3.8x2.0mm DOME LENS SMD CHIP LED LAMP APED3820SGC SUPER BRIGHT GREEN Features Description lLOW with Gallium Phosphide Green Light Emitting Diode. l3.8mmx2.0mm SMT LED,3.2mm THICKNESS. POWER CONSUMPTION. lIDEAL FOR BACKLIGHT AND INDICATOR. l VARIOUS l PACKAGE The Super Bright Green source color devices are made COLORS AND LENS TYPES AVAILABLE. : 500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0342 APPROVED : J. Lu REV NO: V.5 CHECKED :Allen Liu DATE:APR/03/2003 DRAWN: X.T.HU PAGE: 1 OF 4 Selection Guide Dic e P ar t N o . APED 3820SGC Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT GREEN (GaP) WATER C LEAR Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Mi n . Ty p . 10 40 V i ew i n g An g le 2θ1/2 60° (H) 35° (V) Electrical / Optical Characteristics at TA=25°°C Sy m b o l P ar am et er λp e a k Peak Wavelength Super Bri ght Green λD D omi nate Wavelength ∆λ1/2 D ev i c e Ty p . Un its Tes t C o n d i t i o n s 565 nm I F =20mA Super Bri ght Green 568 nm I F =20mA Spectral Li ne Half-wi dth Super Bri ght Green 30 nm I F =20mA pF VF=0V;f=1MHz 2.5 V I F =20mA 10 uA V R = 5V C C apaci tance Super Bri ght Green 15 VF Forward Voltage Super Bri ght Green 2.2 IR Reverse C urrent Super Bri ght Green Max . Absolute Maximum Ratings at TA=25°°C P ar am et er Su p er B r i g h t Gr een Un its Power di ssi pati on 105 mW Peak Forward C urrent [1] 140 mA D C Forward C urrent 25 Reverse Voltage 5 -40°C To +85°C Operati ng / Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB0342 APPROVED : J. Lu REV NO: V.5 CHECKED :Allen Liu DATE:APR/03/2003 DRAWN: X.T.HU mA V PAGE: 2 OF 4 Super Bright Green SPEC NO: DSAB0342 APPROVED : J. Lu APED3820SGC REV NO: V.5 CHECKED :Allen Liu DATE:APR/03/2003 DRAWN: X.T.HU PAGE: 3 OF 4 APED3820SGC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0342 APPROVED : J. Lu REV NO: V.5 CHECKED :Allen Liu DATE:APR/03/2003 DRAWN: X.T.HU PAGE: 4 OF 4