TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS Copyright © 1999, Power Innovations Limited, UK NOVEMBER 1997 - REVISED MARCH 1999 HIGH HOLDING CURRENT 100 A 10/1000 OVERVOLTAGE PROTECTORS ● 8 kV 10/700, 200 A 5/310 ITU-T K20/21 rating ● High Holding Current . . . . . . . . . 225 mA min. ● Ion-Implanted Breakdown Region Precise and Stable Voltage Low Voltage Overshoot under Surge VDRM DEVICE SMBJ PACKAGE (TOP VIEW) R(B) 1 2 T(A) MDXXBG V(BO) MINIMUM MAXIMUM V V ‘4165 135 165 ‘4180 145 180 ‘4200 155 200 ‘4265 200 265 ‘4300 230 300 ‘4360 270 360 device symbol T SD4XAA R ● ● Rated for International Surge Wave Shapes WAVE SHAPE STANDARD 2/10 µs GR-1089-CORE ITSP Terminals T and R correspond to the alternative line designators of A and B A 500 8/20 µs IEC 61000-4-5 300 10/160 µs FCC Part 68 250 10/700 µs ITU-T K20/21 200 10/560 µs FCC Part 68 160 10/1000 µs GR-1089-CORE 100 Low Differential Capacitance . . . 39 pF max. description These devices are designed to limit overvoltages on the telephone line. Overvoltages are normally caused by a.c. power system or lightning flash disturbances which are induced or conducted on to the telephone line. A single device provides 2-point protection and is typically used for the protection of 2-wire telecommunication equipment (e.g. between the Ring and Tip wires for telephones and modems). Combinations of devices can be used for multi-point protection (e.g. 3-point protection between Ring, Tip and Ground). The protector consists of a symmetrical voltage-triggered bidirectional thyristor. Overvoltages are initially clipped by breakdown clamping until the voltage rises to the breakover level, which causes the device to crowbar into a low-voltage on state. This low-voltage on state causes the current resulting from the overvoltage to be safely diverted through the device. The high crowbar holding current prevents d.c. latchup as the diverted current subsides. This TISP4xxxH4BJ range consists of six voltage variants to meet various maximum system voltage levels (135 V to 270 V). They are guaranteed to voltage limit and withstand the listed international lightning surges in both polarities. These high (H) current protection devices are in a plastic package SMBJ (JEDEC DO214AA with J-bend leads) and supplied in embossed carrier reel pack. For alternative voltage and holding current values, consult the factory. For lower rated impulse currents in the SMB package, the 50 A 10/1000 TISP4xxxM3BJ series is available. PRODUCT INFORMATION Information is current as of publication date. Products conform to specifications in accordance with the terms of Power Innovations standard warranty. Production processing does not necessarily include testing of all parameters. 1 TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 absolute maximum ratings, TA = 25°C (unless otherwise noted) RATING Repetitive peak off-state voltage, (see Note 1) SYMBOL VALUE ‘4165 ±135 ‘4180 ±145 ‘4200 ‘4265 VDRM ±155 ±200 ‘4300 ±230 ‘4360 ±270 UNIT V Non-repetitive peak on-state pulse current (see Notes 2, 3 and 4) 2/10 µs (GR-1089-CORE, 2/10 µs voltage wave shape) 500 8/20 µs (IEC 61000-4-5, 1.2/50 µs voltage, 8/20 current combination wave generator) 300 10/160 µs (FCC Part 68, 10/160 µs voltage wave shape) 250 5/200 µs (VDE 0433, 10/700 µs voltage wave shape) 0.2/310 µs (I3124, 0.5/700 µs voltage wave shape) ITSP 5/310 µs (ITU-T K20/21, 10/700 µs voltage wave shape) 220 200 A 200 5/310 µs (FTZ R12, 10/700 µs voltage wave shape) 200 10/560 µs (FCC Part 68, 10/560 µs voltage wave shape) 160 10/1000 µs (GR-1089-CORE, 10/1000 µs voltage wave shape) 100 Non-repetitive peak on-state current (see Notes 2, 3 and 5) 20 ms (50 Hz) full sine wave 55 16.7 ms (60 Hz) full sine wave ITSM 1000 s 50 Hz/60 Hz a.c. Initial rate of rise of on-state current, Exponential current ramp, Maximum ramp value < 200 A Junction temperature Storage temperature range NOTES: 1. 