REVISIONS LTR DESCRIPTION D Corrected dimension D2 for case outlines U, X, and 4. Corrected dimensions D/E and D1/E1 for case outline Y. -sld E Added case outline 9. Added device type 05. Added vendor cage 0EU86 for device types 01 through 03 in the Standard Microcircuit Drawing Source Approval Bulletin. Figure 1; Made corrections to case outline M. Added thermal resistance ratings for all case outlines to paragraph 1.3 . –sld DATE (YR-MO-DA) APPROVED 98-10-02 K.A. Cottongim 00-05-11 Raymond Monnin F Added case outline A. Updated drawing to current requirements of MIL-PRF-38534. -sld 03-02-21 Raymond Monnin G Added case outline B. Added note to paragraph 1.2.4. -sld 03-10-10 Raymond Monnin H Table I; For COE capacitance test, changed the maximum limit from 32 pF to 36 pF and for the CWE and CAD tests changed the maximum limit from 32 pF to 34 pF for the case outline N only. Updated drawing to the current requirements. -sld 06-02-03 Raymond Monnin REV H H SHEET 35 36 REV H H H H H H H H H H H H H H H H H H H H SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve L. Duncan STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 CHECKED BY Michael C. Jones APPROVED BY Kendall A. Cottongim http://www.dscc.dla.mil MICROCIRCUIT, HYBRID, MEMORY, FLASH ERASABLE/PROGRAMMABLE READ ONLY MEMORY, 512K x 32-BIT DRAWING APPROVAL DATE 96-07-31 REVISION LEVEL H SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-94612 36 5962-E251-06 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 ⏐ ⏐ ⏐ Federal stock class designator \ ⏐ ⏐ ⏐ RHA designator (see 1.2.1) 94612 01 ⏐ ⏐ ⏐ Device type (see 1.2.2) / H ⏐ ⏐ ⏐ Device class designator (see 1.2.3) A ⏐ ⏐ ⏐ Case outline (see 1.2.4) X ⏐ ⏐ ⏐ Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 03 04 05 F512K32-150 F512K32-120 F512K32-090 F512K32-070 F512K32-060 Circuit function EPROM FLASH, 512K x 32-bit EPROM FLASH, 512K x 32-bit EPROM FLASH, 512K x 32-bit EPROM FLASH, 512K x 32-bit EPROM FLASH, 512K x 32-bit Access time 150 ns 120 ns 90 ns 70 ns 60 ns 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter A B M 1/ N T U X Y Z 4 9 1/ Descriptive designator Terminals See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 68 68 68 68 68 66 66 68 68 66 68 Package style Co-fired ceramic, single cavity, quad flatpack Co-fired ceramic, single cavity, quad flatpack Co-fired ceramic, single/dual cavity, quad flatpack Co-fired ceramic, single cavity, quad flatpack, low capacitance Co-fired ceramic, single cavity, low profile,quad flatpack Co-fired ceramic, hex-in-line, single cavity, with standoffs Co-fired ceramic, hex-in-line, single cavity, without standoffs Co-fired ceramic, single cavity, quad flatpack, with tie bars Co-fired ceramic, single cavity, ultra low profile, quad flatpack Co-fired ceramic, 1.075", hex-in-line, single cavity, with standoffs Co-fired ceramic, single cavity, ultra low profile, quad flatpack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 2/ Supply voltage range (V ) 3/ ................................................... CC Signal voltage range (VG)(any pin except A9 ) 3/ ...................... Power dissipation (PD) ............................................................... -2.0 V dc to +7.0 V dc -2.0 V dc to +7.0 V dc 1.32 W Maximum at 5 MHz Thermal resistance, junction-to-case (θJC): Case outlines A, M and Z........................................................... Case outlines U and 4................................................................ Case outlines X and Y ............................................................... Case outline N ........................................................................... Case outline B and 9.................................................................. Storage temperature range ........................................................ Lead temperature (soldering, 10 seconds)................................. Data retention ............................................................................ Endurance (write/erase cycles) .................................................. A9 voltage for sector protect (VID) 4/ ......................................... 