VS P5 01 VSP5010 0 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 12-Bit, 31-MSPS, Dual-Channel CCD ANALOG FRONT-END FOR DIGITAL COPIERS FEATURES APPLICATIONS • Dual-Channel CCD Processing: – Correlated Double Sampler (CDS) – Sample-and-Hold Mode (S/H) – Digital Programmable Amplifier – CCD Offset Correction (OB Loop) • High-Performance ADC: – 12-Bit Resolution – INL: ±2 LSB – DNL: ±0.5 LSB – No Missing Codes Ensured • High-Speed Operation: – Sample Rate: 31 MHz (max, Design Ensured) – 78-dB SNR (at 0-dB Gain) • Low-Power Consumption: – Low Voltage: 3.0 V to 3.6 V – Low Power: 290 mW (typ at 3.3 V) – Standby Mode: 20 mW (typ) • • • 2 Copiers Scanners Facsimiles DESCRIPTION The VSP5010 is a complete application-specific standard product (ASP) for charge-coupled device (CCD) line sensor applications such as copiers, scanners, and facsimiles. The VSP5010 provides two independent line-processing channels, and performs analog front-end (AFE) data processing and analog-to-digital conversion. Each channel features correlated double sampling (CDS) and sample-and-hold (S/H) processing stages, 14 analog-to-digital converter (ADC) blocks, a digital programmable gain amplifier (DPGA), and an optical black (OB) correction loop. Data are output in a 12-bit word; two-channel ADC data are multiplexed and then output. The VSP5010 operates from a single 3.3-V supply. The device is available in an LQFP-64 package. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2008, Texas Instruments Incorporated PRODUCT PREVIEW 1 VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGELEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING VSP5010PM LQFP-64 PM –25°C to +85°C VSP5010PM (1) ORDERING NUMBER TRANSPORT MEDIA, QUANTITY VSP5010PM Tray, 160 Pieces VSP5010PMR Tape and Reel, 1000 For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). VSP5010 UNIT PRODUCT PREVIEW Supply voltage VCC, VDD +4.0 V Supply voltage differences VCC, VDD ±0.1 V Ground voltage differences AGND, DGND ±0.1 V Digital input voltage –0.3 to (VDD + 0.3) V Analog input voltage –0.3 to (VCC + 0.3) V ±10 mA Ambient temperature under bias –40 to +125 °C Storage temperature –55 to +150 °C Junction temperature +150 °C Lead temperature (soldering, 5s) +260 °C Package temperature (IR reflow, peak, 10s) +235 °C Input current (all pins except supplies) (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range, unless otherwise noted. MIN NOM MAX UNIT Analog supply voltage VCC 3 3.3 3.6 V Digital supply voltage VDD 3 3.3 3.6 V 30 MHz Analog input voltage, full-scale (0 dB) 1 Digital input logic family Digital input clock frequency CMOS System clock 10 Digital output load capacitance Operating free-air temperature, TA 2 30 –25 Submit Documentation Feedback pF +85 °C Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 ELECTRICAL CHARACTERISTICS Over operating free-air temperature range, unless otherwise noted. VSP5010PM PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RESOLUTION Resolution 12 Bits 2 Channels 30 MHz V SIGNAL PASS Signal pass MAXIMUM CONVERSION RATE Maximum conversion rate DIGITAL INPUT Input current VT+ Positive-going threshold 1.8 VT– Negative-going threshold 1.1 IIH Logic high, VIN = +3 V ±20 µA IIL Logic low, VIN = 0 V ±20 µA VCC + 0.3 V Input limit –0.3 SYSCLK clock duty cycle 50 Input capacitance V % 5 PRODUCT PREVIEW Input voltage pF DIGITAL OUTPUT (Even Channel and Odd Channel) Logic family CMOS Logic coding Straight Binary Multiplexing frequency Output voltage 60 VOH Logic high, IOH = –2 mA VOL Logic low, IOL = 2 mA MHz 2.5 V 0.4 V ANALOG INPUT (CCDIN) Input level for full-scale output DPGA gain = 0 dB 1400 Allowable feed-through level mV 1.0 Input capacitance V 15 Input limit –0.3 pF 3.6 V TRANSFER CHARACTERISTICS Differential nonlinearity (DNL) Integral nonlinearity (INL) No missing codes CDS mode = 0 dB, DPGA gain = 0 dB ±0.5 ±1 LSB SH mode, DPGA gain = 0 dB ±0.5 ±1 LSB CDS mode = 0 dB, DPGA gain = 0 dB ±2 ±4 LSB SH mode, DPGA gain = 0 dB ±4 DPGA gain = 0 dB LSB Ensured Step input settling time Full-scale step input 1 Pixel Overload recovery time Step input from 2.0 V to 0 V 2 Pixels 9 (fixed) Clocks Data latency Signal-to-noise ratio (1) DPGA gain = 0 dB 78 dB DPGA gain = +24 dB 54 dB Channel mismatch ±3 % CORRELATED DOUBLE SAMPLER (CDS) Reference level sample settling time Within 1 LSB, driver impedance = 50 Ω 8.3 ns Data level sample settling time Within 1 LSB, driver impedance = 50 Ω 83 ns (1) SNR = 20 log (16384/output rms noise in LSB), input connected to ground through capacitor. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 3 VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com ELECTRICAL CHARACTERISTICS (continued) Over operating free-air temperature range, unless otherwise noted. VSP5010PM PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT CLAMP Clamp-on resistance 400 Ω Clamp level 1.5 V OB CLAMP LOOP CCD offset correction range –300 DAC resolution Minimum DAC output current Maximum DAC output current mV Bits COB pin ±0.15 µA µA COB pin ±153 CCOB = 0.1 µF 40.7 µs CCOB = 0.1 µF, at current DAC full-scale output 1530 V/s Loop time constant Slew rate 300 10 Program range Optical black clamp level 0 OB clamp code = 0101 0000b 510 LSB 160 LSB Positive reference voltage 1.85 V Negative reference voltage 1.1 V 10 Bits REFERENCE PRODUCT PREVIEW DIGITAL PROGRAMMABLE AMPLIFIER (DPGA) Gain program resolution Gain Gain code = 11 1111 1111b 24 dB 16 V/V Gain code = 10 0000 0000b 18 dB 8 V/V Gain code = 00 0100 0000b 0 dB 1 V/V Gain code = 00 0000 0000b — 0 V/V ±0.5 dB Gain error SERIAL INTERFACE Chip address = 2 bits, register address = 4 bits, and data = 10 bits Data length 2 Serial clock frequency Bytes 10 MHz 3.6 V POWER SUPPLY Supply voltage VCC, VDD Power dissipation 3.0 3.3 VCC = VDD = 3.3 V, fSYSCLK = 30 MHz, load = 10 pF 290 mW Standby mode 20 mW TEMPERATURE RANGE Operation temperature –25 +85 °C Storage temperature –55 +125 °C Thermal resistance 4 θJA LQFP-64 package Submit Documentation Feedback 83 °C/W Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 PIN CONFIGURATION 52 51 50 49 B0 (LSB) 1 48 BYP_EV B1 2 47 CCDIN_EV B2 3 46 AGND B3 4 45 VCC B4 5 44 REFN_EV B5 6 43 CM_EV CLPOB 7 42 REFP_EV SYSCLK 8 41 AGND SHD 9 40 VCC SHP 10 PRODUCT PREVIEW 53 BYPM_EV 54 BYPP_EV 55 COB_EV 56 BYPR_EV 57 AGND 58 VCC 59 AGND 60 CA1 61 CDS/SH_SEL CA0 62 INPUTCLP AGND 63 OUTENB VCC 64 RESET DGND VSP5010PM LQFP-64 (TOP VIEW) 39 REFP_OD B6 11 38 CM_OD B7 12 37 REFN_OD B8 13 36 VCC B9 14 35 AGND B10 15 34 CCDIN_OD B11 (MSB) 16 23 24 25 26 27 28 29 30 31 RDO AGND AGND VCC COB_OD BYPR_OD BYPP_OD 32 BYPM_OD 22 WRT AGND 21 SDI VDD 20 SCLK 19 VCC 18 AGND 17 DGND 33 BYP_OD Table 1. TERMINAL FUNCTIONS TERMINAL (1) NAME NO. TYPE (1) B0 (LSB) 1 DO ADC output, bit 0 (least significant bit) B1 2 DO ADC output, bit 1 B2 3 DO ADC output, bit 2 B3 4 DO ADC output, bit 3 B4 5 DO ADC output, bit 4 B5 6 DO ADC output, bit 5 CLPOB 7 DI Optical black clamp pulse SYSCLK 8 DI System clock input SHD 9 DI CCD data sampling pulse SHP 10 DI CCD reference sampling pulse B6 11 DO ADC output, bit 6 B7 12 DO ADC output, bit 7 B8 13 DO ADC output, bit 8 B9 14 DO ADC output, bit 9 B10 15 DO ADC output, bit 10 B11 (MSB) 16 DO ADC output, bit 11 (most significant bit) DGND 17 P DESCRIPTION Digital ground for digital outputs (B0–B11) Designators in TYPE: P = power supply and ground; DI = digital input; DO = digital output; AI = analog input; and AO = analog output. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 5 VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com Table 1. TERMINAL FUNCTIONS (continued) TERMINAL PRODUCT PREVIEW 6 NAME NO. TYPE (1) VDD 18 P Digital supply for digital outputs (B0–B11) AGND 19 P Analog ground VCC 20 DI Analog power supply AGND 21 DI Analog ground DESCRIPTION SDI 22 DI Serial interface data input SCLK 23 DI Serial interface data shift clock (rising edge trigger) WRT 24 DI Serial interface data write pulse (rising edge trigger) RDO 25 DO Serial interface register read output AGND 26 P Analog ground AGND 27 P Analog ground VCC 28 P Analog power supply COB_OD 29 AO OB loop output voltage (odd); connect 0.1-µF capacitor between ground BYPR_OD 30 AO Input buffer reference bypass (odd) BYPP_OD 31 AO CDS positive reference bypass (odd); open or bypass to ground by a 0.1-µF capacitor BYPM_OD 32 AO CDS negative reference bypass (odd); open or bypass to ground by a 0.1-µF capacitor BYP_OD 33 AO CDS common reference bypass (odd); bypass to ground by a 0.1-µF capacitor CCDIN_OD 34 AI CCD signal