AMMP-6130 30 GHz Power Amplifier with Frequency Multiplier (x2) in SMT Package Data Sheet Description Features Avago Technologies AMMP-6130 is a high gain, narrowband doubler and output power amplifier designed for DBS applications and other commercial communication systems. The MMIC takes an input 15 GHz signal and passes it through a harmonic frequency multiplier (x2) and then three stages of power amplification. Integrated matching structures filter and match input/output to 50 Ω. It has integrated input and output DC blocking capacitors and bias structures to all stages. The MMIC is fabricated using PHEMT technology. The backside of this package part is both RF and DC ground. This helps simply the assembly process and reduces assembly related performance variations and costs. The surface mount package allows elimination of “chip & wire” assembly for lower cost. This MMIC is a cost effective alternative to hybrid (discrete-FET) amplifiers that require complex tuning and assembly process. • • • • • Surface Mount Package, 5.0 x 5.0 x 1.25 mm 5x5 mm Surface Mount Package Integrated DC Block and Choke 50 Ω Input and Output Match Single Positive Supply Pin No Negative Gate Bias Specifications (Vd=4.5V, Idd=200mA) • • • • • Frequency Range 15GHz in, 30GHz out Output Power: 21 dBm Harmonic Suppression: 60dBc Single Positive Supply DC Requirements: 4.5V, 200mA Applications • Microwave Radio systems • Satellite VSAT, DBS Up/Down Link • Broadband Wireless Access) Pin Connections (Top View) 1 8 2 3 X2 4 7 6 Pin 1 2 3 4 5 6 7 8 Function Vd RF Out RF In 5 PACKAGE BASE GND Note: These devices are ESD sensitive. The following precautions are strongly recommended. Ensure that an ESD approved carrier is used when units are transported from one destination to another. Personal grounding is to be worn at all times when handling these devices. The manufacturer assumes no responsibilities for ESD damage due to improper storage and handling of these devices. Absolute Maximum Ratings (1) DC Specifications/ Physical Properties (2) Sym Parameters/Condition Unit Max Vdd Drain to Ground Voltage V Idd Drain Current Pin 5 Parameter and Sym Test Condition Unit mA 300 Idd mA RF CW Input Power Max dBm 15 Tch Max channel temperature C +150 Drain Supply Current under any RF power drive and temp. (Vd=4.5 V) Tstg Storage temperature C -65 +150 Vd Drain Supply Voltage V C 260 for 20s θjc Thermal Resistance(3) C/W Tmax Maximum Assembly Temp Notes. 1. Operation in excess of any of these conditions may result in permanent damage to this device. The absolute maximum ratings for Vdd, Idd and Pin were determined at an ambient temperature of 25°C unless noted otherwise. Min Typ 3.5 Max 200 250 4.5 5 45 2. Ambient operational temperature TA=25°C unless noted 3. Channel-to-backside Thermal Resistance (Tchannel = 34°C) as measured using infrared microscopy. Thermal Resistance at backside temp. (Tb) = 25°C calculated from measured data. AMMP-6130 RF Specifications (4,5) TA= 25°C, Vdd = 4.5 V, Idd = 200mA, Zo=50 Ω, Pin=5dBm Symbol Parameters and Test Conditions Freq Operational Frequency Gain (4,5) Conversion Gain (5) Pout Output Power FS Fundamental Suppression 3H Sup 3rd Harmonic Suppression Frequency Units Minimum Maximum GHz 30 30 dB 14 18.5 16 30 dBm 19 23.5 21 30 dBc 60 dBc 50 Notes. 4. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C. 5. All tested parameters guaranteed with measurement accuracy +/-1dB/dBm/dBc. Typical Distribution of Conversion Gain and Output Power based on 1000 parts StDev = 0.46 Conversion Gain at 30GHz 2 Typical StDev = 0.39 Output Power at 30GHz AMMP-6130 Typical Performance (TA = 25°C, Vdd=4.5V, Idd=200 mA, Zin = Zout = 50Ω, Pin=3dBm unless otherwise stated) 20 65 18 16 60 22 50 45 8 40 C.G. 2H-1H 6 4 29 25 14.5 15 15.5 Input Frequency [GHz] 22 20 2H [dBm] 20 18 4V 3.5V 5V 4.5V 30.5 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 10 2H 1H 3H 0 12 30 31 15 5 29.5 30.5 Figure 2. Output Power vs. Output Frequency vs. Input Power 25 29 30 Output Frequency [GHz] 24 14 29.5 16 Figure 1. Conversion Gain & Fundamental Sup vs. Input Freq 16 3dBm 5dBm 4dBm 14 30 14 2H [dBm] 18 16 35 2 20 29 31 29.5 30 30.5 Frequency [GHz] 1H [dBm], 3H [dBm] 12 10 2H [dBm] 2H-1H [dBm] 55 14 C.G.[dB] 24 31 Frequency [GHz] 24 0 20 -5 16 -10 12 8 14GHz 16GHz 15GHz 4 -6 -4 -2 0 2 4 6 -15 -20 -25 13 Pin [dBm] Figure 5. Output Power vs. Input Power vs. Input Freq 22 20 18 16 -40C 25C 85C 14 12 29 29.5 30 30.5 18 23 Frequency [GHz] 28 Figure 6. Input and Output Return Loss vs. Freq 24 2H [dBm] S11[dB] S22[dB] -30 0 31 Frequency [GHz] Figure 7. Output Power vs. Output Freq @ Temp = 25C, -40C & 85C 3 Figure 4. Fundamental, 2H & 3H Output Power vs. Output Freq Return Loss [dB] 2H [dBm] Figure 3. Output Power vs. Output Frequency @ 4 bias levels 33 Typical Scattering Parameters [1] (TA = 25°C, Vdd =4.5 V, IDD = 200 mA, Zin = Zout = 50 Ω) Freq S11 S21 S12 S22 GHz dB Mag Phase dB Mag Phase dB Mag Phase dB Mag Phase 1 0.779 73.909 -80.000 0.000 32.383 -76.478 0.000 96.570 -0.425 0.952 -101.410 -2.166 2 -2.531 0.747 -33.368 -55.139 0.002 131.860 -64.437 0.001 14.797 -1.765 0.816 159.979 3 -3.497 0.669 -148.095 -47.131 0.004 4.147 -60.915 0.001 -81.506 -3.270 0.686 61.101 4 -4.889 0.570 81.765 -35.890 0.016 -149.666 -61.938 0.001 -167.459 -6.891 0.452 -23.500 5 -4.747 0.579 -58.704 -39.659 0.010 14.517 -76.478 0.000 -43.361 -5.259 0.546 -102.375 6 -4.158 0.620 177.213 -42.499 0.008 -90.973 -60.000 0.001 179.115 -5.923 0.506 170.014 7 -3.851 0.642 65.073 -40.491 0.009 125.799 -52.217 0.002 90.638 -6.641 0.466 79.202 8 -3.490 0.669 -47.052 -38.202 0.012 6.552 -50.903 0.003 -0.484 -7.851 0.405 -19.043 9 -2.858 0.720 -152.082 -36.449 0.015 127.728 -51.213 0.003 -66.346 -8.101 0.394 -114.956 10 -2.405 0.758 115.491 -39.453 0.011 -65.533 -50.752 0.003 -143.716 -7.230 0.435 158.758 11 -2.455 0.754 30.433 -36.924 0.014 -163.279 -51.057 0.003 143.963 -6.848 0.455 78.557 12 -3.151 0.696 -60.545 -31.920 0.025 107.046 -51.701 0.003 70.767 -7.764 0.409 -2.902 13 -4.322 0.608 -169.451 -25.739 0.052 3.617 -53.351 0.002 -5.502 -9.863 0.321 -100.642 14 -4.834 0.573 73.490 -21.180 0.087 -117.593 -56.773 0.001 -76.081 -9.730 0.326 143.433 15 -8.532 0.471 -34.070 -18.548 0.118 110.391 -58.416 0.001 -115.604 -7.355 0.429 47.561 16 -17.084 0.140 178.992 -17.566 0.132 6.543 -55.139 0.002 176.951 -6.539 0.471 -30.885 17 -4.491 0.596 -53.423 -17.635 0.131 -135.344 -54.895 0.002 114.486 -7.803 0.407 -107.509 18 -3.044 0.704 -155.503 -23.293 0.068 136.100 -55.918 0.002 53.047 -10.664 0.293 152.353 19 -3.366 0.679 102.797 -18.655 0.117 95.071 -55.650 0.002 10.720 -9.247 0.345 7.160 20 -3.044 0.704 -9.051 -9.450 0.337 -14.777 -50.604 0.003 -48.544 -6.265 0.486 -113.148 21 -2.867 0.719 -108.593 -5.991 0.502 -145.395 -48.068 0.004 -132.798 -11.811 0.257 132.293 22 -3.422 0.674 162.205 -4.028 0.629 82.328 -48.291 0.004 150.079 -13.966 0.200 -67.065 23 -4.695 0.582 63.767 -3.379 0.678 -39.850 -47.033 0.004 77.624 -10.858 0.287 -171.437 24 -4.668 0.584 -51.945 -2.061 0.789 -163.461 -49.119 0.004 -14.763 -13.856 0.203 116.377 25 -3.628 0.659 -154.450 -0.831 0.909 69.328 0.002 -91.783 -26.366 0.048 37.539 -54.425 26 -3.951 0.635 115.995 1.569 1.198 -59.027 -63.098 0.001 -133.605 -20.510 0.094 -161.333 27 -6.246 0.487 5.230 5.448 1.872 160.771 -54.425 0.002 -121.717 -14.933 0.179 150.560 28 -4.878 0.570 -139.262 8.677 2.716 0.554 -52.956 0.002 154.890 -13.580 0.209 94.577 29 -2.704 0.732 123.438 8.718 2.728 -161.843 -51.535 0.003 104.130 -19.160 0.110 112.029 30 -2.261 0.771 55.231 7.537 2.381 45.858 0.006 33.927 -10.134 0.324 60.389 31 -2.438 0.755 -17.264 4.931 1.764 -99.661 -40.677 0.009 -92.384 -16.812 0.144 -33.753 32 -4.679 0.584 -129.407 2.021 1.262 124.211 -45.352 0.005 171.824 -12.958 0.225 93.604 33 -3.935 0.636 87.568 -2.173 0.779 -7.487 -47.639 0.004 82.835 -7.855 0.405 28.172 34 -2.625 0.739 -0.364 -3.950 0.635 -121.959 -54.425 0.002 29.124 -6.979 0.448 -23.046 35 -2.781 0.726 -54.324 -5.113 0.555 74.844 -51.213 0.003 24.686 -7.925 0.402 -70.880 36 -1.933 0.800 -110.128 -14.647 0.185 -47.149 -50.314 0.003 -44.356 -12.031 0.250 -120.006 37 -2.389 0.760 -179.000 -20.114 0.099 -142.199 -47.432 0.004 -103.624 -24.967 0.056 -83.063 38 -3.601 0.661 76.661 -23.728 0.065 119.631 0.005 170.138 0.266 -78.816 39 -3.147 0.696 -52.739 -29.776 0.032 19.317 -48.995 0.004 109.913 -8.394 0.380 -129.674 40 -2.535 0.747 -142.354 -37.109 0.014 -63.508 -48.636 0.004 59.709 -8.793 0.363 175.556 Note: Data obtained off of a connectorized module 4 -44.883 -45.514 -11.511 Biasing and Operation The AMMP-6130 frequency doubler has been designed with a fully integrated self bias network; thus, requiring only a single 4.5v bias input with a typical current draw of 200mA. The one-stage frequency doubler relies on the nonlinear behavior of the FET to produce the doubled signal at the output. A high-pass filter at the input shorts any reflected 2nd harmonic signal to ground. The input also consists of matching components tuned to 15GHz. An additional LC-filter is included at the input for stability. The doubler is operated at pinchoff to create a half-wave conduction angle ideal for generation of the 2nd harmonic. The AMMP-6130 is also designed for stability over temperature. Figure 8. Evaluation / Test Board (Available to qualified customer requests) C C3 Port Vd1 MLIN TL10 Port Vd2 MLIN TL11 MLIN TL12 MLOC TL8 C C2 Port Input_15G MLIN TL3 MLIN TL4 MLIN HP_FET TL7 HPFET1 C MLIN C4 TL20 MLIN TL21 MLIN TL15 MLIN TL18 MLIN TL2 MLOC TL9 C C9 C C10 R R1 Figure 9. Simplified Doubler-Amplifier Schematic 5 MLIN MLINTL14 TL17 C HP_FET C5 HPFET2 R R2 C C C11 C12 R R5 R R3 C HP_FET C6 HPFET3 MLIN TL13 MLIN TL22 MLIN TL16 MLIN TL19 C C C C R C15C13 C14 C16R6 R R4 C HP_FET C7 HPFET4 Port Output_30G The AMMP Packaged Devices are compatible with high volume surface mount PCB assembly processes. Recommended SMT Attachment for 5x5 Package The PCB material and mounting pattern, as defined in the data sheet, optimizes RF performance and is strongly recommended. An electronic drawing of the land pattern is available upon request from Avago Sales & Application Engineering. Manual Assembly NOTES: DIMENSIONS ARE IN INCHES [MILIMETERS] ALL GROUNDS MUST BE SOLDERED TO PCB RF Material is Rogers RO4350, 0.010" thick Figure 10. PCB Land Pattern and Stencil Layouts 300 Peak = 250 ± 5˚C 250 Temp (C) Melting point = 218˚C 200 150 100 50 0 Ramp 1 0 Preheat Ramp 2 50 100 Reflow 150 200 Cooling 250 Seconds Figure 11. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste 300 • Follow ESD precautions while handling packages. • Handling should be along the edges with tweezers. • Recommended attachment is conductive solder paste. Please see recommended solder reflow profile. Neither Conductive epoxy or hand soldering is recommended. • Apply solder paste using a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical and electrical performance. • Follow solder paste and vendor’s recommendations when developing a solder reflow profile. A standard profile will have a steady ramp up from room temperature to the pre-heat temp. to avoid damage due to thermal shock. • Packages have been qualified to withstand a peak temperature of 260°C for 20 seconds. Verify that the profile will not expose device beyond these limits. A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads. The recommended stencil layout is shown in Figure 8. The stencil has a solder paste deposition opening approximately 70% to 90% of the PCB pad. Reducing stencil opening can potentially generate more voids underneath. On the other hand, stencil openings larger than 100% will lead to excessive solder paste smear or bridging across the I/O pads. Considering the fact that solder paste thickness will directly affect the quality of the solder joint, a good choice is to use a laser cut stencil composed of 0.127mm (5 mils) thick stainless steel which is capable of producing the required fine stencil outline. The most commonly used solder reflow method is accomplished in a belt furnace using convection heat transfer. The suggested reflow profile for automated reflow processes is shown in Figure 9. This profile is designed to ensure reliable finished joints. However, the profile indicated in Figure 1 will vary among different solder pastes from different manufacturers and is shown here for reference only. Package, Tape & Reel, and Ordering Information .011 Dimensional Tolerances: 0.002" [0.05mm] Back View Carrier Tape and Pocket Dimensions AMMP-6130 Part Number Ordering Information Part Number Devices Per Container Container AMMP-6130-BLKG 10 Antistatic bag AMMP-6130-TR1G 100 7" Reel AMMP-6130-TR2G 500 7" Reel Note: No RF performance degradation is seen due to ESD upto 250 V HBM and 80 V MM. The DC characteristics in general show increased leakage at lower ESD discharge voltages. The user is reminded that this device is ESD sensitive and needs to be handled with all necessary ESD protocols. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. AV01-0287EN - August 2, 2006