10.2°C/W 10.63°C/W 6.5°C/W 12.36°C/W 4.57°C/W -65°C to +150°C +300°C 10 years minimum 10,000 cycles minimum -2.0 V dc to +14.0 V dc 1.4 Recommended operating conditions. 1/ 2/ 3/ 4/ Supply voltage range (V ) ........................................................ CC Input low voltage range (VIL) ...................................................... Input high voltage range (VIH) .................................................... +4.5 V dc to +5.5 V dc -0.5 V dc to +0.8 V dc +2.0 V dc to VCC + 0.5 V dc Case operating temperature range (TC) ..................................... A9 voltage for sector protect ...................................................... -55°C to +125°C +11.5 V dc to +12.5 V dc Due to the short leads of case outlines M (single cavity) and case outline 9, caution should be taken if the system application is to be used where extreme thermal transitions can occur. Case outline A can be used if longer leads are necessary. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Minimum DC voltage on input or I/O pins is -0.5 V. During voltage transitions, input may overshoot VSS to -2.0 V for periods of up to 20 ns. Maximum DC voltage on output and I/O pins is VCC + 0.5 V. During voltage transitions, outputs may overshoot to VCC + 2.0 V for periods of up to 20 ns. Minimum DC input voltage on A9 pin is -0.5 V. During voltage transitions, A9 may overshoot VSS to -2.0 V for periods of up to 20 ns. Maximum DC input voltage on A9 is +13.5 V which may overshoot to +14.0 V for periods of up to 20 ns. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, and 6 . 3.2.5 Block diagram. The block diagram shall be as specified on figure 7. 3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 4 3.5 Programming procedure. The programming procedure shall be as specified by the manufacturer and shall be available upon request. 3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This reprogrammability test shall be done for the initial characterization and after any design process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be done for initial characterization and after any design process change which may affect data retention. The methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 5 TABLE I. Electrical performance characteristics. Test Group A subgroups Conditions 1/ 2/ Symbol -55°C ≤ TC ≤+125°C unless otherwise specified Limits Device types Min Unit Max DC parameters Input leakage current ILI VCC = 5.5 V dc, VIN = GND or VCC 1,2,3 All 10 µA Output leakage current ILO VCC = 5.5 V dc, VIN = GND or VCC 1,2,3 All 10 µA VCC active current for Read ICC1 CS = VIL, OE = VIH, 1,2,3 All 190 mA 1,2,3 All 240 mA 1,2,3 All 6.5 mA 0.8 V f = 5 MHz, V CC V active current for CC program/erase ICC2 CS = VIL, OE = VIH, f = 5 MHz, V CC VCC standby current ISB = 5.5 V dc = 5.5 V dc CS = VIH, f = 5 MHz, V CC = 5.5 V dc Input low level VIL 1,2,3 All Input high level VIH 1,2,3 All Output low voltage VOL VCC = 4.5 V, IOL = 8.0 mA 1,2,3 All Output high voltage VOH VCC = 4.5 V, IOL = -2.5 mA 1,2,3 All COE VIN = 0 V, f = 1.0 MHz, 4 All 50 pF 4 All 36 pF 2.0 V 0.45 V 0.85 x VCC V Dynamic characteristics OE capacitance 3/ TA = +25° C V = 0 V, f = 1.0 MHz, IN TA = +25° C, Case outline N only See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Group A subgroups Conditions 1/ 2/ Symbol -55°C ≤ TC ≤+125°C unless otherwise specified Limits Device types Min Unit Max Dynamic characterisitics - Continued WE 1-4 capacitance 3/ CWE VIN = 0 V, f = 1.0 MHz, 4 All 20 pF 4 All 50 pF 4 All 34 pF 4 All 20 pF 4 All 15 pF 4 All 20 pF 4 All 15 pF 4 All 50 pF 4 All 34 pF 7, 8A,8B All TA = +25° C, Case outlines A, B, M, Z, U and 9 VIN = 0 V, f = 1.0 MHz, TA = +25° C, Case outline T V = 0 V, f = 1.0 MHz, IN TA = +25° C, Case outline N CS 1-4 capacitance 3/ CCS VIN = 0 V, f = 1.0 MHz, TA = +25° C V = 0 V, f = 1.0 MHz, IN TA = +25° C, Case outline N only Data I/O capacitance 3/ CI/O VIN = 0 V, f = 1.0 MHz, TA = +25° C V = 0 V, f = 1.0 MHz, IN TA = +25° C, