IXYS IXFT16N120P

IXFH16N120P
IXFT16N120P
PolarTM Power MOSFET
HiPerFETTM
VDSS
ID25
RDS(on)
trr
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
= 1200V
= 16A
≤ 950mΩ
Ω
≤ 300ns
TO-247 (IXFH)
Symbol
Test Conditions
Maximum Ratings
VDSS
TJ = 25°C to 150°C
1200
V
VDGR
TJ = 25°C to 150°C, RGS = 1MΩ
1200
V
VGSS
Continuous
± 30
V
VGSM
Transient
± 40
V
ID25
TC = 25°C
16
A
IDM
TC = 25°C, pulse width limited by TJM
35
A
IA
TC = 25°C
8
A
EAS
TC = 25°C
800
mJ
dV/dt
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
15
V/ns
PD
TC = 25°C
660
W
-55 ... +150
°C
TJM
150
°C
Tstg
-55 ... +150
°C
TJ
TL
Maximum lead temperature for soldering
300
°C
TSOLD
Plastic body for 10s
260
°C
Md
Mounting torque (TO-247)
1.13 / 10
Nm/lb.in.
Weight
TO-247
TO-268
6
5
g
g
TAB
TO-268 (IXFT)
G
G = Gate
S = Source
z
z
z
z
z
BVDSS
VGS = 0V, ID = 1mA
1200
VGS(th)
VDS = VGS, ID = 1mA
3.5
IGSS
VGS = ± 30V, VDS = 0V
IDSS
VDS = VDSS
VGS = 0V
z
RDS(on)
TJ = 125°C
VGS = 10V, ID = 0.5 • ID25, Note 1
© 2008 IXYS CORPORATION, All rights reserved
V
± 200
nA
25 μA
2.5 mA
International standard packages
Fast recovery diode
Unclamped Inductive Switching (UIS)
rated
Low package inductance
- easy to drive and to protect
Easy to mount
Space savings
High power density
Applications:
V
6.5
D
= Drain
TAB = Drain
Advantages
z
Characteristic Values
Min.
Typ. Max.
TAB
Features
z
Symbol
Test Conditions
(TJ = 25°C, unless otherwise specified)
S
z
z
z
z
High Voltage Switched-mode and
resonant-mode power supplies
High Voltage Pulse Power Applications
High Voltage Discharge circuits in
Lasers Pulsers, Spark Igniters, RF
Generators
High Voltage DC-DC converters
High Voltage DC-AC inverters
950 mΩ
DS99896A (04/08)
IXFH16N120P
IXFT16N120P
Symbol
Test Conditions
(TJ = 25°C unless otherwise specified)
gfs
Characteristic Values
Min.
Typ.
Max.
VDS = 20V, ID = 0.5 • ID25, Note 1
7
Ciss
Coss
VGS = 0V, VDS = 25V, f = 1MHz
Crss
RGi
Gate input resistance
td(on)
TO-247 (IXFH) Outline
11
S
6900
pF
390
pF
48
pF
1.4
Ω
35
ns
tr
Resistive Switching Times
28
ns
td(off)
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
66
ns
tf
RG = 2Ω (External)
35
ns
120
nC
37
nC
47
nC
Qg(on)
Qgs
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
0.19 °C/W
RthJC
RthCS
°C/W
(TO-247)
0.21
Source-Drain Diode
TJ = 25°C unless otherwise specified)
Characteristic Values
Min.
Typ.
Max.
IS
VGS = 0V
16
A
ISM
Repetitive, pulse width limited by TJM
64
A
VSD
IF = IS, VGS = 0V, Note 1
1.5
V
trr
IF = 8A, -di/dt = 100A/μs
300 ns
QRM
VR = 100V, VGS = 0V
IRM
0.75
μC
7.5
A
∅P
e
Dim.
Millimeter
Min. Max.
A
4.7
5.3
2.2
2.54
A1
2.2
2.6
A2
b
1.0
1.4
b1
1.65
2.13
b2
2.87
3.12
C
.4
.8
D
20.80 21.46
E
15.75 16.26
e
5.20
5.72
L
19.81 20.32
L1
4.50
∅P 3.55
3.65
Q
5.89
6.40
R
4.32
5.49
S
6.15 BSC
Inches
Min. Max.
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
0.205 0.225
.780 .800
.177
.140 .144
0.232 0.252
.170 .216
242 BSC
TO-268 Outline
Note 1: Pulse test, t ≤ 300μs; duty cycle, d ≤ 2%.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or moreof the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXFH16N120P
IXFT16N120P
Fig. 1. Output Characteristics
@ 25ºC
Fig. 2. Extended Output Characteristics
@ 25ºC
16
26
VGS = 10V
8V
14
VGS = 10V
8V
24
22
12
20
7V
ID - Amperes
ID - Amperes
18
10
8
6
6V
7V
16
14
12
10
6V
8
4
6
4
2
5V
5V
2
0
0
0
2
4
6
8
10
12
14
16
0
5
10
16
25
30
2.8
VGS = 10V
8V
7V
14
2.6
VGS = 10V
2.4
RDS(on) - Normalized
12
ID - Amperes
20
Fig. 4. RDS(on) Normalized to ID = 8A Value
vs. Junction Temperature
Fig. 3. Output Characteristics
@ 125ºC
10
6V
8
6
4
2.2
2.0
I D = 16A
1.8
I D = 8A
1.6
1.4
1.2
1.0
0.8
2
5V
0.6
0
0.4
0
5
10
15
20
25
30
35
-50
-25
0
VDS - Volts
25
50
75
100
125
150
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = 8A Value
vs. Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
18
2.4
VGS = 10V
2.2
16
TJ = 125ºC
14
2.0
12
ID - Amperes
RDS(on) - Normalized
15
VDS - Volts
VDS - Volts
1.8
1.6
1.4
10
8
6
1.2
4
TJ = 25ºC
1.0
2
0
0.8
0
2
4
6
8
10
12
14
16
ID - Amperes
© 2008 IXYS CORPORATION, All rights reserved
18
20
22
24
26
-50
-25
0
25
50
75
TC - Degrees Centigrade
100
125
150
IXFH16N120P
IXFT16N120P
Fig. 7. Input Admittance
18
14
16
g f s - Siemens
10
TJ = - 40ºC
14
TJ = 125ºC
25ºC
- 40ºC
12
ID - Amperes
Fig. 8. Transconductance
16
8
6
4
25ºC
12
10
125ºC
8
6
4
2
2
0
0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
0
7.0
2
4
6
VGS - Volts
Fig. 9. Forward Voltage Drop of
Intrinsic Diode
10
12
14
16
Fig. 10. Gate Charge
50
10
45
9
40
8
35
7
VGS - Volts
IS - Amperes
8
ID - Amperes
30
25
20
TJ = 125ºC
15
VDS = 600V
I D = 8A
I G = 10mA
6
5
4
3
TJ = 25ºC
10
2
5
1
0
0
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0
1.3
10
20
30
VSD - Volts
40
50
60
70
80
90
100 110 120 130
QG - NanoCoulombs
Fig. 12. Maximum Transient Thermal
Impedance
Fig. 11. Capacitance
100,000
1.00
Ciss
10,000
1,000
Z(th)JC - ºC / W
Capacitance - PicoFarads
f = 1 MHz
Coss
0.10
100
Crss
10
0
5
10
15
20
25
30
35
40
VDS - Volts
0.01
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS REF: F_16N120P(85) 04-03-08-A