input (odd) AGND 35 P Analog ground VCC 36 P Analog supply REFN_OD 37 AO ADC negative reference bypass (odd); bypass to ground by a 0.1-µF capacitor CM_OD 38 AO ADC common reference (odd); bypass to ground by a 0.1-µF capacitor REFP_OD 39 AO ADC positive reference (odd); bypass to ground by a 0.1-µF capacitor VCC 40 P Analog power supply AGND 41 P Analog ground REFP_EV 42 AO ADC positive reference bypass (even); bypass to ground by a 0.1-µF capacitor CM_EV 43 AO ADC common reference bypass (even); bypass to ground by a 0.1-µF capacitor REFN_EV 44 AO ADC negative reference bypass (even); bypass to ground by a 0.1-µF capacitor VCC 45 P Analog power supply AGND 46 P Analog ground CCDIN_EV 47 AI CCD signal input (even) BYP_EV 48 AO CDS common reference bypass (even); bypass to ground by a 0.1-µF capacitor BYPM_EV 49 AO CDS negative reference bypass (even); bypass to ground by a 0.1-µF capacitor BYPP_EV 50 AO CDS positive reference bypass (even); bypass to ground by a 0.1-µF capacitor BYPR_EV 51 AO Input buffer reference bypass (even); bypass to ground by a 0.1-µF capacitor COB_EV 52 AO OB loop output voltage (even); connect 0.1-µF capacitor between ground VCC 53 P Analog power supply AGND 54 P Analog ground AGND 55 P Analog ground CDS/SH_SEL 56 DI CDS/SH mode select; high = CDS mode, low = SH mode CA1 57 DI Chip address 1 CA0 58 DI Chip address 0 INPUTCLP 59 DI Input clamp control (active low) RESET 60 DI Asynchronous register reset (active low) OUTENB 61 DI Output enable/disable; high = high impedance, low = output enable AGND 62 P Analog ground VCC 63 P Analog power supply DGND 64 P Digital ground for digital outputs (B0–B11) Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 FUNCTIONAL BLOCK DIAGRAM SCLK SDI RDO WRT BYPP_E COB_E BYPM_E BYP_E REFP_E REFN_E CM_E CA0 Serial Interface CA1 EVEN Channel Internal Reference RESET Buffer CCD Out Signal Current DAC Decoder Clamp CDS/SH 14-Bit ADC Digital PGA Output Register OUTENB CDS/SH SEL CLPOB INPUTCLP 12-Bit Digital Output Output Control Timing/Control SHP SHD SYSCLK CCDIN_OD CCD Out Signal Digital PGA 14-Bit ADC CDS/SH Output Register Clamp Buffer Current DAC Decoder ODD Channel Internal Reference BYPP_OD COB_OD BYPM_OD BYP_OD REFP_OD CM_OD REFN_OD Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 7 PRODUCT PREVIEW CCDIN_EV VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com N N+1 N+2 CCD Signal tCKP tS tWP SHP (External) tPD tS tWD tCKP tDP SHD (External) ADC_Clock (Internal) ECH Data (Internal) N-8 N-7 N-6 OCH Data (Internal) N-8 N-7 N-6 tINHIBIT tADC tADC tCKP PRODUCT PREVIEW SYSCLK (External) MUX Data (Internal) N-9(EV) N-8(EV) N-9(OD) tD1 N-8(OD) N-7(EV) tD2 MUX Clock (Internal) B[11:0] (External) N-9(EV) N-9(OD) N-8(EV) N-8(OD) tOD Figure 1. VSP5010 CDS Mode Timing Specifications (Even and Odd Channels) 1 TIMING CHARACTERISTICS SYMBOL tCKP 8 32 Clock period TYP MAX UNIT ns SYSCLK pulse width (2) 16 tWP SHD pulse width 6 8.3 ns tWD SHD pulse width 6 8.3 ns tPD SHP trailing edge to SHD leading edge 8 tDP SHD trailing edge to SHP leading edge 8 tS Sampling delay ns ns ns 3.5 Inhibited clock period tD1 Internal MUX clock delay 1 (3) 4 ns tD2 Internal MUX clock delay 2 (3) 4 ns 13 ns 13 ns Output delay at data output delay = 0 ns 10 ns tINHIBIT DL (5) MIN (1) tADC tOD (1) (2) (3) (4) PARAMETER (4) ns Output delay at data output delay = 2 ns (4) Data latency (5) Design ensured. A shipment final test is 33 ns. Design ensured. A shipment final test is 16.7 ns. See the Serial Interface section. Load = 25 pF, data output delay = 2 ns indicates that the delay time is set by the Configuration Register of the serial interface. See the MPX Clock Edge Phase configuration. Depending on an Internal MUX clock delay and output delay, latency can carry out the decrease of an increase. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 CCD Signal N N+1 tWD N+2 tS tCKP SHP (External) tDS tADC tADC tCKP SYSCLK (External) ECH Data (Internal) N-8 N-7 N-6 OCH Data (Internal) N-8 N-7 N-6 N-9(EV) N-9(OD) tD1 N-8(EV) N-8(OD) N-7(OD) PRODUCT PREVIEW MUX Data (Internal) tD2 MUX Clock (Internal) B[11:0] (External) N-9(EV) N-9(OD) N-8(OD) N-8(EV) tOD Figure 2. VSP5010 SH Mode Timing Specifications (Even and Odd Channels) 1 TIMING CHARACTERISTICS SYMBOL PARAMETER MIN tCKP Clock period (1) 32 tADC MAX UNIT ns 16 tWD SHD pulse width tS Sampling delay tDS SHD trailing edge to SYSCLK leading edge 6 ns 8.3 ns 3.5 –8 (3) ns +6 ns tD1 Internal MUX clock delay 1 4.5 ns tD2 Internal MUX clock delay 2 (3) 12.5 ns Output delay at data output delay = 0 ns (4) 13 ns (5) 17 ns 9 Clocks tOD DL (1) (2) (3) (4) (5) SYSCLK pulse width (2) TYP Output delay at data output delay = 2 ns Data latency Design ensured. A shipment final test is 33 ns. Design ensured. A shipment final test is 16.7 ns. See the Serial Interface section. Load = 25 pF, data output delay = 0 ns indicates that the delay time is set by the Configuration Register of the serial interface. Load = 25 pF, data output delay = 2 ns indicates that the delay time is set by the Configuration Register of the serial interface. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 9 VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com WRT tXH tXS tCKL tCKH tXW tCKP SCLK tDH tDS SD MSB (CA1) LSB (D0) Two Bytes Figure 3. Serial Interface Timing Specification 1 TIMING CHARACTERISTICS (31-MHz Operation) PRODUCT PREVIEW SYMBOL 10 PARAMETER MIN TYP MAX UNIT tCKP Clock period 100 ns tCKH Clock high pulse width 40 ns tCKL Clock low pulse width 40 ns tDS Data setup time 30 ns tDH Data hold time 30 ns tXS WRTL to SCLK setup time 15 ns tXH SCLK to WRT hold time 15 ns tXW WRT setup time 15 ns Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 WRT tX SCLK tXS tCKL tCKH 1 SD tXH 15 2 16 tDH tDA tCKP tXR MSB (CA1) tXS tCKH 1 9 2 10 tCKP LSB (D0) Two Bytes tRS tCKH MSB (D9) RD LSB (D0) 10 Bits PRODUCT PREVIEW Figure 4. Serial Interface Timing Specification 2 (Read) TIMING CHARACTERISTICS SYMBOL PARAMETER MIN TYP MAX UNIT tCKP Clock period 100 ns tCKH Clock high pulse width 40 ns tCKL Clock low pulse width 40 ns tDS Data setup time (write) 30 ns tDH Data hold time (write) 30 ns tXS WRTL to SCLK setup time 15 ns tXH SCLK to WRT hold time 15 ns ns tXW WRT setup time 15 tWRW Minimum WRT width 10 tRS Data setup time (reading) ns 30 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 ns 11 VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com APPLICATION INFORMATION OVERVIEW The VSP5010 was developed as an analog front-end for charge-coupled device (CCD) line imaging sensor applications such as copiers, facsimiles, and so forth. The VSP5010 provides two independent EVEN/ODD channels for processing, with each channel operating at 31 MHz. Output signals from each EVEN/ODD channel of the CCD image sensor are sampled at the correlated double sampling (CDS) circuit and then transmitted to a 14-bit, high-precision analog-to-digital converter (ADC). The ADC output is then amplified by the required gain at a digital programmable gain amplifier (DPGA) and then rounded to 12-bit data, and output sequentially as EVEN/ODD data that are synchronized with SYSCLK. The CDS stage can be also used as a sample-and-hold (S/H) step. Each channel has an optical black level clamp circuit (OB loop) and automatically compensates offsets of the CCD and CDS/SH during the OB pixel period (CLPOB). The OB level output value can be set at a required value through the serial interface. DC bias lost in ac coupling is reproduced as an input clamp voltage, which is the necessary level for internal operation. Input clamp voltage is charged to a capacitor that is connected to CCDIN during a dummy pixel period (INPUTCLP) by SHP. Gain setting, operation polarity of each clock, operating mode selection, and so forth are done through the serial interface by accessing internal registers. Each setting of register values can be reset to its respective default value by setting RESET to active low. PRODUCT PREVIEW CORRELATED DOUBLE SAMPLER (CDS) AND SAMPLE/HOLD (S/H) CIRCUIT The CDS circuit removes low-frequency and/or common-mode noise, such as fluctuations per pixel, from the CCD image sensor output. Noises longer than one pixel period among the input signals are rejected by a subtraction operation at the CDS circuit. Figure 5 shows a simplified CDS block diagram. SHP C1 = 10 pF CIN CCD Output CCDIN OPA SHD INPUTCLP C2 = 10 pF SHP VSP5010 VCLAMP Figure 5. Simplified Block Diagram 12 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 The CDS circuit can be configured as a sample-and-hold (S/H) circuit by the CDS/SH SEL pin. A simplified S/H circuit block diagram is shown in Figure 6. In the S/H mode, the input clamp voltage (VCLAMP) is charged by INPUTCLP and the sampling signal (SHD) to the CIN capacitor. INPUTCLP is activated at the dummy pixel (or OB pixel) of CCD. By these operations, the dummy pixel (or OB pixel) level voltage is fixed to VCLAMP at the CCDIN terminal. When sampling for the OB pixel and an effective pixel, the VCLAMP voltage is charged to capacitor C1, and C2 charges the voltage lower than VCLAMP according to the signal voltage from the CCD. As the voltage difference in C1 and C2 is acquired during the hold period, signals from the CCD are acquired as voltage based on VCLAMP. In CDS mode, the signal voltage is received as the voltage difference between the sampled voltage of SHP (reference level) and SHD (data level); the signal level is not affected even when VCLAMP charges or fluctuates because of leakage, etc. However, when operated as S/H, the VCLAMP fluctuation is read as an offset error because the signal is acquired based on VCLAMP. In order to prevent VCLAMP leakage, a buffer is inserted at the input in S/H mode. SHD VCLAMP PRODUCT PREVIEW C1 = 10 pF OPA CIN CCD Output CCDIN SHP C2 = 10 pF INPUTCLP VSP5010 SHP VCLAMP Figure 6. Simplified Sample-and-Hold (S/H) Circuit INPUT CLAMP (DUMMY PIXEL CLAMP) Output from the CCD image sensor is ac-coupled with the VSP5010 through a capacitor. The purpose of the input clamp is to reproduce the dc bias lost by ac coupling, and to supply an optimum dc bias for proper device operation at the CDS/SH circuit. Refer to Figure 5 and Figure 6 for simplified block diagrams of the input clamp circuit. The input signal level is clamped to the internal reference voltage by activating both SHP (during CDS mode; activate SHD during SH mode) and INPUTCLP during the CCD dummy pixel output period. HIGH PRECISION A/D CAPACITOR The ADC block of the VSP5010 consists of a pipeline architecture. This converter has a complete differential circuit configuration and error correction circuit, and ensures 14-bit resolution. Circuits that generate the necessary reference voltage at the ADC are built inside the device, and are shown as REFP (high-potential reference), REFN (low-potential reference), and CM (common-mode voltage) pins outside the device. In order to assure ADC accuracy, these reference voltage pins must be sufficiently decoupled by a capacitor (0.1 µF recommended). Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 13 VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com DIGITAL PROGRAMMABLE GAIN AMPLIFIER (DPGA) The DPGA circuit can control gain values in the range of 0 V/V to 16 V/V by inputting a digital code through the serial interface. Gain changes linearly in proportion to the code setting, as shown in Figure 7. 18 16 14 Gain (V/V) 12 10 8 6 4 2 0 0 128 256 384 512 640 768 896 1024 Input Gain Control Figure 7. Block Diagram of CDS and Input Clamp PRODUCT PREVIEW OPTICAL BLACK LEVEL (OB) LOOP AND OB CLAMP LEVEL The VSP5010 has a built-in self-calibration circuit (OB loop) that compensates the OB level by using optical black (OB) pixels output from the CCD image sensor. A block diagram of the OB loop and OB clamp circuit is shown in Figure 8. OB Clamp Level CDS/SH CCDIN ADC DATA OUT DPGA BYPP2 Current DAC Decoder COB CPLOB Figure 8. OB Loop and OB Level Clamp The CCD offset is compensated by converging this calibration circuit while activating CLPOB during a period when OB pixels are output from the CCD. In CDS mode, CCD offset is compensated as a difference between the reference level and the data level of the OB pixel. In SH mode, VCLAMP is compensated by INPUTCLP as the difference between fixed dummy pixels and the OB pixels. These compensated signal levels are recognized as actual OB levels, and outputs are clamped to OB levels set by the serial interface. These OB levels are the base of black for the effective pixel period thereafter. The DPGA is a gain stage outside the OB loop; therefore, OB levels are not affected even when the gain changes. 