SSC MMBT3904LT1

MMBT3904LT1
Transistors (NPN)
FEATURES
„
Power dissipation, PCM: 0.2W (Tamb=25℃)
„
Collector current, ICM: 0.2A
„
Collector-base voltage, V(BR)CBO: 60V
„
Operating and storage junction temperature range:
TJ, Tstg: -55℃ to +150℃
„
SOT-23 plastic-encapsulate package
Device Marking: AM1
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Test Conditions
Min
Max
60
Unit
Collector-base breakdown voltage
V(BR)CBO
Ic= 100 µA, IE=0
V
Collector-emitter breakdown voltage
V(BR)CEO
VIc= 1 mA, IB=0
Emitter-base breakdown voltage
V(BR)EBO
IE= 100µA, IC=0
Collector cut-off current
ICBO
VCB= 60V, IE=0
0.1
µA
Collector cut-off current
ICEO
VCE= 40V, IB=0
0.1
µA
Emitter cut-off current
IEBO
VEB= 5V, IC=0
0.1
µA
DC current gain
HFE(1)
VCE=10V, IC= 1mA
100
HFE(2)
VCE= 1V, IC= 50mA
Collector-emitter saturation voltage
VCE(sat)
IC=50mA, IB= 5mA
0.3
V
Base-emitter saturation voltage
VBE(sat)
IC= 50mA, IB= 5mA
0.95
V
Transition frequency
fT
VCE= 20V, IC= 10mA
40
6
60
V
V
300
250
MHz
f=100MHz
Delay Time
td
VCC=3.0Vdc,VBE=0.5Vdc
35
nS
Rise Time
tr
IC=10mAdc,IB1=1.0mAdc
35
nS
Storage Time
ts
VCC=3.0Vdc, IC=10mAdc
200
nS
Fall Time
tf
IB1=IB2=1.0mAdc
50
nS
Note: Unless otherwise specified, these specifications apply over the operating ambient
temperature of 25℃.
12/16/2006 Rev. 1.00
www.SiliconStandard.com
1
MMBT3904LT1
Disclaimer
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation
makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such
information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of
third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any
products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license
is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any
information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties.
12/16/2006 Rev. 1.00
www.SiliconStandard.com
2