TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 Excalibur™ LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIER FEATURES 1 • Qualified for Automotive Applications • Low Noise – 10 Hz: 15 nV/√Hz – 1 kHz: 10.5 nV/√Hz • 10000-pF Load Capability • 20-mA Short-Circuit Output Current (Min) • 27-V/µs Slew Rate (Min) • High Gain-Bandwidth Product: 5.9 MHz • Single or Split Supply: 4 V to 44 V • Fast Settling Time – 340 ns to 0.1% – 400 ns to 0.01% • Large Output Swing: VCC– + 0.1 V to VCC+ – 1 V D PACKAGE (TOP VIEW) 2 1OUT 1IN1IN+ VCC- 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN2IN+ DESCRIPTION/ORDERING INFORMATION The TLE2142 device is a high-performance, internally compensated operational amplifier built using the Texas Instruments complementary bipolar Excalibur™ process. It is a pin-compatible upgrade to standard industry products. The design incorporates an input stage that simultaneously achieves low audio-band noise of 10.5 nV/√Hz with a 10-Hz 1/f corner and symmetrical 40-V/µs slew rate typically with loads up to 800 pF. The resulting low distortion and high power bandwidth are important in high-fidelity audio applications. A fast settling time of 340 ns to 0.1% of a 10-V step with a 2-kΩ/100-pF load is useful in fast actuator/positioning drivers. Under similar test conditions, settling time to 0.01% is 400 ns. The device is stable with capacitive loads up to 10 nF, although the 6-MHz bandwidth decreases to 1.8 MHz at this high loading level. As such, the TLE2142 is useful for low-droop sample-and-holds and direct buffering of long cables, including 4-mA to 20-mA current loops. The special design also exhibits an improved insensitivity to inherent integrated circuit component mismatches as is evidenced by a 500-µV maximum offset voltage and 1.7-µV/°C typical drift. Minimum common-mode rejection ratio and supply-voltage rejection ratio are 85 dB and 90 dB, respectively. Device performance is relatively independent of supply voltage over the ±2-V to ±22-V range. Inputs can operate between VCC– – 0.3 V to VCC+ – 1.8 V without inducing phase reversal, although excessive input current may flow out of each input exceeding the lower common-mode input range. The all-npn output stage provides a nearly rail-to-rail output swing of VCC– + 0.1 V to VCC+ – 1 V under light current-loading conditions. The device can sustain shorts to either supply, because output current is internally limited, but care must be taken to ensure that maximum package power dissipation is not exceeded. The TLE2142 can also be used as a comparator. Differential inputs of VCC± can be maintained without damage to the device. Open-loop propagation delay with TTL supply levels is typically 200 ns. This gives a good indication as to output stage saturation recovery when the device is driven beyond the limits of recommended output swing. The TLE2142 device is available in industry-standard 8-pin small-outline (D) packages. The device is characterized for operation from –40°C to 125°C. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Excalibur is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com SYMBOL (EACH AMPLIFIER) IN+ + IN- - OUT ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) 2 SOIC – D Reel of 2500 ORDERABLE PART NUMBER TLE2142QDRQ1 TOP-SIDE MARKING 2142Q For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 Q33 Q32 Q31 Q29 D7 D6 Q28 65 43 14 8 1 Transistors Resistors Diodes Capacitors Epi-FET TLE2142 COMPONENT DEVICE COMPONENT COUNT VCC Q17 Q7 R5 C1 Q9 Q12 Q11 Q4 Q2 Q6 IN + IN - Q1 R2 D1 Q3 R1 R10 Q16 Q15 Q14 R8 R3 Q5 Q8 R4 R6 Q10 D2 Q13 R7 R9 C2 R11 Q18 VCC + Q19 R12 Q20 Q21 C3 C4 Q24 D5 Q25 R13 D3 D4 Q22 R14 R16 R17 Q23 R15 Q27 Q26 R18 D8 Q30 R20 R22 Q35 R23 Q36 Q37 R19 Q34 R21 R24 OUT EQUIVALENT SCHEMATIC Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 3 TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC+ Supply voltage (2) 22 V VCC– Supply voltage –22 V VID Differential input voltage (3) ±44 V VI Input voltage range (any input) II Input current (each input) ±1 mA IO Output current ±80 mA Total current into VCC+ 80 mA VCC+ to (VCC– – 0.3) V Total current out of VCC– 80 mA Duration of short-circuit current at (or below) 25°C (4) Unlimited θJA Package thermal impedance (5) (6) TA Operating free-air temperature range –40°C to 125°C Tstg Storage temperature range –65°C to 150°C ESD (1) (2) (3) (4) (5) (6) 97.1°C/W Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C Electrostatic discharge rating, Human-body model 500 V Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–. Differential voltages are at IN+ with respect to IN–. Excessive current flows, if input, are brought below VCC– – 0.3 V. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation rating is not exceeded. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS VCC± Supply voltage VIC Common-mode input voltage TA Operating free-air temperature 4 VCC = 5 V VCC± = ±15 V Submit Documentation Feedback MIN MAX UNIT ±2 ±22 V 0 2.7 –15 12.7 –40 125 V °C Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 ELECTRICAL CHARACTERISTICS VCC = 5 V, at specified free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VIO Input offset voltage VO = 2.5 V, RS = 50 Ω, VIC = 2.5 V αVIO Temperature coefficient of input offset voltage VO = 2.5 V, RS = 50 Ω, VIC = 2.5 V IIO Input offset current VO = 2.5 V, RS = 50 Ω, VIC = 2.5 V IIB Input bias current VO = 2.5 V, RS = 50 Ω, VIC = 2.5 V VICR Common-mode input voltage range TA (1) MIN 25°C High-level output voltage 25°C 8 Full range 25°C –0.8 Full range 25°C 0 to 3 –0.3 to 3.2 0 to 2.7 –0.3 to 2.9 3.9 4.1 4 IOH = –15 mA 3.4 3.7 IOH = –100 µA 3.75 Full range Low-level output voltage µA V V 25°C 75 125 150 225 1.2 IOL = 100 µA 1.4 200 Full range 250 IOL = 10 mA 1.25 25°C 50 Full range 5 220 mV V mV V AVD Large-signal differential voltage amplification ri Input resistance 25°C 70 MΩ ci Input capacitance 25°C 2.5 pF zo Open-loop output impedance f = 1 MHz 25°C 30 Ω CMRR Common-mode rejection ratio VIC = VICR(min), RS = 50 Ω kSVR Supply-voltage rejection ratio (ΔVCC±/ΔVIO) VCC± = ±2.5 V to ±15 V, RS = 50 Ω ICC Supply current VO = 2.5 V, No load, VIC = 2.5 V (1) VIC = ±2.5 V, RL = 2 kΩ, VO = 1 V to -1.5 V nA 3.45 IOL = 15 mA IOL = 1 mA µV 3.65 IOL = 150 µA IOL = 1.5 mA –2 –2.3 3.8 IOH = –10 mA 100 200 Full range UNIT µV/°C 1.7 RS = 50 Ω IOH = –1 mA VOL 1900 2600 Full range IOH = –150 µA VOH MAX 220 Full range 25°C IOH = –1.5 mA TYP 25°C 85 Full range 80 25°C 90 Full range 85 25°C 118 dB 106 6.6 Full range V/mV dB 8.8 9.2 mA Full range is –40°C to 125°C. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 5 TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com OPERATING CHARACTERISTICS VCC = 5 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SR+ Positive slew rate AVD = –1, RL = 2 kΩ (1), CL = 500 pF 45 V/µs SR– Negative slew rate AVD = –1, RL = 2 kΩ (1), CL = 500 pF 42 V/µs ts Settling time AVD = –1, 2.5-V step Vn Equivalent input noise voltage RS = 20 Ω Vn(PP) Peak-to-peak equivalent input noise voltage f = 0.1 Hz to 1 Hz 0.48 f = 0.1 Hz to 10 Hz 0.51 In Equivalent input noise current f = 10 Hz 1.92 f = 1 kHz 0.5 THD+N Total harmonic distortion plus noise VO = 1 V to 3 V, RL = 2 kΩ (1), AVD = 2, f = 10 kHz B1 Unity-gain bandwidth RL = 2 kΩ (1), CL = 100 pF 5.9 MHz Gain-bandwidth product RL = 2 kΩ (1), CL = 100 pF, f = 100 kHz 5.8 MHz Maximum output-swing bandwidth VO(PP) = 2 V, RL = 2 kΩ (1), AVD = 1, CL = 100 pF 660 kHz 57 ° BOM φm (1) 6 Phase margin at unity gain To 0.1% 0.16 To 0.01% 0.22 f = 10 Hz 15 f = 1 kHz 10.5 (1) RL = 2 kΩ , CL = 100 pF 0.0052 µs nV/√Hz µV pA/√Hz % RL terminated at 2.5 V. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 ELECTRICAL CHARACTERISTICS VCC = ±15 V, at specified free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VIO Input offset voltage VIC = 0, RS = 50 Ω αVIO Temperature coefficient of input offset voltage VIC = 0, RS = 50 Ω IIO Input offset current VIC = 0, RS = 50 Ω IIB Input bias current VIC = 0, RS = 50 Ω VICR Common-mode input voltage range TA (1) MIN 25°C 7 Full range 25°C –0.7 –15 to –15.3 to 13 13.2 Full range –15 to –15.3 to 12.7 12.9 13.8 25°C 14 IO = –15 mA 13.3 13.7 IO = –100 µA 13.7 13.3 IO = 150 µA –14.7 –14.9 VOM– 25°C –14.5 –14.8 IO = 15 mA –13.4 –13.8 IO = 100 µA –14.6 IO = 1 mA Full range IO = 10 mA nA µA V V 13.6 IO = –10 mA IO = 1.5 mA µV 14.1 13.7 Full range –1.5 –1.8 25°C RS = 50 Ω 100 250 Full range UNIT µV/°C 1.7 25°C IO = –1 mA Maximum negative peak output voltage swing 1200 2000 Full range IO = –1.5 mA Maximum positive peak output voltage swing MAX 290 Full range IO = –150 µA VOM+ TYP V –14.5 –13.4 25°C 100 Full range 20 450 AVD Large-signal differential voltage amplification ri Input resistance 25°C 65 MΩ ci Input capacitance 25°C 2.5 pF zo Open-loop output impedance f = 1 MHz 25°C 30 Ω CMRR Common-mode rejection ratio VIC = VICR(min), RS = 50 Ω kSVR Supply-voltage rejection ratio (ΔVCC±/ΔVIO) VCC± = ±2.5 V to ±15 V, RS = 50 Ω IOS Short-circuit output current VO = 0 ICC Supply current VO = 0, No load, VIC = 2.5 V (1) VO = ±10 V, RL = 2 kΩ VID = 1 V VID = –1 V 25°C 85 Full range 80 25°C 90 Full range 85 25°C 25°C 108 dB 106 –25 –50 20 31 6.9 Full range V/mV dB mA 9 9.4 mA Full range is –40°C to 125°C. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 7 TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com OPERATING CHARACTERISTICS VCC = ±15 V, TA = 25°C (unless otherwise noted) MIN TYP SR+ Positive slew rate PARAMETER AVD = –1, RL = 2 kΩ, CL = 100 pF TEST CONDITIONS 27 45 V/µs SR– Negative slew rate AVD = –1, RL = 2 kΩ, CL = 100 pF 27 42 V/µs ts Settling time AVD = –1, 10-V step Vn Equivalent input noise voltage RS = 20 Ω Vn(PP) Peak-to-peak equivalent input noise voltage f = 0.1 Hz to 1 Hz 0.48 f = 0.1 Hz to 10 Hz 0.51 In Equivalent input noise current f = 10 Hz 1.89 f = 1 kHz 0.47 THD+N Total harmonic distortion plus noise VO(PP) = 20 V, RL = 2 kΩ, AVD = 10, f = 10 kHz 0.01 B1 Unity-gain bandwidth RL = 2 kΩ, CL = 100 pF To 0.1% 0.34 To 0.01% 0.4 f = 10 Hz 15 f = 1 kHz 10.5 MAX UNIT µs nV/√Hz µV pA/√Hz % 6 MHz Gain-bandwidth product RL = 2 kΩ, CL = 100 pF, f = 100 kHz 5.9 MHz BOM Maximum output-swing bandwidth VO(PP) = 20 V, AVD = 1, RL = 2 kΩ, CL = 100 pF 668 kHz φm Phase margin at unity gain RL = 2 kΩ, CL = 100 pF 58 ° 8 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 TYPICAL CHARACTERISTICS Table of Graphs VIO Input offset voltage Distribution Figure 1 IIO Input offset current vs Free-air temperature Figure 2 IIB Input bias current vs Common-mode input voltage Figure 3 vs Free-air temperature Figure 4 vs Supply voltage Figure 5 vs Free-air temperature Figure 6 vs Output current Figure 7 vs Settling time Figure 9 vs Supply voltage Figure 5 vs Free-air temperature Figure 6 vs Output current Figure 8 vs Settling time Figure 9 VOM+ VOM– Maximum positive peak output voltage Maximum negative peak output voltage VO(PP) Maximum peak-to-peak output voltage vs Frequency Figure 10 VOH High-level output voltage vs Output current Figure 11 VOL Low-level output voltage vs Output current Figure 12 Phase shift vs Frequency Figure 13 vs Frequency Figure 13 vs Free-air temperature Figure 14 AVD Large-signal differential voltage amplification zo Closed-loop output impedance vs Frequency Figure 15 IOS Short-circuit output current vs Free-air temperature Figure 16 vs Frequency Figure 17 vs Free-air temperature Figure 18 vs Frequency Figure 19 vs Free-air temperature Figure 20 vs Supply voltage Figure 21 vs Free-air temperature Figure 22 CMRR Common-mode rejection ratio kSVR Supply-voltage rejection ratio ICC Supply current Vn Equivalent input noise voltage vs Frequency Figure 23 Vn Input noise voltage Over a 10-second period Figure 24 In Noise current vs Frequency Figure 25 THD+N Total harmonic distortion plus noise vs Frequency Figure 26 vs Free-air temperature Figure 27 vs Load capacitance Figure 28 Noninverting large signal vs Time Figure 29 Inverting large signal vs Time Figure 30 Small signal vs Time Figure 31 Unity-gain bandwidth vs Load capacitance Figure 32 Gain margin vs Load capacitance Figure 33 Phase margin vs Load capacitance Figure 34 SR Slew rate Pulse response B1 φm Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 9 TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com INPUT OFFSET CURRENT vs FREE-AIR TEMPERATURE TLE2142 DISTRIBUTION OF INPUT OFFSET VOLTAGE 20 24 18 IIIO IO − Input Offset Current − nA Percentage of Units − % 20 236 Units Tested From 1 Wafer Lot VCC ± = ± 15 V TA = 25°C P