HITACHI 2SB1025

2SB1025
Silicon PNP Epitaxial
Application
• Low frequency power amplifier
• Complementary pair with 2SD1418
Outline
UPAK
1
3
2
4
1. Base
2. Collector
3. Emitter
4. Collector (Flange)
2SB1025
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Collector to base voltage
VCBO
–120
V
Collector to emitter voltage
VCEO
–80
V
Emitter to base voltage
VEBO
–5
V
Collector current
IC
–1
A
–2
A
1
W
Collector peak current
iC(peak)*
1
2
Collector power dissipation
PC *
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes: 1. PW ≤ 10 ms, Duty cycle ≤ 20%
2. Value on the alumina ceramic board (12.5 × 20 × 0.7 mm)
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V(BR)CBO
–120
—
—
V
I C = –10 µA, IE = 0
Collector to emitter breakdown
voltage
V(BR)CEO
–80
—
—
V
I C = –1 mA, RBE = ∞
Emitter to base breakdown
voltage
V(BR)EBO
–5
—
—
V
I E = –10 µA, IC = 0
Collector cutoff current
I CBO
—
—
–10
µA
VCB = –100 V, IE = 0
60
—
320
VCE = –5 V, IC = –150 mA
hFE2
30
—
—
VCE = –5 V,
I C = –500 mA (Pulse test)
Collector to emitter saturation
voltage
VCE(sat)
—
—
–1
V
I C = –500 mA,
I B = –50 mA (Pulse test)
Base to emitter voltage
VBE
—
—
–0.9
V
VCE = –5 V, IC = –150 mA
Gain bandwidth product
fT
—
140
—
MHz
VCE = –5 V, IC = –150 mA
Collector output capacitance
Cob
—
20
—
pF
VCB = –10 V, IE = 0,
f = 1 MHz
DC current transfer ratio
Note:
hFE1*
1
1. The 2SB1025 is grouped by hFE1 as follows.
Mark
DH
DJ
DK
hFE1
60 to 120
100 to 200
160 to 320
2
2SB1025
Typical Output Characteristics
Maximum Collector Dissipation Curve
–1.0
Collector Current IC (A)
Collector Power Dissipation Pc (W)
(on the alumina ceramic board)
1.2
0.8
0.4
–0.8
–0.6
–0.4
–40
–30 0
–2
–10 5
–
–2
–1
–0.5 mA
–0.2
IB = 0
0
0
50
100
150
Ambient Temperature Ta (°C)
600
–200
75°C
–100
Ta =
–50
–20
25
–25
–10
–5
–2
–1
0
–0.2 –0.4 –0.6 –0.8 –1.0
Base to Emitter Voltage VBE (V)
DC Current Transfer Ratio hFE
–500
VCE = –5 V
Pulse
–2
–4
–6
–8
–10
Collector to Emitter Voltage VCE (V)
DC Current Transfer Ratio vs.
Collector Current
Typical Output Characteristics
Collector Current IC (mA)
0
–12
0
0
1
–
–80
–60
500
VCE = –5 V
Pulse
400
300
200
Ta = 75°C
25
–25
100
0
–1
–3
–10 –30 –100 –300 –1,000
Collector Current IC (mA)
3
2SB1025
–0.5
–0.4
–0.3
–0.2
–0.1
Base to Emitter Saturation Voltage
VBE (sat) (V)
Collector to Emitter Saturation Voltage
VCE (sat) (V)
Saturation Voltage vs. Collector Current
–1.2
–0.6
IC = 10 IB
Pulse
–1.0
VBE (sat)
–0.8
–0.6
Ta =
25
75
–0.2
VCE (sat)
0
–1
–3
–10 –30 –100 –300 –1,000
Collector Current IC (mA)
4
Collector Output Capacitance vs.
Collector to Base Voltage
Collector Output Capacitance Cob (pF)
Gain Bandwidth Product fT (MHz)
Gain Bandwidth Product vs.
Collector Current
VCE = –5 V
300
200
100
–10
–30
–100
–300
Collector Current IC (mA)
C
Ta = 75°C
25
–25
–0.4
0
–25°
–1,000
200
100
f = 1 MHz
IE = 0
50
20
10
5
2
–1
–2
–5 –10 –20
–50 –100
Collector to Base Voltage VCB (V)
Unit: mm
1.5 1.5
3.0
0.44 Max
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
(0.2)
(2.5)
(1.5)
(0.4)
0.53 Max
0.48 Max
1.5 ± 0.1
0.44 Max
2.5 ± 0.1
4.25 Max
φ1
0.8 Min
1.8 Max
0.4
4.5 ± 0.1
UPAK
—
Conforms
0.050 g
Cautions
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copyright, trademark, or other intellectual property rights for information contained in this document.
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intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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products.
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