HITACHI 4AM15

4AM15
Silicon N-Channel/P-Channel Power MOS FET Array
Application
High speed power switching
Features
•
Low on-resistance
N Channel: RDS(on) ≤ 0.5 Ω, VGS = 10 V, ID = 2 A
P Channel: RDS(on) ≤ 0.9 Ω, VGS = –10 V, ID = –2 A
•
•
•
•
Low drive current
High speed switching
High density mounting
Suitable for H-bridged motor driver
Outline
4AM15
Absolute Maximum Ratings (Ta = 25°C)
Ratings
Item
Symbol
Nch
Pch
Unit
Drain to source voltage
VDSS
200
–200
V
Gate to source voltage
VGSS
±20
±20
V
Drain current
ID
4
–4
A
Drain peak current
ID(pulse)*1
16
–16
A
Body to drain diode reverse drain current
IDR
4
–4
A
Channel dissipation
Pch (Tc = 25°C)*2 32
W
Pch*2
4.0
W
Channel temperature
Tch
150
°C
Storage temperature
Tstg
–55 to +150
°C
Notes: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. 4 Device Operation
2
4AM15
Electrical Characteristics (Ta = 25°C)
N Channel
Item
Symbol
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V(BR)DS 200
S
Min
—
—
V
ID = 10 mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GS ±20
S
—
—
V
IG = ±100 µA, VDS = 0
Gate to source leak current
IGSS
—
—
±10
µA
VGS = ±16 V, VDS = 0
Zero gate voltage drain current IDSS
—
—
250
µA
VDS = 160 V, VGS = 0
Gate to source cutoff voltage
VGS(off) 2.0
—
4.0
V
ID = 1 mA, VDS = 10 V
Static drain to source on state
resistance
RDS(on) —
0.33
0.5
Ω
ID = 2 A, VGS = 10 V*1
Forward transfer admittance
|yfs|
3.0
—
S
ID = 2 A
1.5
VDS = 10 V*1
Input capacitance
Ciss
—
750
—
pF
VDS = 10 V
Output capacitance
Coss
—
260
—
pF
VGS = 0
Reverse transfer capacitance
Crss
—
40
—
pF
f = 1 MHz
Turn-on delay time
td(on)
—
19
—
ns
ID = 2 A
Rise time
tr
—
26
—
ns
VGS = 10 V
Turn-off delay time
td(off)
—
45
—
ns
RL = 15 Ω
Fall time
tf
—
24
—
ns
Body to drain diode forward
voltage
VDF
—
1.0
—
V
IF = 4 A, VGS = 0
Body to drain diode reverse
recovery time
trr
—
125
—
ns
IF = 4 A, VGS = 0,
diF/dt = 100 A/µs
Note:
1. Pulse Test
See characteristic curves of 2SK1957
3
4AM15
Electrical Characteristics (Ta = 25°C)
P Channel
Item
Symbol
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V(BR)DS –200
S
Min
—
—
V
ID = –10 mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GS ±20
S
—
—
V
IG = ±100 µA, VDS = 0
Gate to source leak current
IGSS
—
—
±10
µA
VGS = ±16 V, VDS = 0
Zero gate voltage drain current IDSS
—
—
–250
µA
VDS = –160 V, VGS = 0
Gate to source cutoff voltage
VGS(off) –2.0
—
–4.0
V
ID = –1 mA, VDS = –10 V
Static drain to source on state
resistance
RDS(on) —
0.7
0.9
Ω
ID = –2 A, VGS = –10 V*1
Forward transfer admittance
|yfs|
3.0
—
S
ID = –2 A
1.5
VDS = –10 V*1
Input capacitance
Ciss
—
920
—
pF
VDS = –10 V
Output capacitance
Coss
—
23 0
—
pF
VGS = 0
Reverse transfer capacitance
Crss
—
70
—
pF
f = 1 MHz
Turn-on delay time
td(on)
—
17
—
ns
ID = –2 A
Rise time
tr
—
40
—
ns
VGS = –10 V
Turn-off delay time
td(off)
—
85
—
ns
RL = 15 Ω
Fall time
tf
—
45
—
ns
Body to drain diode forward
voltage
VDF
—
–1.0
—
V
IF = –4 A, VGS = 0
Body to drain diode reverse
recovery time
trr
—
170
—
ns
IF = –4 A, VGS = 0,
diF/dt = 100 A/µs
Note:
4
1. Pulse Test
4AM15
5
4AM15
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part of this document without Hitachi’s permission.
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any other reasons during operation of the user’s unit according to this document.
4. Circuitry and other examples described herein are meant merely to indicate the characteristics and
performance of Hitachi’s semiconductor products. Hitachi assumes no responsibility for any
intellectual property claims or other problems that may result from applications based on the
examples described herein.
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party or Hitachi, Ltd.
6. MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in MEDICAL
APPLICATIONS without the written consent of the appropriate officer of Hitachi’s sales company.
Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi’s products
are requested to notify the relevant Hitachi sales offices when planning to use the products in
MEDICAL APPLICATIONS.
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