3.0mmx3.0mm FULL-COLOR SURFACE MOUNT LED LAMP AT T E N T I O N Features OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES lLOW POWER CONSUMPTION. l 3.0mmx3.0mm SMT LED, 2.0mm(MAX.) THICKNESS. l ONE RED , ONE GREEN AND ONE BLUE CHIPS IN ONE PACKAGE. l CAN PRODUCE ANY COLOR IN VISIBLE SPECTRUM, INCLUDING WHITE LIGHT. l PACKAGE : 1000PCS / REEL. APKF3030SUVGBEC HYPER RED / GREEN / BLUE Description The Hyper Red source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. The Green source color devices are made with InGaN on SiC Light Emitting Diode. The Blue source color devices are made with InGaN on SiC Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1206 APPROVED: J. Lu REV NO: V.3 CHECKED: Allen Liu DATE:JUL/11/2003 DRAWN:X.T.HU PAGE: 1 OF 6 Selection Guide Dic e P ar t N o . L en s Ty p e HYPER RED ( InGaAIP) APKF3030SUVGBEC GREEN ( InGaN ) BLUE (InGaN) WATER C LEAR Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Iv (m c d ) @ 20 m A Mi n . Ty p . 110 250 110 50 220 V i ew i n g An g le 2θ1/2 100° 120 Electrical / Optical Characteristics at TA=25°°C Sy m b o l P ar am et er D ev i c e λpeak Peak Wavelength λD D omi nate Wavelength ∆λ1/2 Spectral Li ne Half-wi dth C C apaci tance VF Forward Voltage IR Reverse C urrent Hyper Red Green Blue Hyper Red Green Blue Hyper Red Green Blue Hyper Red Green Blue Hyper Red Green Blue All Ty p . 640 520 465 Max . 628 525 470 27 38 25 45 45 110 1.9 3.5 3.7 2.5 4.5 4.3 10 Un its Tes t C o n d i t i o n s nm I F=20mA nm I F=20mA nm I F=20mA pF VF= 0V; f =1MHz V I F=20mA uA V R = 5V Absolute Maximum Ratings at TA=25°°C P ar am et er Power di ssi pati on D C Forward C urrent Peak Forward C urrent [1] Reverse Voltage Operati ng / Storage Temperature H y p er R ed Gr een B lu e Un its 30 30 30 mA 170 185 5 Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD1206 APPROVED: J. Lu REV NO: V.3 CHECKED: Allen Liu 105 120 150 5 160 -40°C To +85°C 5 DATE:JUL/11/2003 DRAWN:X.T.HU mW mA V PAGE: 2 OF 6 APKF3030SUVGBEC Hyper Red SPEC NO: DSAD1206 APPROVED: J. Lu REV NO: V.3 CHECKED: Allen Liu DATE:JUL/11/2003 DRAWN:X.T.HU PAGE: 3 OF 6 Green SPEC NO: DSAD1206 APPROVED: J. Lu REV NO: V.3 CHECKED: Allen Liu DATE:JUL/11/2003 DRAWN:X.T.HU PAGE: 4 OF 6 Blue SPEC NO: DSAD1206 APPROVED: J. Lu REV NO: V.3 CHECKED: Allen Liu DATE:JUL/11/2003 DRAWN:X.T.HU PAGE: 5 OF 6 APKF3030SUVGBEC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1206 APPROVED: J. Lu REV NO: V.3 CHECKED: Allen Liu DATE:JUL/11/2003 DRAWN:X.T.HU PAGE: 6 OF 6