ONSEMI 2N6292

PNP - 2N6107, 2N6109,
2N6111; NPN - 2N6288,
2N6292
Complementary Silicon
Plastic Power Transistors
These devices are designed for use in general−purpose amplifier and
switching applications.
Features
• DC Current Gain Specified to 7.0 Amperes
•
•
•
•
hFE = 30−150 @ IC
= 3.0 Adc − 2N6111, 2N6288
= 2.3 (Min) @ IC = 7.0 Adc − All Devices
Collector−Emitter Sustaining Voltage −
VCEO(sus) = 30 Vdc (Min) − 2N6111, 2N6288
= 50 Vdc (Min) − 2N6109
= 70 Vdc (Min) − 2N6107, 2N6292
High Current Gain − Bandwidth Product
fT = 4.0 MHz (Min) @ IC = 500 mAdc − 2N6288, 90, 92
= 10 MHz (Min) @ IC = 500 mAdc − 2N6107, 09, 11
TO−220AB Compact Package
Pb−Free Packages are Available*
MAXIMUM RATINGS (Note 1)
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Symbol
2N6111, 2N6288
2N6109
2N6107, 2N6292
2N6111, 2N6288
2N6109
2N6107, 2N6292
Emitter−Base Voltage
VCEO
VCB
Value
Unit
7 AMPERE
POWER TRANSISTORS
COMPLEMENTARY SILICON
30 − 50 − 70 VOLTS, 40 WATTS
MARKING
DIAGRAM
4
TO−220AB
CASE 221A
STYLE 1
1
2
PIN 1.
2.
3.
4.
3
Vdc
30
50
70
Vdc
40
60
80
VEB
5.0
Vdc
Collector Current − Continuous
− Peak
IC
7.0
10
Adc
Base Current
IB
3.0
Adc
Total Power Dissipation @ TC = 25_C
Derate above 25_C
PD
40
0.32
W
W/°C
TJ, Tstg
−65 to +150
°C
Operating and Storage Junction
Temperature Range
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2N6xxx
xxx
G
A
Y
WW
2N6xxxG
AYWW
BASE
COLLECTOR
EMITTER
COLLECTOR
= Specific Device Code
= See Table on Page 4
= Pb−Free Package
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering, marking, and shipping information in
the package dimensions section on page 4 of this data sheet.
THERMAL CHARACTERISTICS
Characteristics
Thermal Resistance, Junction−to−Case
Symbol
Max
Unit
RqJC
3.125
_C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates JEDEC Registered Data.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2011
October, 2011 − Rev. 9
1
Publication Order Number:
2N6107/D
PNP − 2N6107, 2N6109, 2N6111; NPN − 2N6288, 2N6292
PD, POWER DISSIPATION (WATTS)
40
30
20
10
0
0
20
40
60
80
100
120
TC, CASE TEMPERATURE (°C)
160
140
Figure 1. Power Derating
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ELECTRICAL CHARACTERISTICS (TC = 25_C unless otherwise noted) (Note 2)
Characteristic
Symbol
Min
Max
30
50
70
−
−
−
−
−
−
1.0
1.0
1.0
−
−
−
−
−
−
100
100
100
2.0
2.0
2.0
−
1.0
30
30
30
2.3
150
150
150
−
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 3)
(IC = 100 mAdc, IB = 0)
2N6111, 2N6288
2N6109
2N6107, 2N6292
Collector Cutoff Current
(VCE = 20 Vdc, IB = 0)
(VCE = 40 Vdc, IB = 0)
(VCE = 60 Vdc, IB = 0)
2N6111, 2N6288
2N6109
2N6107, 2N6292
Collector Cutoff Current
(VCE = 40 Vdc, VEB(off) = 1.5 Vdc)
(VCE = 60 Vdc, VEB(off) = 1.5 Vdc)
(VCE = 80 Vdc, VEB(off) = 1.5 Vdc)
(VCE = 30 Vdc, VEB(off) = 1.5 Vdc, TC = 150_C)
(VCE = 50 Vdc, VEB(off) = 1.5 Vdc, TC = 150_C)
(VCE = 70 Vdc, VEB(off) = 1.5 Vdc, TC = 150_C)
2N6111, 2N6288
2N6109
2N6107, 2N6292
2N6111, 2N6288
2N6109
2N6107, 2N6292
Emitter Cutoff Current (VBE = 5.0 Vdc, IC = 0)
VCEO(sus)
ICEO
ICEX
IEBO
Vdc
mAdc
mAdc
mAdc
mAdc
ON CHARACTERISTICS (Note 3)
DC Current Gain
(IC = 2.0 Adc, VCE = 4.0 Vdc)
(IC = 2.5 Adc, VCE = 4.0 Vdc)
(IC = 3.0 Adc, VCE = 4.0 Vdc)
(IC = 7.0 Adc, VCE = 4.0 Vdc)
2N6107, 2N6292
2N6109
2N6111, 2N6288
All Devices
hFE
−
Collector−Emitter Saturation Voltage (IC = 7.0 Adc, IB = 3.0 Adc)
VCE(sat)
−
3.5
Vdc
Base−Emitter On Voltage (IC = 7.0 Adc, VCE = 4.0 Vdc)
VBE(on)
−
3.0
Vdc
4.0
10
−
−
DYNAMIC CHARACTERISTICS
Current Gain — Bandwidth Product (Note 4)
(IC = 500 mAdc, VCE = 4.0 Vdc, ftest = 1.0 MHz)
2N6288, 92
2N6107, 09, 11
fT
MHz
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Cob
−
250
pF
Small−Signal Current Gain (IC = 0.5 Adc, VCE = 4.0 Vdc, f = 50 kHz)
hfe
20
−
−
2.
3.
4.
Indicates JEDEC Registered Data.
Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
fT = |hfe| • ftest
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2
PNP − 2N6107, 2N6109, 2N6111; NPN − 2N6288, 2N6292
VCC
+30 V
25 ms
RC
+11 V
SCOPE
RB
0
D1
51
-9.0 V
tr, tf ≤ 10 ns
DUTY CYCLE = 1.0%
-4 V
RB and RC ARE VARIED TO OBTAIN DESIRED CURRENT LEVELS
D1 MUST BE FAST RECOVERY TYPE, eg:
1N5825 USED ABOVE IB ≈ 100 mA
MSD6100 USED BELOW IB ≈ 100 mA
Figure 2. Switching Time Test Circuit
2.0
1.0
TJ = 25°C
VCC = 30 V
IC/IB = 10
t, TIME (s)
μ
0.7
0.5
0.3
0.2
tr
0.1
0.07
0.05
td @ VBE(off) ≈ 5.0 V
0.03
0.02
0.07 0.1
1.0
0.2 0.3
0.5
2.0
IC, COLLECTOR CURRENT (AMP)
3.0
5.0 7.0
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 3. Turn−On Time
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
D = 0.5
0.2
0.1
ZqJC(t) = r(t) RqJC
RqJC = 3.125°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) - TC = P(pk) ZqJC(t)
0.05
0.02
0.03
0.02
0.01
0.01
0.01
SINGLE PULSE
0.02
0.05
0.1
0.2
0.5
1.0
2.0
5.0
t, TIME (ms)
10
Figure 4. Thermal Response
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3
20
50
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
100
200
500
1.0 k
IC, COLLECTOR CURRENT (AMPS)
PNP − 2N6107, 2N6109, 2N6111; NPN − 2N6288, 2N6292
15
10
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC − VCE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 5 is based on TJ(pk) = 150_C; TC is
variable depending on conditions. Second breakdown
pulse limits are valid for duty cycles to 10% provided
TJ(pk) v 150_C. TJ(pk) may be calculated from the data in
Figure 4. At high case temperatures, thermal limitations will
reduce the power that can be handled to values less than the
limitations imposed by second breakdown.
0.1 ms
0.5 ms
7.0
5.0
dc
3.0
2.0
0.1
ms
CURRENT LIMIT
SECONDARY
BREAKDOWN LIMIT
THERMAL LIMIT
@ TC = 25°C (SINGLE PULSE)
1.0
0.7
0.5
0.3
0.2
0.15
1.0
5.0 ms
2.0 3.0
20 30
50
5.0 7.0 10
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
70 100
Figure 5. Active−Region Safe Operating Area
300
5.0
t, TIME (s)
μ
2.0
ts
1.0
0.7
0.5
TJ = 25°C
VCC = 30 V
IC/IB = 10
IB1 = IB2
200
C, CAPACITANCE (pF)
3.0
tr
0.3
0.2
TJ = 25°C
Cib
100
70
Cob
50
0.1
0.07
0.05
0.07 0.1
0.2
0.3
0.5
2.0 3.0
1.0
IC, COLLECTOR CURRENT (AMP)
30
0.5
5.0 7.0
1.0
Figure 6. Turn−Off Time
10
20
2.0 3.0
5.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
ORDERING INFORMATION
Device
Device Marking
Package
2N6107
2N6107G
TO−220AB
2N6107
TO−220AB
(Pb−Free)
2N6109
2N6109G
TO−220AB
(Pb−Free)
2N6111
TO−220AB
(Pb−Free)
50 Units / Rail
TO−220AB
2N6288
TO−220AB
(Pb−Free)
2N6292
2N6292G
50 Units / Rail
TO−220AB
2N6288
2N6288G
50 Units / Rail
TO−220AB
2N6109
2N6111
2N6111G
Shipping
50 Units / Rail
TO−220AB
2N6292
TO−220AB
(Pb−Free)
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4
50 Units / Rail
30
50
PNP − 2N6107, 2N6109, 2N6111; NPN − 2N6288, 2N6292
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AG
−T−
B
F
T
SEATING
PLANE
C
S
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
U
1 2 3
H
K
Z
L
R
V
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.036
0.142
0.161
0.095
0.105
0.110
0.161
0.014
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.045
0.055
0.235
0.255
0.000
0.050
0.045
----0.080
STYLE 1:
PIN 1.
2.
3.
4.
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.91
3.61
4.09
2.42
2.66
2.80
4.10
0.36
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
1.15
1.39
5.97
6.47
0.00
1.27
1.15
----2.04
BASE
COLLECTOR
EMITTER
COLLECTOR
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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2N6107/D