SSC 2N7002

2N7002
N-CHANNEL MOSFET
PRODUCT SUMMARY
SOT-23 Plastic-Encapsulate Transistors
SOT-23
FEATURES
1. GATE
2. SOURCE
High density cell design for low RDS(ON)
Voltage controlled small signal switch
Rugged and reliable
High saturation current capability
3. DRAIN
Pb-free; RoHS-compliant
MARKING: 7002
MAXIMUM RATINGS (TA=25 oC unless otherwise noted)
Symbol
Parameter
Value
Units
VDS
Drain-Source voltage
60
V
ID
Drain Current
115
mA
PD
Power Dissipation
225
mW
TJ
Junction Temperature
150
℃
Tstg
Storage Temperature
-55-150
℃
08/04/2007 Rev.1.00
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1
2N7002
ELECTRICAL CHARACTERISTICS (Tamb=25 oC unless otherwise specified)
Parameter
Symbol
Test
conditions
MIN
TYP
MAX
UNIT
VGS=0 V, ID=10 μA
60
Vth(GS)
VDS=VGS, ID=250 μA
1
Gate-body Leakage
lGSS
VDS=0 V, VGS=±25 V
Zero Gate Voltage Drain Current
IDSS
VDS=60 V, VGS=0 V
On-state Drain Current
ID(ON)
VGS=10 V, VDS=7 V
500
rDS(0n)
VGS=10 V, ID=500mA
1
7.5
Drain-Source On-Resistance
VGS=5 V, ID=50mA
1
7.5
VDS=10 V, ID=200mA
80
500
ms
VGS=10V, ID=500mA
0.5
3.75
V
VGS=5V, ID=50mA
0.05
0.375
V
IS=115mA, VGS=0 V
0.55
1.2
V
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Forward Trans conductance
Drain-source on-voltage
V(BR)DSS
gfs
VDS(on)
Diode Forward Voltage
VSD
Input Capacitance
Ciss
Output Capacitance
COSS
Reverse Transfer Capacitance
CrSS
V
2.5
±80
nA
80
nA
mA
Ω
50
VDS=25V, VGS=0V, f=1MHz
25
pF
5
SWITCHING TIME
Turn-on Time
td(on)
Turn-off Time
td(off)
08/04/2007 Rev.1.00
VDD=25 V, RL=50Ω
ID=500mA,VGEN=10 V
RG=25 Ω
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20
40
ns
2
2N7002
TYPICAL CHARACTERISTICS
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no
guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.
08/04/2007 Rev.1.00
www.SiliconStandard.com
3