DIM375WKS06-S000 DIM375WKS06-S000 IGBT Chopper Module (Upper Arm Control) DS5732-1.0 February 2004 FEATURES KEY PARAMETERS ■ Low Forward Voltage Drop VCES 600V ■ Isolated Copper Baseplate VCE(sat)* (typ) 2.1V IC (max) 375A IC(PK) (max) 750A APPLICATIONS ■ Choppers ■ Motor Controllers *(measured at the power busbars and not the auxiliary terminals) The Powerline range of modules includes half bridge, chopper, bi-directional, dual and single switch configurations covering voltages from 600V to 3300V and currents up to 3600A. The DIM375WKS06-S000 is a 600V n channel enhancement mode, insulated gate bipolar transistor (IGBT) chopper module configured with the upper arm of the bridge controlled. The module is suitable for a variety of medium voltage applications in motor drives and power conversion. 1(K,E) 2(A) 3(C1) 4(G1) 5(E1) The IGBT has a wide reverse bias safe operating area (RBSOA) for ultimate reliability in demanding applications. These modules incorporate electrically isolated base plates and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety. Fig. 1 Chopper circuit diagram Typical applications include dc motor drives, ac pwm drivesand ups systems.. ORDERING INFORMATION Order as: DIM375WKS06-S000 Note: When ordering, use complete part number. Outline type code: W (See package details for further information) Fig. 2 Electrical connections - (not to scale) Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 1/8 DIM375WKS06-S000 ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Tcase = 25˚C unless stated otherwise Symbol Test Conditions Parameter VCES Collector-emitter voltage VGES Gate-emitter voltage VGE = 0V - Max. Units 600 V ±20 V Continuous collector current Tcase = 65˚C 375 A IC(PK) Peak collector current 1ms, Tcase = 95˚C 750 A Pmax Max. transistor power dissipation Tcase = 25˚C, Tj = 150˚C 1736 W Diode I2t value VR = 0, tp = 10ms, Tvj = 125˚C TBD kA2s Isolation voltage - per module Commoned terminals to base plate. AC RMS, 1 min, 50Hz 2.5 kV IC I2t Visol THERMAL AND MECHANICAL RATINGS Internal insulation: Al2O3 Baseplate material: Cu Creepage distance: 24mm Test Conditions Parameter Symbol Rth(j-c) Clearance: 13mm CTI (Critical Tracking Index): 175 Thermal resistance - transistor arm Continuous dissipation - Min. Typ. Max. Units - - 72 ˚C/kW - - 135 ˚C/kW - - 15 ˚C/kW junction to case Rth(j-c) Rth(c-h) Tj Tstg - Thermal resistance - diode (per arm) Continuous dissipation - (Antiparallel and freewheel diode) junction to case Thermal resistance - case to heatsin Mounting torque 5Nm (per module) (with mounting grease) Junction temperature Transistor - - 150 ˚C Diode - - 125 ˚C –40 - 125 ˚C 3 - 5 Nm 2.5 - 5 Nm - Storage temperature range Screw torque Mounting - M6 Electrical connections - M6 2/8 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com DIM375WKS06-S000 ELECTRICAL CHARACTERISTICS Tcase = 25˚C unless stated otherwise. Symbol Parameter Test Conditions Min. Typ. Max. Units Collector cut-off current VGE = 0V, VCE = VCES - - 2 mA (IGBT and Diode arm) VGE = 0V, VCE = VCES, Tcase = 125˚C - - 10 mA Gate leakage current VGE = ±20V, VCE = 0V - - 2 µA VGE(TH) Gate threshold voltage IC = 15mA, VGE = VCE 4.5 5.5 7.5 V VCE(sat)† Collector-emitter saturation voltage VGE = 15V, IC = 350A - 2.1 2.6 V VGE = 15V, IC = 350A, , Tcase = 125˚C - 2.3 2.8 V ICES IGES IF Diode forward current DC - - 375 A IFM Diode maximum forward current tp = 1ms - - 750 A VF† Diode forward voltage IF = 350A - 1.5 1.8 V (IGBT and Diode arm) IF = 350A, Tcase = 125˚C - 1.5 1.8 V Cies Input capacitance VCE = 25V, VGE = 0V, f = 1MHz - 40 - nF LM Module inductance - - 20 - nH Internal transistor resistance - per arm - - 0.23 RINT mΩ Note: † Measured at the power busbars and not the auxiliary terminals. L* is the circuit inductance + LM Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 3/8 DIM375WKS06-S000 ELECTRICAL CHARACTERISTICS Tcase = 25˚C unless stated otherwise Min. Typ. Max. Units IC = 375A - 600 - ns Fall time VGE = ±15V - 250 - ns EOFF Turn-off energy loss VCE = 