TLC5971 www.ti.com SBVS146 – AUGUST 2010 12-Channel, 16-Bit, Enhanced Spectrum, PWM, RGB, LED Driver with 3.3-V Linear Regulator Check for Samples: TLC5971 FEATURES APPLICATIONS • • • • 1 • • • • • • • • • • DESCRIPTION The TLC5971 is a 12-channel, constant-current sink driver. Each output channel has individually adjustable currents with 65536 PWM grayscale (GS) steps. Also, each color group can be controlled by 128 constant-current sink steps with the global brightness control (BC) function. GS control and BC are accessible via a two-wire signal interface. The maximum current value for each channel is set by a single external resistor. All constant-current outputs are turned off when the IC is in an over-temperature condition. VCC Power Supply (6 V to 17 V) GND GND VCC VREG OUTR0 IREF OUTG0 ¼ 1 mF GND 1 mF OUTR0 IREF OUTG0 OUTG3 Controller VCC VREG OUTG3 OUTB3 OUTB3 DATA SDTI SDTO SDTI SDTO CLK SCKI SCKO SCKI SCKO GND TLC5971 ¼ • RGB LED Cluster Lamp Displays ¼ • 12 Constant-Current Sink Output Channels Current Capability: 60 mA per channel Grayscale (GS) Control with Enhanced Spectrum PWM: 16-bit (65536 steps) Global Brightness Control (BC): 7-bit (128 steps) Power-Supply Voltage Range: Internal linear regulator: 6 V to 17 V Direct power supply: 3 V to 5.5 V LED Supply Voltage: Up to 17 V Constant-Current Accuracy: – Channel-to-Channel = ±1% (typ) – Device-to-Device = ±1% (typ) Data Transfer Rate: 20 MHz Linear Voltage Regulator: 3.3 V Auto Display Repeat Function Display Timing Reset Function Internal/External Selectable GS Clock Thermal Shutdown (TSD) with Auto Restart Unlimited Device Cascading Operating Temperature Range: –40°C to +85°C ¼ 23 TLC5971 NOTE: The number of LEDs in series changes, depending on the VCC voltage. Typical Application Circuit Example (Internal Linear Regulator Using VCC = 6 V to 17 V) 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incoporated. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TLC5971 SBVS146 – AUGUST 2010 www.ti.com DESCRIPTION (CONTINUED) VCC Power Supply (3 V to 5.5 V) GND VCC GND VCC VREG OUTR0 IREF OUTG0 IREF OUTG0 ¼ ¼ OUTR0 ¼ VREG OUTG3 Controller OUTG3 OUTB3 OUTB3 DATA SDTI SDTO SDTI SDTO CLK SCKI SCKO SCKI SCKO GND ¼ GND TLC5971 TLC5971 Typical Application Circuit Example (Direct Power Supplying VCC = 3 V to 5.5 V) This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD TLC5971 HTSSOP-20 PowerPAD™ TLC5971 (1) 2 QFN-24 4.0 mm × 4.0 mm ORDERING NUMBER TRANSPORT MEDIA, QUANTITY TLC5971PWPR Tape and Reel, 2000 TLC5971PWP Tube, 70 TLC5971RGER Tape and Reel, 3000 TLC5971RGET Tape and Reel, 250 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 ABSOLUTE MAXIMUM RATINGS (1) (2) Over operating free-air temperature range, unless otherwise noted. VALUE MIN Supply voltage Input voltage Output voltage –0.3 +18 V IREF –0.3 VREG + 0.3 V SDTI, SCKI –0.3 VREG + 0.6 V OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3 –0.3 +18 V SDTO, SCKO –0.3 VREG + 0.3 V VREG –0.3 +6 V 75 mA –30 mA +150 °C VREG Operating junction temperature TJ Storage temperature Tstg Electrostatic discharge rating (2) UNIT VCC OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3 Output current (DC) (1) MAX (max) +150 °C Human body model (HBM) –55 4 kV Charged device model (CDM) 2 kV Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. THERMAL INFORMATION TLC5971 THERMAL METRIC (1) TLC5971 PWP RGE 20 PINS 24 PINS qJA Junction-to-ambient thermal resistance 68.6 38 qJCtop Junction-to-case (top) thermal resistance 44.2 40.5 qJB Junction-to-board thermal resistance 19.3 10.2 yJT Junction-to-top characterization parameter 2.7 0.3 yJB Junction-to-board characterization parameter 15.7 10 qJCbot Junction-to-case (bottom) thermal resistance 1.8 2.9 (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. DISSIPATION RATINGS PACKAGE DERATING FACTOR ABOVE TA = +25°C POWER RATING TA < +25°C POWER RATING TA = +70°C POWER RATING TA = +85°C HTSSOP 20-pin with PowerPAD soldered (1) 25.7 mW/°C 3121 mW 1998 mW 1623 mW QFN 24-pin exposed thermal pad soldered (2) 24.8 mW/°C 3106 mW 1988 mW 1615 mW (1) (2) With PowerPAD soldered onto copper area on TI recommended printed circuit board (PCB); 2-oz. copper. For more information, see application report SLMA002, PowerPAD Thermally-Enhanced Package (available for download at www.ti.com). The package thermal impedance is calculated in accordance with JESD51-5. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 3 TLC5971 SBVS146 – AUGUST 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS At TA = –40°C to +85°C, and VCC = 6 V to 17 V or VCC = VREG = 3 V to 5.5 V, unless otherwise noted. TLC5971 MIN UNIT NOM MAX 17 V 3.3 5.5 V 17 V DC CHARACTERISTICS VCC Supply voltage, internal voltage regulator used 6 VREG Supply voltage, VREG connected to VCC 3 VO Voltage applied to output (OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3) VIH High-level input voltage (SDTI, SCKI) 0.7 × VREG VREG V VIL Low-level input voltage (SDTI, SCKI) GND 0.3 × VREG V VIHYS Input voltage hysteresis (SDTI, SCKI) IOH High-level output current (SDTO) –2 mA IOL Low-level output current (SDTO) 2 mA IOLC Constant output sink current (OUTR0 to OUTR3, OUTG0 to OUTG3, OUTB0 to OUTB3) 60 mA IREG Voltage regulator output current (VREG) –25 mA TA Operating free temperature range –40 +85 °C TJ Operating junction temperature –40 +125 °C 0.007 20 0.2 × VREG V AC CHARACTERISTICS fCLK (SCKI) Data clock frequency and GS control clock frequency, SCKI tWH/tWL Pulse duration, SCKI tSU tH MHz 10 ns Setup time, SDTI – SCKI↑ 5 ns Hold time, SDTI – SCKI↑ 3 ns ELECTRICAL CHARACTERISTICS At TA = –40°C to +85°C, VCC = 6 V to 17 V or VCC = VREG = 3 V to 5.5 V, VLED = 5 V, and CVREG = 1 µF, unless otherwise noted. Typical values are at TA = +25°C and VCC = 12 V. TLC5971 PARAMETER TEST CONDITIONS VOH High-level output voltage, SDTO/SCKO IOH = –2 mA VOL Low-level output voltage, SDTO/SCKO IOL = 2 mA II Input current, SDTI/SCKI VI = VREG or GND MIN MAX UNIT VREG – 0.4 TYP VREG V 0 0.4 V –1 1 µA ICC SDTI/SCKI = low, BLANK = 1, GSn = FFFFh, BCX = 7Fh, VOUTXn = 1 V, RIREF = 24 kΩ (IOLCMax = 2 mA) 2 4 mA ICC1 SDTI/SCKI = low, BLANK = 1, GSn = FFFFh, BCX = 7Fh, VOUTXn = 1 V, RIREF = 1.6 kΩ (IOLCMax = 30 mA) 6 9 mA ICC2 SDTI = 10 MHz, SCKI = 20 MHz, BLANK = 0, auto repeat enable, external GS clock selected, GSn = FFFFh, BCX = 7Fh, VOUTXn = 1 V, RIREF = 1.6 kΩ (IOLCMax = 30 mA) 14 22 mA ICC3 SDTI = 10 MHz, SCKI = 20 MHz, BLANK = 0, auto repeat enable, external GS clock selected, GSn = FFFFh, BCX = 7Fh, VOUTXn = 1 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA) 21 36 mA 60.5 64.7 mA 0.1 µA ±3 % Supply current IOLC Constant output current, OUTXn All OUTXn on, BCX = 7Fh, VOUTXn = 1 V, VOUTfix = 1 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA) IOLKG Leakage output current, OUTXn All OUTXn on, BCX = 7Fh, VOUTXn = 17 V, VOUTfix = 17 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA) 56.3 (1) Constant-current error (channel-to-channel in same color group), OUTXn ΔIOLC (1) All OUTXn on, BCX = 7Fh, VOUTXn = VOUTfix = 1 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA) ±1 The deviation of each output in the same color group (OUTR0-OUTR3 or OUTG0-OUTG3 or OUTB0-OUTB3) from the average current from the same