2.0X1.25mm SMD CHIP LED LAMP APTK2012SEC Features Description !2.0mmX1.25mm SMT LED, 0.75mm THICKNESS. !LOW POWER CONSUMPTION. !WIDE ! IDEAL SUPER BRIGHT ORANGE VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. The Super Bright Orange source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1047 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e APTK2012SEC Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT ORANGE (InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 110 28 0 10 0 ° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e Ty p . λpeak Peak Wavelength Super Bright Orange λD Dominate Wavelength ∆λ1/2 Max . Un it s Tes t Co n d it io n s 6 10 nm IF = 2 0 m A Super Bright Orange 601 nm IF = 2 0 m A Spectral Line Half-width Super Bright Orange 29 nm IF = 2 0 m A C Capacitance Super Bright Orange 30 pF V F = 0 V; f = 1 M Hz VF Forward Voltage Super Bright Orange 2.0 2.5 V IF = 2 0 m A IR Reverse Current Super Bright Orange 10 uA VR = 5V Absolute Maximum Ratings at T)=25°°C P ar am e t e r Su p er B r ig h t Or an g e Un it s Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 195 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD1047 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 2 OF 4 Super Bright Orange SPEC NO: DSAD1047 APPROVED : J. Lu APTK2012SEC REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 3 OF 4 APTK2012SEC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1047 APPROVED : J. Lu REV NO: V.1 CHECKED :Allen Liu DATE:MAR/23/2003 DRAWN:D.L.HUANG PAGE: 4 OF 4