14 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 The converging time of the OB loop is determined based on the capacitor value connected to the COB terminal and the output from the current output digital-to-analog converter (DAC) of the loop. The time constant (T) can be obtained from Equation 1: T = C/(16384 ´ IMIN) (1) Where: • C is the capacitor value connected to COB, • IMIN is the minimum current (0.15 µA) of the current DAC, which has a current equivalent to 1 LSB of the DAC converter output. When C = 0.1 µF, T is 40.7 µs. The slew rate (SR) can be obtained from Equation 2: SR = IMAX/C (2) The OB clamp level (digital output value) can be set externally through the serial interface by inputting a digital code to the OB clamp level register. The digital code to be input and the corresponding OB clamp level are shown in Table 2. Table 2. Input Code and OB Clamp Level to be Set CLAMP LEVEL (LSB) CODE VSP5010 (12-BIT) 0000 0000b 0 0000 0001b 2 — — 0100 1111b 158 0101 0000 (default) 160 0101 0001b 162 — — 1011 1111b 508 1111 1111b 510 SETTLING OF OB LOOP AND INPUT CLAMP Because these capacitors are discharged at start-up and after a long standby state, these two capacitors must be charged to the proper operational voltage. The charging time for the input clamp voltage is the logical AND of SHP (SHD in S/H mode) and INPUTCLP. The actual charging time per line is the duration of the SHP pulse times the number of dummy pixels in the line. Equally, COB is only charged during the OB pixel period. Therefore, some time is necessary to bring the VSP5010 into a normal operating state at device start-up. Though start-up time depends on the number of dummy and pixels per line, at least 500 ms to 1 s should be allowed. STANDBY MODE Normal operation mode and standby mode can be switched by the serial interface. In standby mode, power consumption can be saved; all operation is suspended other than the interface circuit and reference voltage supply. During standby mode, additional power consumption may be obtained by suspending SYSCLK. When restoring a SYSCLK that was suspended during standby mode, more than two clocks of SYSCLK must be acquired before inputting commands. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 15 PRODUCT PREVIEW Where: • C is the capacitor value connected to COB, • IMAX is the maximum current (153 µA) of the current DAC, which is the equivalent current to 1023 LSB of the DAC converter output. VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com OUTPUT DATA DELAY Large transient noise occurs when the output data change because several logic lines change simultaneously. When this transient noise timing overlaps the analog signal sampling timing, it may affect the ADC converting value. To avoid this effect, changing the timing of the VSP5010 output data can be delayed in approximately 3-ns steps by serial control. The delay value set refers to the increase in default time between SYSCLKL and the data output set in the timing specification. TEST MODE AND TEST PATTERN The VSP5010 can be set to test mode by setting the configuration register. During test mode, the test pattern generated inside will be output with or without a CCD input signal. There are two test patterns. One is a pattern which outputs the code that is the OB level +128 LSB for a specified number of pixels (stripe pattern); the other is a pattern which increments the output code from 1 to 4095 by a specified number of LSBs per pixel (gradation pattern). These patterns can be selected by setting the configuration register through the serial interface. CHIP ADDRESS PRODUCT PREVIEW The VSP5010 has two chip address pins, CA0 and CA1. Setting these pins gives a particular address for the device, and the data-writing device can be selected by the address in serial interface data. By this function, the serial interface can be used as a common line for up to four devices. REGISTER READING Each register data can be read from the RDO pin by setting bit A3 of the serial interface data to '1', and setting the reading register address to A[2:0]. After writing the address to specify which register is to be read, assert WRT and apply SCLK. The value of the register is output sequentially on the RD pin. Refer to the Serial Interface Timing Specification 2 (Read) for details. While reading registers, the writing function is disabled. 16 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 SERIAL INTERFACE REGISTER DESCRIPTION The serial interface of the VSP5010 is composed of three signals; SDI, SCLK, and WRT. SDI data are sequentially stored to the shift register at the rising edge of SCLK, and shift register data are stored to the parallel latch at the rising edge of WRT. Serial data are two bytes of fixed length and are composed of a two-bit chip address, a four-bit register address, and 10-bit data. The chip address can only write register to a device that matches its value to the address set by CA0 and CA1. By using this two-bit chip address, the serial interface can be shared by other devices. Both the address (A[3:0]) and the serial data (D[9:0]) start with the MSB (A3, D9) and end with the LSB (A0, D0). When data with more than two bytes are applied, the final two bytes immediately before the rising edge of WRT are effective, and any data writtenbefore that are lost. Register configuration and serial data format are shown in Table 3. Each register value is defined at the time of device power-on (VCC = 2.1 V (typ)). Table 3. Serial Interface Command Data Format LSB CA1 CA0 A3 A2 A1 A0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Configuration X (1) X 0 0 0 0 0 0 C7 C6 0 C4 0 C2 C1 C0 Standby mode and Clk Dly X X 0 0 0 1 D9 D8 D7 D6 D5 D4 D3 D2 0 S0 DPGA gain EVEN X X 0 0 1 0 G9 G8 G7 G6 G5 G4 G3 G2 G1 G0 DPGA gain ODD X X 0 0 1 1 G9 G8 G7 G6 G5 G4 G3 G2 G1 G0 OB clamp level EVEN X X 0 1 0 0 0 0 O7 O6 O5 O4 O3 O2 O1 O0 OB clamp level ODD X X 0 1 0 1 0 0 O7 O6 O5 O4 O3 O2 O1 O0 Test mode X X 0 1 1 0 0 0 0 0 T5 T4 0 T2 0 T0 Internal ADCK monitor X X 0 1 1 1 0 0 0 0 0 0 0 0 PT1 0 Read out X X 1 R2 R1 R0 X X X X X X X X X X Configuration Register Description (Address = 000h) Bits C[2:0] Clock Polarity Bit C0 (INPUTCLP Polarity) Bit C1 (CLPOB Polarity) Bit C2 (SHP/SHD Polarity) 0 = Active low (default) 1 = Active high 0 = Active low (default) 1 = Active high 0 = Active low (default) 1 = Active high Bit C4 Data Output Order 0 = EVEN/ODD (default) 1 = ODD/EVEN Bits C[7:6] Data Output Delay (1) Bit C7 Bit C6 0 = Time (0 ns, typ) (default) 0 Delay = time (0 ns, typ) (default) 0 = Delay time (2 ns, typ) 1 = Delay time (2 ns, typ) 1 = Delay time (4 ns, typ) 0 = Delay time (4 ns, typ) 1 = Delay time (6 ns, typ) 1 = Delay time (6 ns, typ) X = Don't care. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 17 PRODUCT PREVIEW MSB REGISTERS VSP5010 SBES014 – AUGUST 2008 ................................................................................................................................................................................................ www.ti.com Standby Mode and MPX Clock Edge Phase Description (Address = 01h) Bit S0 Standby/Normal Operation Select 0 = Normal operation mode (default) 1 = Standby mode Bits D[8:1] MPX Clock Edge Phase Figure 9 illustrates the MPX clock edge phase. Bits D[5:2] Dlyedge 2 Timing (except constant delay tD1) 0000b = Delay time (1.6 ns) 1000b = Delay time (8.0 ns) (default, 0.8 ns/step) 1111b = Delay time (13.6 ns) Bits D[9:6] Dlyedge 1 Timing (except constant delay tD1) 0000b = Delay time (–2.4 ns) 1000b = Delay time (0 ns) (default, 0.3 ns/step) 1111b = Delay time (2.1 ns) SysClock (30 MHz) tD OutClock (60 MHz) PRODUCT PREVIEW DlyEdge1 DlyEdge2 Figure 9. MPX Clock Edge Phase CAUTION: Please do not use at Delayedge 1 > Delayedge 2 (example: D[5:2] = 0000b and D[9:6] = 1111b) Delayedge2 should maintain sufficient width to allow proper data output timing. Internal ADCK Monitor Description (Address = 07h) Bit D1 PT1 0 = Normal 1 = Internal ADC clock to B0 (ADC output, bit 0, least significant bit) EVEN Channel Gain Register Description (Address = 02h) Bits G[9:0] Gain Value GAIN[9:0] /64 (default = 00 0100 0000b) ODD Channel Gain Register Description (Address = 03h) Bits G[9:0] Gain Value GAIN[9:0] /64 (default = 00 0100 0000b) EVEN Channel OB Clamp Register Description (Address = 04h) Bits O[7:0] OB Clamp Level 2 LSB × O[7:0] (default = 0101 0000b) ODD Channel OB Clamp Register Description (Address = 05h) Bits O[7:0] OB Clamp Level 2 LSB × O[7:0] (default = 0101 0000b) 18 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 VSP5010 www.ti.com ................................................................................................................................................................................................ SBES014 – AUGUST 2008 Test Mode Register Description (Address = 06h) Bit T0 Test Mode Enable/Disable 0 = Disable (default) 1 = Enable Bit T2 Test Pattern Select 0 = Gradation pattern (default) 1 = Stripe pattern Bits T[5:4] Test Pattern Data Interval Bit T5 Bit T4 0 = Stripe pattern (8 pixels), gradation pattern (2 pixels) (default) 0 = Stripe pattern (8 pixels), gradation pattern (2 pixels) (default) 0 = Stripe pattern (16 pixels), gradation pattern (4 pixels) 1 = Stripe pattern (16 pixels), gradation pattern (4 pixels) 1 = Stripe pattern (32 pixels), gradation pattern (8 pixels) 0 = Stripe pattern (32 pixels), gradation pattern (8 pixels) 1 = Stripe pattern (64 pixels), gradation pattern (16 pixels) 1 = Stripe pattern (64 pixels), gradation pattern (16 pixels) Bit A[2:0] R[2:0] 2:0 = Set reading register address POWER SUPPLY, GROUNDING AND DEVICE DECOUPLING RECOMMENDATIONS The VSP5010 incorporates a very high-precision and high-speed ADC and analog circuitry which are vulnerable to any extraneous noise from the rails or elsewhere. For this reason, although the VSP5010 has analog and digital supply pins, it should be treated as an analog component; all supply pins except for VDD should be powered by the analog supply only. This configuration ensures the most consistent results, because digital power lines often carry high levels of wideband noise that would otherwise be coupled into the device and degrade the achievable performance. Proper grounding, short lead length, and the use of ground planes are also very important for high-frequency designs. Multilayer printed circuit boards (PCBs) are recommended for the best performance; these types of boards offer distinct advantages such as minimizing ground impedance, separation of signal layers by ground layers, and so forth. It is highly recommended that analog and digital ground pins of the VSP5010 be joined together at the IC and be connected only to the analog ground of the system. The driver stage of the digital outputs (B[11:0]) is supplied through a dedicated supply VDD (pin 18) and it should be separated from the other supply pins completely or at least with a ferrite bead. Because of the high operation speed, the converter also generates high-frequency current transients and noise that are fed back into the supply and reference lines. This additional interference requires the supply and reference pins be sufficiently bypassed. In most cases, 0.1-µF ceramic chip capacitors are adequate to decouple the reference pins. Supply pins should be decoupled to the ground plane with a parallel combination of tantalum (1-µF to 22-µF) and ceramic (0.1-µF) capacitors. The effectiveness of the decoupling depends largely on the proximity to the individual pin. VDD should be decoupled to the proximity of DGND (pin 17 and pin 64). Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): VSP5010 19 PRODUCT PREVIEW Register Read Out Description PACKAGE OPTION ADDENDUM www.ti.com 29-Jan-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) VSP5010PM ACTIVE LQFP PM 64 160 Green (RoHS & no Sb/Br) A42 SNBI Level-1-260C-UNLIM VSP5010PMG6 ACTIVE LQFP PM 64 160 Green (RoHS & no Sb/Br) A42 SNBI Level-1-260C-UNLIM VSP5010PMR ACTIVE LQFP PM 64 1000 Green (RoHS & no Sb/Br) A42 SNBI Level-1-260C-UNLIM VSP5010PMRG6 ACTIVE LQFP PM 64 1000 Green (RoHS & no Sb/Br) A42 SNBI Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device VSP5010PMR Package Package Pins Type Drawing LQFP PM 64 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 25.4 Pack Materials-Page 1 12.8 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 12.8 1.9 16.0 24.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) VSP5010PMR LQFP PM 64 1000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996 PM (S-PQFP-G64) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 0,08 M 33 48 49 32 64 17 0,13 NOM 1 16 7,50 TYP Gage Plane 10,20 SQ 9,80 12,20 SQ 11,80 0,25 0,05 MIN 0°– 7° 0,75 0,45 1,45 1,35 Seating Plane 0,08 1,60 MAX 4040152 / C 11/96 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. 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