color group. Deviation is calculated by the formula: D (%) = IOLCXn -1 ´ 100 (IOLCX0 + IOLCX1 + IOLCX2 + IOLCX3) 4 Where: X = R/G/B, and n = 0-3 4 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 ELECTRICAL CHARACTERISTICS (continued) At TA = –40°C to +85°C, VCC = 6 V to 17 V or VCC = VREG = 3 V to 5.5 V, VLED = 5 V, and CVREG = 1 µF, unless otherwise noted. Typical values are at TA = +25°C and VCC = 12 V. TLC5971 PARAMETER TEST CONDITIONS TYP MAX ±1 ±4 % All OUTn on, BCX = 7Fh, VOUTXn = VOUTfix = 1 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA) ±0.5 ±1 %/V Load regulation of constant-current output, OUTXn (4) All OUTn on, BCX = 7Fh, VOUTXn = VOUTfix = 1 V, RIREF = 0.82 kΩ (IOLCMax = 60 mA) ±1 ±3 %/V TTSD Thermal shutdown temperature Junction temperature (5) 150 165 180 °C THYS Thermal shutdown hysteresis Junction temperature (5) 5 10 20 °C VIREF Reference voltage output, IREF RIREF = 0.82 kΩ 1.18 1.21 1.24 V VREG Linear regulator output voltage, VREG VCC = 6 V to 17 V, IREG = 0 mA to –25 mA 3.1 3.3 3.5 V ΔVREG Line regulation of linear regulator, VREG VCC = 6 V to 17 V, IREG = 0 mA 90 mV ΔVREG1 Load regulation of linear regulator, VREG VCC = 12 V, IREG = 0 mA to –25 mA 120 mV VSTR Undervoltage lockout release, VREG 2.5 2.7 2.9 V VHYS Undervoltage lockout hysteresis, VREG 300 400 500 mV ΔIOLC1 Constant current error (2) (device-to-device in same color group), OUTXn All OUTXn on, BCX = 7Fh, VOUTXn = VOUTfix = 1V, RIREF = 0.82 kΩ (IOLCMax = 60 mA), at same grouped color output of OUTR0-3, OUTG0-3, and OUTB0-3 ΔIOLC2 Line regulation of constant-current output, OUTXn (3) ΔIOLC3 (2) MIN UNIT The deviation of each color group constant-current average from the ideal constant-current value. Deviation is calculated by the following formula: (IOLCX0 + IOLCX1 + IOLCX2 + IOLCX3) - (Ideal Output Current) 4 D (%) = ´ 100 Ideal Output Current Where: X = R/G/B. Ideal current is calculated by the following formula for the OUTRn and OUTGn groups: IOLCXn(IDEAL) (mA) = 41 ´ (3) 1.21 RIREF (W) Where: X = R/G/B. Line regulation is calculated by this equation: D (%/V) = (IOLCXn at VCC = 5.5 V) - (IOLCXn at VCC = 3 V) (IOLCXn at VCC = 3 V) (4) 5.5 V - 3 V Where: X = R/G/B, n = 0-3. Load regulation is calculated by the equation: D (%/V) = (IOLCXn at VOUTXn = 3 V) - (IOLCXn at VOUTXn = 1 V) 100 ´ (IOLCXn at VOUTXn = 1 V) (5) 100 ´ 3V-1V Where: X = R/G/B, n = 0-3. Not tested, specified by design. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 5 TLC5971 SBVS146 – AUGUST 2010 www.ti.com SWITCHING CHARACTERISTICS At TA = –40°C to +85°C, VCC = 6 V to 17 V or VCC = VREG = 3 V to 5.5 V, CVREG = 1 µF, CL = 15 pF, RL = 68 Ω, and VLED = 5 V, unless otherwise noted. Typical values are at TA = +25°C and VCC = 12 V. TLC5971 PARAMETER tR0 Rise time, SDTO/SCKO tR1 Rise time, OUTXn tF0 Fall time, SDTO/SCKO tF1 Fall time, OUTXn TEST CONDITIONS MIN BCX = 7Fh BCX = 7Fh TYP MAX 3 10 UNIT ns 5 15 ns 3 10 ns 15 25 ns tD0 SCKI↑ to SDTO↑↓ 10 25 60 ns tD1 SCKI↑ to SCKO↑ 5 15 40 ns tD2 (1) SCKO↑ to SDTO↑↓ 5 10 20 ns tD3 SCKI↑ to OUTRn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 1 Or SCKI↓ to OUTRn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 0 10 25 60 ns tD4 SCKI↑ to OUTGn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 1 Or SCKI↓ to OUTGn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 0 25 50 90 ns tD5 SCKI↑ to OUTBn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 1 Or SCKI↓ to OUTBn↑↓, BLANK = 0, BCXn = 7Fh, OUTTMG = 0 40 75 120 ns tD6 (2) Last SCKI↑ to internal latch pulse genaration 16384/fO sec Propagation delay tW(SCKO) Shift clock output one pulse width fOSC Internal oscillator frequency (1) (2) 6 SCKO↑ to SCKO↓ 8/fOSC SC 12 25 35 ns 6 10 12 MHz The propagation delays are calculated by tD2 = tD0 – tD1. The generation timing of the internal latch pulse changes depending on the SCKI clock frequency; see the Internal Latch Pulse Generation Timing section. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 FUNCTIONAL BLOCK DIAGRAM VCC 3.3 V REG VREG MSB LSB SDTI SCKI UVLO reset 224-Bit Shift Register Clock Timing Adjust SDTO 0 223 SCKO 6 Write Command Decode 218 wrtena MSB LSB intlat Data Latch Control 218-Bit Data Latch reset 0 26 EXTCLK 1 intlat BLANK TMGRST 2 192 GS Clock Counter Clock Select Internal Oscillator 3 BLANK DSPRPT OUTTMG GSX 16 217 Thermal Detection 16-Bit ES-PWM Timing Control 12 21 3-Grouped Switching Delay BCX IREF Reference Current Control 12 12-Channel Constant Sink Current Driver with 7-Bit, 3-Grouped BC GND OUTR0 OUTG0 OUTB0 OUTR3 OUTG3 OUTB3 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 7 TLC5971 SBVS146 – AUGUST 2010 www.ti.com PIN CONFIGURATIONS PWP PACKAGE HTSSOP-20 PowerPAD (TOP VIEW) OUTB1 OUTG1 OUTR1 OUTB0 OUTG0 OUTR0 24 23 22 21 20 19 RGE PACKAGE QFN-24 (TOP VIEW) IREF 1 20 VREG GND 2 19 VCC OUTR0 3 18 OUTB3 OUTG0 4 17 OUTG3 SDTI 1 18 GND OUTB0 5 16 OUTR3 SCKI 2 17 NC OUTR1 6 15 OUTB2 NC (1) 3 16 IREF OUTG1 7 14 OUTG2 NC 4 15 VREG OUTB1 8 13 OUTR2 SCKO 5 14 NC SDTI 9 12 SDTO SDTO 6 13 VCC SCKI 10 11 SCKO 7 8 9 10 11 12 OUTG2 OUTB2 OUTR3 OUTG3 OUTB3 Thermal Pad (Bottom Side) OUTR2 PowerPAD (Bottom Side) (1) NC = not connected TERMINAL FUNCTIONS TERMINAL NAME PWP RGE I/O DESCRIPTION SDTI 9 1 I Serial data input for the 224-bit shift register SCKI 10 2 I Serial data shift clock input. Data present on SDTI are shifted to the LSB of the 224-bit shift register with the SCKI rising edge Data in the shift register are shifted toward the MSB at each SCKI rising edge. The MSB data of the shift register appear on SDTO. SDTO 12 6 O Serial data output of the 224-bit shift register. SDTO is connected to the MSB of the 224-bit shift register. Data are clocked out at the SCKI rising edge. SCKO 11 5 O Serial data shift clock output. The input shift clock signal from SCKI is adjusted to the timing of the serial data output for SDTO and the signal is then output at SCKO. VREG 20 15 I/O Internal linear voltage regulator output. A decoupling capacitor of 1 µF must be connected. This output can be used for external devices as a 3.3-V power supply. This terminal can be connected with the VREG terminal of other devices to increase the supply current. Also, this pin can be supplied with 3 V to 5.5 V from an external power supply by connecting it to VCC. IREF 1 16 I/O Maximum current programming terminal. A resistor connected between IREF and GND sets the maximum current for every constant-current output. When this terminal is directly connected to GND, all outputs are forced off. The external resistor should be placed close to the device. OUTR0 3 19 O OUTR1 6 22 O OUTR2 13 7 O OUTR3 16 10 O OUTG0 4 20 O OUTG1 7 23 O OUTG2 14 8 O OUTG3 17 11 O 8 RED constant-current outputs. Multiple outputs can be configured in parallel to increase the constant-current capability. Different voltages can be applied to each output. GREEN constant-current outputs. Multiple outputs can be configured in parallel to increase the constant-current capability. Different voltages can be applied to each output. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 TERMINAL FUNCTIONS (continued) TERMINAL NAME PWP RGE I/O OUTB0 5 21 O OUTB1 8 24 O OUTB2 15 9 O OUTB3 18 12 O VCC 19 13 — GND, PowerPAD (PWP) 2 — — GND, exposed thermal pad (RGE) — 18 — NC — 3, 4, 14, 17 — DESCRIPTION BLUE constant-current outputs. Multiple outputs can be configured in parallel to increase the constant-current capability. Different voltages can be applied to each output. Power-supply terminal Power ground terminal No internal connection Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 9 TLC5971 SBVS146 – AUGUST 2010 www.ti.com PARAMETRIC MEASUREMENT INFORMATION PIN EQUIVALENT INPUT/OUTPUT SCHEMATICS VREG VREG INPUT OUTPUT GND GND Figure 1. SDTI/SCKI Figure 2. SDTO/SCKO OUTXn (1) GND (1) X = R/G/B, n = 0-3. Figure 3. OUTR0 Through OUTB3 TEST CIRCUITS VCC RL VCC VREG (1) VLED OUTXn VCC IREF CVREG RIREF VREG (2) CL GND VCC SDTO/SCKO (1) CVREG GND CL (1) X = R/G/B, n = 0-3. (2) CL includes measurement probe and stray capacitance. Figure 4. Rise/Fall Time Test Circuit for OUTXn (1) CL includes measurement probe and stray capacitance. Figure 5. Rise/Fall Time Test Circuit for SDTO/SCKO VCC OUTR0 ¼ ¼ VREG (1) OUTXn VCC IREF CVREG OUTB3 RIREF VOUTXn GND VOUTfix (1) X = R/G/B, n = 0-3. Figure 6. Constant-Current Test Circuit for OUTXn 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 TIMING DIAGRAMS TWH, TWL: VREG SCKI (1) 50% GND TWH TWL TSU, TH: VREG SCKI (1) 50% GND TSU TH VREG (1) SDTI 50% GND (1) Input pulse rise and fall time is 1ns to 3ns. Figure 7. Input Timing tR0, tR1, tF0, tF1, tD0, tD1, tD2, tD3, tD4, tD5: VREG INPUT (1) 50% GND tD VOH or VOUTXnH 90% OUTPUT 50% 10% VOL or VOUTXnL tR or tF (1) Input pulse rise and fall time is 1ns to 3ns. Figure 8. Output Timing Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 11 TLC5971 SBVS146 – AUGUST 2010 www.ti.com Write Command (6 Bits) SDTI DATA 0A WRT CMD4 WRT CMD5 Write Data (218 Bits) WRT CMD0 DATA 217B DATA 1B DATA 2B DATA 0B WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217C DATA 216C 1 2 3 4 5 6 7 8 DATA 215C tH tSU tWH SCKI 1 2 222 6 223 224 9 tWL DATA 0A WRT CMD5 WRT CMD4 WRT CMD0 DATA 217B DATA 2B DATA 1B DATA 0B WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217C DATA 216C 224-Bit Shift Register LSB + 1 (Internal) DATA 1A DATA 0A WRT CMD5 WRT CMD1 WRT CMD0 DATA 3B DATA 2B DATA 1B DATA 0B WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217C 224-Bit Shift Register MSB - 1 (Internal) WRT CMD4 WRT CMD3 WRT CMD2 DATA 216A DATA 215A DATA 0A WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217B DATA 216B DATA 215B DATA 214B 224-Bit Shift Register MSB (Internal) WRT CMD5 WRT CMD4 WRT CMD3 DATA 217A DATA 216A DATA 1A DATA 0A WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217B DATA 216B DATA 215B ¼ ¼ ¼ ¼ 224-Bit Shift Register LSB (Internal) tD6 (2) Latch Signal (Internal) Latch Data (Internal) Latest Data (All GS Data are 0001h) Previous Data 1 BLANK Bit in Data Latch (Internal) 0 1 EXTGCK Bit in Data Latch (Internal) 0 OUTTMG Bit in Data Latch (Internal) 0 1 tD0 SDTO WRT CMD5 WRT CMD4 WRT CMD3 tD1 DATA 217A DATA 216A tW(SCKO) DATA 1A DATA 0A WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217B DATA 216B DATA 215B tR0/tF0 SCKO OUTR0-R3 OFF ON OFF OUTG0-G3 ON OFF OUTB0-B3 ON tF1 (VOUTXnH) (1) (VOUTXnL) tR1 tD3 (VOUTXnH) (1) (VOUTXnL) tD4 (VOUTXnH) (1) (VOUTXnL) tD5 (1) OUTXn on-off timing depends on previous GS data in the 218-bit data latch. (2) The propagation delay time shows the period from the rising edge of the last SCKI, not the 224th SCKI to the internal latch signal generation. Figure 9. Data Write and OUTXn Switching Timing (OUTTMG = 1) 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 Write Command (6 Bits) SDTI DATA 0A WRT CMD4 WRT CMD5 Write Data (218 Bits) WRT CMD0 DATA 217B DATA 1B DATA 2B WRT CMD5 DATA 0B WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217C DATA 216C DATA 215C tH tSU tWH SCKI 1 2 222 6 223 224 1 2 3 4 5 6 7 8 9 tWL DATA 0A WRT CMD5 WRT CMD4 WRT CMD0 DATA 217B DATA 2B DATA 1B DATA 0B WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217C DATA 216C 224-Bit Shift Register LSB + 1 (Internal) DATA 1A DATA 0A WRT CMD5 WRT CMD1 WRT CMD0 DATA 3B DATA 2B DATA 1B DATA 0B WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217C 224-Bit Shift Register MSB - 1 (Internal) WRT CMD4 WRT CMD3 WRT CMD2 DATA 216A DATA 215A DATA 0A WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217B DATA 216B DATA 215B DATA 214B 224-Bit Shift Register MSB (Internal) WRT CMD5 WRT CMD4 WRT CMD3 DATA 217A DATA 216A DATA 1A DATA 0A WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217B DATA 216B DATA 215B ¼ ¼ ¼ ¼ 224-Bit Shift Register LSB (Internal) tD6 (2) Latch Signal (Internal) Latch Data (Internal) Latest Data (All GS Data are 0001h) Previous Data 1 BLANK Bit in Data Latch (Internal) 0 1 EXTGCK Bit in Data Latch (Internal) 0 1 OUTTMG Bit in Data Latch (Internal) 0 tD0 SDTO WRT CMD5 WRT CMD4 WRT CMD3 tD1 DATA 217A DATA 216A tW(SCKO) DATA 1A DATA 0A WRT CMD5 WRT CMD4 WRT CMD3 WRT CMD2 WRT CMD1 WRT CMD0 DATA 217B DATA 216B DATA 215B tR0/tF0 SCKO OUTR0-R3 OFF ON OFF OUTG0-G3 ON OFF OUTB0-B3 ON tF1 (VOUTXnH) (1) (VOUTXnL) tR1 tD3 (VOUTXnH) (1) (VOUTXnL) tD4 (VOUTXnH) (1) (VOUTXnL) tD5 (1) OUTXn on-off timing depends on previous GS data in the 218-bit data latch. (2) The propagation delay time shows the period from the rising edge of the last SCKI, not the 224th SCKI to the internal latch signal generation. Figure 10. Data Write and OUTXn Switching Timing (OUTTMG = 0) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 13 TLC5971 SBVS146 – AUGUST 2010 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C and VCC = 24 V, unless otherwise noted. REFERENCE RESISTOR vs OUTPUT CURRENT POWER DISSIPATION vs TEMPERATURE 4000 Power Dissipation Rate (mW) RIREF, Reference Resistor (kW) 100 24.805 9.922 10 4.961 3.307 1.984 2.481 1.102 0.902 1.240 0.992 0.827 1.654 1 0.1 1.417 3000 2000 1000 TLC5971PWP TLC5971RGE 0 0 10 20 30 40 50 70 60 -40 -20 0 20 Figure 11. OUTPUT CURRENT vs OUTPUT VOLTAGE OUTPUT CURRENT vs OUTPUT VOLTAGE TA = +25°C, VCC = 12 V, BCx = 7Fh IOLCMax = 60 mA 62 IOLCMax = 50 mA 50 IOLCMax = 40 mA 40 IOLCMax = 30 mA 30 IOLCMax = 20 mA 20 IOLCMax = 5 mA IOLCMax = 2 mA IOLCMax = 60 mA VCC = 12 V BCx = 7Fh 63 Output Current (mA) Output Current (mA) 100 80 64 60 IOLCMax = 10 mA 10 0 61 60 59 58 57 TA = -40°C 56 TA = +25°C 55 TA = +85°C 54 0 0.5 1 1.5 2 2.5 0 3 0.5 1 1.5 2 3 2.5 Output Voltage (V) Output Voltage (V) Figure 13. Figure 14. CONSTANT-CURRENT ERROR vs OUTPUT CURRENT (Channel-to-Channel in Color Group) CONSTANT-CURRENT ERROR vs AMBIENT TEMPERATURE (Channel-to-Channel in Color Group) 3 3 TA = +25°C VCC = 12 V BCx = 7Fh 2 IOLCMax = 60 mA VCC = 12 V BCx = 7Fh 2 1 DIOLC (%) 1 DIOLC (%) 60 Figure 12. 70 0 0 -1 -1 -2 -2 -3 -3 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Output Current (mA) Figure 15. 14 40 Free-Air Temperature (°C) IOLC, Output Current (mA) Figure 16. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 TYPICAL CHARACTERISTICS (continued) At TA = +25°C and VCC = 24 V, unless otherwise noted. GLOBAL BRIGHTNESS CONTROL LINEARITY SUPPLY CURRENT vs OUTPUT CURRENT 70 30 TA = +25°C VCC = 12 V 60 25 IOLCMax = 60 mA 50 20 ICC (mA) Output Current (mA) TA = +25°C, VCC = 12 V BCx = 7Fh, GSx = FFFFh EXTGCK = 1, DSPRPT = 1 SDTI = 10 MHz, SCKI = 20 MHz 40 IOLCMax = 2 mA IOLCMax = 30 mA 30 15 10 20 IOLCMax = 10 mA 5 10 0 0 0 16 48 32 64 80 96 112 128 0 10 20 Brightness Control Data (dec) 50 Figure 18. SUPPLY CURRENT vs AMBIENT TEMPERATURE LINEAR REGULATOR OUTPUT VOLTAGE vs LINEAR REGULATOR OUTPUT CURRENT Linear Regulator Output Voltage, VREG (V) 25 20 ICC (mA) 40 Figure 17. 30 15 10 IOLCMax = 60 mA, VCC = 12 V BCx = 7Fh, GSx = FFFFh EXTGCK = 1, DSPRPT = 1 SDTI = 10 MHz, SCKI = 20 MHz 5 0 -40 0 -20 20 40 60 3.5 80 100 3.45 3.4 3.35 3.3 3.25 TA = +25°C, IOLCMax = 60 mA, VCC = 12 V BCx = 7Fh, GSx = FFFFh EXTGCK = 0, DSPRPT = 1 3.2 3.15 3.1 0 5 10 15 25 20 Linear Regulator Output Current, IREG (mA) Figure 19. Figure 20. LINEAR REGULATOR OUTPUT VOLTAGE vs SUPPLY VOLTAGE CONSTANT-CURRENT OUTPUT VOLTAGE WAVEFORM TA = +25°C, IOLCMax = 60 mA, BCx = 7Fh, GSx = FFFFh EXTGCK = 0, DSPRPT = 1 3.45 60 3.5 Ambient Temperature (°C) Linear Regulator Output Voltage, VREG (V) 30 Output Current (mA) CH1 (OUTR0) CH1 (2 V/div) 3.4 3.35 CH2 (2 V/div) CH 2 (OUTG0) TA = +25°C, VCC = 12 V IOLCMax = 60 mA, BCx = 7Fh, GSXn = 0001h, VLED = 5 V, RL = 68 W, OUTTMG = 1 IREG = 0 mA 3.3 3.25 CH3 (OUTB0) IREG = -25 mA CH3 (2 V/div) 3.2 3.15 CH4 (SCKI) CH4 (5 V/div) 3.1 6 8 10 12 14 16 18 Time (20 ns/div) Supply Voltage, VCC (V) Figure 21. Figure 22. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 15 TLC5971 SBVS146 – AUGUST 2010 www.ti.com APPLICATION INFORMATION MAXIMUM CONSTANT SINK CURRENT SETTING The maximum constant sink current value for each channel, IOLCMax, is programmed through a single resistor, RIREF, placed between IREF and GND. The desired value can be calculated with Equation 1: RIREF (kW) = VIREF (V) IOLCMax (mA) ´ 41 Where: VIREF = the internal reference voltage on the IREF pin (1.21 V, typically, when the the global brightness control data are at maximum), IOLCMax = 2 mA to 60 mA. (1) IOLCMax is the maximum current for each output. Each output sinks the IOLCMax current when it is turned on and global brightness control data (BC) are set to the maximum value of 7Fh (127d). RIREF must be between 0.82 kΩ and 24.8 kΩ to hold IOLCMax between 60 mA (typical) and 2 mA (typical). Otherwise, the output may be unstable. Output currents lower than 2 mA can be achieved by setting IOLCMax to 2 mA or higher and then using global brightness control to lower the output current. The constant-current sink values for specific external resistor values are shown in Figure 11 and Table 1. Table 1. Maximum Constant-Current versus External Resistor Value 16 IOLCMax (mA) RIREF (kΩ, Typical) 60 0.827 55 0.902 50 0.992 45 1.1 40 1.24 35 1.42 30 1.65 25 1.98 20 2.48 15 3.31 10 4.96 5 9.92 2 24.8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 GLOBAL BRIGHTNESS CONTROL (BC) FUNCTION (SINK CURRENT CONTROL) The TLC5971 has the capability to adjust all output currents of each color group (OUTR0-3, OUTG0-3, and OUTB0-3) to the same current value. This function is called global brightness (BC) control. The BC data are seven bits long, which allows each color group output current to be adjusted in 128 steps from 0% to 100% of the maximum output current, IOLCMax. The BC data are set via the serial interface. When the BC data are changed, the output current is changed immediately. When the IC is powered on, all outputs are forced off by BLANK (bit 213). BLANK initializes in the data latch but the data in the 224-bit shift register and the 218-bit data latch are not set to a default value, except for the BLANK bit. Therefore, BC data must be written to the data latch when BLANK is set to '0'. Equation 2 determines each color group maximum output sink current: IOUT (mA) = IOLCMax (mA) ´ BCX 127d Where: IOLCMax = the maximum channel current for each channel determined by RIREF BC = the global brightness control value in the data latch for the specific color group (BCX = 0d to 127d, X = R/G/B) (2) Table 2 summarizes the BC data value versus the output current ratio and set current value. Table 2. BC Data versus Current Ratio and Set Current Value OUTPUT CURRENT RATIO TO IOLCMax (%, Typical) BC DATA (Binary) BC DATA (Decimal) BC DATA (Hex) 60 mA IOLCMax (mA, Typical) 2 mA IOLCMax (mA, Typical) 000 0000 0 00 0 0 0 000 0001 1 01 0.8 0.47 0.02 000 0010 2 02 1.6 0.94 0.03 — — — — — — 111 1101 125 7D 98.4 59.06 1.97 111 1110 126 7E 99.2 59.53 1.98 111 1111 127 7F 100 60 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 17 TLC5971 SBVS146 – AUGUST 2010 www.ti.com GRAYSCALE (GS) FUNCTION (PWM CONTROL) The TLC5971 can adjust the brightness of each output channel using the enhanced spectrum pulse width modulation (ES-PWM) control scheme. The PWM bit length for each output is 16 bits. The use of the 16-bit length results in 65536 brightness steps from 0% to 100% brightness. The PWM operation for all color groups is controlled by a 16-bit grayscale (GS) counter. The GS counter increments on each rising or falling edge of the external or internal GS reference clock that is selected by OUTTMG (bit 217) and EXTGCK (bit 216) in the data latch. When the external GS clock is selected, the GS counter uses the SCKI clock as the grayscale clock. The GS counter is reset to 0000h and all outputs are forced off when BLANK (bit 213) is set to '1' in the data latch and the counter value is held at '0' while BLANK is '1', even if the GS reference clock is toggled in between. Equation 3 calculates each output (OUTXn) total on-time (tOUT_ON): tOUT_ON (ns) = tGSCLK (ns) ´ GSXn Where: tGSCLK = one period of the selected GS reference clock (internal clock = 100ns typical, external clock = the period of SCKI) GSXn = the programmed GS value for OUTXn (0d to 65535d) (3) Table 3 summarizes the GS data values versus the output total on-time and duty cycle. When the IC is powered up, BLANK (bit 213) is set to '1' to force all outputs off; however, the 224-bit shift register and the 218-bit data latch are not set to default values. Therefore, the GS data must be written to the data latch when BLANK (bit 213) is set to '0'. Table 3. Output Duty Cycle and Total On-Time versus GS Data GS DATA (decimal) GS DATA (hex) 0 1 18 ON-TIME DUTY (%) GS DATA (decimal) GS DATA (hex) ON-TIME DUTY (%) 0 0 32768 8000 50.001 1 0.002 32769 8001 50.002 2 2 0.003 32770 8002 50.004 3 3 0.005 32771 8003 50.005 — — — — — — 8191 1FFF 12.499 40959 9FFF 62.499 8192 2000 12.5 40960 A000 62.501 8193 2001 12.502 40961 A001 62.502 — — — — — — 16383 3FFF 24.999 49149 BFFF 74.997 16384 4000 25 49150 C000 74.998 16385 4001 25.002 49151 C001 75 — — — — — — 24575 5FFF 37.499 57343 DFFF 87.5 24576 6000 37.501 57344 E000 87.501 24577 6001 37.502 57345 E001 87.503 — — — — — — 32765 7FFD 49.996 65533 FFFD 99.997 32766 7FFE 49.998 65534 FFFE 99.998 32767 7FFF 49.999 65535 FFFF 100 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 ENHANCED SPECTRUM (ES) PWM CONTROL Enhanced spectrum (ES) PWM has the total display period divided into 128 display segments. The total display period refers the period between the first grayscale clock input to the 65536th grayscale clock input after BLANK (bit 213) is set to '0'. Each display period has 512 grayscale values, maximum. Each output on-time changes depending on the grayscale data. Refer to Table 4 for sequence information and Figure 23 for timing information. Table 4. ES-PWM Drive Turn-On Time Length GS DATA (dec) GS DATA (hex) OUTn