SECOS SSG5509A

SSG5509A
N & P-Ch Enhancement Mode Power MOSFET
N-Ch: 6.1 A, 30 V, RDS(ON) 30 mΩ
Ω
P-Ch: -4.8 A, -30 V, RDS(ON) 55 mΩ
Ω
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
SOP-8
DESCRIPTION
The SSG5509A uses advanced trench technology to
provide excellent on-resistance extremely efficient and
cost-effectiveness device. The SOP-8 package is universally
preferred for all commercial-industrial surface mount
applications and suited for low voltage applications such as
DC/DC converters.
B
L
M
A
FEATURES
C
N
Lower Gate Charge
RoHS Compliant
J
H
MARKING CODE
REF.
5509ASS
= Date
D
A
B
C
D
E
F
G
Code
PACKAGE INFORMATION
Package
MPQ
Leader Size
SOP-8
3K
13 inch
K
G
Millimeter
Min.
Max.
5.80
6.20
4.80
5.00
3.80
4.00
0°
8°
0.40
0.90
0.19
0.25
1.27 TYP.
F
REF.
H
J
K
L
M
N
E
Millimeter
Min.
Max.
0.35
0.49
0.375 REF.
45°
1.35
1.75
0.10
0.25
0.25 REF.
MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Symbol
Ratings
N-Ch
P-Ch
Unit
Drain-Source Voltage
VDS
30
-30
V
Gate-Source Voltage
VGS
±12
±12
V
6.1
-4.8
A
4.9
-3.8
A
30
-30
A
Continuous Drain Current
Pulsed Drain Current
3
TA=25℃
℃
ID
TA=70℃
℃
1
IDM
Total Power Dissipation
Operating Junction and Storage Temperature Range
PD
2
W
TJ, TSTG
-55~150
°C
0.016
W / °C
62.5
°C / W
Linear Derating Factor
Thermal Resistance Ratings
Maximum Thermal Resistance Junction-ambient
http://www.SeCoSGmbH.com/
27-Jun-2011 Rev. A
3
RθJA
Any changes of specification will not be informed individually.
Page 1 of 7
SSG5509A
N & P-Ch Enhancement Mode Power MOSFET
N-Ch: 6.1 A, 30 V, RDS(ON) 30 mΩ
Ω
P-Ch: -4.8 A, -30 V, RDS(ON) 55 mΩ
Ω
Elektronische Bauelemente
N-CHANNEL ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Symbol
Min.
Typ.
Max.
Unit
Drain-Source Breakdown Voltage
BVDSS
30
-
-
V
VGS=0, ID=250µA
Gate Threshold Voltage
VGS(th)
0.5
-
1.2
V
VDS=VGS, ID=250µA
Forward Transconductance
gfs
-
15
-
S
VDS=5V, ID=5A
Gate-Source Leakage Current
IGSS
-
-
±100
nA
VGS= ±12V
-
-
1
µA
VDS=24V, VGS=0
-
-
25
µA
VDS=24V, VGS=0
-
-
30
-
-
35
Parameter
Drain-Source Leakage Current(TJ =25℃
℃)
Test Conditions
IDSS
Drain-Source Leakage Current(TJ =70℃
℃)
Static Drain-Source On-Resistance
RDS(ON)
VGS=10V, ID=5.8A
mΩ
55
2
Total Gate Charge
Qg
-
9.7
Gate-Source Charge
Qgs
-
1.6
-
Gate-Drain (“Miller”) Change
Qgd
-
3.1
-
Td(on)
-
3.3
-
Tr
-
4.8
-
Td(off)
-
26.3
-
Tf
-
4.1
-
Input Capacitance
Ciss
-
823
-
Output Capacitance
Coss
-
99
-
Reverse Transfer Capacitance
Crss
-
77
-
Turn-on Delay Time
2
Rise Time
Turn-off Delay Time
Fall Time
VGS=4.5V, ID=5A
VGS=2.5V, ID=4A
nC
ID=5.8A
VDS=15V
VGS=4.5V
nS
VDS=15V
VGS=10V
RG=3Ω
RL=2.7Ω
pF
VGS=0
VDS=15V
f=1.0 MHz
Source -Drain Diode
Forward On Voltage
2
VSD
-
-
1.0
V
IS=1A, VGS=0
Trr
-
16
-
nS
Reverse Recovery Charge
Qrr
-
8.9
-
nC
IS=5A, VGS=0,
dl/dt =100A/µs
Continuous Source Current (Body Diode)
IS
-
-
2.5
A
Reverse Recovery Time
2
VD=VG=0, VS=1.0V
Notes:
1. Pulse width limited by Max. junction temperature.
2. Pulse width≦300us, duty cycle≦2%.
3. Surface mounted on 1 in2 copper pad of FR4 board; 135 °C/W when mounted on Min. copper pad.
http://www.SeCoSGmbH.com/
27-Jun-2011 Rev. A
Any changes of specification will not be informed individually.
