TI PCA9557PWR

PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
REMOTE 8-BIT I2C AND SMBus LOW-POWER I/O EXPANDER
WITH RESET AND CONFIGURATION REGISTERS
FEATURES
1
•
•
•
•
•
•
•
•
•
RGV PACKAGE
(TOP VIEW)
14
13
12
11
10
9
RESET
RGY PACKAGE
(TOP VIEW)
16 15 14 13
A0
A1
A2
P0
1
2
3
12
11
10
9
4
5
6
7
8
P7
P6
P5
P4
SDA
A0
A1
A2
P0
P1
2
3
4
5
6
7
1
16 15
14
13
12
11
9 10
8
GND
RESET
P7
P6
P5
P4
P3
P2
P3
6
7
8
VCC
15
P2
4
5
16
GND
1
2
3
P1
SCL
SDA
A0
A1
A2
P0
P1
GND
SDA
SCL
VCC
D, DB, DGV, OR PW PACKAGE
(TOP VIEW)
VCC
•
•
•
Internal Power-On Reset
High-Impedance Open Drain on P0
Power Up With All Channels Configured as
Inputs
No Glitch on Power Up
Noise Filter on SCL/SDA Inputs
Latched Outputs With High Current Drive
Maximum Capability for Directly Driving LEDs
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
RESET
P7
P6
P5
P4
P3
P2
•
•
•
•
•
Low Standby Current Consumption of
1 µA Max
I2C to Parallel Port Expander
Operating Power-Supply Voltage Range of
2.3 V to 5.5 V
5-V Tolerant I/O Ports
400-kHz Fast I2C Bus
Three Hardware Address Pins Allow for Use of
up to Eight Devices on I2C/SMBus
Lower-Voltage Higher-Performance Migration
Path for PCA9556
Input/Output Configuration Register
Polarity Inversion Register
Active-Low Reset Input
SCL
•
DESCRIPTION/ORDERING INFORMATION
This 8-bit I/O expander for the two-line bidirectional bus (I2C) is designed for 2.3-V to 5.5-V VCC operation. The
device provides general-purpose remote I/O expansion for most microcontroller families via the I2C interface
[serial clock (SCL) and serial data (SDA)].
The PCA9557 consists of one 8-bit configuration (input or output selection), input port, output port, and polarity
inversion (active-high) registers. At power on, the I/Os are configured as inputs. However, the system master can
enable the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for each input or
output is kept in the corresponding input or output register. The polarity of the input port register can be inverted
with the polarity inversion register. All registers can be read by the system master.
The device outputs (latched) have high-current drive capability for directly driving LEDs. The device has low
current consumption.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2008, Texas Instruments Incorporated
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The system master can reset the PCA9557 in the event of a timeout or other improper operation by asserting a
low in the active-low reset (RESET) input. The power-on reset puts the registers in their default state and
initializes the I2C/SMBus state machine. Asserting RESET causes the same reset/initialization to occur without
depowering the part.
Three hardware pins (A0, A1, and A2) are used to program and vary the fixed I2C address, allowing up to eight
devices to share the same I2C bus or SMBus.
ORDERING INFORMATION
PACKAGE (1) (2)
TA
PCA9557RGVR
PD557
QFN – RGY
Reel of 1000
PCA9557RGYR
PD557
Reel of 2500
PCA9557DR
Reel of 250
PCA9557DT
Tube of 40
PCA9557D
Reel of 2000
PCA9557DBR
Tube of 80
PCA9557DB
Reel of 2000
PCA9557PWR
Reel of 250
PCA9557PWT
Tube of 90
PCA9557PW
Reel of 2000
PCA9557DGVR
SSOP – DB
TSSOP – PW
TVSOP – DGV
(1)
(2)
TOP-SIDE MARKING
Reel of 2000
SOIC – D
–40°C to 85°C
ORDERABLE PART NUMBER
QFN – RGV
PCA9557
PD557
PD557
PD557
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
TERMINAL FUNCTIONS
NO.
2
QFN (RGY)
SOIC (D),
SSOP (DB),
TSSOP (PW),
AND
TVSOP (DGV)
QFN (RGV)
1
15
SCL
Serial clock bus. Connect to VCC through a pullup resistor.
2
16
SDA
Serial data bus. Connect to VCC through a pullup resistor.
3
1
A0
Address input. Connect directly to VCC or ground.
4
2
A1
Address input. Connect directly to VCC or ground.
5
3
A2
Address input. Connect directly to VCC or ground.
6
4
P0
P-port input/output. High impedance open-drain design structure. Connect to VCC
through a pullup resistor.
7
5
P1
P-port input/output. Push-pull design structure.
8
6
GND
NAME
DESCRIPTION
Ground
9
7
P2
P-port input/output. Push-pull design structure.
10
8
P3
P-port input/output. Push-pull design structure.
11
9
P4
P-port input/output. Push-pull design structure.
12
10
P5
P-port input/output. Push-pull design structure.
13
11
P6
P-port input/output. Push-pull design structure.
14
12
P7
P-port input/output. Push-pull design structure.
15
13
RESET
16
14
VCC
Active-low reset input. Connect to VCC through a pullup resistor if no active
connection is used.
Supply voltage
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
LOGIC DIAGRAM (POSITIVE LOGIC)
A0
A1
A2
SCL
SDA
3
4
5
1
2
P7−P0
Input
Filter
I2C-Bus
Control
Shift
Register
8 Bits
I/O
Port
Write Pulse
VCC
RESET
GND
Read Pulse
16
15
Power-On
Reset
8
A.
Pin numbers shown are for the D, DB, DGV, PW, and RGY packages.
B.
All I/Os are set to inputs at reset.
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
3
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
SIMPLIFIED SCHEMATIC DIAGRAM OF P0
Data From
Shift Register
Data From
Shift Register
Configuration
Register
Q
D
Output Port
Register Data
FF
Write Configuration
Pulse
CK Q
Write Pulse
D
Q
FF
P0
CK Q
Output
Port
Register
ESD Protection Diode
Input
Port
Register
D
Q
FF
Read Pulse
GND
Input Port
Register Data
CK Q
Data From
Shift Register
D
Q
FF
Write Polarity Pulse
Polarity
Register Data
CK Q
Polarity
Inversion
Register
A.
4
On power up or reset, all registers return to default values.
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
SIMPLIFIED SCHEMATIC DIAGRAM OF P7–P1
Data From
Shift Register
Data From
Shift Register
Output Port
Register Data
VCC
Configuration
Register
D
Q
FF
Write Configuration
Pulse
CK Q
Write Pulse
D
Q
FF
P7−P1
CK Q
Output
Port
Register
ESD Protection Diode
Input
Port
Register
D
Q
FF
Read Pulse
GND
Input Port
Register Data
CK Q
Data From
Shift Register
D
Q
FF
Write Polarity Pulse
Polarity
Register Data
CK Q
Polarity
Inversion
Register
A.
On power up or reset, all registers return to default values.
I2C Interface
The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be
connected to a positive supply through a pullup resistor when connected to the output stages of a device. Data
transfer may be initiated only when the bus is not busy.
I2C communication with this device is initiated by a master sending a start condition, a high-to-low transition on
the SDA input/output while the SCL input is high (see Figure 1). After the start condition, the device address byte
is sent, most-significant bit (MSB) first, including the data direction bit (R/W).
After receiving the valid address byte, this device responds with an acknowledge (ACK), a low on the SDA
input/output during the high of the ACK-related clock pulse. The address (A2–A0) inputs of the slave device must
not be changed between the start and the stop conditions.
On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control
commands (start or stop) (see Figure 2).
A stop condition, a low-to-high transition on the SDA input/output while the SCL input is high, is sent by the
master (see Figure 1).
Any number of data bytes can be transferred from the transmitter to the receiver between the Start and the Stop
conditions. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before
the receiver can send an ACK bit. The device that acknowledges must pull down the SDA line during the ACK
clock pulse, so that the SDA line is stable low during the high pulse of the ACK-related clock period (see
Figure 3). When a slave receiver is addressed, it must generate an ACK after each byte is received. Similarly,
the master must generate an ACK after each byte that it receives from the slave transmitter. Setup and hold
times must be met to ensure proper operation.
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
5
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
A master receiver signals an end of data to the slave transmitter by not generating an acknowledge (NACK) after
the last byte has been clocked out of the slave. This is done by the master receiver by holding the SDA line high.
In this event, the transmitter must release the data line to enable the master to generate a stop condition.
SDA
SCL
S
P
Stop Condition
Start Condition
Figure 1. Definition of Start and Stop Conditions
SDA
SCL
Data Line
Change
Figure 2. Bit Transfer
Data Output
by Transmitter
NACK
Data Output
by Receiver
ACK
SCL From
Master
1
2
8
9
S
Start
Condition
Clock Pulse for
Acknowledgment
Figure 3. Acknowledgment on the I2C Bus
Interface Definition
BYTE
6
BIT
7 (MSB)
6
5
4
3
2
1
0 (LSB)
I2C slave address
L
L
H
H
A2
A1
A0
R/W
Px I/O data bus
P7
P6
P5
P4
P3
P2
P1
P0
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
Device Address
The address of the PCA9557 is shown in Figure 4.
Slave Address
0
0
1
1 A2 A1 A0 R/W
Fixed
Programmable
Figure 4. PCA9557 Address
Address Reference
INPUTS
I2C BUS SLAVE ADDRESS
A2
A1
A0
L
L
L
24 (decimal), 18 (hexadecimal)
L
L
H
25 (decimal), 19 (hexadecimal)
L
H
L
26 (decimal), 1A (hexadecimal)
L
H
H
27 (decimal), 1B (hexadecimal)
H
L
L
28 (decimal), 1C (hexadecimal)
H
L
H
29 (decimal), 1D (hexadecimal)
H
H
L
30 (decimal), 1E (hexadecimal)
H
H
H
31 (decimal), 1F (hexadecimal)
The last bit of the slave address defines the operation (read or write) to be performed. A high (1) selects a read
operation, while a low (0) selects a write operation.
Control Register and Command Byte
Following the successful acknowledgment of the address byte, the bus master sends a command byte that is
stored in the control register in the PCA9557. Two bits of this data byte state the operation (read or write) and
the internal registers (input, output, polarity inversion or configuration) that will be affected. This register can be
written or read through the I2C bus. The command byte is sent only during a write transmission.
Once a new command byte has been sent, the register that was addressed continues to be accessed by reads
until a new command byte has been sent.
0
0
0
0
0
0
B1
B0
Figure 5. Control Register Bits
Command Byte
CONTROL REGISTER BITS
B1
B0
COMMAND BYTE
(HEX)
0
0
0x00
Input Port
Read byte
xxxx xxxx
0
1
0x01
Output Port
Read/write byte
0000 0000
1
0
0x02
Polarity Inversion
Read/write byte
1111 0000
1
1
0x03
Configuration
Read/write byte
1111 1111
REGISTER
PROTOCOL
POWER-UP
DEFAULT
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
7
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
Register Descriptions
The input port register (register 0) reflects the incoming logic levels of the pins, regardless of whether the pin is
defined as an input or an output by the configuration register. It only acts on read operation. Writes to these
registers have no effect. The default value, X, is determined by the externally applied logic level.
Before a read operation, a write transmission is sent with the command byte to signal the I2C device that the
input port register will be accessed next.
Register 0 (Input Port Register)
BIT
I7
I6
I5
I4
I3
I2
I1
I0
DEFAULT
X
X
X
X
X
X
X
X
The output port register (register 1) shows the outgoing logic levels of the pins defined as outputs by the
configuration register. Bit values in this register have no effect on pins defined as inputs. In turn, reads from this
register reflect the value that is in the flip-flop controlling the output selection, not the actual pin value.
Register 1 (Output Port Register)
BIT
O7
O6
O5
O4
O3
O2
O1
O0
DEFAULT
0
0
0
0
0
0
0
0
The polarity inversion register (register 2) allows polarity inversion of pins defined as inputs by the configuration
register. If a bit in this register is set (written with 1), the corresponding port pin's polarity is inverted. If a bit in this
register is cleared (written with a 0), the corresponding port pin's original polarity is retained.
Register 2 (Polarity Inversion Register)
BIT
N7
N6
N5
N4
N3
N2
N1
N0
DEFAULT
1
1
1
1
0
0
0
0
The configuration register (register 3) configures the directions of the I/O pins. If a bit in this register is set to 1,
the corresponding port pin is enabled as an input with high impedance output driver. If a bit in this register is
cleared to 0, the corresponding port pin is enabled as an output.
Register 3 (Configuration Register)
BIT
C7
C6
C5
C4
C3
C2
C1
C0
DEFAULT
1
1
1
1
1
1
1
1
Power-On Reset
When power (from 0 V) is applied to VCC, an internal power-on reset holds the PCA9557 in a reset condition until
VCC has reached VPOR. At that time, the reset condition is released, and the PCA9557 registers and I2C/SMBus
state machine initialize to their default states. After that, VCC must be lowered to below 0.2 V and back up to the
operating voltage for a power-reset cycle. The RESET input can be asserted to reset the system, while keeping
the VCC at its operating level.
RESET
A reset can be accomplished by holding the RESET pin low for a minimum of tW. The PCA9557 registers and
I2C/SMBus state machine are held in their default states until RESET again is high. This input requires a pullup
resistor to VCC if no active connection is used.
8
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
Bus Transactions
Data is exchanged between the master and PCA9557 through write and read commands.
Writes
Data is transmitted to the PCA9557 by sending the device address and setting the least-significant bit (LSB) to a
logic 0 (see Figure 4 for device address). The command byte is sent after the address and determines which
register receives the data that follows the command byte. There is no limitation on the number of data bytes sent
in one write transmission (see Figure 6 and Figure 7).
SCL
1
2
3
4
5
6
7
8
9
Slave Address
SDA
S
0
0 1
Command Byte
1 A2 A1 A0 0
Start Condition
A
0
0
0
0
0
0
Data to Port
0
1
A
R/W ACK From Slave
Data 1
A
ACK From Slave
P
ACK From Slave
Write to Port
Data Out
From Port
Data 1 Valid
tpv
Figure 6. Write to Output Port Register
<br/>
SCL
1
2
3
4
5
6
7
8
9
Slave Address
SDA
S
0
0
1
Start Condition
Command Byte
1 A2 A1 A0 0
R/W
A
0
0
0
0
ACK From Slave
0
0
Data to Register
0 1/0 A
Data
ACK From Slave
A
P
ACK From Slave
Figure 7. Write to Configuration or Polarity Inversion Registers
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
9
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
Reads
The bus master first must send the PCA9557 address with the LSB set to a logic 0 (see Figure 4 for device
address). The command byte is sent after the address and determines which register is accessed. After a restart,
the device address is sent again but, this time, the LSB is set to a logic 1. Data from the register defined by the
command byte then is sent by the PCA9557 (see Figure 8 and Figure 9). After a restart, the value of the register
defined by the command byte matches the register being accessed when the restart occurred. Data is clocked
into the register on the rising edge of the ACK clock pulse. There is no limitation on the number of data bytes
received in one read transmission, but when the final byte is received, the bus master must not acknowledge the
data.
ACK From
Slave
Slave Address
S 0
0
1
1 A2 A1 A0 0
ACK From
Slave
Command Byte
A
A S 0
ACK From
ACK From
Master
Slave Data from Register
Slave Address
0
1
1 A2 A1 A0 1 A
At this moment, master-transmitter
becomes master-receiver, and
slave-receiver becomes
slave-transmitter
R/W
A
Data
First Byte
R/W
Data from Register
NACK From
Master
Data
NA P
Last Byte
Figure 8. Read From Register
<br/>
SCL
1
2
3
4
5
6
7
8
9
Data From Port
Slave Address
SDA
S 0
0
1
1 A2 A1 A0 1
Start
Condition
R/W
A
Data 1
Data From Port
A
ACK From
Slave
Data 4
ACK From
Master
NA P
NACK From
Master
Stop
Condition
Read From
Port
Data Into
Port
Data 2
tph
Data 3
Data 4
Data 5
tps
A.
This figure assumes the command byte has been previously programmed with 00h.
B.
Transfer of data can be stopped at any moment by a stop condition. When this occurs, data present at the last
acknowledge phase is valid (output mode). Input data is lost.
C.
This figure eliminates the command byte transfer, a restart, and slave address call between the initial slave address
call and actual data transfer from the P port (see Figure 8).
