AOSMD AO4824

AO4824
Asymmetric Dual N-Channel Enhancement Mode Field Effect
Transistor
General Description
Features
Q1
The AO4824 uses advanced trench technology to
provide excellent RDS(ON) and low gate charge. The
two MOSFETs make a compact and efficient switch
and synchronous rectifier combination for use in DCDC converters. Standard Product AO4824 is Pb-free
(meets ROHS & Sony 259 specifications). AO4824L
is a Green Product ordering option. AO4824 and
AO4824L are electrically identical.
Q2
VDS (V) = 30V
ID = 8.5A
RDS(ON) < 17mΩ
RDS(ON) < 27mΩ
VDS(V) = 30V
ID=9.8A
(VGS = 10V)
<13mΩ
(VGS = 10V)
<15mΩ
(VGS = 4.5V)
D1
D2
SOIC-8
S2
G2
S1
G1
1
2
3
4
8
7
6
5
D2
D2
D1
D1
G1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
Continuous Drain
TA=25°C
Current A
ID
TA=70°C
Pulsed Drain Current B
IDM
TA=25°C
TA=70°C
Power Dissipation
Junction and Storage Temperature Range
Parameter: Thermal Characteristics MOSFET Q1
t ≤ 10s
Maximum Junction-to-AmbientA
A
Steady-State
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
C
Steady-State
Parameter: Thermal Characteristics MOSFET Q2
t ≤ 10s
Maximum Junction-to-AmbientA
A
Maximum Junction-to-Ambient
Maximum Junction-to-Lead
C
G2
S1
Steady-State
Steady-State
Alpha & Omega Semiconductor, Ltd.
PD
TJ, TSTG
Symbol
RθJA
RθJL
Symbol
RθJA
RθJL
S2
Max Q1
30
Max Q2
30
Units
V
±20
±12
V
8.5
6.8
9.8
7.8
A
30
40
2
2
1.28
-55 to 150
1.28
-55 to 150
Typ
48
Max
62.5
Units
74
35
110
40
°C/W
Typ
Max
Units
48
74
35
62.5
110
40
°C/W
W
°C
AO4824
Q1 Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Min
Parameter
STATIC
BVDSS PARAMETERS
Drain-Source Breakdown Voltage
IDSS
IGSS
Zero Gate Voltage Drain Current
VGS(th)
Gate-Body leakage current
ID(ON)
Gate Threshold Voltage
On state drain current
VGS=10V, VDS=5V
VGS=10V, ID=8.5A
gFS
VGS=4.5V, ID=6A
Forward Transconductance
VDS=5V, ID=8.5A
Diode Forward Voltage
IS=1A,VGS=0V
Maximum Body-Diode Continuous Current
Rg
Reverse Transfer Capacitance
Gate resistance
1
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
1
5
Units
V
100
µA
nA
1.8
3
V
13.8
20
17
25
21
27
mΩ
mΩ
1
3
S
V
A
30
TJ=125°C
VGS=0V, VDS=15V, f=1MHz
A
23
0.76
1040
180
110
0.7
1250
0.85
pF
pF
pF
Ω
19.2
23
nC
9.36
11.2
nC
VGS=0V, VDS=0V, f=1MHz
SWITCHING
PARAMETERS
Qg(10V)
Total
Gate Charge
Qg(4.5V)
Qgs
0.003
TJ=55°C
VDS=0V, VGS= ±20V
VDS=VGS ID=250µA
Static Drain-Source On-Resistance
DYNAMIC
PARAMETERS
Ciss
Input
Capacitance
Coss
Output Capacitance
Crss
Max
30
ID=250µA, VGS=0V
VDS=24V, VGS=0V
RDS(ON)
VSD
IS
Typ
Conditions
VGS=10V, VDS=15V, ID=8.5A
2.6
4.2
VGS=10V, VDS=15V, RL=1.8Ω,
RGEN=3Ω
5.2
4.4
17.3
3.3
16.7
6.7
IF=8.5A, dI/dt=100A/µs
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=8.5A, dI/dt=100A/µs
nC
nC
7.5
6.5
25
5
21
10
ns
ns
ns
ns
ns
nC
2
A: The value of R θJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The value
in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using 80 µs pulses, duty cycle 0.5% max.
2
E. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA
curve provides a single pulse rating.
Rev 4 : Aug 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO4824
Q1 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
20
4V
10V
25
20
3.5V
12
ID(A)
ID (A)
VDS=5V
16
4.5V
15
125°C
8
10
13.4
VGS=3V
5
22
0
0
0
1
2
3
4
5
1.5
2
VDS (Volts)
Fig 1: On-Region Characteristics
16
26
0.76
3
2.5
3.5
4
VGS(Volts)
Figure 2: Transfer Characteristics
26
Normalized On-Resistance
1.6
24
VGS=4.5V
22
RDS(ON) (mΩ)
25°C
4
20
18
16
VGS=10V
14
12
10
VGS=10V
ID=8.5A
1.4
VGS=4.5V
1.2
1
0.8
0
5
10
15
20
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1.0E+01
50
1.0E+00
ID=8.5A
1.0E-01
30
IS (A)
RDS(ON) (mΩ)
40
125°C
125°C
1.0E-02
25°C
1.0E-03
20
1.0E-04
25°C
1.0E-05
10
2
4
6
8
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.0
0.2
0.4
0.6
0.8
VSD (Volts)
Figure 6: Body-Diode Characteristics
1.0
AO4824
Q1 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
1500
10
VDS=15V
ID=8.5A
1250
Capacitance (pF)
VGS (Volts)
8
6
4
2
Ciss
1000
750
500
Coss
0
4
8
12
16
20
0
5
Qg (nC)
Figure 7: Gate-Charge Characteristics
100.0
22
26
100µs
1ms
10.0
0.1s
1.0
1s
TJ(Max)=150°C
TA=25°C
25
30
30
20
10
10s
DC
0
0.001
0.1
1
20
TJ(Max)=150°C
TA=25°C
40
10µs
10ms
10
100
VDS (Volts)
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=62.5°C/W
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
15
0.76
50
RDS(ON)
limited
0.1
10
VDS (Volts)
Figure 8: Capacitance Characteristics
Power (W)
ID (Amps)
16
Crss
0
0
ZθJA Normalized Transient
Thermal Resistance
13.4
250
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000
AO4824
Q2 Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
VGS(th)
ID(ON)
Gate-Body leakage current
Gate Threshold Voltage
On state drain current
RDS(ON)
Static Drain-Source On-Resistance
gFS
VSD
IS
Conditions
Min
ID=250µA, VGS=0V
VDS=24V, VGS=0V
30
0.004
VDS=0V, VGS= ±12V
VDS=VGS ID=250µA
VGS=4.5V, VDS=5V
VGS=10V, ID=9.8A
0.6
40
TJ=125°C
VGS=4.5V, ID=9A
Forward Transconductance
VDS=5V, ID=9.8A
Diode Forward Voltage
IS=1A
Maximum Body-Diode Continuous Current
Rg
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
1
5
µA
1.1
100
2
10.5
13.4
12
13
17
15
mΩ
1
3
S
V
A
37
0.73
nA
V
A
mΩ
VGS=0V, VDS=15V, f=1MHz
3656 4250
256
pF
pF
VGS=0V, VDS=0V, f=1MHz
168
0.86
pF
Ω
VGS=4.5V, VDS=15V, ID=9.8A
30.5
4.5
tD(on)
tr
Turn-On DelayTime
Turn-On Rise Time
tD(off)
tf
trr
Turn-Off DelayTime
Turn-Off Fall Time
IF=9.8A, dI/dt=100A/µs
Body Diode Reverse Recovery time
Body Diode Reverse Recovery charge IF=9.8A, dI/dt=100A/µs
Qrr
30
Max Units
V
TJ=55°C
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Crss
Typ
VGS=10V, VDS=15V, RL=1.6Ω,
RGEN=3Ω
1.05
36
nC
nC
8.5
5.5
8.2
nC
ns
3.1
52.4
5.7
5
75
8.5
ns
ns
ns
21.5
11
26
15
ns
nC
2
A: The value of R θJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with TA =25°C.
The value in any given application depends on the user's specific board design. The current rating is based on the t≤ 10s thermal
resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
SOA curve provides a single pulse rating.
Rev 4: Aug 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISIN
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
AO4824
Q2 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
40
30
10V
25
4.5V
30
20
ID(A)
2.5V
ID (A)
VDS=5V
20
VGS=2V
15
125°C
10
10
5
25°C
0
0
0
1
2
3
4
0.5
5
1
13
Normalized On-Resistance
RDS(ON) (mΩ)
2
2.5
1.8
VGS=4.5V
12
11
VGS=10V
10
9
0
5
10
15
20
25
ID=9.8A
1.6
VGS=4.5V
1.4
VGS=10V
1.2
1
0.8
30
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
50
100
150
200
Temperature (°C)
Figure 4: On resistance vs. Junction Temperature
30
1.0E+01
1.0E+00
ID=9.8A
25
125°C
20
125°C
15
IS (A)
1.0E-01
RDS(ON) (mΩ)
1.5
VGS (Volts)
Figure 2: Transfer Characteristics
VDS (Volts)
Fig 1: On-Region Characteristics
25°C
1.0E-02
1.0E-03
25°C
1.0E-04
10
1.0E-05
5
0.0
0
2
4
6
8
VGS (Volts)
Figure 5: On resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
10
0.2
0.4
0.6
0.8
VSD (Volts)
Figure 6: Body-Diode Characteristics
1.0
AO4824
Q2 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10000
5
VDS=15V
ID=9.8A
Capacitance (pF)
VGS (Volts)
4
f=1MHz
VGS=0V
Ciss
3
2
1000
Coss
1
Crss
0
100
0
5
10
15
20
25
30
35
0
Qg (nC)
Figure 7: Gate-Charge Characteristics
5
10
15
20
25
30
VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
40
RDS(ON)
limited
TJ(Max)=150°C, TA=25°C
100µs 10µs
1ms
10.0
30
Power (W)
ID (A)
10ms
0.1s
1.0
TJ(Max)=150°C
TA=25°C
1s
20
10
10s
DC
0
0.001
0.1
0.1
1
10
100
VDS (Volts)
ZθJA Normalized Transient
Thermal Resistance
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=62.5°C/W
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
0.01
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000