DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS µPC8128TB, µPC8151TB, µPC8152TB SILICON MMIC LOW CURRENT AMPLIFIERS FOR CELLULAR/CORDLESS TELEPHONES DESCRIPTION The µPC8128TB, µPC8151TB and µPC8152TB are silicon monolithic integrated circuits designed as buffer amplifiers for cellular or cordless telephones. These amplifiers can realize low current consumption with external chip inductor (eg 1005 size) which can not be realized on internal 50 Ω wideband matched IC. These low current amplifiers operate on 3.0 V. These ICs are manufactured using NEC’s 20 GHz fT NESAT™ III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability. FEATURES • Supply voltage : VCC = 2.4 to 3.3 V • Low current consumption : µPC8128TB ; ICC = 2.8 mA TYP. @VCC = 3.0 V µPC8151TB ; ICC = 4.2 mA TYP. @VCC = 3.0 V µPC8152TB ; ICC = 5.6 mA TYP. @VCC = 3.0 V • High efficiency : µPC8128TB ; PO(1 dB) = −4.0 dBm TYP. @f = 1 GHz µPC8151TB ; PO(1 dB) = +2.5 dBm TYP. @f = 1 GHz µPC8152TB ; PO(1 dB) = −4.5 dBm TYP. @f = 1 GHz • Power gain : µPC8128TB, 8151TB ; GP = 12.5 dB TYP. @f = 1 GHz µPC8152TB ; GP = 23 dB TYP. @f = 1 GHz • Excellent isolation : µPC8128TB ; ISL = 39 dB TYP. @f = 1 GHz : µPC8151TB ; ISL = 38 dB TYP. @f = 1 GHz : µPC8152TB ; ISL = 40 dB TYP. @f = 1 GHz • Operating frequency : 100 to 1 900 MHz (Output port LC matching) • High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) • Light weight : 7 mg (Standard value) APPLICATION • Buffer Amplifiers on 800 to 1 900 MHz cellular or cordless telephones Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P12549EJ3V0DS00 (3rd edition) Date Published February 2001 N CP(K) Printed in Japan The mark shows major revised points. © 1997, 2001 µPC8128TB, µPC8151TB, µPC8152TB ORDERING INFORMATION Part Number Package µPC8128TB-E3 Marking 6-pin super minimold C2P µPC8151TB-E3 C2U µPC8152TB-E3 C2V Supplying Form • Embossed tape 8 mm wide • 1, 2, 3 pins face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, please contact your local NEC sales office. Part number for sample order: µPC8128TB, µPC8151TB, µPC8152TB PIN CONNECTIONS 3 2 1 C2P (Top View) (Bottom View) Pin Name 1 INPUT 2 GND 4 4 3 5 5 2 3 GND 6 6 1 4 OUTPUT 5 GND 6 VCC Marking is an example of µPC8128TB 2 Pin No. Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB PRODUCT LINE-UP (TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω) Parameter 1.0 GHz output port matching frequency 1.66 GHz output port matching frequency 1.9 GHz output port matching frequency 2.4 GHz output port matching frequency ICC (mA) GP (dB) ISL (dB) PO(1 dB) (dBm) GP (dB) ISL (dB) PO(1 dB) (dBm) GP (dB) ISL (dB) PO(1 dB) (dBm) GP (dB) ISL (dB) PO(1 dB) (dBm) µPC8128TB 2.8 12.5 39 −4.0 13 39 −4.0 13 37 −4.0 − − − C2P µPC8151TB 4.2 12.5 38 +2.5 15 36 +1.5 15 34 +0.5 − − − C2U µPC8152TB 5.6 23 40 −4.5 19.5 38 −8.5 17.5 35 −8.5 − − − C2V µPC8178TB 1.9 11 39 −4.0 − − − 11.5 40 −7.0 11.5 38 −7.5 C3B µPC8179TB 4.0 13.5 44 +3.0 − − − 15.5 42 +1.5 15.5 41 +1.0 C3C Part No. Marking Remarks Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. SYSTEM APPLICATION EXAMPLE EXAMPLE OF DIGITAL CELLULER TELEPHONE RX I Q DEMOD. ÷N SW PLL PLL I 0° TX φ PA 90° Q These ICs can be added to your system around V parts, when you need more isolation or gain. The application herein, however, shows only examples, therefore the application can depend on your kit evaluation. Data Sheet P12549EJ3V0DS 3 µPC8128TB, µPC8151TB, µPC8152TB PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage (V)Note 1 INPUT − 0.90 1.06 0.80 2 3 5 4 6 GND OUTPUT VCC 0 voltage as same as VCC through external inductor 2.4 to 3.3 − − − Function and Applications Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance defference. Signal output pin. This pin is designed as collector output. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. For L, a size 1005 chip in-ductor can be chosen. Power supply pin. This pin should be externally equipped with bypass capacitor to minimize its inpedance. Internal Equivalent Circuit µ PC8128TB, µ PC8151TB 4 6 ↓ 1 ↓ 2 5 3 µPC8152TB 6 4 1 3 2 5 Note Pin voltage is measured at VCC = 3.0 V. Above: µPC8128TB, Center: µPC8151TB, Below: µPC8152TB 4 Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25°C, Pin 4, Pin 6 3.6 V Circuit Current ICC TA = +25°C 15 mA Power Dissipation PD Mounted on double-sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C 270 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Input Power Pin +5 dBm TA = +25 °C RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 2.4 3.0 3.3 V The same voltage should be applied to pin 4 and pin 6. Operating Frequency fopt 0.1 − 1.9 GHz Matched output port with external LC Data Sheet P12549EJ3V0DS Remark 5 µPC8128TB, µPC8151TB, µPC8152TB ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω, at LC matched frequency) Parameter Symbol µPC8128TB Conditions µPC8151TB µPC8152TB Unit MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX. Circuit Current ICC No signal 1.8 2.8 3.8 2.8 4.2 5.8 4.2 5.6 7.1 mA Power Gain GP f = 1.00 GHz f = 1.66 GHz f = 1.90 GHz 9.5 10 10 12.5 13 13 14.5 15 15 9.5 12 12 12.5 15 15 14.5 17 17 20 16.5 14.5 23 19.5 17.5 25 21.5 19.5 dB Isolation ISL f = 1.00 GHz f = 1.66 GHz f = 1.90 GHz 34 34 32 39 39 37 − − − 33 31 29 38 36 34 − − − 35 32 30 40 36 35 − − − dB Gain 1 dB Compression Output Power PO(1 dB) f = 1.00 GHz f = 1.66 GHz f = 1.90 GHz −7.5 −8.5 −8.5 −4.0 −4.0 −4.0 − − − −1.0 −2.5 −3.0 +2.5 +1.5 +0.5 − − − −7.5 −11.5 −11.5 −4.5 −8.5 −8.5 − − − dBm Saturated Output PowerNote PO(sat) f = 1.00 GHz f = 1.66 GHz f = 1.90 GHz − − − − − − − − − − − − − − − − − − −2.5 −5.5 −7.0 +0.5 −2.5 −3.0 − − − dB Noise Figure NF f = 1.00 GHz f = 1.66 GHz f = 1.90 GHz − − − 6.0 6.0 6.0 7.5 7.5 7.5 − − − 6.0 6.0 6.0 7.5 7.5 7.5 − − − 3.5 4.0 4.5 5.0 5.5 6.0 dB Input Return Loss (without matching circuit) RLin f = 1.00 GHz f = 1.66 GHz f = 1.90 GHz 2 2 2.5 5 5 5.5 − − − 2 1 1 5 4 4 − − − 8.5 7.5 8.5 11.5 10.5 11.5 − − − dB (Pin = −6 dBm) Note Saturated output power is specified only in µPC8152TB which has flat saturated region. STANDARD CHARACTERISTICS (Unless otherwise specified, TA = +25°C, VCC = Vout = 3.0 V, ZS = ZL = 50 Ω, at LC matched frequency) Reference Value Parameter Output Return Loss (with external matching circuit) 3rd Order Intermodulation Distortion 6 Symbol RLout IM3 Conditions µPC8128TB µPC8151TB µPC8152TB Unit f = 1.00 GHz f = 1.66 GHz f = 1.90 GHz 10 25 14 10 18 12 15 7.5 7 dB f1 = 1.000 GHz, f2 = 1.001 GHz, PO(each) = −20 dBm f1 = 1.660 GHz, f2 = 1.661 GHz, PO(each) = −20 dBm f1 = 1.900 GHz, f2 = 1.901 GHz, PO(each) = −20 dBm −50 −46 −46 −62 −56 −54 −51 −43 −42 dBc Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB TEST CIRCUIT VCC C7 C6 C4 C5 C3 Output port matching CIRCUIT L1 6 50 Ω IN C1 4 1 C2 50 Ω OUT 2,3,5 Data Sheet P12549EJ3V0DS 7 µPC8128TB, µPC8151TB, µPC8152TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD µPC8128TB/µPC8151TB µ PC8128/ 51/52TB Top View connector connector C2 L1 C2P OUT IN C1 C6 C5 Mounting direction C3 (Marking is an example for µPC8128TB) C4 COMPONENT LIST 1.0 GHz output port matching 1.66 GHz output port matching 1.9 GHz output port matching 1 000 pF 1 000 pF 1 000 pF C2 1.0 pF 0.75 pF 0.75 pF L1 8.2 nH 3.3 nH 2.2 nH C1, C3 to C6 8 Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB µPC8152TB µ PC8128/ 51/52TB Top View OUT C2V C2 L1 IN connector connector C1 C7 C6 Mounting direction C3 C5 C4 COMPONENT LIST 1.0 GHz output port matching 1.66 GHz output port matching 1.9 GHz output port matching 1 000 pF 1 000 pF 1 000 pF C2 1.5 pF 1.0 pF 1.5 pF L1 8.2 nH 1.8 nH 1.2 nH C1, C3 to C7 Notes 1. 42 × 35 × 0.4 mm double-sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes Data Sheet P12549EJ3V0DS 9 µPC8128TB, µPC8151TB, µPC8152TB EXAMPLE OF APPLICATION CIRCUIT (µPC8128TB, µPC8151TB) In improving RLin of µPC8128TB and µPC8151TB at 1.0 GHz, L2 should be attached. VCC C3 Output port maching CIRCUIT L1 6 50 Ω L2 C1 C2 4 1 IN 50 Ω OUT 2,3,5 In improving RLin of µPC8128TB and µPC8151TB at 1.66 GHz to 1.9 GHz, C’ should be attached. VCC C3 Output port matching CIRCUIT L1 6 50 Ω C1 IN 4 1 C2 OUT C' 2,3,5 10 50 Ω Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C) – µPC8128TB – CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 4 VCC = 3.0 V No signal Circuit Current ICC (mA) Circuit Current ICC (mA) 4 3 2 1 0 0 1 2 3 4 3 2 1 0 –60 –40 –20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (°C) Supply Voltage VCC (V) Data Sheet P12549EJ3V0DS 11 µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.0 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 45.664 Ω –69.156 Ω MARKER 1 1.0 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 30.865 Ω 11.494 Ω MARKER 1 1.0 GHz 1 START STOP 12 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.0 GHz output port matching POWER GAIN vs. FREQUENCY +20 POWER GAIN vs. FREQUENCY +20 VCC = 3.3 V +10 0 VCC = 3.0 V –10 VCC = 2.4 V –20 –30 Power Gain GP (dB) Power Gain GP (dB) +10 –40 –50 0.1 0 TA = +25°C –10 TA = –40°C –20 –30 –40 0.3 1.0 –50 0.1 3.0 0.3 3.0 ISOLATION vs. FREQUENCY ISOLATION vs. FREQUENCY –30 –30 VCC = 2.4 V VCC = 3.0 V VCC = 3.0 V –40 Isolation ISL (dB) Isolation ISL (dB) 1.0 Frequency f (GHz) Frequency f (GHz) –50 VCC = 3.3 V –40 TA = –40°C TA = +25°C –50 TA = +85°C –60 –60 –70 0.1 TA = +85°C VCC = 3.0 V 0.3 1.0 –70 0.1 3.0 Frequency f (GHz) 0.3 1.0 Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY 0 0 VCC = 3.0 V VCC = 2.4 V –5 –10 VCC = 3.0 V VCC = 3.3 V –15 –20 0.1 0.3 1.0 3.0 Input Return Loss RLin (dB) TA = –40°C Input Return Loss RLin (dB) 3.0 –5 TA = +25°C TA = +85°C –10 –15 –20 0.1 Frequency f (GHz) 0.3 1.0 3.0 Frequency f (GHz) Data Sheet P12549EJ3V0DS 13 µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.0 GHz output port matching OUTPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY +10 +10 0 –10 VCC = 2.4 V –20 –30 0.1 0.3 1.0 Output Return Loss RLout (dB) Output Return Loss RLout (dB) VCC = 3.3 V VCC = 3.0 V VCC = 3.0 V 0 TA = +25°C –10 TA = –40°C –20 –30 0.1 3.0 0.3 OUTPUT POWER vs. INPUT POWER +10 TA = +85°C +5 Output Power Pout (dBm) Output Power Pout (dBm) VCC = 3.0 V VCC = 3.3 V +5 VCC = 3.0 V –5 VCC = 2.4 V –10 –15 –20 –25 0 –5 TA = +25°C –10 TA = –40°C –15 –20 –25 –30 –40 –35 –30 –25 –20 –15 –10 –5 0 –30 –40 –35 –30 –25 –20 –15 –10 +5 –5 0 +5 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE +20 VCC = 3.0 V +10 f1 = 1 000 MHz f2 = 1 001 MHz 0 PO(each) –10 –20 IM3 –30 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 3rd Order Intermodulation Distortion IM3 (dBc) Output Power of Each Tone PO(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) 3.0 OUTPUT POWER vs. INPUT POWER +10 60 f1 = 1 000 MHz f2 = 1 001 MHz 50 VCC = 3.3 V 40 VCC = 3.0 V 30 VCC = 2.4 V 20 10 0 –30 Input Power of Each Tone Pin(each) (dBm) 14 1.0 Frequency f (GHz) Frequency f (GHz) 0 TA = +85°C Data Sheet P12549EJ3V0DS –25 –20 –15 –10 –5 0 Output Power of Each Tone PO(each) (dBm) +5 µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.0 GHz output port matching NOISE FIGURE vs. SUPPLY VOLTAGE 7.0 Noise Figure NF (dB) 6.5 6.0 5.5 5.0 4.5 4.0 2.0 2.5 3.0 3.5 Supply Voltage VCC (V) Data Sheet P12549EJ3V0DS 15 µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.66 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 27.846 Ω –43.406 Ω MARKER 1 1.66 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 46.598 Ω –9.8574 Ω MARKER 1 1.66 GHz 1 START STOP 16 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.66 GHz output port matching POWER GAIN vs. FREQUENCY ISOLATION vs. FREQUENCY +20 –30 VCC = 3.3 V 0 –10 Isolation ISL (dB) Power Gain GP (dB) +10 VCC = 3.0 V –20 –30 –40 –50 VCC = 2.4 V –60 –40 VCC = 2.4 V –50 VCC = 3.0 V –60 0.1 0.3 1.0 –70 0.1 3.0 Frequency f (GHz) +10 Output Return Loss RLout (dB) Input Return Loss RLin (dB) VCC = 2.4 V –5 –10 VCC = 3.0 V VCC = 3.3 V –15 –20 0.1 0.3 1.0 +5 0 –5 –10 –15 –25 –30 0.1 3.0 0.3 1.0 3.0 Frequency f (GHz) +10 VCC = 3.3 V 0 –5 VCC = 3.0 V –10 –15 VCC = 2.4 V –25 –5 0 +5 Output Power of Each Tone PO(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) OUTPUT POWER vs. INPUT POWER –30 –40 –35 –30 –25 –20 –15 –10 VCC = 3.3 V VCC = 3.0 V VCC = 2.4 V –20 Frequency f (GHz) Output Power Pout (dBm) 3.0 OUTPUT RETURN LOSS vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY –20 1.0 Frequency f (GHz) 0 +5 0.3 VCC = 3.3 V OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE +20 VCC = 3.0 V +10 f1 = 1 660 MHz f2 = 1 661 MHz 0 PO(each) –10 –20 –30 IM3 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 Input Power of Each Tone Pin(each) (dBm) Input Power Pin (dBm) Data Sheet P12549EJ3V0DS 17 µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.66 GHz output port matching NOISE FIGURE vs. SUPPLY VOLTAGE 60 7.0 f1 = 1 660 MHz f2 = 1 661 MHz 50 VCC = 3.3 V 40 VCC = 3.0 V 30 VCC = 2.4 V 20 6.0 5.5 5.0 4.5 10 0 –30 6.5 Noise Figure NF (dB) 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE –25 –20 –15 –10 –5 0 +5 4.0 2.0 Output Power of Each Tone PO(each) (dBm) 18 Data Sheet P12549EJ3V0DS 2.5 3.0 Supply Voltage VCC (V) 3.5 µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.9 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 24.725 Ω –34.01 Ω MARKER 1 1.9 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 74.719 Ω –22.016 Ω MARKER 1 1.9 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS 19 µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 1.9 GHz output port matching POWER GAIN vs. FREQUENCY +20 ISOLATION vs. FREQUENCY –30 VCC = 3.3 V 0 –10 VCC = 3.0 V –20 VCC = 2.4 V –30 Isolation ISL (dB) Power Gain GP (dB) +10 –40 –50 VCC = 2.4 V –60 –40 –50 VCC = 3.0 V –60 0.1 0.3 1.0 –70 0.1 3.0 INPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLout (dB) Input Return Loss RLin (dB) –5 VCC = 3.0 V –10 VCC = 3.3 V –15 –20 0.1 0.3 1.0 +5 –5 –10 –15 –25 0.3 1.0 3.0 Frequency f (GHz) +15 VCC = 3.3 V +5 0 VCC = 3.0 V –5 –10 VCC = 2.4 V –20 –5 0 +5 Output Power of Each Tone PO(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) OUTPUT POWER vs. INPUT POWER –25 –40 –35 –30 –25 –20 –15 –10 VCC = 2.4 V –20 –30 0.1 3.0 VCC = 3.0 V 0 Frequency f (GHz) Output Power Pout (dBm) 3.0 VCC = 3.3 V VCC = 2.4 V OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE +20 VCC = 3.0 V +10 f1 = 1 900 MHz f2 = 1 901 MHz 0 PO(each) –10 –20 –30 IM3 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) 20 1.0 +10 0 –15 0.3 Frequency f (GHz) Frequency f (GHz) +10 VCC = 3.3 V –5 0 Input Power of Each Tone Pin(each) (dBm) Data Sheet P12549EJ3V0DS +5 µPC8128TB, µPC8151TB, µPC8152TB – µPC8128TB – 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 60 f1 = 1 900 MHz f2 = 1 901 MHz 50 VCC = 3.3 V 40 VCC = 3.0 V 30 VCC = 2.4 V 20 10 0 –30 NOISE FIGURE vs. SUPPLY VOLTAGE 7.0 6.5 Noise Figure NF (dB) 3rd Order Intermodulation Distortion IM3 (dBc) 1.9 GHz output port matching 6.0 5.5 5.0 4.5 –25 –20 –15 –10 –5 0 +5 4.0 2.0 Output Power of Each Tone PO(each) (dBm) Data Sheet P12549EJ3V0DS 2.5 3.0 Supply Voltage VCC (V) 3.5 21 µPC8128TB, µPC8151TB, µPC8152TB S-PARAMETERS (TA = +25°°C, VCC = Vout = 3.0 V) – µPC8128TB – S11–Frequency 0.1 G 3.0 G 2.0 G 1.0 G S22–Frequency 0.1 G 1.0 G 2.0 G 3.0 G 22 Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB TYPICAL S-PARAMETER VALUES (TA = +25°C) µPC8128TB VCC = Vout = 3.0 V, ICC = 2.8 mA FREQUENCY MHz S11 MAG. S21 ANG. MAG. S12 ANG. MAG. S22 ANG. MAG. ANG. 100.0000 0.859 –14.5 1.089 –176.0 0.001 176.7 1.005 –1.7 200.0000 0.769 –23.8 1.138 –173.2 0.001 142.6 1.019 –4.2 300.0000 0.694 –27.1 1.208 –171.0 0.003 112.3 1.015 –5.8 400.0000 0.637 –30.1 1.336 –171.7 0.005 88.8 0.996 –8.7 500.0000 0.595 –32.4 1.478 –172.8 0.005 77.7 0.976 –10.9 600.0000 0.568 –35.9 1.623 –175.6 0.005 64.1 0.976 –12.8 700.0000 0.555 –40.7 1.822 –179.0 0.006 73.7 0.983 –14.1 800.0000 0.569 –45.0 1.955 176.9 0.007 64.2 0.988 –15.5 900.0000 0.597 –49.4 2.147 172.5 0.007 72.5 0.973 –17.4 1000.0000 0.633 –52.6 2.307 166.8 0.008 49.9 0.945 –19.9 1100.0000 0.643 –56.3 2.468 160.6 0.008 66.8 0.928 –22.0 1200.0000 0.644 –59.7 2.572 153.6 0.007 48.8 0.934 –24.1 1300.0000 0.611 –64.3 2.677 144.2 0.007 45.3 0.950 –24.8 1400.0000 0.585 –69.5 2.704 137.3 0.005 64.5 0.938 –26.6 1500.0000 0.562 –75.1 2.693 128.8 0.005 66.0 0.913 –28.2 1600.0000 0.559 –80.5 2.712 122.7 0.005 93.6 0.898 –30.1 1700.0000 0.547 –85.4 2.640 116.3 0.006 83.5 0.892 –32.0 1800.0000 0.540 –89.5 2.665 110.4 0.005 101.6 0.893 –33.6 1900.0000 0.524 –93.2 2.599 104.5 0.005 115.4 0.896 –34.7 2000.0000 0.503 –97.8 2.582 98.5 0.006 110.9 0.895 –36.5 2100.0000 0.474 –103.5 2.500 93.1 0.007 129.4 0.877 –38.6 2200.0000 0.461 –110.0 2.472 86.7 0.008 130.5 0.873 –40.4 2300.0000 0.465 –116.2 2.453 80.9 0.009 137.8 0.878 –41.9 2400.0000 0.475 –121.0 2.426 74.8 0.010 133.3 0.877 –43.5 2500.0000 0.488 –123.1 2.364 70.4 0.012 139.0 0.871 –45.4 2600.0000 0.491 –125.0 2.310 63.9 0.011 140.8 0.864 –47.9 2700.0000 0.480 –125.1 2.282 61.1 0.014 142.6 0.855 –51.1 2800.0000 0.460 –127.0 2.159 56.3 0.014 140.7 0.851 –53.0 2900.0000 0.437 –129.4 2.205 51.4 0.016 141.5 0.867 –55.1 3000.0000 0.410 –133.4 2.085 48.8 0.018 143.2 0.861 –57.0 3100.0000 0.401 –137.8 2.038 42.4 0.019 142.1 0.855 –60.0 Data Sheet P12549EJ3V0DS 23 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 6 5 No signal Circuit Current ICC (mA) Circuit Current ICC (mA) 5 4 3 2 1 0 0 1 2 3 4 4 3 2 1 0 –60 –40 Supply Voltage VCC (V) 24 VCC = 3.0 V –20 0 +20 +40 +60 +80 Operating Ambient Temperature TA (°C) Data Sheet P12549EJ3V0DS +100 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.0 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 52.156 Ω –69.48 Ω MARKER 1 1.0 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 32.893 Ω 16.221 Ω MARKER 1 1.0 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS 25 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.0 GHz output port matching POWER GAIN vs. FREQUENCY +20 POWER GAIN vs. FREQUENCY +20 VCC = 3.3 V +10 0 Power Gain GP (dB) Power Gain GP (dB) +10 VCC = 3.0 V –10 VCC = 2.4 V –20 –30 0 TA = +25°C –10 TA = –40°C –20 –30 –40 –40 –50 0.1 0.3 1.0 –50 0.1 3.0 0.3 ISOLATION vs. FREQUENCY 3.0 ISOLATION vs. FREQUENCY –30 –30 VCC = 2.4 V Isolation ISL (dB) –40 –50 VCC = 3.3 V VCC = 3.0 V 1.0 Frequency f (GHz) Frequency f (GHz) Isolation ISL (dB) TA = +85°C VCC = 3.0 V –60 VCC = 3.0 V TA = –40°C –40 –50 TA = +25°C –60 TA = +85°C –70 0.1 0.3 1.0 3.0 1.0 3.0 Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY 0 VCC = 2.4 V Input Return Loss RLin (dB) TA = –40°C –5 VCC = 3.0 V VCC = 3.3 V –10 –15 –20 0.1 0.3 1.0 3.0 –5 TA = +25°C TA = +85°C –10 –15 –20 0.1 VCC = 3.0 V 0.3 1.0 Frequency f (GHz) Frequency f (GHz) 26 0.3 Frequency f (GHz) 0 Input Return Loss RLin (dB) –70 0.1 Data Sheet P12549EJ3V0DS 3.0 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.0 GHz output port matching OUTPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY +10 +10 0 VCC = 3.3 V –10 VCC = 3.0 V –20 VCC = 2.4 V –30 0.1 0.3 1.0 Output Return Loss RLout (dB) Output Return Loss RLout (dB) VCC = 3.0 V 0 TA = +85°C –10 TA = +25°C TA = –40°C –20 –30 0.1 3.0 0.3 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER +10 VCC = 3.0 V VCC = 3.3 V 0 VCC = 3.0 V –5 –10 TA = +85°C +5 Output Power Pout (dBm) +5 Output Power Pout (dBm) 3.0 Frequency f (GHz) +10 VCC = 2.4 V –15 –20 –25 0 –5 TA = +25°C –10 TA = –40°C –15 –20 –25 –30 –40 –35 –30 –25 –20 –15 –10 –5 0 –30 –40 –35 –30 –25 –20 –15 –10 +5 –5 0 +5 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE +10 VCC = 3.0 V 0 f1 = 1 000 MHz f2 = 1 001 MHz –10 PO(each) –20 –30 IM3 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 3rd Order Intermodulation Distortion IM3 (dBc) Output Power of Each Tone PO(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) 1.0 60 f1 = 1 000 MHz f2 = 1 001 MHz 50 VCC = 3.3 V 40 VCC = 3.0 V 30 20 VCC = 2.4 V 10 0 –20 Input Power of Each Tone Pin(each) (dBm) Data Sheet P12549EJ3V0DS –15 –10 –5 0 +5 Output Power of Each Tone PO(each) (dBm) 27 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.0 GHz output port matching NOISE FIGURE vs. SUPPLY VOLTAGE 7.5 Noise Figure NF (dB) 7.0 6.5 6.0 5.5 5.0 4.5 2.0 2.5 3.0 3.5 Supply Voltage VCC (V) 28 Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.66 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 26.748 Ω –46.359 Ω MARKER 1 1.66 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 49.086 Ω –23.154 Ω MARKER 1 1.66 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS 29 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.66 GHz output port matching ISOLATION vs. FREQUENCY POWER GAIN vs. FREQUENCY –20 +20 VCC = 3.3 V VCC = 2.4 V –30 0 –10 Isolation ISL (dB) Power Gain GP (dB) +10 VCC = 3.0 V –20 VCC = 2.4 V –30 –40 VCC = 3.0 V –40 –50 VCC = 3.3 V –60 –50 –60 0.1 0.3 1.0 –70 0.1 3.0 0.3 1.0 Frequency f (GHz) Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY 0 +10 VCC = 3.3 V Output Return Loss RLout (dB) –5 VCC = 3.0 V –10 VCC = 3.3 V –15 –20 0.1 0.3 1.0 –5 –10 –15 –20 VCC = 2.4 V –25 0.3 1.0 3.0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE VCC = 3.3 V VCC = 3.0 V 0 VCC = 2.4 V –5 –10 –15 –20 –25 –30 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 +10 VCC = 3.0 V 0 f1 = 1 660 MHz f2 = 1 661 MHz –10 –20 PO(each) IM3 –30 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) 30 VCC = 3.0 V 0 Frequency f (GHz) +10 Output Power Pout (dBm) +5 –30 0.1 3.0 Output Power of Each Tone PO(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Input Return Loss RLin (dB) VCC = 2.4 V +5 3.0 –5 0 Input Power of Each Tone Pin(each) (dBm) Data Sheet P12549EJ3V0DS +5 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.66 GHz output port matching NOISE FIGURE vs. SUPPLY VOLTAGE 60 7.5 f1 = 1 660 MHz f2 = 1 661 MHz 50 VCC = 3.3 V 40 VCC = 3.0 V 30 20 VCC = 2.4 V 10 0 –20 –15 –10 7.0 Noise Figure NF (dB) 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 6.5 6.0 5.5 5.0 –5 0 +5 4.5 2.0 Output Power of Each Tone PO(each) (dBm) Data Sheet P12549EJ3V0DS 2.5 3.0 Supply Voltage VCC (V) 3.5 31 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.9 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 24.301 Ω –37.246 Ω 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 64.633 Ω –35.777 Ω 1 START STOP 32 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.9 GHz output port matching ISOLATION vs. FREQUENCY POWER GAIN vs. FREQUENCY –20 +20 VCC = 3.3 V VCC = 2.4 V +10 –30 Isolation ISL (dB) Power Gain GP (dB) VCC = 3.0 V 0 –10 –20 VCC = 2.4 V –30 –40 –40 –50 VCC = 3.0 V –60 –50 VCC = 3.3 V –60 0.1 0.3 1.0 –70 0.1 3.0 INPUT RETURN LOSS vs. FREQUENCY 3.0 OUTPUT RETURN LOSS vs. FREQUENCY 0 +10 VCC = 3.3 V Output Return Loss RLout (dB) VCC = 2.4 V Input Return Loss RLin (dB) 1.0 Frequency f (GHz) Frequency f (GHz) –5 VCC = 3.0 V –10 VCC = 3.3 V –15 –20 0.1 0.3 1.0 +5 –5 –10 –15 –25 0.3 1.0 3.0 Frequency f (GHz) +10 VCC = 3.3 V +5 VCC = 3.0 V 0 VCC = 2.4 V –10 –15 –20 –25 –30 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 Output Power of Each Tone PO(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) OUTPUT POWER vs. INPUT POWER –5 VCC = 2.4 V –20 –30 0.1 3.0 VCC = 3.0 V 0 Frequency f (GHz) Output Power Pout (dBm) 0.3 OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE +10 VCC = 3.0 V 0 f1 = 1 900 MHz f2 = 1 901 MHz –10 –20 PO(each) IM3 –30 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 Input Power of Each Tone Pin(each) (dBm) Input Power Pin (dBm) Data Sheet P12549EJ3V0DS 33 µPC8128TB, µPC8151TB, µPC8152TB – µPC8151TB – 1.9 GHz output port matching NOISE FIGURE vs. SUPPLY VOLTAGE 60 7.5 f1 = 1 900 MHz f2 = 1 901 MHz 50 VCC = 3.3 V 40 VCC = 3.0 V 30 20 VCC = 2.4 V 10 0 –25 –20 –15 –10 7.0 Noise Figure NF (dB) 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 6.5 6.0 5.5 5.0 –5 0 +5 4.5 2.0 Output Power of Each Tone PO(each) (dBm) 34 Data Sheet P12549EJ3V0DS 2.5 3.0 Supply Voltage VCC (V) 3.5 µPC8128TB, µPC8151TB, µPC8152TB S-PARAMETERS (TA = +25°°C, VCC = Vout = 3.0 V) – µPC8151TB – S11–Frequency 0.1 G 3.0 G 2.0 G 1.0 G S22–Frequency 0.1 G 1.0 G 2.0 G 3.0 G Data Sheet P12549EJ3V0DS 35 µPC8128TB, µPC8151TB, µPC8152TB TYPICAL S-PARAMETER VALUES (TA = +25°C) µPC8151TB VCC = Vout = 3.0 V, ICC = 4.2 mA FREQUENCY MHz S11 MAG. S21 ANG. MAG. S12 ANG. MAG. S22 ANG. MAG. ANG. 100.0000 0.843 –16.0 1.202 –178.9 0.000 69.5 0.996 –3.3 200.0000 0.752 –27.1 1.197 –177.5 0.003 120.2 1.009 –6.9 300.0000 0.666 –32.4 1.221 –175.4 0.003 103.2 0.998 –9.9 400.0000 0.603 –36.8 1.299 –174.5 0.004 92.8 0.986 –13.8 500.0000 0.555 –40.5 1.398 –174.0 0.005 88.8 0.968 –17.3 600.0000 0.528 –44.8 1.513 –174.9 0.005 95.2 0.968 –20.4 700.0000 0.517 –49.9 1.691 –176.2 0.007 67.5 0.971 –23.1 800.0000 0.525 –54.4 1.815 –178.2 0.007 72.4 0.972 –25.8 900.0000 0.545 –58.9 2.008 179.5 0.006 84.5 0.960 –29.3 1000.0000 0.571 –62.8 2.189 175.7 0.009 78.3 0.936 –32.8 1100.0000 0.580 –67.3 2.399 171.2 0.007 60.0 0.926 –36.3 1200.0000 0.588 –71.3 2.560 165.9 0.007 89.5 0.933 –39.5 1300.0000 0.571 –76.4 2.736 157.5 0.008 67.2 0.941 –42.0 1400.0000 0.563 –82.3 2.865 151.3 0.008 79.6 0.930 –45.0 1500.0000 0.553 –88.8 2.946 143.3 0.006 79.9 0.906 –48.1 1600.0000 0.552 –95.2 3.077 137.0 0.006 91.4 0.895 –51.5 1700.0000 0.551 –101.5 3.083 130.1 0.009 102.3 0.888 –54.8 1800.0000 0.550 –107.5 3.174 123.9 0.009 100.5 0.884 –57.3 1900.0000 0.536 –113.3 3.164 117.4 0.006 109.5 0.885 –60.2 2000.0000 0.517 –119.8 3.193 110.7 0.009 115.9 0.881 –63.4 2100.0000 0.495 –127.1 3.149 104.4 0.010 124.2 0.870 –66.6 2200.0000 0.484 –135.3 3.143 97.3 0.011 122.4 0.867 –69.8 2300.0000 0.484 –142.6 3.135 90.5 0.012 131.7 0.866 –72.3 2400.0000 0.490 –148.5 3.120 83.5 0.015 138.1 0.868 –75.5 2500.0000 0.499 –152.5 3.053 78.4 0.016 136.3 0.866 –78.7 2600.0000 0.499 –155.8 2.991 71.4 0.018 142.9 0.864 –82.5 2700.0000 0.485 –157.4 2.958 68.0 0.018 143.9 0.858 –86.6 2800.0000 0.464 –160.6 2.810 62.9 0.021 142.5 0.852 –89.7 2900.0000 0.439 –164.1 2.866 57.5 0.022 149.3 0.872 –93.4 3000.0000 0.416 –168.6 2.713 54.5 0.025 148.4 0.864 –96.6 3100.0000 0.403 –173.6 2.635 48.0 0.030 143.6 0.867 –101.0 36 Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 8 7 No signal VCC = 3.0 V 6 Circuit Current ICC (mA) Circuit Current ICC (mA) 7 6 5 4 3 2 5 4 3 2 1 1 0 0 1 2 3 4 Supply Voltage VCC (V) 0 –60 –40 –20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (°C) Data Sheet P12549EJ3V0DS 37 µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.0 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 51.59 Ω –20.508 Ω MARKER 1 1.0 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 75.816 Ω –12.941 Ω MARKER 1 1.0 GHz 1 START STOP 38 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.0 GHz output port matching POWER GAIN vs. FREQUENCY POWER GAIN vs. FREQUENCY +30 +30 VCC = 3.0 V VCC = 3.3 V +20 Power Gain GP (dB) Power Gain GP (dB) +20 +10 VCC = 2.4 V 0 –10 –20 –30 –40 0.1 TA = +85°C VCC = 3.0 V +10 TA = +25°C 0 TA = –40°C –10 –20 –30 0.3 1.0 –40 0.1 3.0 0.3 1.0 Frequency f (GHz) Frequency f (GHz) ISOLATION vs. FREQUENCY ISOLATION vs. FREQUENCY –30 –30 VCC = 3.0 V TA = +25°C VCC = 3.0 V VCC = 3.3 V –50 VCC = 2.4 V Isolation ISL (dB) Isolation ISL (dB) –40 –60 –70 0.1 –40 TA = +85°C –50 TA = –40°C –60 0.3 1.0 –70 0.1 3.0 0.3 Frequency f (GHz) 1.0 3.0 Frequency f (GHz) INPUT RETURN LOSS vs. FREQUENCY INPUT RETURN LOSS vs. FREQUENCY 0 0 VCC = 3.0 V VCC = 2.4 V –5 Input Return Loss RLin (dB) Input Return Loss RLin (dB) 3.0 –10 VCC = 3.0 V –15 –20 VCC = 3.3 V –25 –30 0.1 0.3 1.0 3.0 –5 TA = –40°C –10 –15 TA = +25°C –20 TA = +85°C –25 –30 0.1 0.3 1.0 3.0 Frequency f (GHz) Frequency f (GHz) Data Sheet P12549EJ3V0DS 39 µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.0 GHz output port matching OUTPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY +10 Output Return Loss RLout (dB) Output Return Loss RLout (dB) +10 0 –10 VCC = 3.3 V VCC = 3.0 V –20 VCC = 2.4 V –30 0.1 0.3 1.0 VCC = 3.0 V TA = +85°C 0 –10 TA = +25°C –20 TA = –40°C –30 0.1 3.0 0.3 OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER +5 +5 Output Power of Each Tone PO(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Output Power Pout (dBm) 0 VCC = 3.0 V –10 VCC = 2.4 V –15 –20 0 TA = +85°C 0 TA = +25°C –5 TA = –40°C –10 –15 –20 0 +5 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE +20 VCC = 3.0 V +10 f1 = 1 000 MHz f2 = 1 001 MHz 0 PO(each) –10 –20 –30 IM3 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 60 f1 = 1 000 MHz f2 = 1 001 MHz 50 40 VCC = 3.3 V 30 VCC = 3.0 V 20 VCC = 2.4 V 10 0 –25 Input Power of Each Tone Pin(each) (dBm) 40 VCC = 3.0 V –25 –40 –35 –30 –25 –20 –15 –10 –5 +5 3rd Order Intermodulation Distortion IM3 (dBc) Output Power Pout (dBm) VCC = 3.3 V –25 –40 –35 –30 –25 –20 –15 –10 –5 3.0 Frequency f (GHz) Frequency f (GHz) –5 1.0 Data Sheet P12549EJ3V0DS –20 –15 –10 –5 0 Output Power of Each Tone PO(each) (dBm) +5 µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.0 GHz output port matching NOISE FIGURE vs. SUPPLY VOLTAGE 5.5 Noise Figure NF (dB) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 2.5 3.0 3.5 Supply Voltage VCC (V) Data Sheet P12549EJ3V0DS 41 µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.66 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 98.301 Ω –25.836 Ω MARKER 1 1.66 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 22.714 Ω 10.238 Ω MARKER 1 1.66 GHz 1 START STOP 42 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.66 GHz output port matching ISOLATION vs. FREQUENCY POWER GAIN vs. FREQUENCY –30 +30 VCC = 3.3 V VCC = 2.4 V +20 +10 0 VCC = 2.4 V –10 –20 –30 Isolation ISL (dB) Power Gain GP (dB) VCC = 3.0 V –40 VCC = 3.0 V –50 –60 VCC = 3.3 V –40 –50 0.1 0.3 1.0 –70 0.1 3.0 INPUT RETURN LOSS vs. FREQUENCY OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLout (dB) VCC = 2.4 V –10 –20 VCC = 3.0 V VCC = 3.3 V –30 –40 –50 0.1 0.3 1.0 VCC = 3.3 V 0 –10 VCC = 3.0 V –20 VCC = 2.4 V –30 0.1 3.0 0.3 1.0 3.0 Frequency f (GHz) Frequency f (GHz) OUTPUT POWER vs. INPUT POWER OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE +5 VCC = 3.3 V 0 VCC = 3.0 V –5 VCC = 2.4 V –15 –20 –25 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 Output Power of Each Tone PO(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) Input Return Loss RLin (dB) 3.0 +10 0 Output Power Pout (dBm) 1.0 Frequency f (GHz) Frequency f (GHz) –10 0.3 +20 VCC = 3.0 V +10 f1 = 1 660 MHz f2 = 1 661 MHz 0 PO(each) –10 –20 –30 IM3 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 –5 0 +5 Input Power of Each Tone Pin(each) (dBm) Input Power Pin (dBm) Data Sheet P12549EJ3V0DS 43 µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.66 GHz output port matching NOISE FIGURE vs. SUPPLY VOLTAGE 60 5.5 f1 = 1 660 MHz f2 = 1 661 MHz 50 VCC = 3.3 V 40 30 VCC = 3.0 V 20 VCC = 2.4 V 10 0 –25 5.0 Noise Figure NF (dB) 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 4.5 4.0 3.5 3.0 –20 –15 –10 –5 0 +5 2.5 2.0 Output Power of Each Tone PO(each) (dBm) 44 Data Sheet P12549EJ3V0DS 2.5 3.0 Supply Voltage VCC (V) 3.5 µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.9 GHz output port matching S-PARAMETERS (monitored at connector on board) TA = +25°C, VCC = Vout = 3.0 V S11 REF 1.0 Units 1 200.0 mUnits/ 85.828 Ω 11.969 Ω MARKER 1 1.9 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz S22 REF 1.0 Units 1 200.0 mUnits/ 62.398 Ω 55.551 Ω MARKER 1 1.9 GHz 1 START STOP 0.100000000 GHz 3.100000000 GHz Data Sheet P12549EJ3V0DS 45 µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.9 GHz output port matching ISOLATION vs. FREQUENCY POWER GAIN vs. FREQUENCY +30 –10 VCC = 3.3 V –20 +10 0 VCC = 2.4 V VCC = 3.0 V –10 –20 Isolation ISL (dB) Power Gain GP (dB) +20 –40 VCC = 3.0 V –50 –30 –60 –40 –50 0.1 0.3 1.0 –70 0.1 3.0 INPUT RETURN LOSS vs. FREQUENCY –20 VCC = 3.0 V VCC = 3.3 V –30 –40 –50 0.1 0.3 1.0 0 VCC = 3.0 V –10 VCC = 2.4 V –20 –30 0.1 3.0 VCC = 3.3 V VCC = 3.0 V –10 VCC = 2.4 V –20 –25 –5 0 +5 Output Power of Each Tone Po(each) (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) +5 –30 –40 –35 –30 –25 –20 –15 –10 0.3 1.0 3.0 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER Output Power Pout (dBm) 3.0 VCC = 3.3 V Frequency f (GHz) –15 1.0 OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLout (dB) Input Return Loss RLin (dB) VCC = 2.4 V –10 –5 0.3 +10 0 0 VCC = 3.3 V Frequency f (GHz) Frequency f (GHz) OUTPUT POWER OF EACH TONE, IM3 vs. INPUT POWER OF EACH TONE +20 VCC = 3.0 V +10 f1 = 1 900 MHz 0 f2 = 1 901 MHz PO(each) –10 –20 IM3 –30 –40 –50 –60 –70 –80 –40 –35 –30 –25 –20 –15 –10 Input Power Pin (dBm) 46 VCC = 2.4 V –30 –5 0 Input Power of Each Tone Pin(each) (dBm) Data Sheet P12549EJ3V0DS +5 µPC8128TB, µPC8151TB, µPC8152TB – µPC8152TB – 1.9 GHz output port matching NOISE FIGURE vs. SUPPLY VOLTAGE 60 5.5 f1 = 1 900 MHz f2 = 1 901 MHz 50 VCC = 3.3 V 40 VCC = 3.0 V 30 VCC = 2.4 V 20 4.5 4.0 3.5 3.0 10 0 –30 5.0 Noise Figure NF (dB) 3rd Order Intermodulation Distortion IM3 (dBc) 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE –25 –20 –15 –10 –5 0 2.5 2.0 Output Power of Each Tone PO(each) (dBm) 2.5 3.0 3.5 Supply Voltage VCC (V) Remark The graphs indicate nominal characteristics. Data Sheet P12549EJ3V0DS 47 µPC8128TB, µPC8151TB, µPC8152TB S-PARAMETERS (TA = +25°°C, VCC = Vout = 3.0 V) – µPC8152TB – S11–Frequency 1.0 G 2.0 G 0.1 G 3.0 G S22–Frequency 0.1 G 3.0 G 2.0 G 48 Data Sheet P12549EJ3V0DS 1.0 G µPC8128TB, µPC8151TB, µPC8152TB TYPICAL S-PARAMETER VALUES (TA = +25°C) µPC8152TB VCC = Vout = 3.0 V, ICC = 5.6 mA FREQUENCY MHz S11 MAG. S21 ANG. MAG. S12 ANG. MAG. S22 ANG. MAG. ANG. 100.0000 0.062 168.0 6.691 –0.3 0.002 40.8 0.775 –3.3 200.0000 0.047 169.1 7.049 –3.7 0.001 101.6 0.773 –6.6 300.0000 0.055 166.9 7.418 –9.3 0.003 97.3 0.761 –9.1 400.0000 0.078 162.1 7.883 –16.0 0.003 70.7 0.759 –12.0 500.0000 0.101 155.6 8.311 –22.1 0.005 76.7 0.754 –15.3 600.0000 0.121 147.4 8.583 –29.7 0.004 80.5 0.754 –18.3 700.0000 0.135 141.2 9.093 –37.3 0.006 79.8 0.756 –21.3 800.0000 0.143 133.2 9.276 –45.4 0.005 85.9 0.755 –24.7 900.0000 0.146 122.4 9.572 –53.6 0.009 89.6 0.752 –28.1 1000.0000 0.146 108.9 9.763 –62.6 0.009 70.3 0.745 –32.0 1100.0000 0.153 97.4 9.851 –71.9 0.007 90.8 0.733 –36.3 1200.0000 0.157 82.7 9.926 –80.5 0.011 84.9 0.723 –40.3 1300.0000 0.164 73.3 9.816 –91.2 0.010 81.9 0.710 –44.3 1400.0000 0.168 63.4 9.586 –99.6 0.011 81.4 0.679 –48.5 1500.0000 0.171 56.1 9.332 –109.4 0.011 82.3 0.649 –52.0 1600.0000 0.165 47.2 9.128 –117.9 0.009 79.0 0.624 –56.3 1700.0000 0.164 38.7 8.544 –126.1 0.011 77.5 0.591 –59.2 1800.0000 0.156 30.2 8.152 –133.5 0.011 76.8 0.557 –61.4 1900.0000 0.158 25.1 7.607 –140.6 0.011 75.9 0.527 –63.4 2000.0000 0.148 21.5 7.264 –147.5 0.012 75.8 0.498 –65.6 2100.0000 0.140 19.1 6.759 –153.7 0.013 82.6 0.476 –66.8 2200.0000 0.124 21.6 6.366 –159.7 0.012 92.4 0.455 –67.1 2300.0000 0.104 19.3 6.028 –165.7 0.014 88.9 0.438 –68.1 2400.0000 0.085 17.8 5.642 –171.5 0.015 89.8 0.418 –68.1 2500.0000 0.068 10.9 5.200 –176.0 0.015 87.2 0.399 –69.5 2600.0000 0.059 9.9 4.874 179.1 0.016 94.2 0.390 –69.2 2700.0000 0.055 –0.1 4.527 175.9 0.017 93.5 0.380 –70.2 2800.0000 0.054 0.2 4.202 171.3 0.022 88.2 0.372 –70.3 2900.0000 0.054 1.9 4.005 167.7 0.021 91.4 0.369 –69.5 3000.0000 0.055 12.0 3.697 164.4 0.021 86.8 0.360 –69.6 3100.0000 0.057 22.3 3.502 160.4 0.023 83.9 0.352 –71.0 Data Sheet P12549EJ3V0DS 49 µPC8128TB, µPC8151TB, µPC8152TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0±0.2 1.25±0.1 50 Data Sheet P12549EJ3V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.9±0.1 0.1 MIN. µPC8128TB, µPC8151TB, µPC8152TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor (L) should be attached between output and VCC pins. The L and series capacitor (C2) values should be adjusted for applied frequency to match impedance to next stage. (5) The DC capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Count: 3, Exposure limit: NoneNote IR35-00-3 VPS Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Count: 3, Exposure limit: NoneNote VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Count: 1, Exposure limit: NoneNote WS60-00-1 Partial Heating Pin temperature: 300°C or below Time: 3 seconds or less (per side of device) Exposure limit: NoneNote – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P12549EJ3V0DS 51 µPC8128TB, µPC8151TB, µPC8152TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is current as of February, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4