2. 3. 4. 5. A diT/dt 400 A/µs TJ -40 to +150 °C Tstg -65 to +150 °C See Applications Information and Figure 10 for voltage values at lower temperatures. Initially the TISP4xxxH4BJ must be in thermal equilibrium with TJ = 25°C. The surge may be repeated after the TISP4xxxH4BJ returns to its initial conditions. See Applications Information and Figure 11 for current ratings at other temperatures. EIA/JESD51-2 environment and EIA/JESD51-3 PCB with standard footprint dimensions connected with 5 A rated printed wiring track widths. See Figure 8 for the current ratings at other durations. Derate current values at -0.61 %/°C for ambient temperatures above 25 °C PRODUCT 2 60 2.1 INFORMATION TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 electrical characteristics for the T and R terminals, TA = 25°C (unless otherwise noted) PARAMETER IDRM V(BO) V(BO) TEST CONDITIONS MIN TYP ±5 TA = 85°C ±10 ‘4165 ±165 ‘4180 ±180 ‘4200 ±200 ‘4265 ±265 ‘4300 ±300 ‘4360 ±360 ‘4165 ±174 dv/dt ≤ ±1000 V/µs, Linear voltage ramp, ‘4180 ±189 Impulse breakover Maximum ramp value = ±500 V ‘4200 ±210 voltage di/dt = ±20 A/µs, Linear current ramp, ‘4265 ±276 Maximum ramp value = ±10 A ‘4300 ±311 state current Breakover voltage VD = ±VDRM dv/dt = ±750 V/ms, RSOURCE = 300 Ω ‘4360 RSOURCE = 300 Ω I(BO) Breakover current dv/dt = ±750 V/ms, VT On-state voltage IT = ±5 A, tW = 100 µs Holding current IT = ±5 A, di/dt = +/-30 mA/ms IH dv/dt ID Coff MAX TA = 25°C Repetitive peak off- Critical rate of rise of off-state voltage Off-state current ±0.225 Off-state capacitance f = 100 kHz, Vd = 1 V rms, VD = -1 V f = 100 kHz, f = 100 kHz, f = 100 kHz, Vd = 1 V rms, VD = -2 V Vd = 1 V rms, VD = -50 V Vd = 1 V rms, VD = -100 V V A ±3 V ±0.8 A kV/µs TA = 85°C Vd = 1 V rms, VD = 0, V ±0.8 ±5 VD = ±50 V f = 100 kHz, µA ±373 ±0.15 Linear voltage ramp, Maximum ramp value < 0.85VDRM UNIT ±10 ‘4165 thru ‘4200 80 90 ‘4265 thru ‘4360 70 84 ‘4165 thru ‘4200 71 79 ‘4265 thru ‘4360 60 67 ‘4165 thru ‘4200 65 74 ‘4265 thru ‘4360 55 62 ‘4165 thru ‘4200 30 35 ‘4265 thru ‘4360 24 28 ‘4165 thru ‘4200 28 33 ‘4265 thru ‘4360 22 26 TYP MAX µA pF thermal characteristics PARAMETER TEST CONDITIONS MIN EIA/JESD51-3 PCB, IT = ITSM(1000), RθJA Junction to free air thermal resistance 4-layer PCB, IT = ITSM(1000), TA = 25 °C NOTE 113 TA = 25 °C, (see Note 6) 265 mm x 210 mm populated line card, UNIT °C/W 50 6: EIA/JESD51-2 environment and PCB has standard footprint dimensions connected with 5 A rated printed wiring track widths. PRODUCT INFORMATION 3 TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 PARAMETER MEASUREMENT INFORMATION +i Quadrant I ITSP Switching Characteristic ITSM IT V(BO) VT I(BO) IH VDRM -v IDRM ID VD ID IDRM VD VDRM +v IH I(BO) VT V(BO) IT ITSM Quadrant III ITSP Switching Characteristic -i Figure 1. VOLTAGE-CURRENT CHARACTERISTIC FOR T AND R TERMINALS ALL MEASUREMENTS ARE REFERENCED TO THE R TERMINAL PRODUCT 4 INFORMATION PMXXAAB TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 TYPICAL CHARACTERISTICS OFF-STATE CURRENT vs JUNCTION TEMPERATURE TCHAG 100 1.10 NORMALISED BREAKOVER VOLTAGE vs JUNCTION TEMPERATURE TC4HAF VD = ±50 V Normalised Breakover Voltage |ID| - Off-State Current - µA 10 1 0·1 0·01 1.05 1.00 0.95 0·001 -25 0 25 50 75 100 125 TJ - Junction Temperature - °C -25 150 Figure 2. ON-STATE CURRENT vs ON-STATE VOLTAGE 200 150 100 TC4HAH Normalised Holding Current IT - On-State Current - A NORMALISED HOLDING CURRENT vs JUNCTION TEMPERATURE TC4HAK 1.5 50 40 30 20 15 10 7 5 4 3 1 0.7 2.0 TA = 25 °C tW = 100 µs '4265 THRU '4360 150 Figure 3. 