DRIVER OPERATION 0 0000h Does not turn on 1 0001h Turns on during one GS clock period in the 1st display period 2 0002h Turns on during one GS clock period in the 1st and 65th display period 3 0003h Turns on during one GS clock period in the 1st, 33rd, and 65th display period 4 0004h Turns on during one GS clock period in the 1st, 33rd, 65th, and 97th display period 5 0005h Turns on during one GS clock period in the 1st, 17th, 33rd, 65th, and 97th display period 6 0006h Turns on during one GS clock period in the 1st, 17th, 33rd, 65th, 81st, and 97th display period The number of display periods that OUTXn is turned on during one GS clock is incremented by the GS data increasing in the following order. The order of display periods that the output turns on are: 1, 65, 33, 97, 17, 81, 49, 113, 9, 73, 41, 105, 25, 89, 57, 121, 5, 69, 37, 101, 21, 85, 53, 117, 13, 77, 45, 109, 29, 93, 61, 125, 3, 67, 35, 99, 19, 83, 51, 115, 11, 75, 43, 107, 27, 91, 59, 123, 7, 71, 39, 103, 23, 87, 55, 119, 15, 79, 47, 111, 31, 95, 63, 127, 2, 66, 34, 98, 18, 82, 50, 114, 10, 74, 42, 106, 26, 90, 58, 122, 6, 70, 38, 102, 22, 86, 54, 118, 14, 78, 46, 110, 30, 94, 62, 126, 4, 68, 36, 100, 20, 84, 52, 116, 12, 76, 44, 108, 28, 92, 60, 124, 8, 72, 40, 104, 24, 88, 56, 120, 16, 80, 48, 112, 32, 96, 64, and 128. — — 127 007Fh Turns on during one GS clock period in the 1st to 127th display period, but does not turn on in the 128th display period 128 0080h Turns on during one GS clock period in all display periods (1st to 128th) 129 0081h Turns on during two GS clock periods in the 1st display period and one GS clock period in the next display period — — 255 00FFh Turns on during two GS clock periods in the 1st to 127th display period, but only turns on during one GS clock period in the 128th display period 256 0100h Turns on during two GS clock periods in all display periods (1st to 128th) 257 0101h Turns on during three GS clock periods in the 1st display period and two GS clock periods in the next display period — — 65478 FEFFh Turns on during 511 GS clock periods in the 1st to 127th display period, but only turns on 510 GS clock periods in the 128th display period 65280 FF00h Turns on during 511 GS clock periods in all display periods (1st to 128th) 65281 FF01h Turns on during 512 GS clock periods in the 1st display period and 511 GS clock periods in the 2nd to 128th display periods — — 65534 FFFEh Turns on during 512 GS clock periods in the 1st to 63th and 65th to 127th display periods, and turns on 511 GS clock periods in the 64th and 128th display periods 65535 FFFFh Turns on during 512 GS clock periods in the 1st to 127th display period, but only turns on 511 GS clock periods in the 128th display period The number of display periods where OUTn is turned on for two GS clocks is incremented by the increased GS data similar to the previous case where the GS value is 1 trough 127 Display periods with OUTn turned on is incremented by the increased GS datasimilar to 0101h operation — Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 19 TLC5971 SBVS146 – AUGUST 2010 www.ti.com BLANK Bit in Data Latch (Internal) 511 1 2 3 ¼ 513 512 514 16382 16385 32766 32769 49150 49153 16383 16386 32767 32770 49151 49154 49155 16384 16387 32768 32771 49152 ¼ ¼ ¼ 65023 65026 65024 65025 65534 65535 65536 ¼ ¼ 127th Period 128th Period GS Reference Clock (Internal) High Voltage Level OUTXn OFF (GS Data = 0000h) ON 1st Period 2nd Period ¼ ¼ 32nd Period 33rd Period ¼ 64th Period 65th Period ¼ 96th Period 97th Period ¼ 1st Period Low Voltage Level T = GS Clock ´ 1d OUTXn OFF (GS Data = 0001h) ON T = GS Clock ´ 1d When the DSPRPT Bit is ‘1’ T = GS Clock ´ 1d OUTXn OFF (GS Data = 0002h) ON T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 1d OUTXn OFF (GS Data = 0003h) ON T = GS Clock ´ 1d T = GS Clock ´ 1d OUTXn OFF (GS Data = 0004h) ON ¼ T = GS Clock ´ 1d ¼ T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 1d OUTXn OFF (GS Data = 0041h) ON ¼ T = GS Clock ´ 1d ¼ T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 1d OUTXn OFF (GS Data = 0080h) ON T = GS Clock ´ 1d T = GS Clock ´ 2d T = GS Clock ´ 1d OUTXn OFF (GS Data = 0081h) ON T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 2d T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 1d T = GS Clock ´ 2d T = GS Clock ´ 1d ¼ OUTXn OFF (GS Data = 0082h) ON T = GS Clock ´ 1d T = GS Clock ´ 1d ¼ T= GS Clock ´ 511d T = GS Clock ´ 511d in 2nd to 128th Periods OUTXn OFF (GS Data = FF80h) ON T = GSCLK ´ 512d T = GS Clock ´ 511d in 2nd to 128th Periods OUTXn OFF (GS Data = FF81h) ON ¼ ¼ T= GS Clock ´ 512d T = GS Clock ´ 512d in 2nd to 63rd and 65th to 127th Periods, T = GS Clock ´ 511d in 64th Period T= GS Clock ´ 511d OUTXn OFF (GS Data = FFFEh) ON T= GS Clock ´ 512d OUTXn OFF (GS Data = FFFFh) ON T= GS Clock ´ 511d T = GS Clock ´ 512d in 2nd to 127th Periods Figure 23. ES-PWM Operation 20 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 REGISTER AND DATA LATCH CONFIGURATION The TLC5971 has a 224-bit shift register and a 218-bit data latch that set grayscale (GS) data, global brightness control (BC), and function control (FC) data into the device. When the internal latch pulse is generated and the data of the six MSBs in the shift register are 25h, the 218 following data bits in the shift register are copied into the 218-bit data latch. If the data of the six MSBs is not 25h, the 218 data bits are not copied into the 218-bit data latch. The data in the data latch are used for GS, BC, and FC functions. Figure 24 shows the shift register and the data latch configuration. 224-Bit Shift Register LSB MSB SDTO Write Command Bit 5 ¼ 223 Write Command Bit 0 Write Data Bit 217 Write Data Bit 216 Write Data Bit 215 Write Data Bit 214 218 217 216 215 214 ¼ Write Data Bit 3 Write Data Bit 2 Write Data Bit 1 Write Data Bit 0 3 2 1 0 SDTI SCKI 218 6 218-Bit Data Latch LSB MSB 6-Bit Write Command Decoder OUT TMG EXT GCK TMG RST DSP RPT 217 216 215 214 ¼ OUTR0 Bit 3 OUTR0 Bit 2 OUTR0 Bit 1 OUTR0 Bit 0 3 2 1 0 Internal Latch Pulse Write Command = 25h (100101b) 26 To the three groups of 7-bit BC, PWM timing control, GS clock counter, and clock select circuit. The internal latch pulse is generated after eight periods between the last 2 SCKI rising edges with no input. 192 To GS timing control circuit. Figure 24. Common Shift Register and Control Data Latch Configuration 224-Bit Shift Register The 224-bit shift register is used to input data from the SDTI pin with the SCKI clock into the TLC5971. The shifted data in this register is used for GS, BC, and FC. The six MSBs are used for the write command. The LSB of the register is connected to the SDTI pin and the MSB is connected to the SDTO pin. On each SCKI rising edge, the data on SDTI are shifted into the register LSB and all 224 bits are shifted towards the MSB. The register MSB is always connected to SDTO. When the device is powered up, the data in the 224-bit shift register is not set to any default value. 