Package 16 12 8 4 VO = 0 VIC = 0 16 14 12 10 VCC ± = ± 2.5 V 8 6 VCC ± = ± 15 V 4 2 0 −800 −600 200 400 600 −400 −200 0 VIO − Input Offset Voltage − µV 0 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C 800 Figure 1. Figure 2. INPUT BIAS CURRENT vs FREE-AIR TEMPERATURE INPUT BIAS CURRENT vs COMMON-MODE INPUT VOLTAGE −1000 0 VCC ± = ± 2.5 V VO = 0 VIC = 0 IIIB IB − Input Bias Current − nA uA IIIB IB − Input Bias Current − µA −0.2 −0.4 −0.6 TA = 125°C −0.8 TA = 25°C −1 −1.2 −1.4 −3 TA = − 55°C −2.5 −2 −1.5 −1 −0.5 0 0.5 VIC − Common-Mode Input Voltage − V 1 −900 VCC ± = ± 2.5 V −800 −700 VCC ± = ± 15 V −600 −500 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C Figure 3. 10 Figure 4. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 MAXIMUM PEAK OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE MAXIMUM PEAK OUTPUT VOLTAGE vs SUPPLY VOLTAGE 15 RL = 2 kΩ TA = 25°C 18 VCC ± = ± 15 V V OM − Maximum Peak Output Voltage − V V OM − Maximum Peak Output Voltage − V 24 12 VOM + 6 0 −6 VOM − −12 −18 − 24 0 3 6 9 12 15 18 21 14.6 RL = ∞ 14.2 VOM + 13.8 RL = 2 kΩ −13.8 −14.2 RL = 2 kΩ VOM − −14.6 RL = ∞ −15 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C 24 VCC ± − Supply Voltage − V Figure 5. Figure 6. MAXIMUM NEGATIVE PEAK OUTPUT VOLTAGE vs OUTPUT CURRENT 14.6 VCC ± = ± 15 V 14.4 14.2 TA = 125°C 14 TA = 25°C TA = − 55°C 13.8 13.6 −0.1 −0.4 −1 −4 −10 − 40 −100 V OM − − Maximum Negative Peak Output Voltage − V V OM + − Maximum Positive Peak Output Voltage − V MAXIMUM POSITIVE PEAK OUTPUT VOLTAGE vs OUTPUT CURRENT −13.4 VCC ± = ± 15 V −13.6 −13.8 TA = 125°C −14 −14.2 TA = − 55°C −14.4 TA = 25°C −14.6 −14.8 − 15 0.1 IO − Output Current − mA Figure 7. 0.4 1 4 10 40 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 100 IO − Output Current − mA Figure 8. 11 TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com MAXIMUM PEAK OUTPUT VOLTAGE vs SETTLING TIME AVD = −1 VCC ± = ± 15 V TA = 25°C 10 7.5 0.1% 0.01% 5 2.5 Rising 0 Falling −2.5 0.01% −5 0.1% −7.5 −10 −12.5 0 100 200 300 400 500 V O(PP) − Maximum Peak-to-Peak Output Voltage − V VVOM OM − Maximum Peak Output Voltage − V 12.5 MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE vs FREQUENCY ts − Settling Time − ns 30 VCC ± = ± 15 V RL = 2 kΩ 25 TA = 25°C 20 TA = 125°C 15 10 TA = − 55°C 5 0 100 k 400 k Figure 9. HIGH-LEVEL OUTPUT VOLTAGE vs OUTPUT CURRENT 10 M LOW-LEVEL OUTPUT VOLTAGE vs OUTPUT CURRENT 4.6 1400 VCC = 5 V VOL V OL − Low-Level Output Voltage − mV VCC = 5 V V OH − High-Level Output Voltage − V 4M 1M f − Frequency − Hz Figure 10. 4.4 TA = 125°C 4.2 TA = 25°C 4 TA = − 55°C 3.8 3.6 1200 TA = 125°C 1000 800 600 TA = 25°C 400 200 TA = − 55°C 3.4 −0.1 −1 −10 −100 0 0.1 IO − Output Current − mA Figure 11. 12 1 10 100 IO − Output Current − mA Figure 12. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION vs FREE-AIR TEMPERATURE 0° 110 20° 100 40° 90 60° 80 Phase Shift 80° 70 100° 60 120° AVD 50 140° 40 160° 180° 30 VCC ± = ± 15 V RL = 2 kΩ CL = 100 pF TA = 25°C 20 10 0 200° 220° 240° − 10 1 10 100 1k 10 k 100 k f − Frequency − Hz 1M 140 VCC ± = ± 15 V VO = ± 10 V AAVD VD − Large-Signal Differential Voltage Amplification − dB 120 Phase Shift AAVD VD − Large-Signal Differential Voltage Amplification − dB LARGE-SIGNAL DIFFERENTIAL VOLTAGE AMPLIFICATION AND PHASE SHIFT vs FREQUENCY 260° 10 M RL = 10 kΩ 120 RL = 2 kΩ 100 80 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C Figure 13. Figure 14. CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY SHORT-CIRCUIT OUTPUT CURRENT vs FREE-AIR TEMPERATURE 60 100 VCC ± = ± 15 V VO = 0 IOS − Short-Circuit Output Current − mA z o − Closed-Loop Output Impedance − Ω 30 Ω 10 1 AVD = 100 0.1 AVD = 10 AVD = 1 0.01 0.001 1k 10 k 100 k f − Frequency − Hz 1M 10 M 50 VID = 1 40 30 VID = − 1 20 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C Figure 15. Figure 16. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 13 TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com COMMON-MODE REJECTION RATIO vs FREQUENCY 120 VCC ± = ± 15 V TA = 25°C CMRR − Common-Mode Rejection Ratio − dB CMRR − Common-Mode Rejection Ratio − dB 140 COMMON-MODE REJECTION RATIO vs FREE-AIR TEMPERATURE 120 100 80 60 40 20 0 100 1k 10 k 100 k VIC = VICRmin VCC = 5 V 116 112 108 VCC ± = ± 15 V 104 100 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C Figure 18. 1M f − Frequency − Hz Figure 17. SUPPLY-VOLTAGE REJECTION RATIO vs FREQUENCY SUPPLY-VOLTAGE REJECTION RATIO vs FREE-AIR TEMPERATURE 110 kkSVR SVR − Supply-Voltage Rejection Ratio − dB kkSVR SVR − Supply-Voltage Rejection Ratio − dB 160 140 kSVR + 120 kSVR − 100 80 60 40 20 VCC ± = ± 2.5 V to ± 15 V TA = 25°C 0 10 100 1k 10 k 100 k f − Frequency − Hz 1M 10 M 108 106 104 102 100 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C Figure 19. 14 VCC ± = ± 2.5 V to ± 15 V Figure 20. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 SUPPLY CURRENT vs FREE-AIR TEMPERATURE SUPPLY CURRENT vs SUPPLY VOLTAGE 4 3.8 VO = 0 No Load TA = 125°C IIDD CC − Supply Current − mA IIDD CC − Supply Current − mA 3.6 3.5 TA = 25°C 3 TA = − 55°C 2.5 VCC ± = ± 15 V 3.4 VCC ± = ± 2.5 V 3.2 3 VO = 0 No Load 2.8 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C 2 0 4 8 12 16 20 |VCC ±| − Supply Voltage − V 24 Figure 21. Figure 22. INPUT NOISE VOLTAGE OVER A 10-SECOND PERIOD EQUIVALENT INPUT NOISE VOLTAGE vs FREQUENCY 750 VCC ± = ± 15 V RS = 20 Ω VCC ± = ± 15 V f = 0.1 to 10 Hz TA = 25°C 500 200 Input Noise Voltage − nV Vn − Equivalent Input Noise Voltage − nV/ Hz 250 TA = − 55°C 150 TA = 125°C 100 TA = 25°C 50 250 0 −250 −500 −750 0 1 10 100 1k 10 k 0 f − Frequency − Hz Figure 23. 2 4 6 8 10 t − Time − s Figure 24. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 15 TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com NOISE CURRENT vs FREQUENCY TOTAL HARMONIC DISTORTION PLUS NOISE vs FREQUENCY 6 TA = − 55°C 4 TA = 25°C 2 TA = 125°C 0 10 1 100 1k 10 k f − Frequency − Hz THD + N − Total Harmonic Distortion + Noise − % In − Noise Current − pA/ Hz 8 1% VO(PP) = 20 V VCC ± = ± 15 V TA = 25°C 0.1% AV = 10 RL = 600 Ω AV = 10 RL = 2 kΩ 0.001% 10 100 Figure 25. 100 k Figure 26. 