Page 2 of 7
SSG5509A
N & P-Ch Enhancement Mode Power MOSFET
N-Ch: 6.1 A, 30 V, RDS(ON) 30 mΩ
Ω
P-Ch: -4.8 A, -30 V, RDS(ON) 55 mΩ
Ω
Elektronische Bauelemente
P-CHANNEL ELECTRICAL CHARACTERISTICS (TJ=25°C unless otherwise specified)
Symbol
Min.
Typ.
Max.
Unit
Drain-Source Breakdown Voltage
BVDSS
-30
-
-
V
VGS=0, ID= -250µA
Gate Threshold Voltage
VGS(th)
-0.5
-
-1.2
V
VDS=VGS, ID= -250µA
Forward Transconductance
gfs
-
11
-
S
VDS= -5V, ID= -5A
Gate-Source Leakage Current
IGSS
-
-
±100
nA
VGS= ±12V
-
-
-1
µA
VDS= -24V, VGS=0
-
-
-25
µA
VDS= -24V, VGS=0
-
-
55
-
-
70
-
-
120
Parameter
Drain-Source Leakage Current(TJ =25℃
℃)
Test Conditions
IDSS
Drain-Source Leakage Current(TJ =70℃
℃)
Static Drain-Source On-Resistance
2
RDS(ON)
Total Gate Charge
Qg
-
9.4
-
Gate-Source Charge
Qgs
-
2
-
Gate-Drain (“Miller”) Change
Qgd
-
3
-
Td(on)
-
6.3
-
Tr
-
3.2
-
Td(off)
-
38.2
-
Tf
-
12
-
Input Capacitance
Ciss
-
954
-
Output Capacitance
Coss
-
115
-
Reverse Transfer Capacitance
Crss
-
77
-
Turn-on Delay Time
2
Rise Time
Turn-off Delay Time
Fall Time
VGS= -10V, ID= -4.2A
mΩ
VGS= -4.5V, ID= -4A
VGS= -2.5V, ID= -1A
nC
ID= -4 A
VDS= -15V
VGS= -4.5V
nS
VDS= -15V
VGS= -10V
RG=6Ω
RL=3.6Ω
pF
VGS=0
VDS= -15V
f=1.0 MHz
IS= -1A, VGS=0
Source -Drain Diode
Forward On Voltage
2
VSD
-
-
-1.0
V
Trr
-
20.2
-
nS
Reverse Recovery Charge
Qrr
-
11.2
-
nC
Continuous Source Current (Body Diode)
IS
-
-
-2.2
A
Reverse Recovery Time
2
IS= -4A, VGS=0,
dl/dt=100A/µs
VD=VG=0, VS= -1V
Notes:
1. Pulse width limited by Max. junction temperature.
2. Pulse width≦300us, duty cycle≦2%.
3. Surface mounted on 1 in2 copper pad of FR4 board; 135 °C/W when mounted on Min. copper pad.
http://www.SeCoSGmbH.com/
27-Jun-2011 Rev. A
Any changes of specification will not be informed individually.
Page 3 of 7
SSG5509A
Elektronische Bauelemente
N & P-Ch Enhancement Mode Power MOSFET
N-Ch: 6.1 A, 30 V, RDS(ON) 30 mΩ
Ω
P-Ch: -4.8 A, -30 V, RDS(ON) 55 mΩ
Ω
CHARACTERISTIC CURVE (N-Ch)
http://www.SeCoSGmbH.com/
27-Jun-2011 Rev. A
Any changes of specification will not be informed individually.
Page 4 of 7
SSG5509A
Elektronische Bauelemente
N & P-Ch Enhancement Mode Power MOSFET
N-Ch: 6.1 A, 30 V, RDS(ON) 30 mΩ
Ω
P-Ch: -4.8 A, -30 V, RDS(ON) 55 mΩ
Ω
CHARACTERISTIC CURVE (N-Ch)
http://www.SeCoSGmbH.com/
27-Jun-2011 Rev. A
Any changes of specification will not be informed individually.
Page 5 of 7
SSG5509A
Elektronische Bauelemente
N & P-Ch Enhancement Mode Power MOSFET
N-Ch: 6.1 A, 30 V, RDS(ON) 30 mΩ
Ω
P-Ch: -4.8 A, -30 V, RDS(ON) 55 mΩ
Ω
CHARACTERISTIC CURVE (P-Ch)
http://www.SeCoSGmbH.com/
27-Jun-2011 Rev. A
Any changes of specification will not be informed individually.
Page 6 of 7
SSG5509A
Elektronische Bauelemente
N & P-Ch Enhancement Mode Power MOSFET
N-Ch: 6.1 A, 30 V, RDS(ON) 30 mΩ
Ω
P-Ch: -4.8 A, -30 V, RDS(ON) 55 mΩ
Ω
CHARACTERISTIC CURVE (P-Ch)
http://www.SeCoSGmbH.com/
27-Jun-2011 Rev. A
Any changes of specification will not be informed individually.
Page 7 of 7