Figure 9. Read Input Port Register
10
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6
V
VI
Input voltage range (2)
–0.5
6
V
(2)
VO
Output voltage range
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–20
mA
IIOK
Input/output clamp current
VO < 0 or VO > VCC
–20
µA
IOL
Continuous output low current
VO = 0 to VCC
50
mA
IOH
Continuous output high current
VO = 0 to VCC
–50
mA
ICC
θJA
–0.5
Continuous current through GND
–250
Continuous current through VCC
160
Package thermal impedance (3)
D package
73
DB package
82
DGV package
120
PW package
108
RGV package
51
RGY package
Tstg
(1)
(2)
(3)
6
UNIT
Storage temperature range
V
mA
°C/W
47
–65
150
°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
VCC
MIN
MAX
2.3
5.5
0.7 × VCC
5.5
2
5.5
SCL, SDA
–0.5
0.3 × VCC
A2–A0, P7–P0, RESET
–0.5
0.8
Supply voltage
SCL, SDA
UNIT
V
VIH
High-level input voltage
VIL
Low-level input voltage
IOH
High-level output current
P7–P1
–10
mA
IOL
Low-level output current
P7–P0
25
mA
TA
Operating free-air temperature
85
°C
A2–A0, P7–P0, RESET
–40
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
V
V
11
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Input diode clamp voltage
II = –18 mA
VPOR
Power-on reset voltage
VI = VCC or GND, IO = 0
IOH = –8 mA
P-port high-level output voltage (2)
VOH
IOH = –10 mA
SDA
VOL = 0.4 V
VCC
MIN
2.3 V to 5.5 V
–1.2
VPOR
2.3 V
1.8
3V
2.6
4.5 V
3
4.75 V
4.1
2.3 V
1.5
3V
2.5
4.5 V
3
4.75 V
4
2.3 V to 5.5 V
3
VOL = 0.5 V
IOL
P port
(3)
VOL = 0.55 V
2.3 V to 5.5 V
VOL = 0.7 V
P port, except for P0 (3)
IOH
P0 (3)
SCL, SDA
II
A2–A0, RESET
TYP (1)
MAX
1.65
2.1
UNIT
V
V
V
8
20
8
20
10
24
mA
VOH = 2.3 V
2.3 V to 5.5 V
–4
mA
VOH = 4.6 V
4.6 V to 5.5 V
1
VOH = 3.3 V
3.3 V to 5.5 V
1
VI = VCC or GND
2.3 V to 5.5 V
±1
±1
µA
µA
IIH
P port
VI = VCC
2.3 V to 5.5 V
1
µA
IIL
P port
VI = GND
2.3 V to 5.5 V
1
µA
VI = VCC or GND, IO = 0,
I/O = inputs, fSCL = 400 kHz
Operating mode
VI = VCC or GND, IO = 0,
I/O = inputs, fSCL = 100 kHz
ICC
Standby mode
ΔICC
CI
Cio
(1)
(2)
(3)
12
Additional current in Standby mode
SCL
SDA
P port
VI = VCC or GND, IO = 0,
I/O = inputs, fSCL = 0 kHz
5.5 V
19
25
3.6 V
12
22
2.7 V
8
20
5.5 V
1.5
5
3.6 V
1
4
2.7 V
0.6
3
5.5 V
0.25
1
3.6 V
0.25
0.9
2.7 V
0.2
0.8
One input at VCC – 0.6 V,
Other inputs at VCC or GND
2.3 V to 5.5 V
0.2
Every LED I/O at VI = 4.3 V,
fSCL = 0 kHz
5.5 V
0.4
µA
mA
VI = VCC or GND
2.3 V to 5.5 V
VIO = VCC or GND
2.3 V to 5.5 V
4
6
5.5
8
7.5
9.5
pF
pF
All typical values are at nominal supply voltage (2.5-V, 3.3-V, or 5-V VCC) and TA = 25°C.
The total current sourced by all I/Os must be limited to 85 mA per bit.
Each I/O must be externally limited to a maximum of 25 mA, and the P port (P7–P0) must be limited to a maximum current of 200 mA.
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
I2C INTERFACE TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 10)
STANDARD MODE
I2C BUS
FAST MODE
I2C BUS
MIN
MAX
100
UNIT
MIN
MAX
0
400
fscl
I2C clock frequency
0
tsch
I2C clock high time
4
0.6
µs
tscl
I2C clock low time
4.7
1.3
µs
2
tsp
I C spike time
tsds
I2C serial data setup time
tsdh
I2C serial data hold time
ticr
I2C input rise time
50
50
250
100
0
0
2
kHz
ns
ns
ns
1000
20 + 0.1Cb (1)
300
ns
(1)
300
ns
300
ticf
I C input fall time
300
20 + 0.1Cb
tocf
I2C output fall time, 10-pF to 400-pF bus
300
20 + 0.1Cb (1)
tbuf
I2C bus free time between Stop and Start
4.7
1.3
µs
tsts
I2C Start or repeated Start condition setup time
4.7
0.6
µs
tsth
I2C Start or repeated Start condition hold time
4
0.6
µs
tsps
I2C Stop condition setup time
4
0.6
µs
tvd(data)
Valid data time, SCL low to SDA output valid
1
0.9
µs
tvd(ack)
Valid data time of ACK condition, ACK signal from SCL low to
SDA (out) low
1
0.9
µs
Cb
I2C bus capacitive load
400
400
pF
(1)
ns
Cb = total capacitance of one bus line in pF
RESET TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 13)
STANDARD MODE
I2C BUS
MIN
tW
Reset pulse duration (1)
tREC
Reset recovery time
tRESET
Time to reset (2)
(1)
(2)
MAX
16
FAST MODE
I2C BUS
MIN
UNIT
MAX
16
ns
0
0
ns
400
400
ns
A pulse duration of 16 ns minimum must be applied to RESET to return the PCA9557 to its default state.
The PCA9557 requires a minimum of 400 ns to be reset.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 10)
PARAMETER
FROM
TO
STANDARD MODE
I2C BUS
MIN
MAX
FAST MODE
I2C BUS
MIN
UNIT
MAX
SCL
P0
250
250
SCL
P1–P7
200
200
Input data setup time
P port
SCL
0
0
ns
Input data hold time
P port
SCL
200
200
ns
tpv
Output data valid
tps
tph
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
ns
13
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
TEMPERATURE
STANDBY SUPPLY CURRENT
vs
TEMPERATURE
20
60
70
SCL = VCC
VCC = 5 V
ICC - Standby Supply Current - nA
50
f SCL = 400 kHz
I/Os unloaded
45
40
35
30
25
VCC = 3.3 V
20
15
10
VCC = 2.5 V
f SCL = 400 kHz
I/Os unloaded
60
15
ICC – Supply Current – µA
55
ICC - Supply Current - µA
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
VCC = 5 V
10
VCC = 3.3 V
5
VCC = 2.5 V
50
40
30
20
10
5
0
-50
-25
0
25
50
75
0
-50
100
0
-25
25
50
75
100
2.3
I/O SINK CURRENT
vs
OUTPUT LOW VOLTAGE
TA = 25°C
15
10
TA = 85°C
5
30
ISINK – I/O Sink Current – mA
ISINK – I/O Sink Current – mA
20
TA = –40°C
25
TA = 25°C
20
15
10
TA = 85°C
5
0
0.3
0.4
0.5
0.6
0.1
VOL – Output Low Voltage – V
30
TA = 25°C
25
20
15
10
TA = 85°C
0.3
0.4
0.5
0.0
0.6
0.1
0.2
0.3
0.4
0.5
0.6
VOL – Output Low Voltage – V
I/O SOURCE CURRENT
vs
OUTPUT HIGH VOLTAGE
(P7–P1)
40
VCC = 5 V
VCC = 3.3 V
35
TA = –40°C
15
TA = 25°C
10
5
TA = 85°C
25
ISOURCE – I/O Source Current – mA
ISOURCE – I/O Source Current – mA
ISOURCE – I/O Source Current – mA
0.2
30
0
TA = –40°C
20
TA = 25°C
15
10
TA = 85°C
5
0.3
0.4
0.5
0.6
0.7
TA = –40°C
30
25
TA = 25°C
20
15
10
TA = 85°C
5
0
0
0.2
(VCC – VOH) – Output High Voltage – V
14
35
I/O SOURCE CURRENT
vs
OUTPUT HIGH VOLTAGE
(P7–P1)
VCC = 2.5 V
0.1
5.5
TA = –40°C
40
VOL – Output Low Voltage – V
I/O SOURCE CURRENT
vs
OUTPUT HIGH VOLTAGE
(P7–P1)
0.0
5.1
0
0.0
20
4.7
5
0
0.2
4.3
VCC = 5 V
45
35
TA = –40°C
3.9
50
VCC = 3.3 V
25
3.5
I/O SINK CURRENT
vs
OUTPUT LOW VOLTAGE
40
VCC = 2.5 V
0.1
3.1
VCC – Supply Voltage – V
I/O SINK CURRENT
vs
OUTPUT LOW VOLTAGE
30
0.0
2.7
TA - Free-Air Temperature - °C
TA - Free-Air Temperature - °C
ISINK – I/O Sink Current – mA
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
(VCC – VOH) – Output High Voltage – V
Submit Documentation Feedback
0.7
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
(VCC – VOH) – Output High Voltage – V
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
TYPICAL CHARACTERISTICS (continued)
OUTPUT HIGH VOLTAGE
vs
SUPPLY VOLTAGE
(P7–P1)
OUTPUT HIGH VOLTAGE
vs
TEMPERATURE
(P7–P1)
600
(V CC – V OH ) – Output High Voltage – mV
TA = 25°C
5
4
IOH = –4 mA
3
IOH = –8 mA
2
IOH = –10 mA
1
0
2.3
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
VCC – Supply Voltage – V
550
500
300
450