300V - 26 - mJ td(on) Turn-on delay time RG(ON) = RG(OFF) = 4.7Ω - 200 - ns L ~ 100nH - 150 - ns Parameter Symbol td(off) tf tr Turn-off delay time Rise time Test Conditions EON Turn-on energy loss - 16 - mJ Qg Gate charge - 3 - µC Qrr Diode reverse recovery charge IF = 375A, VR = 300V, - 20 - µC Irr Diode reverse current dIF/dt = 3000A/µs - 200 - A - 5 - mJ Min. Typ. Max. Units IC = 375A - 650 - ns Fall time VGE = ±15V - 500 - ns EOFF Turn-off energy loss VCE = 300V - 40 - mJ td(on) Turn-on delay time RG(ON) = RG(OFF) = 4.7Ω - 200 - ns L ~ 100nH - 100 - ns - 15 - mJ IF = 375A, VR = 300V, - 30 - µC dIF/dt = 3000A/µs - 230 - A - 8 - mJ EREC Diode reverse recovery energy Tcase = 125˚C unless stated otherwise Parameter Symbol td(off) tf tr Turn-off delay time Rise time EON Turn-on energy loss Qrr Diode reverse recovery charge Irr Diode reverse current EREC 4/8 Diode reverse recovery energy Test Conditions Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com DIM375WKS06-S000 TYPICAL CHARACTERISTICS 700 600 700 Common emitter Tcase = 125˚C Vce is measured at power 600 busbars and not the auxiliary terminals Common emitter Tcase = 25˚C Vce is measured at power busbars and not the auxiliary terminals 500 Collector current, Ic - (A) Collector current, Ic - (A) 500 400 300 200 400 300 200 VGE = 10V VGE = 12V VGE = 15V VGE = 20V 100 0 0 1 2.0 3 4 Collector-emitter voltage, Vce - (V) VGE = 10V VGE = 12V VGE = 15V VGE = 20V 100 0 0 5 1.0 2.0 3.0 4.0 5.0 6.0 14 16 Collector-emitter voltage, Vce - (V) Fig.3 Typical output characteristics Fig.4 Typical output characteristics 45 60 Conditions: Tcase = 125ºC 40 Vcc = 300V Rg = 4.7 ohms Eoff Eon Erec 50 Switching Energy, Esw - (mJ) Switching energy, Esw - (mJ) 35 30 25 20 15 40 30 20 10 10 Eon Eoff Erec 5 0 0 50 100 150 200 250 300 Collector current, IC - (A) 350 400 Fig.4 Typical switching energy vs collector current 0 2 4 10 12 6 8 Gate resistance, Rg - (Ohms) Fig.5 Typical switching energy vs gate resistance Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 5/8 DIM375WKS06-S000 700 VF is measured at power busbars and not the auxiliary terminals 600 900 800 Tj = 25˚C Tj = 125˚C 700 Collector current, IC - (A) Foward current, IF - (A) 500 400 300 200 600 Chip 500 400 Module 300 200 100 100 Tj = 125˚C Vge = ±15V Rg = 4.7 0 0 0 0 0.5 2.0 1.0 1.5 Foward voltage, VF - (V) 2.5 600 200 400 Collector-emitter voltage, Vce - (V) 3.0 Fig.7 Reverse bias safe operating area Fig.6 Diode typical forward characteristics 1000 300 Tj = 125˚C Transient thermal impedance, Zth (j-c) - (°C/kW ) Transistor Diode Reverse recovery current, Irr - (A) 250 200 150 100 50 100 10 IGBT Diode 0 0 100 200 300 400 500 Reverse voltage, VR - (V) 600 Fig.7 Diode reverse bias safe operating area 6/8 800 700 1 0.001 Ri (˚C/KW) τi (ms) Ri (˚C/KW) τi (ms) 0.01 1 2 3 1.6941 6.7097 9.0831 0.1069 4.363 21.9182 3.0955 17.2139 16.1073 0.0895 2.6571 17.3886 0.1 Pulse width, tp - (s) 1 4 54.477 92.4022 98.6071 71.8108 10 Fig.8 Transient thermal impedance Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com DIM375WKS06-S000 PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 1(K,E) 2(A) 3(C1) 4(G1) 5(E1) Nominal weight: 420g Module outline type code: W Fig. 15 Package details Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.dynexsemi.com 7/8 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs). HEATSINKS The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or Customer Services. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: +44-(0)1522-500500 Fax: +44-(0)1522-500550 CUSTOMER SERVICE Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 SALES OFFICES Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19. France: Tel: +33 (0)2 47 55 75 53. Fax: +33 (0)2 47 55 75 59. Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020 North America: Tel: (440) 259-2060. Fax: (440) 259-2059. Tel: (949) 733-3005. Fax: (949) 733-2986. These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2003 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. www.dynexsemi.com