= %< 68)< &'8,7( $6,& 57%<= 87B78 C%*9 *97 &)5&*(6*7 &'8,7( $6,& C97< .)88D %<&7(*7,> <$)* ! '9- -%:('&*(%$" (')<, -%8 &8'* :)* ')* *' 6::7$* 68)< Figure 10. MRF373SR1 Broadband Push–Pull Component Layout MOTOROLA RF DEVICE DATA MRF373R1 MRF373SR1 7 Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Table 2. MRF373SR1 Broadband Push–Pull Application Parts List Designation Description 1.0 pF, AVX, P12101J1R0BBT C2, C4, C10 10 pF, AVX, P12101J100GBT C3A, B 120 pF, 300 V, AVX, AQ149M121JAJBE C5, C6, C9 12 pF, AVX, P12101J120GBT C7, C8 18 pF, AVX, P12101J180GBT C11 6.8 pF, AVX, P12101J6R8BBT C12 4.7 pF, AVX, P12101J4R7BBT C13, C18A, B 3.3 pF, AVX, P12101J3R3BBT C14A, B 100 pF, 500 V, AVX, AQ147M101JAJBE C15 2.7 pF, AVX, P12101J2R7BBT C16A, B 3.3 mF, 100 V, Vitramon P/N VJ3640Y335KXBAT C17A, B, C19A, B 22 mF, 35 V, Kemet P/N T491D226K35AS L1A, B, L3A, B, L4, L5 8.0 nH, Coilcraft P/N A03T L2, L6 12.5 nH, Coilcraft P/N A04T R1A, B 22 Ω, Vishay Dale Chip Resistor, 1/4 W (1206) R2A, B 10 Ω, Vishay Dale Chip Resistor, 1/4 W (1206) R3 390 Ω, Vishay Dale Chip Resistor (1206) R4 2.4 kΩ, Vishay Dale Chip Resistor (1206) R5T 470 Ω Thermistor, KOA SPEER MOT P/N 0680149M01 PCB MRF373 PP Printed Circuit Board Rev 2C, Rogers RO4350, Height 30 mils, ε( = 3.48 Balun A, B Vertical 660 MHz Broadband Balun, Printed Circuit Board Rev 01, Rogers RO3010, Height 50 mils, ε( = 10.2 ARCHIVED 2005 C1 MRF373R1 MRF373SR1 8 MOTOROLA RF DEVICE DATA Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 3 ,: D/ 3 012 / 3 - $7( &%,7 012 012 012 012 012 012 3 ,: D/ 3 012 / 3 - $7( &%,7 $&#+##!," 0# 0 # #!,:" TYPICAL TWO–TONE BROADBAND CHARACTERISTICS ')* + !+ " Figure 11. Intermodulation Distortion versus Output Power (MRF373S Broadband Push–Pull Fixture) ')* + !+ " Figure 12. Broadband Power Gain versus Output Power (MRF373S Broadband Push–Pull Fixture) η ###!4" ARCHIVED 2005 3 ,: D/ 3 012 / 3 - $7( &%,7 012 012 012 ')* + !+ " Figure 13. Efficiency versus Output Power (MRF373S Broadband Push–Pull Fixture) MOTOROLA RF DEVICE DATA MRF373R1 MRF373SR1 9 Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 ARCHIVED 2005 NOTES MRF373R1 MRF373SR1 10 MOTOROLA RF DEVICE DATA Archived 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 PACKAGE DIMENSIONS Q 666 2X G B 0 0 0 ? > 0 0 >0> > 0? 1> > 0 1 0 > !>" + 0 E > 1 3 B 2 (FLANGE) 2X D 555 0 2X 0 R K (LID) 0 ::: 0 0 0 F H ::: N (LID) 0 0 0 S C E (INSULATOR) 666 555 M 0 0 (INSULATOR) A ARCHIVED 2005 0 SEATING PLANE T A 0 0 0 DIM A B C D E F G H K M N Q R S aaa bbb ccc ? > > > CASE 360B–05 ISSUE F NI–360 MRF373R1 (FLANGE) B ? > 0 0 >0> > 0? 1> > 0 1 0 > !>" + 0 E > 1 2 B (FLANGE) 2X 2X K 0 D 555 0 0 R (LID) ::: 0 0 0 F H N (LID) ::: 0 0 0 S (INSULATOR) E C T M SEATING PLANE (INSULATOR) 555 0 MILLIMETERS MIN MAX > > > > > > > > > > > > ># > > > > > > > > > > > > > > ># ># ># A A PIN 3 INCHES MIN MAX > > > > > > > > > > > > ># > > > > > > > > > > > > > > ># ># ># 0 0 MOTOROLA RF DEVICE DATA 666 0 0 0 DIM A B C D E F H K M N R S aaa bbb ccc INCHES MIN MAX > > > > > > > > > > > > > > > > > > > > > > > > ># ># ># MILLIMETERS MIN MAX > > > > > > > > > > > > > > > > > > > > > > > > ># ># ># ? > > > CASE 360C–05 ISSUE D NI–360S MRF373SR1 MRF373R1 MRF373SR1 11 Archived 2005 ARCHIVED 2005 ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Motorola reserves the right to make changes without further notice to any products herein. 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All other product or service names are the property of their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan. 81–3–3440–3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T. Hong Kong. 852–26668334 Technical Information Center: 1–800–521–6274 HOME PAGE: http://www.motorola.com/semiconductors/ MRF373R1 MRF373SR1 12 ◊ MOTOROLA RF DEVICE DATA MRF373/D Archived 2005