TYSEMI NTR4503NT3G

Product specification
NTR4503N
Power MOSFET
ID MAX
85 m @ 10 V
30 V
Features
•
•
•
•
RDS(on) TYP
V(BR)DSS
30 V, 2.5 A, Single N−Channel, SOT−23
2.5 A
105 m @ 4.5 V
Leading Planar Technology for Low Gate Charge / Fast Switching
4.5 V Rated for Low Voltage Gate Drive
SOT−23 Surface Mount for Small Footprint (3 x 3 mm)
Pb−Free Package is Available
N−Channel
D
Applications
• DC−DC Conversion
• Load/Power Switch for Portables
• Load/Power Switch for Computing
G
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
S
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
30
V
Gate−to−Source Voltage
VGS
±20
V
ID
2.0
A
Continuous Drain
Current (Note 1)
Steady
State
TA = 25°C
TA = 85°C
1.5
t ≤ 10 s
TA = 25°C
2.5
Power Dissipation
(Note 1)
Steady
State
TA = 25°C
Continuous Drain
Current (Note 2)
Steady
State
TA = 25°C
Power Dissipation
(Note 2)
ID
TA = 85°C
TA = 25°C
TR3
W
A
1.5
SOT−23
CASE 318
STYLE 21
1
Gate
1.1
W
tp = 10 s
IDM
6.0
A
C = 100 pF,
RS = 1500 ESD
125
V
TJ,
Tstg
−55 to
150
°C
Source Current (Body Diode)
IS
2.0
A
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
THERMAL RESISTANCE RATINGS
Parameter
3
Drain
2
0.73
0.42
Operating Junction and Storage Temperature
3
1
PD
Pulsed Drain Current
ESD Capability (Note 3)
PD
MARKING DIAGRAM/
PIN ASSIGNMENT
Symbol
Max
Unit
Junction−to−Ambient − Steady State (Note 1)
RJA
170
°C/W
Junction−to−Ambient − t < 10 s (Note 1)
RJA
100
Junction−to−Ambient − Steady State (Note 2)
RJA
300
M
Parameter
TR3
M
2
Source
= Specific Device Code
= Date Code
ORDERING INFORMATION
Device
Package
Shipping†
NTR4503NT1
SOT−23
3000/Tape & Reel
NTR4503NT1G
SOT−23
(Pb−Free)
3000/Tape & Reel
NTR4503NT3G
SOT−23
(Pb−Free)
10000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. Surface−mounted on FR4 board using 1 in sq pad size.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
3. ESD Rating Information: HBM Class 0.
http://www.twtysemi.com
[email protected]
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Product specification
NTR4503N
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Units
V(BR)DSS
VGS = 0 V, ID = 250 A
30
36
IDSS
VGS = 0 V, VDS = 24 V
1.0
VGS = 0 V, VDS = 24 V, TJ = 125°C
10
IGSS
VDS = 0 V, VGS = 20 V
100
nA
Gate Threshold Voltage
VGS(TH)
VGS = VDS, ID = 250 A
1.75
3.0
V
Drain−to−Source On−Resistance
RDS(on)
( )
VGS = 10 V, ID = 2.5 A
85
110
m
VGS = 4.5 V, ID = 2.0 A
105
140
VDS = 4.5 V, ID = 2.5 A
5.3
S
135
pF
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
V
A
TY CHARACTERISTICS (Note 4)
Forward Transconductance
gFS
1.0
CHARGES AND CAPACITANCES
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Input Capacitance
Ciss
VGS = 0 V, f = 1.0 MHz,
VDS = 15 V
52
15
VGS = 0 V, f = 1.0 MHz,
VDS = 24 V
130
250
42
75
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
13
25
Total Gate Charge
QG(TOT)
3.6
7.0
Threshold Gate Charge
QG(TH)
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
0.7
Total Gate Charge
QG(TOT)
1.9
Threshold Gate Charge
QG(TH)
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
VGS = 10 V, VDS = 15 V,
ID = 2.5 A
VGS = 4.5 V, VDS = 24 V,
ID = 2.5 A
pF
nC
0.3
0.6
nC
0.3
0.6
0.9
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
td(on)
5.8
12
5.8
10
14
25
tf
1.6
5.0
td(on)
4.8
tr
td(off)
tr
td(off)
VGS = 10 V, VDD = 15 V,
ID = 1 A, RG = 6 VGS = 10 V, VDD = 24 V,
ID = 2.5 A, RG = 2.5 tf
ns
ns
6.7
13.6
1.8
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
VSD
VGS = 0 V, IS = 2.0 A
0.85
1.2
V
Reverse Recovery Time
tRR
ns
QRR
VGS = 0 V, IS = 2.0 A,
dIS/dt = 100 A/s
9.2
Reverse Recovery Charge
4.0
nC
4. Pulse Test: Pulse Width 300 s, Duty Cycle 2%.
5. Switching characteristics are independent of operating junction temperatures.
http://www.twtysemi.com
[email protected]
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