1.6x0.8mm SMD CHIP LED LAMP KP-1608SYC SUPER BRIGHT YELLOW Features Description !1.6mmx0.8mm !LOW !WIDE SMT LED, 1.1mm THICKNESS. The Super Bright Yellow source color devices POWER CONSUMPTION. are made with DH InGaAlP on GaAs substrate VIEWING ANGLE. Light Emitting Diode. ! IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: KDA0024 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/04/2001 DRAWN: S. H. CHEN PAGE: 1 OF4 Selection Guide Par t No . Di c e KP-1608SYC Iv (mc d ) @ 20 mA L en s Ty p e SUPER BRIGHT YELLOW ( InGaAlP ) WATER CLEAR View in g An g l e Min . Ty p . 2θ1/2 40 80 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par ameter Dev ic e λpeak Peak Wavelength Super Bright Yellow λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un i t s Tes t Co n d itio n s 590 nm IF=20mA Super Bright Yellow 588 nm IF=20mA Spectral Line Halfwidth Super Bright Yellow 28 nm IF=20mA C Capacitance Super Bright Yellow 25 pF VF=0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF=20mA IR Reverse Current Super Bright Yellow 10 uA VR = 5V Absolute Maximum Ratings at T)=25°°C Par ameter Su p er B r ig h t Yello w Un i t s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 175 mA Reverse Voltage 5 V Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: KDA0024 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/04/2001 DRAWN: S. H. CHEN PAGE: 2 OF4 Super Bright Yellow KP-1608SYC SPEC NO: KDA0024 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/04/2001 DRAWN: S. H. CHEN PAGE: 3 OF4 KP-1608SYC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: KDA0024 APPROVED: J.LU REV NO: V.1 CHECKED: DATE: SEP/04/2001 DRAWN: S. H. CHEN PAGE: 4 OF4