50 50 40 SR − Slew Rate − V/ µ s SR + SR − Slew Rate − V/ µ s 1k 10 k f − Frequency − Hz SLEW RATE vs LOAD CAPACITANCE 60 40 SR − 30 20 VCC ± = ± 15 V AVD = − 1 RL = 2 kΩ CL = 500 pF SR+ 30 20 SR − 10 VCC ± = ± 15 V AVD = − 1 TA = 25°C 0 −75 −50 −25 0 25 50 75 100 125 150 TA − Free-Air Temperature − °C 0 0.01 Figure 27. 16 AV = 100 RL = 2 kΩ 0.01% SLEW RATE vs FREE-AIR TEMPERATURE 10 AV = 100 RL = 600 Ω 0.1 1 CL − Load Capacitance − nF 10 Figure 28. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 TLE2142-Q1 www.ti.com....................................................................................................................................................................................................... SLOS628 – JULY 2009 INVERTING LARGE-SIGNAL PULSE RESPONSE NONINVERTING LARGE-SIGNAL PULSE RESPONSE 15 15 TA = 125°C TA = 25°C 10 TA = 25°C 5 V VO O − Output Voltage − V V VO O − Output Voltage − V 10 TA = − 55°C 0 TA = − 55°C −5 TA = 25°C VCC ± = ± 15 V AVD = 1 RL = 2 kΩ CL = 300 pF −10 TA = − 55°C TA = 125°C 5 0 TA = 125°C TA = 25°C −5 VCC ± = ± 15 V AVD = −1 RL = 2 kΩ CL = 300 pF −10 TA = 125°C −15 −15 0 1 2 3 4 5 0 1 2 Figure 29. 4 5 Figure 30. UNITY-GAIN BANDWIDTH vs LOAD CAPACITANCE SMALL-SIGNAL PULSE RESPONSE 100 7 VCC ± = ± 15 V RL = 2 kΩ B B1 1 − Unity-Gain Bandwidth − MHz TA = − 55°C 50 0 VCC ± = ± 15 V AVD = −1 RL = 2 kΩ CL = 300 pF TA = 25°C −50 3 t − Time − µs t − Time − µs V VO O − Output Voltage − mV TA = − 55°C 6 TA = 25°C 5 TA = 125°C 4 3 2 −100 0 400 800 t − Time − ns 1200 1600 1 10 100 1000 10000 CL − Load Capacitance − pF Figure 31. Figure 32. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 17 TLE2142-Q1 SLOS628 – JULY 2009....................................................................................................................................................................................................... www.ti.com PHASE MARGIN vs LOAD CAPACITANCE GAIN MARGIN vs LOAD CAPACITANCE 14 12 TA = − 55°C 8 6 TA = 125°C TA = 25°C 50° TA = 125°C 40° 30° 20° 4 2 10° TA = 25°C 0 10 TA = − 55°C 60° φ m − Phase Margin Gain Margin − dB 10 70° VCC ± = ± 15 V AVD = 1 RL = 2 kΩ to ∞ VO = − 10 V to 10 V 100 1000 CL − Load Capacitance − pF 10000 VCC ± = ± 15 V RL = 2 kΩ 0° 10 Figure 33. 18 100 1000 CL − Load Capacitance − pF 10000 Figure 34. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TLE2142-Q1 PACKAGE OPTION ADDENDUM www.ti.com 1-Aug-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing TLE2142QDRQ1 ACTIVE SOIC D Pins Package Eco Plan (2) Qty 8 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TLE2142-Q1 : TLE2142 • Catalog: • Military: TLE2142M NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog • Military - QML certified for Military and Defense Applications Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Dec-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLE2142QDRQ1 Package Package Pins Type Drawing SOIC D 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 12.4 Pack Materials-Page 1 6.4 B0 (mm) K0 (mm) P1 (mm) 5.2 2.1 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Dec-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLE2142QDRQ1 SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee® Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated