WEITRON 2N4003K

2N4003K
N-Channel Enhancement
Mode Power MOSFET
3 DRAIN
P b Lead(Pb)-Free
1
GATE
Features:
* Gate
Pretection
Diode
DRAIN CURRENT
0.5 AMPERES
DRAIN SOUCE VOLTAGE
30 VOLTAGE
*
* Low Gate Voltage Threshold Vgs(th)
to Facilitate Drive Circuit Design.
* Low Gate Charge for Fast Switching.
* ESD Protected Gate.
* Minimum Breakdown Voltage Rating of 30V.
SOURCE 2
3
1
2
Application:
* Level Shifters
* Level Switches
* Low Side Load Switches
* Portable Applications
SOT-23
Maximum Ratings(TA=25℃
Unless Otherwise Specified)
Rating
Symbol
Value
Drain-Source Voltage
V DS
30
Gate-Source Voltage
VG S
±20
Continuous Drain Current 1 ,Steady State
(TA=25°C)
ID
(TA=85°C)
Power Dissipation1
,Steady State
Continuous Drain Current 1 ,t<10s
PD
(TA=25°C)
ID
(TA=85°C)
Power Dissipation1
0.5
0.37
0.69
0.56
0.40
Unit
V
A
W
A
PD
0.83
W
IDM
1.7
A
R θJA
180
150
300
°C /W
TJ
+150
°C
Storage Temperature Range
Tstg
-55~+150
°C
Source Current (Body Diode)
IS
1.0
A
Lead Temperature for Soldering Purposes (1/8” from case 10s)
TL
260
°C
,t<5s
Pulsed Drain Current
Maximum Junction-ambient
,Steady State1
,t<10s1
,Steady State2
Operating Junction Temperature Range
Note: 1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces).
2. Surface−mounted on FR4 board using the minimum recommended pad size.
Device Marking
2N4003K = TR8
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2N4003K
Electrical Characteristics (TA =25°C Unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
V (BR)DSS
30
-
-
Unit
Static
Drain-Source Breakdown Voltage
V G S =0, ID =100 A
V
Gate-Source Threshold Voltage3
V G S(Th)
0.8
-
1.6
IGSS
-
-
±1.0
IDSS
-
-
1
RDS(on)
-
1.5
1.0
2.0
1.5
Ω
g fs
-
0.33
-
S
Input Capacitance
VGS=0V, VDS=5.0V, f=1.0MHz
Ciss
-
21
Output Capacitance
VGS=0V, VDS=5.0V, f=1.0MHz
Coss
-
19.7
-
pF
Reverse Transfer Capacitance
VGS=0V, VDS=5.0V, f=1.0MHz
Crss
-
8.1
-
V DS =V GS , ID =250 A
Gate-Source Leakage Current
V G S = ± 10V
Zero Gate Voltage Drain Current (TJ =25˚C)
V DS =30V,VG S =0
Drain-Source On-Resistance3
V G S =2.5V,I D = 10mA
V G S =4.0V,I D =10mA
Forward Transconductance3
V DS =3.0V, ID =10mA
Dynamic
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08-Sep-09
2N4003K
Switching
4
Turn-on Delay Time
VGS =4.5V, VDD=5.0V,ID=0.1A, RG=50Ω
t d(on)
-
16.7
-
Rise Time4
VGS =4.5V, VDD=5.0V,ID=0.1A, RG=50Ω
tr
-
47.9
ns
4
td
VGS =4.5V, VDD=5.0V,ID=0.1A, RG=50Ω
)
-
65.1
-
Fall Time4
VGS =4.5V, VDD=5.0V,ID=0.1A, RG=50Ω
tf
-
64.2
-
Total Gate Charge
VGS=5.0V, VDS =24V, I D=0.1A
Qg
-
1.15
-
Threshold Gate Charge
VGS=5.0V, VDS =24V, I D=0.1A
Q g(TH)
-
0.15
-
Gate-Source Charge
VGS=5.0V, VDS =24V, I D=0.1A
Q gs
-
0.32
-
Gate-Drain Change
VGS=5.0V, VDS =24V, I D=0.1A
Qgd
-
0.23
-
nC
Source-Drain Diode Characteristics
Forward On Voltage
VGS =0V, IS =10mA
TJ = 25°C
TJ = 125°C
Reverse Recovery Time
VGS =0V, IS =10mA, dls/dt=8A/μs
V SD
-
0.65
0.45
0.7
-
V
trr
-
14
-
nS
Note : 3. Pulse Test: pulse width ≤ 300 μs, duty cycle ≤ 2%.
4. Switching characteristics are independent of operating junction temperatures.
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2N4003K
TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted)
1.6
1.6
VDS ≥ 10 V
VGS = 10 V to 5 V
0.8
4V
0.4
3.5 V
TJ = 25°C
0.8
TJ = 125°C
0.4
0
0
1
2
VDS, DRAIN TO SOURCE VOLTAGE (V)
3
1
4
2
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 1. On Region Characteristics
Figure 2. Transfer Characteristics
ID = 0.2 A
8
6
4
2
0
2.4
2.8
3.2
3.6
VGS, GATE TO SOURCE VOLTAGE (V)
4
0
RDS(on), DRAIN−TO−SOURCE RESISTANCE ( )
10
VGS = 10 V
TJ = 125°C
0.8
0.6
TJ = 25°C
0.4
TJ = −55°C
0.2
0
0
0.1
0.2
0.3
0.4
0.5
0.6
ID, DRAIN CURRENT (AMPS)
Figure 4. On Resistance vs. Drain Current and
Temperature
1000
1.80
VGS = 0 V
ID = 0.3 A
VGS = 4.5 V
IDSS, LEAKAGE (nA)
1.60
5
1
Figure 3. On Resistance vs. Gate to Source Voltage
RDS(on), DRAIN−TO−SOURCE RESISTANCE ( )
(NORMALIZED)
TJ = −55°C
1.2
2.5 V
0
RDS(on), DRAIN−TO−SOURCE RESISTANCE ( )
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
4.5 V
1.2
1.40
1.20
1.00
TJ = 150°C
100
TJ = 125°C
0.80
0.60
−25
10
−50
0
25
50
75
100
125
150
Figure 5. On Resistance Variation with Temperature
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5
10
15
20
30
25
VDS, DRAIN TO SOURCE VOLTAGE (VOLTS)
TJ, JUNCTION TEMPERATURE (°C)
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0
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Figure 6. Drain to Source Leakage Current vs. Voltage
08-Sep-09
2N4003K
VGS, GATE−TO−SOURCE VOLTAGE (V)
50
C, CAPACITANCE (pF)
TJ = 25°C
VGS = 0 V
40
30
Ciss
20
Coss
10
0
Crss
0
4
12
8
TJ = 25°C
ID = 0.1 A
4
3
2
1
0
0.4
0
20
16
5
DRAIN TO SOURCE VOLTAGE (V)
1.2
0.8
QG, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation
Figure 8. Gate to Source & Drain to Source
Voltage vs. Total Charge
IS, SOURCE CURRENT (A)
1
VGS = 0 V
0.1
0.01
0.001
0 .4
TJ = 150°C
TJ = 25°C
0.6
0.8
VSD, SOURCE−TO−DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
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2N4003K
SOT-23 Outline Dimension
Unit:mm
SOT-23
Dim
A
B
C
D
E
G
H
J
K
L
M
A
B
TOP VIEW
C
D
E
G
H
K
J
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L
M
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Min
0.35
1.19
2.10
0.85
0.46
1.70
2.70
0.01
0.89
0.30
0.076
Max
0.51
1.40
3.00
1.05
1.00
2.10
3.10
0.13
1.10
0.61
0.25
08-Sep-09