VISHAY SI9945AEY

Si9945AEY
Vishay Siliconix
Dual N-Channel 60-V (D-S), 175C MOSFET
VDS (V)
60
rDS(on) ()
ID (A)
0.080 @ VGS = 10 V
3.7
0.100 @ VGS = 4.5 V
3.4
D1
D1
D2
D2
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
G1
G2
Top View
S1
S2
N-Channel MOSFET
N-Channel MOSFET
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
60
Gate-Source Voltage
VGS
20
Continuous Drain Current (TJ = 175C)a
TA = 25C
TA = 70C
3.2
IDM
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
2
2.4
PD
TA = 70C
Operating Junction and Storage Temperature Range
A
25
IS
TA = 25C
V
3.7
ID
Pulsed Drain Current
Unit
W
1.7
TJ, Tstg
C
–55 to 175
Parameter
Symbol
Typ
t 10 sec
Junction-to-Ambienta
Max
Unit
62.5
C/W
RthJA
Steady State
93
Notes
a. Surface Mounted on 1” x 1” FR4 Board
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Document Number: 70758
S-57253—Rev. C, 24-Feb-98
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Si9945AEY
Vishay Siliconix
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 mA
1.0
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "20 V
Zero Gate Voltage Drain Current
IDSS
Typ
Max
Unit
Static
Gate Threshold Voltage
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
Forward Transconductancea
Diode Forward
Voltagea
V
"100
VDS = 60 V, VGS = 0 V
1
VDS = 60 V, VGS = 0 V, TJ = 55C
10
VDS w 5 V, VGS = 10 V
20
nA
mA
A
VGS = 10 V, ID = 3.7 A
0.06
0.080
VGS = 4.5 V, ID = 3.4 A
0.075
0.100
gfs
VDS = 15 V, ID = 3.7 A
11
VSD
IS = 2.0 A, VGS = 0 V
W
S
1.2
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
11
VDS = 30 V,
V VGS = 10 V
V, ID = 3.7
37 A
20
nC
C
2
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
9
20
tr
10
20
21
40
8
20
45
80
Rise Time
Turn-Off Delay Time
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
2
VDD = 30 V
V,, RL = 30 W
ID ^ 1 A,
A VGEN = 10 V
V, RG = 6 W
IF = 2.0 A, di/dt = 100 A/ms
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
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Document Number: 70758
S-57253—Rev. C, 24-Feb-98
Si9945AEY
Vishay Siliconix
Output Characteristics
Transfer Characteristics
25
25
VGS = 10 through 5 V
20
TC = –55C
20
4V
I D – Drain Current (A)
I D – Drain Current (A)
25C
15
10
3V
5
0
150C
15
10
5
0
0
1
2
3
4
5
0
1
VDS – Drain-to-Source Voltage (V)
2
On-Resistance vs. Drain Current
4
5
6
50
60
Capacitance
0.20
800
0.16
600
C – Capacitance (pF)
r DS(on) – On-Resistance ( )
3
VGS – Gate-to-Source Voltage (V)
0.12
VGS = 4.5 V
0.08
VGS = 10 V
0.04
Ciss
400
200
Coss
Crss
0
0
0
5
10
15
20
25
0
10
ID – Drain Current (A)
Gate Charge
2.4
2.0
VDS = 30 V
ID = 3.7 A
8
r DS(on) – On-Resistance ( )
(Normalized)
V GS – Gate-to-Source Voltage (V)
10
6
4
2
0
0
2
4
6
Qg – Total Gate Charge (nC)
Document Number: 70758
S-57253—Rev. C, 24-Feb-98
20
30
40
VDS – Drain-to-Source Voltage (V)
8
10
On-Resistance vs. Junction Temperature
VGS = 10 V
ID = 3.7 A
1.6
1.2
0.8
0.4
0
–50
–25
0
25
50
75
100
125
150
175
TJ – Junction Temperature (C)
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Si9945AEY
Vishay Siliconix
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.20
r DS(on) – On-Resistance ( W )
I S – Source Current (A)
30
10
TJ = 175C
TJ = 25C
0.16
0.12
0.08
ID = 3.7 A
0.04
1
0
0
0.3
0.6
0.9
1.2
0
1.5
VSD – Source-to-Drain Voltage (V)
2
6
8
10
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power
0.6
120
0.3
90
ID = 250 mA
0.0
Power (W)
V GS(th) Variance (V)
4
–0.3
60
30
–0.6
–0.9
–50
–25
0
25
50
75
100
125
150
175
0
0.001
0.01
0.1
TJ – Temperature (C)
1
10
100
1000
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 93C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10–4
10–3
10–2
10–1
1
10
10+2
10+3
Square Wave Pulse Duration (sec)
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2-4
Document Number: 70758
S-57253—Rev. C, 24-Feb-98