3.2x1.6mm SMD CHIP LED LAMP KPC-3216SYC SUPER BRIGHT YELLOW Features Description !3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. The Super Bright Yellow source color devices are made !LOW POWER CONSUMPTION. with DH InGaAlP on GaAs substrate Light Emitting Diode. !WIDE VIEWING ANGLE. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: KDA0605 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: SEP/27/2001 DRAWN: S.H.Chen PAGE: 1 OF 4 Selection Guide Par t No . Dic e KPC-3216SYC Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW ( InGaAlP ) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 40 80 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Super Bright Yellow λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm IF=20mA Super Bright Yellow 588 nm IF=20mA Spectral Line Halfwidth Super Bright Yellow 28 nm IF=20mA C Capacitance Super Bright Yellow 25 pF VF=0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF=20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C Par am et er Su p er B r ig h t Yello w Un it s Power dissipation 12 5 mW DC Forward Current 30 mA Peak Forward Current [1] 175 mA Reverse Voltage 5 V Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: KDA0605 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: SEP/27/2001 DRAWN: S.H.Chen PAGE: 2 OF 4 Super Bright Yellow KPC-3216SYC SPEC NO: KDA0605 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: SEP/27/2001 DRAWN: S.H.Chen PAGE: 3 OF 4 KPC-3216SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: KDA0605 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: SEP/27/2001 DRAWN: S.H.Chen PAGE: 4 OF 4