400
350
300
250
VCC = 5 V, ISOURCE = 10
200
150
VCC = 2.5 V, ISOURCE = 1 mA
100
VCC = 5 V, ISOURCE = 1 mA
50
0
-50
-25
0
VCC = 2.5 V, ISINK = 10 mA
275
VCC = 2.5 V, ISOURCE = 10
VOL – Output Low Voltage – mV
6
VOH – Output High Voltage – V
OUTPUT LOW VOLTAGE
vs
TEMPERATURE
25
50
75
TA – Free-Air Temperature – °C
250
225
200
175
150
VCC = 5 V, ISINK = 10 mA
125
100
VCC = 2.5 V, ISINK = 1 mA
75
50
VCC = 5 V, ISINK = 1 mA
25
100
0
-50
-25
0
25
50
75
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
100
TA – Free-Air Temperature – °C
15
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
RL = 1 kΩ
SDA
DUT
CL = 50 pF
(see Note A)
SDA LOAD CONFIGURATION
Three Bytes for Complete
Device Programming
Stop
Condition
(P)
Start
Address
Address
Condition
Bit 7
Bit 6
(S)
(MSB)
Address
Bit 1
tscl
R/W
Bit 0
(LSB)
ACK
(A)
Data
Bit 07
(MSB)
Data
Bit 10
(LSB)
Stop
Condition
(P)
tsch
0.7 × VCC
SCL
0.3 × VCC
ticr
ticf
tbuf
tsts
tPHL
tPLH
tsp
0.7 × VCC
SDA
0.3 × VCC
ticf
ticr
tsth
tsdh
tsds
tsps
Repeat
Start
Condition
Start or
Repeat
Start
Condition
Stop
Condition
VOLTAGE WAVEFORMS
BYTE
DESCRIPTION
1
I2C address
2, 3
P-port data
A.
CL includes probe and jig capacitance.
B.
All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.
C.
All parameters and waveforms are not applicable to all devices.
Figure 10. I2C Interface Load Circuit and Voltage Waveforms
16
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
RL = 4.7 kΩ
INT
DUT
CL = 100 pF
(see Note A)
INTERRUPT LOAD CONFIGURATION
ACK
From Slave
Start
Condition
8 Bits
(One Data Bytes)
From Port
R/W
Slave Address
S
0
0
1
1 A2 A1 A0 1
A
1
2
3
4
A
5
6
7
8
Data 1
ACK
From Slave
Data From Port
A
Data 2
1
P
A
tir
tir
B
B
INT
A
tiv
tsps
A
Data
Into
Port
Address
Data 1
0.7 × VCC
INT
0.3 × VCC
SCL
Data 2
0.7 × VCC
R/W
tiv
A
0.3 × VCC
tir
0.7 × VCC
Pn
0.7 × VCC
1.5 V
0.3 × VCC
INT
0.3 × VCC
View A−A
View B−B
A.
CL includes probe and jig capacitance.
B.
All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.
C.
All parameters and waveforms are not applicable to all devices.
Figure 11. Interrupt Load Circuit and Voltage Waveforms
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
17
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Pn
500 W
2 × VCC
DUT
CL = 50 pF
(see Note A)
500 W
P-PORT LOAD CONFIGURATION
0.7 × VCC
SCL
P0
A
P7
0.3 × VCC
Slave
ACK
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
SDA
Pn
tpv
(see Note B)
Unstable
Data
Last Stable Bit
WRITE MODE (R/W = 0)
0.7 × VCC
SCL
P0
A
tps
P7
0.3 × VCC
tph
0.7 × VCC
1.5 V
0.3 × VCC
Pn
READ MODE (R/W = 1)
A.
CL includes probe and jig capacitance.
B.
tpv is measured from 0.7 × VCC on SCL to 50% I/O (Pn) output.
C.
All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.
D.
The outputs are measured one at a time, with one transition per measurement.
E.
All parameters and waveforms are not applicable to all devices.
Figure 12. P-Port Load Circuit and Voltage Waveforms
18
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
RL = 1 kΩ
DUT
500 W
Pn
SDA
2 × VCC
DUT
CL = 50 pF
(see Note A)
CL = 50 pF
(see Note A)
500 W
P-PORT LOAD CONFIGURATION
SDA LOAD CONFIGURATION
Start
SCL
ACK or Read Cycle
SDA
0.3 y VCC
tRESET
RESET
VCC/2
tREC
tw
Pn
VCC/2
tRESET
A.
CL includes probe and jig capacitance.
B.
All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.
C.
I/Os are configured as inputs.
D.
All parameters and waveforms are not applicable to all devices.
Figure 13. Reset Load Circuits and Voltage Waveforms
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
19
PCA9557
SCPS133I – DECEMBER 2005 – REVISED JUNE 2008.................................................................................................................................................... www.ti.com
APPLICATION INFORMATION
Figure 14 shows an application in which the PCA9557 can be used.
VCC
(5 V)
VCC
Master
Controller
1.8 kΩ
1.8 kΩ
620 Ω
2 kΩ
2 kΩ
100 kΩ (X 5)
VCC
SCL
SCL
SDA
SDA
P0
Subsystem 1
INT
P1
RESET
RESET
P2
RESET
P3
GND
Subsystem 2
(e.g., Counter)
PCA9557
P4
P5
A2
A
Controlled Switch
(e.g., CBT Device)
P6
A1
P7
A0
ENABLE
B
GND
ALARM
Subsystem 3
(e.g., Alarm System)
GND
10 kΩ
A.
Device address is configured as 0011100 for this example.
B.
P1, P4, and P5 are configured as inputs.
C.
P0, P2, and P3 are configured as outputs.
D.
P6 and P7 are not used and must be configured as outputs.
Figure 14. Typical Application
20
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
PCA9557
www.ti.com.................................................................................................................................................... SCPS133I – DECEMBER 2005 – REVISED JUNE 2008
Minimizing ICC When I/O Is Used to Control LED
When an I/O is used to control an LED, normally it is connected to VCC through a resistor as shown in Figure 14.
The LED acts as a diode so, when the LED is off, the I/O VIN is about 1.2 V less than VCC. The ΔICC parameter in
Electrical Characteristics shows how ICC increases as VIN becomes lower than VCC. Designs needing to minimize
current consumption, such as battery power applications, should consider maintaining the I/O pins greater than
or equal to VCC when the LED is off.
Figure 15 shows a high-value resistor in parallel with the LED. Figure 16 shows VCC less than the LED supply
voltage by at least 1.2 V. Both of these methods maintain the I/O VIN at or above VCC and prevent additional
supply-current consumption when the LED is off.
VCC
100 kW
LED
VCC
Pn
Figure 15. High-Value Resistor in Parallel With the LED
3.3 V
VCC
5V
LED
Pn
Figure 16. Device Supplied by a Low Voltage
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): PCA9557
21
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jan-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
PCA9557D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DB
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DBR
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DBRG4
ACTIVE
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DG4
ACTIVE
SOIC
D
16
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DGVRG4G4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557DTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PCA9557RGVR
ACTIVE
QFN
RGV
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
PCA9557RGVRG4
ACTIVE
QFN
RGV
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
PCA9557RGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
PCA9557RGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
40
(1)
Lead/Ball Finish
MSL Peak Temp (3)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jan-2008
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.6
2.5
12.0
16.0
Q1
PCA9557DBR
SSOP
DB
16
2000
330.0
16.4
8.2
PCA9557DGVR
TVSOP
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
PCA9557DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
PCA9557PWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
PCA9557RGVR
QFN
RGV
16
2500
330.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
PCA9557RGYR
QFN
RGY
16
1000
180.0
12.4
3.8
4.3
1.5
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
PCA9557DBR
SSOP
DB
16
2000
346.0
346.0
33.0
PCA9557DGVR
TVSOP
DGV
16
2000
346.0
346.0
29.0
PCA9557DR
SOIC
D
16
2500
346.0
346.0
33.0
PCA9557PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
PCA9557RGVR
QFN
RGV
16
2500
346.0
346.0
29.0
PCA9557RGYR
QFN
RGY
16
1000
190.5
212.7
31.8
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated