NEC UPD16654N

DATA SHEET
MOS INTEGRATED CIRCUIT
µPD16654
150/154 OUTPUT TFT-LCD GATE DRIVE
The µPD16654 is a TFT-LCD gate driver. Because this gate driver has a level shift circuit for logic input, it can
output a high gate scanning voltage in response to a CMOS-level input.
Moreover, it can also drive both the XGA/SXGA panel (154 outputs) and SVGA panel (150 outputs) by changing
the number of outputs over between 150 and 154.
FEATURES
• High breakdown voltage output (ON/OFF range: VDD2-VEE2 = 40 V MAX.)
• 3.3 V CMOS level input
• Number of output select function (150/154 outputs)
ORDERING INFORMATION
Part Number
µPD16654N-×××
Package
TCP (TAB package)
The TCP’s external shape is customized. To order your TCP’s external shape, please contact an NEC salesperson.
Document No. S11647EJ1V0DS00 (1st edition)
Date Published May 1998 N CP(K)
Printed in Japan
©
1998
µPD16654
1. BLOCK DIAGRAM
R/L
LS
Osel
LS
CLK
LS
STVR
LS
OE1
LS
OE2
LS
OE3
LS
SR1 SR2 SR3
O1
O2
O3
154-bit
shift register
SR152 SR153 SR154
O152
O153
LS (level shifter): Interfaces between 3.3 V CMOS level and VDD2-VEE1 level.
2
O154
LS
STVL
µPD16654
2. PIN CONFIGURATION (µPD16654N-×××
×××)
×××
S154
S153
S152
S151
VDD2
STVL
OE1
OE2
OE3
CLK
R/L
VCC
Osel
VSS
STVR
VEE1
VEE2
(Cupper plated
surface)
S4
S3
S2
S1
Caution This figure does not specify the TCP package.
3
µPD16654
3. PIN FUNCTIONS
Pin Symbol
Pin Name
Description
O1 to O154
Driver output pins
Scan signal output pins that drive the gate electrode of a TFT-LCD.
The status of each output pin changes in synchronization with the rising edge
of shift clock CLK. The output voltage of the driver is VDD2 to VEE2.
STVR
STVL
Start pulse input/output pin
Input/output pin of the internal shift register.
Start pulse signal is read at the rising edge of shift clock CLK and a scan
signal is output from the driver output pin. The interface of this terminal is
CMOS of 3.3 V.
When Osel signal is Low level, start pulse goes up to high level at the 154th
falling edge of shift clock CLK and goes down to low level at the 155th falling
edge.
And when Osel signal is High level, start pulse goes up to high level at the
150th falling edge of shift clock CLK and goes down to low level at the 151st
falling edge. The output level is VCC-VSS (logic level).
CLK
Shift clock input
Shift clock input for the internal shift register. The contents of internal shift
register is shifted at the rising edge of CLK.
R/L
Shift direction switching
input
Shift direction switching input pin of the internal shift register.
R/L = H (right shift) : STVR → O1 → O2 ··· O153 → O154 → STVL
R/L = L (left shift) STVL → O154 → O153 ··· O2 → O1 → STVR
OE1
OE2
OE3
Enable input
This pin fixes the driver output to the L level when it is high. However, the
shift register is not cleared. And, output enable actuation is asynchronous in
the clock. And, refer to “RELATIONS OF ENABLE INPUT AND OUTPUT
TERMINAL“.
Osel
Number of output select
input
Selects the number of outputs.
Osel = L : 154 outputs (SVGA)
Osel = H: 150 outputs (VGA, XGA, SXGA)
When Osel = H (150 outputs), O76 through O79 outputs of the shift register are
fixed to the VEE2 level. Fix this pin to VCC (VDD2) or VSS (VEE1) on TCP.
VDD2
Positive power supply for
driver
Shared with internal logic and driver
VCC
Reference power supply
3.3 V ± 0.3 V. Reference power supply for level shifter: LS
VSS
Ground (GND)
Connect this pin to the system ground.
VEE1
Negative power supply for
internal logic
Negative power supply for internal logic
VEE2
Negative power supply for
driver
Negative power supply for driver
Caution 1. Power ON/OFF sequence
To prevent the µPD16654 from damage due to latch up, turn on power in the order VCC → VEE1,
VEE2 and VDD2 → logic input. Turn off power in the reverse order. Observe these power
sequences even during transition period.
4
µPD16654
Caution 2. Inserting bypass capacitor
Because the internal logic operates at a high voltage (VDD2-VEE1), insert a bypass capacitor of
about 0.1 µF between the respective power pins as shown below to secure the noise margin
of VIH and VIL.
VDD2
VCC
0.1 µ F
0.1 µ F
0.1 µ F
0.1 µ F
VSS
VEE2
VEE1
Do not input a switching signal to the Osel pin that selects the number of outputs. Connect this pin to VCC or VSS (VEE1).
5
µPD16654
4. RELATIONS OF ENABLE INPUT AND OUTPUT TERMINAL
Switching is possible for 154/150 with µPD16654 by the Osel terminal. And, the output terminal which can be
controlled by the enable signal changes as follows along with this function.
154 out TCP
6
150 out Mode
154 out Mode
(Osel = L)
150 out Mode
(Osel = H)
154 out Mode
(Osel = L)
150 out Mode
(Osel = H)
O1 (OE1)
O1 (OE1)
O1 (OE1)
O1 (OE1)
O2 (OE2)
O2 (OE2)
O2 (OE2)
O2 (OE2)
O3 (OE3)
O3 (OE3)
O3 (OE3)
O3 (OE3)
O4 (OE1)
O4 (OE1)
O4 (OE1)
O4 (OE1)
O5 (OE2)
O5 (OE2)
O5 (OE2)
O5 (OE2)
O6 (OE3)
O6 (OE3)
O6 (OE3)
O6 (OE3)
•
•
•
•
•
•
•
•
•
•
•
•
O72 (OE3)
O72 (OE3)
O72 (OE3)
O72 (OE3)
O73 (OE1)
O73 (OE1)
O73 (OE1)
O73 (OE1)
O74 (OE2)
O74 (OE2)
O74 (OE2)
O74 (OE2)
O75 (OE3)
O75 (OE3)
O75 (OE3)
O75 (OE3)
O76 (OE1)
Vout = VEE2
O77 (OE2)
Vout = VEE2
O78 (OE3)
Vout = VEE2
O79 (OE1)
Vout = VEE2
O80 (OE2)
O80 (OE1)
O80 (OE2)
O80 (OE1)
O81 (OE3)
O81 (OE2)
O81 (OE3)
O81 (OE2)
O82 (OE1)
O82 (OE3)
O82 (OE1)
O82 (OE3)
•
•
•
•
•
•
•
•
•
•
•
•
O150 (OE3)
O150 (OE2)
O150 (OE3)
O150 (OE2)
O151 (OE1)
O151 (OE3)
O151 (OE1)
O151 (OE3)
O152 (OE2)
O152 (OE1)
O152 (OE2)
O152 (OE1)
O153 (OE3)
O153 (OE2)
O153 (OE3)
O153 (OE2)
O154 (OE1)
O154 (OE3)
O154 (OE1)
O154 (OE3)
µPD16654
5. TIMING CHART
(1) 154 outputs, R/L = H Osel = L
1
2
3
153
154
155
156
157
CLK
OE1
OE2
OE3
STVR
O1
O2
O3
O153
O154
STVL
O1 of
next stage
O2 of
next stage
7
µPD16654
(2) 150 outputs, R/L = H Osel = H
1
2
3
CLK
OE1
OE2
OE3
STVR
O1
O2
O3
O153
O154
STVL
O1 of
next stage
O2 of
next stage
O76 to O79 is L (VEE2) level fixation (150 output).
8
149
150
151
152
153
µPD16654
6. ELECTRIC SPECIFICATION
Absolute Maximum Ratings (TA = 25°C, VSS1 = VSS2 = 0 V)
Parameter
Symbol
Rating
Unit
Supply Voltage
VDD2
–0.5 to +28
V
Supply Voltage
VCC
–0.5 to +7.0
V
Supply Voltage
VDD2-VEE1/2
–0.5 to 42
V
Supply Voltage
VEE1
–16.5 to +0.5
V
Supply Voltage
VEE2
VEE1 – 0.5 to +0.5
V
Input Voltage
VI
–0.5 to VCC + 0.5
V
Input Current
II
±10
mA
Output Current
IO
±10
mA
Operating Temperature Range
TA
–20 to +70
°C
Storage Temperature Range
Tstg
–55 to +125
°C
Recommended Operating Condition (TA = –20 to +80°C, VSS1 = VSS2 = 0 V)
Parameter
Symbol
MIN.
Supply Voltage
VDD2
Supply Voltage
TYP.
MAX.
Unit
17
25
V
VEE1
–15
–5.0
V
Supply Voltage
VEE2
VEE1
VEE1 + 6.0
V
Supply Voltage
VDD2 – VEE1
22
40
V
Supply Voltage
VCC
3.0
3.6
V
3.3
Electrical Specifications (TA = –20 to +70°C, VDD1 = 25 V, VDD2 = 3.3 V ± 0.3 V, VEE1 = VEE2 = –15 V, VSS = 0 V)
Parameter
Symbol
Input voltage, high
VIH
Input voltage, low
VIL
Condition
CLK, STVR (STVL), R/L,
Osel, OE1-OE3
MIN.
TYP.
MAX.
Unit
0.8 VCC
VCC
V
VSS
0.2 VCC
V
VOH
STVR (STVL), IOH = –40 µA
Output voltage, low
VOL
STVR (STVL), IOL = +40 µA
Output current, high
InOH
On, Vn = VDD2 – 1.0 V
Output current, low
InOL
On, Vn = VEE2 + 1.0 V
Output ON resistance
Ron
Vn = VEE2 + 1.0 V or VDD2 – 1.0 V
1.0
kΩ
Input leakage current
IIL
VI = 0 V or 3.6 V
±1.0
µA
IDD2
VDD2, fCLK = 30 kHz, no loads
400
µA
ICC
VCC1, fCLK = 30 kHz, no loads
600
µA
IEE
IEE1 + IEE2, fCLK = 30 kHz, no loads
800
µA
Output voltage, high
Dynamic current
Note
VCC – 0.4
Note
VSS
Note
VCC
V
Note
VSS + 0.4
–1.0
1.0
V
mA
mA
Note The cascade output is at the driver level (VCC-VSS).
9
µPD16654
Switching Characteristics (TA = –20 to +70°C, VDD1 = 25 V, VDD2 = 3.3 V ± 0.3 V, VEE1 = VEE2 = –15 V, VSS = 0 V)
Parameter
Cascade output delay time
Symbol
Condition
MIN.
TYP.
MAX.
Unit
tPHL1
CL = 20 pF
800
ns
tPLH1
CLK → STVL (STVR)
800
ns
tPHL2
CL = 300 pF
500
ns
tPLH2
CLK → On
500
ns
tPHL3
CL = 300 pF
500
ns
tPLH3
OEn → On
500
ns
Output rise time
tTLH
CL = 300 pF
450
ns
Output fall time
tTHL
450
ns
Input capacitance
CI
15
pF
Driver output delay time 1
Driver output delay time 2
Maximum clock frequency
fmax.
TA = 25°C
When connected in cascade
500
kHz
Timing Requirement (TA = –20 to +70°C, VDD1 = 25 V, VDD2 = 3.3 V ± 0.3 V, VEE1 = VEE2 = –15 V, VSS = 0 V)
Parameter
Symbol
Condition
MIN.
TYP.
MAX.
Unit
Clock Pulse Low Period
PWCLK(H)
500
ns
Clock Pulse High Period
PWCLK(L)
500
ns
Enable Pulse low period
PWOE
1.0
µs
Data Setup Time
tSETUP
STVR (STVL) ↑ → CLK ↑
200
ns
Data Hold Time
tHOLD
CLK ↑ → STVR (STVL) ↓
200
ns
The rise and fall times of logic input must be tr = tf = 20 ns (10% to 90%).
10
µPD16654
7. SWITCHING CHARACTERISTICS WAVEFORM (R/L = H)
1/fmax.
PWCLK(H)
PWCLK(L)
VCC
CLK
50%
50%
50%
50%
VSS
tSETUP
tHOLD
VCC
STVL1/2
(STVR1/2)
50%
50%
VSS
tPLH1
tPHL1
VCC
STVR1/2
(STVL1/2)
50%
50%
VSS
tPLH2
tTLH
tPHL2
90%
On
tTHL
VDD2
90%
10%
10%
VEE2
PWOE
VCC
50%
OEn
50%
VSS
tPLH3
tPHL3
VEE2
VDD2
90%
On
VEE1
10%
VEE1
VEE2
11
µPD16654
8. RECOMMENDED MOUNTING CONDITIONS
When mounting this product, please make sure that the following recommended conditions are satisfied.
For packaging methods and conditions other than those recommended below, please contact NEC sales
personnel.
Mounting Condition
Thermocompression
Mounting Method
Condition
Soldering
Heating tool 300 to 350°C, heating for 2 to 3 sec; pressure 100 g (per solder)
ACF
(Adhesive
Conductive Film)
Temporary bonding 70 to 100°C; pressure 3 to 8 kg/cm ; time 3 to 5 sec.
2
Real bonding 165 to 180°C; pressure 25 to 45 kg/cm , time 30 to 40 secs.
(When using the anisotropy conductive film SUMIZAC1003 of Sumitomo
Bakelite, Ltd.)
2
Caution To find out the detailed conditions for packaging the ACF part, please contact the ACF
manufacturing company. Be sure to avoid using two or more packaging methods at a time.
Reference
NEC Semiconductor Device Reliability/Quality Control System (C10983E)
Quality Grades to NEC’s Semiconductor Devices (C11531E)
12
µPD16654
[MEMO]
13
µPD16654
[MEMO]
14
µPD16654
[MEMO]
15
µPD16654
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consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
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the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5