218-Bit Data Latch The 218-bit data latch is used to latch the GS, BC, and FC data. The 218 LSBs in the 244-bit shift register are copied to the data latch when the internal latch pulse is generated with the 6-bit write command, 25h (100101b). When the device is powered up, the data in the latch are not reset except for BLANK (bit 213) which is set to '1' to force all outputs off. Therefore, GS, BC, and FC data must be set to the proper values before BLANK is set to '0'. The 218-bit data latch configuration is shown in Figure 25 and the data bit assignment is shown in Table 5. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 21 TLC5971 SBVS146 – AUGUST 2010 www.ti.com From LSB-side of 224-bit shift register. 218 218-Bit Data Latch MSB 217 216 215 214 213 212-206 205-199 198-192 191 OUTTMG 1= Rising Edge EXTCLK 1= External TMGRST 1= Reset DSPRPT 1= Repeat BLANK 1= Blank BC Data Bits 6-0 for BLUE BC Data Bits 6-0 for GREEN BC Data Bits 6-0 for RED OUTB3 Bit 15 Function Control Data (5 Bits) BC Data for OUTRn/Gn/Bn (7 Bits ´ 3 = 21 Bits) 5 176 ¼ OUTB3 Bit 0 31 ¼ GS Data for OUTB3 (16 Bits) OUTG0 Bit 15 To global brightness control (BC) circuit. 15 OUTG0 Bit 0 OUTR0 Bit 15 GS Data for OUTG0 (16 Bits) 21 To function control (FC) circuit. ¼ LSB 0 16 ¼ OUTR0 Bit 0 GS Data for OUTR0 (16 Bits) 192 To grayscale timing control (GS) circuit. Figure 25. 218-Bit Data Latch Configuration Table 5. Data Latch Bit Assignment BIT NUMBER BIT NAME 15-0 GSR0 GS data bits 15 to 0 for OUTR0 31-16 GSG0 GS data bits 15 to 0 for OUTG0 47-32 GSB0 GS data bits 15 to 0 for OUTB0 63-48 GSR1 GS data bits 15 to 0 for OUTR1 79-64 GSG1 GS data bits 15 to 0 for OUTG1 95-80 GSB1 GS data bits 15 to 0 for OUTB1 111-96 GSR2 GS data bits 15 to 0 for OUTR2 127-112 GSG2 GS data bits 15 to 0 for OUTG2 143-128 GSB2 GS data bits 15 to 0 for OUTB2 159-144 GSR3 GS data bits 15 to 0 for OUTR3 175-160 GSG3 GS data bits 15 to 0 for OUTG3 191-176 GSB3 GS data bits 15 to 0 for OUTB3 198-192 BCR6-0 BC data bits 6 to 0 for OUTR0-3 205-199 BCG6-0 BC data bits 6 to 0 for OUTG0-3 212-206 BCB6-0 BC data bits 6 to 0 for OUTB0-3 BLANK Constant-current output enable bit in FC data (0 = output control enabled, 1 = blank). When this bit is '0', all constant-current outputs (OUTR0-OUTB3) are controlled by the GS PWM timing controller. When this bit is '1', all constant-current outputs are forced off. The GS counter is reset to '0', and the GS PWM timing controller is initialized. When the IC is powered on, this bit is set to '1'. DSPRPT Auto display repeat mode enable bit in FC data (0 = disabled, 1 = enabled). When this bit is '0', the auto repeat function is disabled. Each constant-current output is only turned on once, according the GS data after BLANK is set to '0' or after the internal latch pulse is generated with the TMGRST bit set to '1'. When this bit is '1', each output turns on and off according to the GS data every 65536 GS reference clocks. 215 TMGRST Display timing reset mode enable bit in FC data (0 = disabled, 1 = enabled). When this bit is '1', the GS counter is reset to '0' and all constant-current outputs are forced off when the internal latch pulse is generated for data latching. This function is the same when BLANK is set to '0'. Therefore, BLANK does not need to be controlled by an external controller when this mode is enabled. When this bit is '0', the GS counter is not reset and no output is forced off even if the internal latch pulse is generated. 216 EXTGCK GS reference clock select bit in FC data (0 = internal oscillator clock, 1 = SCKI clock). When this bit is '1', PWM timing refers to the SCKI clock. When this bit is '0', PWM timing refers to the internal oscillator clock. OUTTMG GS reference clock edge select bit for OUTXn on-off timing contro in FC datal (0 = falling edge, 1 = rising edge). When this bit is '1', OUTXn are turned on or off at the rising edge of the selected GS reference clock. When this bit is '0', OUTXn are turned on or off at the falling edge of the selected clock. 213 214 217 22 CONTROLLED CHANNEL/FUNCTIONS Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 INTERNAL LATCH PULSE GENERATION TIMING The internal latch pulse is generated when the SCKI rising edge does not change for 8x the period between the last SCKI rising edge and the second to last SCKI rising edge if the data of the six MSBs in the 244-bit shift register are the command code 25h. The generation timing changes as a result of the SCKI frequency with the time range between 16384 times the internal oscillator period (2.74ms), maximum, and 8x the internal oscillator period (666 ns), minimum. Figure 26 shows the internal latch pulse generation timing. The internal latch pulse is generated when the SCKI rising edge is not input during 8 times of Period A if the 6-bit data of the MSB-side in the 244-bit shift register is the command code 25h. SCKI 1 2 3 4 ¼ N-3 N-2 N-1 N The next SCKI clock should start after 8 or more clock periods (1.34 ms, min) of the internal clock from the internal latch pulse generation timing. Period A Latch Pulse (Internal) Write command 25h + 218-bit data. 224-Bit Shift Register Data (Internal) 218-Bit Data Latch (Internal) 218-bit data are copied from shift register when the internal latch is generated. Figure 26. Data Latch Pulse Generation Timing AUTO DISPLAY REPEAT FUNCTION This function repeats the total display period without a BLANK bit change, as long as the GS reference clock is available. This function can be enabled or disabled with DSPRPT (bit 214) in the data latch. When the DSPRPT bit is '1', this function is enabled and the entire display period repeats without a BLANK bit data change. When the DSPRPT bit is '0', this function is disabled and the entire display period executes only once after the BLANK bit is set to '0' or the internal latch pulse is generated when the display timing reset function is enabled. Figure 27 shows the auto display repeat operation timing. BLANK Bit in Data Latch (Internal) 4 1 65534 1 65535 2 65536 5 2 65533 3 4 5 3 65534 1 65535 2 65536 65533 4 7 5 3 10 8 6 1 2 9 65534 1 65535 2 65536 GS Reference Clock (SCKI or Internal Oscillator) DSPRPT Bit in Data Latch (Internal) The maximum GS clocks is 4096 in 12-bit PWM mode. DSPRPT = 1 (Auto Repeat On) DSPRPT = 0 (Auto Repeat Off) 1st Display Period 2nd Display Period Display period is repeated by auto refresh function. OFF OUTXn (GSDATA = FFFFh) 3rd Display Period OUTn is forced off when BLANK is ‘1’. 1st Display Period OUTn is not turned on until the next BLANK changes to ‘0’. ON Figure 27. Auto Repeat Display Function Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 23 TLC5971 SBVS146 – AUGUST 2010 www.ti.com DISPLAY TIMING RESET FUNCTION This function allows the display timing to be initialized using the internal latch pulse, as shown in Figure 28. This function can be enabled or disabled by TMGRST (bit 215) in the data latch. When the TMGRST bit is '1', the GS counter is reset to '0' and all outputs are forced off when the internal latch pulse is generated. This function is the same when the BLANK bit changes (such as from '0' to '1' and from '1' to '0'). Therefore, the BLANK bit does not need to be controlled from an external controller to restart the PWM control from the next GS reference clock rising edge. When this bit is '0', the GS counter is not reset and no output is forced off even if the internal latch pulse is generated. Figure 28 shows the display timing reset operation. BLANK Bit in Data Latch (Internal) 0 = No BLANK. 1 = Display timing reset function is enabled. TMGRST Bit in Data Latch (Internal) 1 = OUTXn on-off state is changed at the rising edge of the clock selected by the EXTCLK bit. EXTCLK Bit in Data Latch (Internal) 1 = OUTXn on-off state is changed at the rising edge of the clock selected by the EXTCLK bit. OUTTMG Bit in Data Latch (Internal) SCKI N-4 N-3 N-2 N-1 N 8x Period A Period A Internal Latch Pulse (Internal) GS Counter for PWM Control (Internal) OFF OUTXn ON M-4 M-3 M-2 M-1 8x or greater internal clock period (1.34 ms, min). 0 M When the TMGRST bit is ‘1’, the GS counter is reset to ‘0’ at the internal latch pulse generation timing. Also, OUTXn is forced off at the same time. ON 1 2 1 ¼ 3 2 3 OFF ON Figure 28. Display Timing Reset Function OUTPUT TIMING SELECT FUNCTION This function selects the on-off change timing of the constant-current outputs (OUTXn) set by OUTTMG (bit 217) in the data latch. When this bit is '1', OUTXn are turned on or off at the rising edge of the selected GS reference clock. When this bit is '0', OUTXn are turned on or off at the falling edge of the selected clock. Electromagnetic interference (EMI) of the total system can be reduced using this bit setting. For example, when the odd number of devices in the system have this bit set to '0' and the even number of devices in the system have this bit set to '1', EMI is reduced because the devices change the OUTXn status at a deferent timing. Figure 29 and Figure 30 show the output switching timing when the OUTTMG bit is '1' and '0', respectively. 24 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 BLANK Bit in Data Latch (Internal) EXTCLK Bit in Data Latch (Internal) 1 0 1 = SCKI used for OUTXn on-off timing control. 1 = OUTXn on-off state changes at the rising edge of the clock selected by the EXTCLK bit. OUTTMG Bit in Data Latch (Internal) SCKI 1 2 3 ¼ 65534 65535 65536 OFF OUTR0-R3 ON tD3 tD3 OUTXn on-off state changes at the rising edge of the clock selected by the EXTCLK bit. OFF OUTG0-G3 ON tD4 tD4 OFF OUTB0-B3 ON tD5 tD5 Figure 29. Output On-Off Timing with Four-Channel Grouped Delay (OUTTMG = 1) BLANK Bit in Data Latch (Internal) EXTCLK Bit in Data Latch (Internal) 1 0 1 = SCKI used for OUTXn on-off timing control. OUTTMG Bit in Data Latch (Internal) 0 = OUTXn on-off state changes at the falling edge of the clock selected by the EXTCLK bit. SCKI 1 2 3 ¼ 65534 65535 65536 OFF OUTR0-R3 ON tD3 OFF OUTXn on-off state changes at the falling edge of the clock selected by the EXTCLK bit. tD3 OUTG0-G3 ON tD4 tD4 tD5 tD5 OFF OUTB0-B3 ON Figure 30. Output On-Off Timing with Four-Channel Grouped Delay (OUTTMG = 0) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 25 TLC5971 SBVS146 – AUGUST 2010 www.ti.com HOW TO CONTROL THE TLC5971 To set each function mode, BC color, GS output, 6-bit write command, 5-bit FC data, 21-bit BC data for each color group, and 192-bit GS data for OUTXn, a total number of 224 bits must be written into the device. Figure 31 shows the 224-bit data packet configuration. When N units of the TLC5971 are cascaded (as shown in Figure 32), N × 224 bits must be written from the controller into the first device to control all devices. The number of cascaded devices is not limited as long as the proper voltage is supplied to the device at VCC. The packets for all devices must be written again whenever the data in one packet is changed. MSB Write Command (6 bits, 25h) LSB Function Control (5 bits) BC for GREEN (7 bits) BC for BLUE (7 bits) BC for RED (7 Bits) GS for OUTB3 (16 Bits) GS for OUTG3 (16 Bits) GS for OUTR3 (16 Bits) GS for OUTB0 (16 Bits) 16 Bits ´6 GS for OUTG0 (16 Bits) GS for OUTR0 (16 Bits) Figure 31. 224-Bit Data Packet Configuration VLED ¼ ¼ ¼ ¼ 3.3 V Controller VCC VCC VCC VCC DATA SDTI SDTO SDTI SDTO SDTI SDTO SDTI SDTO CLK SCKI SCKO SCKI SCKO SCKI SCKO SCKI SCKO VREF 1st TLC5971 IREF VREF 2nd TLC5971 IREF VREF N-1st TLC5971 IREF GND IREF GND GND GND VREF Nth TLC5971 GND Figure 32. Cascading Connection of N TLC5971 Units Data Write and PWM Control with Internal Grayscale Clock Mode When the EXTCLK bit is '0', the internal oscillator clock is used for PWM control of OUTXn (X = R/G/B and n = 0-3) as the GS reference clock. This mode is ideal for illumination applications that change the display image at low frequencies. The data and clock timing is shown in Figure 9 and Figure 33. A writing procedure for the function setting and display control follows: 1. Power up VCC (VLED); all OUTXn are off because BLANK is set to '1'. 2. Write the 224-bit data packet (with MSB bit first) for the Nth TLC5971 using the SDTI and SCKI signals. The first six bits of the 224-bit data packet are used as the write command. The write command must be 25h (100101b); otherwise, the 218-bit data in the 224-bit shift register are not copied to the 218-bit data latch. The EXTCLK bit must be set to '0' for the internal oscillator mode. Also, the DSPRPT bit should be set to '1' to repeat the PWM timing control and BLANK set to '0' to start the PWM control. 3. Write the 224-bit data packet for the (N – 1) TLC5971 without delay after step 2. 4. Repeat the data write sequence until all TLC5971s have data. The total shift clock count (SCKI) is now 224 × N. After all device data are written, stop the SCKI at a high or low level for 8× the period between the last SCKI rising edge and the second to last SCKI rising edge. Then the 218 LSBs in the 224-bit shift resister are copied to the 218-bit data latch in all devices and the PWM control is started or updated at the same time. 26 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 VLED Power The next shift clock should start after 1.34 ms or more from the internal latch pulse generation timing. MSB Shift Data From Controller (SDTI) LSB 224-Bit Packet for Nth TLC5971 MSB 224-Bit Packet for N-1st TLC5971 MSB Shift Clock From Controller (SCKI) 224 Shift Clocks LSB 224 Shift Clocks for N-2’th LSB for 3’rd MSB 224-Bit Packet for 2nd TLC5971 MSB LSB LSB 224 Shift Clocks Next Data 224-Bit Packet for 1st TLC5971 MSB 224 Shift Clocks Next Shift Clock Latch Pulse (Internal) PWM Control Start or data updated OUTXn The time that generates the internal latch pulse is 8x the period between the last SCLK rising edge and the second to last SCLK rising edge. The time changes depending on the period of the shift clock within the range of 2.74 ms to 666 ns. Figure 33. Data Packet and Display Start/Update Timing 1 (Internal Oscillator Mode) Data Write and PWM Control with External Grayscale Clock Mode When the EXTCLK bit is '1', the data shift clock (SCKI) is used for PWM control of OUTXn (X = R/G/B and n = 0-3) as the GS reference clock. This mode is ideal for video image applications that change the display image with high frequencies or for certain display applications that must synchronize all TLC5971s. The data and clock timing are shown in Figure 9 and Figure 34. A writing procedure for the display data and display timing control follows: 1. Power- up VCC (VLED); all OUTXn are off because BLANK is set to '1'. 2. Write the 224-bit data packet MSB-first for the Nth TLC5971 using the SDTI and SCKI signals. The first six bits of the 224-bit data packet are used as the write command. The write command must be 25h (100101b); otherwise, the 218-bit data in the 224-bit shift register are not copied to the 218-bit data latch. The EXTCLK bit must be set to '1' for the external oscillator mode. Also, the DSPRPT bit should be set to '0' so that the PWM control is not repeated, the TMGRST bit should be set to '1' to reset the PWM control timing at the internal latch pulse generation, and BLANK must be set to '0' to start the PWM control. 3. Write the 224-bit data for the (N – 1) TLC5971 without delay after step 2. 4. Repeat the data write sequence until all TLC5971s have data. The total shift clock count (SCKI) is 224 × N. After all device data are written, stop the SCKI at a high or low level for 8× the period between the last SCKI rising edge and the second to last SCKI rising edge. Then the 218 LSBs in the 224-bit shift resister are copied to the 218-bit data latch in all devices. 5. To start the PWM control, send one pulse of the SCKI clock with SDTI low after 1.34µs or more from step 4. The OUTXn are turned on when the output GS data are not 0000h. 6. Send the remaining 65535 SCKI clocks with SDTI low. Then the PWM control for OUTXn is synchronized with the SCKI clock and one display period is finished with a total of 65536 SCKI clock periods. 7. Repeat step 2 to step 6 for the next display period. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 27 TLC5971 SBVS146 – AUGUST 2010 www.ti.com VLED Power MSB Shift Data From Controller (SDTI) LSB 224-Bit Packet for Nth TLC5971 MSB for N-1st MSB Shift Clock From Controller (SCKI) 224 Shift Clocks LSB The next shift clock should start after 1.34 ms or more from the internal latch pulse generation timing. 224-Bit Packet for 1st TLC5971 for 2nd Low MSB 224-Bit Packet for Nth TLC5971 LSB 224 Shift Clocks 65536 Shift Clocks as GS Clock 224 Shift Clocks Latch Pulse (Internal) OUTXn is controlled via the PWM synchronized with SCKI. OUTXn The time that generates the internal latch pulse is 8x the period between the last SCLK rising edge and the second to last SCLK rising edge. The time changes depending on the period of the shift clock within the range of 2.74 ms to 666 ns. Figure 34. Data Packet and Display Start/Update Timing 2 (External Clock Mode) There is another control procedure that is recommended for a long chain of cascaded devices. The data and clock timings are shown in Figure 9 and Figure 35. When 256 TLC5971 units are cascaded, use the following procedure: 1. Power up VCC (VLED); all OUTXn are off because BLANK is set to '1'. 2. Write the 224-bit data packet MSB-first for the 256th TLC5971 using the SDTI and SCKI signals. The EXTCLK bit must be set to '1' for the external oscillator mode. Also, the DSPRPT bit should be set to '0' so that the PWM control does not repeat, the TMGRST bit should be set to '1' to reset the PWM control timing with the internal latch pulse, and BLANK must be set to '0' to start the PWM control. 3. Repeat the data write sequence for all TLC5971s. The total shift clock count (SCKI) is 57344 (224 × 256). After all device data are written, stop the SCKI signal at a high or low level for eight or more periods between the last SCKI rising edge and the second to last SCKI rising edge. Then the 218 LSBs in the 224-bit shift resister are copied to the 218-bit data latch in all devices. 4. To control the PWM, send 8192 SCKI clock periods with SDTI low after 1.34µs or more from step 3 (or step 7). These 8192 clock periods are used for the OUTXn PWM control. 5. Write the new 224-bit data packets to the 256th to first TLC5971s for the next display with 256 × 224 SCKI clock for a total of 57344 clocks. The PWM control for OUTXn remains synchronized with the SCKI clock and one display period is finished with a total of 65536 SCKI clocks. The SCKI clock signal is therefore used for PWM control and, at the same time, to write data into the shift registers of all cascaded parts. 6. Stop the SCKI signal at a high or low level for eight or more periods between the last SCKI rising edge and the second to last SCKI rising edge. Then the 218-bit LSBs in the 224-bit shift resister are copied to the 218-bit data latch in all devices. 7. Repeat step 4 to step 6 for the next display periods. 28 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 TLC5971 www.ti.com SBVS146 – AUGUST 2010 The next shift clock should start after 1.34 ms or more from the internal latch pulse generation timing. VLED Power MSB Shift Data From Controller (SDTI) LSB 224-Bit Packet for 256th TLC5971 MSB for 255th MSB Shift Clock From Controller (SCKI) for 2nd LSB 224-Bit Packet for 1st TLC5971 Timing clock for 1st display. Low Timing clock for 1st display and 2nd display data write. 256 ´ 224-Bit Packet for 256th TLC5971 Low LSB 224 Shift Clocks 224 Shift Clocks 8192 Shift Clocks 224 ´ 256 = 57344 Clocks Shift Clock for 2nd Display 57344 (256 ´ 224) Shift Clocks 65536 Clocks 65536 Clocks Latch Pulse (Internal) OUTXn OUTXn is controlled via the PWM synchronized with SCKI for 1st dis playperiod. OFF OFF 2nd Display Period The time is 8 periods between the last SCLK rising edge and the second to last SCLK rising edge. The wait time changes between 2.74 ms and 666 ns, depending on the period of the shift clock. Figure 35. Data Packet and Display Start/Update Timing 3 (External Clock Mode with 256 Cascaded Devices) THERMAL SHUTDOWN The thermal shutdown (TSD) function turns off all IC constant-current outputs when the junction temperature (TJ) exceeds the threshold (TTSD = +165°C, typ). When the junction temperature drops below (TTSD – THYS), the output control starts at the first GS clock in the next display period. NOISE REDUCTION Large surge currents may flow through the IC and the board if all 12 outputs turn on simultaneously at the start of each GS cycle. These large current surges could induce detrimental noise and EMI into other circuits. The TLC5971 turns on the outputs for each color group independently with a 25 ns (typ) rise time. The output current sinks are grouped into three groups. The first group that is turned on/off are OUTR0-3; the second group that is turned on/off are OUTG0-3; and the third group is OUTB0-3. However, the state of each output is controlled by the selected GS clock; see the Output Timing Select Function section. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TLC5971 29 PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty 2000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TLC5971PWPR ACTIVE HTSSOP PWP 20 CU NIPDAU Level-2-260C-1 YEAR Request Free Samples TLC5971RGER PREVIEW VQFN RGE 24 TBD Call TI Call TI Samples Not Available TLC5971RGET PREVIEW VQFN RGE 24 TBD Call TI Call TI Samples Not Available (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Sep-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLC5971PWPR Package Package Pins Type Drawing SPQ HTSSOP 2000 PWP 20 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 16.4 Pack Materials-Page 1 6.95 B0 (mm) K0 (mm) P1 (mm) 7.1 1.6 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Sep-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC5971PWPR HTSSOP PWP 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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