70 2 1.5 0 25 50 75 100 125 TJ - Junction Temperature - °C '4165 THRU '4200 1.0 0.9 0.8 0.7 0.6 0.5 0.4 1 1.5 2 3 4 5 VT - On-State Voltage - V 7 10 Figure 4. PRODUCT -25 0 25 50 75 100 125 TJ - Junction Temperature - °C 150 Figure 5. INFORMATION 5 TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 TYPICAL CHARACTERISTICS DIFFERENTIAL OFF-STATE CAPACITANCE vs RATED REPETITIVE PEAK OFF-STATE VOLTAGE TC4HAI 1 0.7 0.6 '4165 THRU '4200 0.5 '4265 THRU '4360 0.4 0.3 1 2 3 5 10 20 30 50 100150 VD - Off-state Voltage - V Figure 6. PRODUCT 6 INFORMATION '4300 '4265 '4200 '4180 35 '4165 TJ = 25°C Vd = 1 Vrms 0.8 ∆C - Differential Off-State Capacitance - pF Capacitance Normalised to VD = 0 0.9 0.2 0.5 TCHAJ 36 '4360 NORMALISED CAPACITANCE vs OFF-STATE VOLTAGE 34 33 ∆C = Coff(-2 V) - Coff(-50 V) 32 31 30 130 150 170 200 230 270 VDRM - Repetitive Peak Off-State Voltage - V Figure 7. 300 TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 RATING AND THERMAL INFORMATION THERMAL IMPEDANCE vs POWER DURATION TI4HAC 30 VGEN = 600 Vrms, 50/60 Hz RGEN = 1.4*VGEN/ITSM(t) EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 20 15 10 9 8 7 6 5 4 3 2 1.5 0·1 1 10 100 100 70 50 40 30 20 15 10 7 5 4 3 1 0·1 1000 ITSM(t) APPLIED FOR TIME t EIA/JESD51-2 ENVIRONMENT EIA/JESD51-3 PCB TA = 25 °C 2 1.5 t - Current Duration - s 1 10 100 1000 t - Power Duration - s Figure 8. Figure 9. VDRM DERATING FACTOR vs MINIMUM AMBIENT TEMPERATURE IMPULSE RATING vs AMBIENT TEMPERATURE TI4HAF 1.00 700 600 0.99 TC4HAA BELLCORE 2/10 500 400 Impulse Current - A 0.98 Derating Factor TI4HAE 150 ZθJA(t) - Transient Thermal Impedance - °C/W ITSM(t) - Non-Repetitive Peak On-State Current - A NON-REPETITIVE PEAK ON-STATE CURRENT vs CURRENT DURATION 0.97 '4165 THRU '4200 0.96 0.95 IEC 1.2/50, 8/20 300 FCC 10/160 250 ITU-T 10/700 200 FCC 10/560 150 120 0.94 BELLCORE 10/1000 '4265 THRU '4360 0.93 -40 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 TAMIN - Minimum Ambient Temperature - °C Figure 10. PRODUCT 100 90 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 TA - Ambient Temperature - °C Figure 11. INFORMATION 7 TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 APPLICATIONS INFORMATION deployment These devices are two terminal overvoltage protectors. They may be used either singly to limit the voltage between two conductors (Figure 12) or in multiples to limit the voltage at several points in a circuit (Figure 13). Th3 Th1 Th1 Th2 Figure 12. TWO POINT PROTECTION Figure 13. MULTI-POINT PROTECTION In Figure 12, protector Th1 limits the maximum voltage between the two conductors to ±V(BO). This configuration is normally used to protect circuits without a ground reference, such as modems. In Figure 13, protectors Th2 and Th3 limit the maximum voltage between each conductor and ground to the ±V(BO) of the individual protector. Protector Th1 limits the maximum voltage between the two conductors to its ±V(BO) value. If the equipment being protected has all its vulnerable components connected between the conductors and ground, then protector Th1 is not required. impulse testing To verify the withstand capability and safety of the equipment, standards require that the equipment is tested with various impulse wave forms. The table below shows some common values. STANDARD GR-1089-CORE PEAK VOLTAGE VOLTAGE PEAK CURRENT CURRENT TISP4xxxH4 SERIES SETTING WAVE FORM VALUE WAVE FORM 25 °C RATING RESISTANCE Ω V µs A µs A 2500 2/10 500 2/10 500 1000 10/1000 100 10/1000 100 0 1500 10/160 200 10/160 250 0 FCC Part 68 800 10/560 100 10/560 160 0 (March 1998) 1500 9/720 † 37.5 5/320 † 200 0 1000 9/720 † 25 5/320 † 200 0 1500 0.5/700 37.5 0.2/310 200 0 5/310 200 0 I3124 ITU-T K20/K21 1500 4000 10/700 37.5 100 † FCC Part 68 terminology for the waveforms produced by the ITU-T recommendation K21 10/700 impulse generator If the impulse generator current exceeds the protectors current rating then a series resistance can be used to reduce the current to the protectors rated value and so prevent possible failure. The required value of series resistance for a given waveform is given by the following calculations. First, the minimum total circuit impedance is found by dividing the impulse generators peak voltage by the protectors rated current. The impulse generators fictive impedance (generators peak voltage divided by peak short circuit current) is then subtracted from the minimum total circuit impedance to give the required value of series resistance. In some cases the equipment will require verification over a temperature range. By using the rated waveform values from Figure 11, the appropriate series resistor value can be calculated for ambient temperatures in the range of -40 °C to 85 °C. PRODUCT 8 INFORMATION TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 a.c. power testing The protector can withstand currents applied for times not exceeding those shown in Figure 8. Currents that exceed these times must be terminated or reduced to avoid protector failure. Fuses, PTC (Positive Temperature Coefficient) resistors and fusible resistors are overcurrent protection devices which can be used to reduce the current flow. Protective fuses may range from a few hundred milliamperes to one ampere. In some cases it may be necessary to add some extra series resistance to prevent the fuse opening during impulse testing. The current versus time characteristic of the overcurrent protector must be below the line shown in Figure 8. In some cases there may be a further time limit imposed by the test standard (e.g. UL 1459 wiring simulator failure). capacitance The protector characteristic off-state capacitance values are given for d.c. bias voltage, VD, values of 0, -1 V, -2 V and -50 V. Where possible values are also given for -100 V. Values for other voltages may be calculated by multiplying the VD = 0 capacitance value by the factor given in Figure 6. Up to 10 MHz the capacitance is essentially independent of frequency. Above 10 MHz the effective capacitance is strongly dependent on connection inductance. In many applications, such as Figure 15 and Figure 17, the typical conductor bias voltages will be about -2 V and -50 V. Figure 7 shows the differential (line unbalance) capacitance caused by biasing one protector at -2 V and the other at -50 V. normal system voltage levels The protector should not clip or limit the voltages that occur in normal system operation. For unusual conditions, such as ringing without the line connected, some degree of clipping is permissible. Under this condition about 10 V of clipping is normally possible without activating the ring trip circuit. Figure 10 allows the calculation of the protector VDRM value at temperatures below 25 °C. The calculated value should not be less than the maximum normal system voltages. The TISP4265H4BJ, with a VDRM of 200 V, can be used for the protection of ring generators producing 100 V rms of ring on a battery voltage of -58 V (Th2 and Th3 in Figure 17). The peak ring voltage will be 58 + 1.414*100 = 199.4 V. However, this is the open circuit voltage and the connection of the line and its equipment will reduce the peak voltage. In the extreme case of an unconnected line, clipping the peak voltage to 190 V should not activate the ring trip. This level of clipping would occur at the temperature when the VDRM has reduced to 190/200 = 0.95 of its 25 °C value. Figure 10 shows that this condition will occur at an ambient temperature of -22 °C. In this example, the TISP4265H4BJ will allow normal equipment operation provided that the minimum expected ambient temperature does not fall below -22 °C. JESD51 thermal measurement method To standardise thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51 standard. Part 2 of the standard (JESD51-2, 1995) describes the test environment. This is a 0.0283 m3 (1 ft3) cube which contains the test PCB (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller than 27 mm on a side and the other for packages up to 48 mm. The SMBJ measurements used the smaller 76.2 mm x 114.3 mm (3.0 “ x 4.5 “) PCB. The JESD51-3 PCBs are designed to have low effective thermal conductivity (high thermal resistance) and represent a worse case condition. The PCBs used in the majority of applications will achieve lower values of thermal resistance and so can dissipate higher power levels than indicated by the JESD51 values. PRODUCT INFORMATION 9 TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 typical circuits MODEM TIP WIRE RING FUSE RING DETECTOR R1a Th3 HOOK SWITCH TISP4360H4 PROTECTED EQUIPMENT Th1 D.C. SINK Th2 SIGNAL TIP AI6XBP RING WIRE Figure 14. MODEM INTER-WIRE PROTECTION E.G. LINE CARD R1b AI6XBK Figure 15. PROTECTION MODULE R1a Th3 SIGNAL Th1 Th2 R1b AI6XBL D.C. Figure 16. ISDN PROTECTION OVERCURRENT PROTECTION TIP WIRE RING/TEST PROTECTION TEST RELAY RING RELAY SLIC RELAY S3a R1a Th3 S1a SLIC PROTECTION Th4 S2a SLIC Th1 Th2 RING WIRE Th5 R1b S3b S1b S2b TISP6xxxx, TISPPBLx, ½TISP6NTP2 C1 220 nF TEST EQUIPMENT RING GENERATOR Figure 17. LINE CARD RING/TEST PROTECTION PRODUCT 10 INFORMATION VBAT AI6XBJ TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 MECHANICAL DATA SMBJ (DO-214AA) plastic surface mount diode package This surface mount package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly. SMB 4,57 4,06 3,94 3,30 2 Index Mark (if needed) 2,40 2,00 1,52 0,76 2,10 1,90 0,20 0,10 2,32 1,96 5,59 5,21 ALL LINEAR DIMENSIONS IN MILLIMETERS MDXXBHA PRODUCT INFORMATION 11 TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 MECHANICAL DATA recommended printed wiring footprint. SMB Pad Size 2.54 2.40 2.16 ALL LINEAR DIMENSIONS IN MILLIMETERS MDXXBI device symbolization code Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified. DEVICE SYMOBLIZATION CODE TISP4165H4BJ 4165H4 TISP4180H4BJ 4180H4 TISP4200H4BJ 4200H4 TISP4265H4BJ 4265H4 TISP4300H4BJ 4300H4 TISP4360H4BJ 4360H4 carrier information Devices are shipped in one of the carriers below. Unless a specific method of shipment is specified by the customer, devices will be shipped in the most practical carrier. For production quantities the carrier will be embossed tape reel pack. Evaluation quantities may be shipped in bulk pack or embossed tape. PRODUCT 12 CARRIER ORDER # Embossed Tape Reel Pack TISP4xxxH4BJR Bulk Pack TISP4xxxH4BJ INFORMATION TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 MECHANICAL DATA tape dimensions SMB Package Single-Sprocket Tape 4,10 3,90 1,65 1,55 2,05 1,95 1,85 1,65 0,40 MAX. 5,55 5,45 8,10 7,90 ø 1,5 MIN. 0 MIN. Carrier Tape Direction of Feed 12,30 11,70 8,20 MAX. Cover Tape 4,5 MAX. Embossment 20° Index Mark (if needed) Maximium component rotation Typical component cavity centre line Typical component centre line ALL LINEAR DIMENSIONS IN MILLIMETERS NOTES: A. The clearance between the component and the cavity must be within 0,05 mm MIN. to 0,65 mm MAX. so that the component cannot rotate more than 20° within the determined cavity. B. Taped devices are supplied on a reel of the following dimensions:- MDXXBJ Reel diameter: 330 ±3,0 mm Reel hub diameter 75 mm MIN. Reel axial hole: 13,0 ±0,5 mm C. 3000 devices are on a reel. PRODUCT INFORMATION 13 TISP4165H4BJ THRU TISP4200H4BJ, TISP4265H4BJ THRU TISP4360H4BJ BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS NOVEMBER 1997 - REVISED MARCH 1999 IMPORTANT NOTICE Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the information being relied on is current. PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. PI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor is any license, either express or implied, granted under any patent right, copyright, design right, or other intellectual property right of PI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORISED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS. Copyright © 1999, Power Innovations Limited PRODUCT 14 INFORMATION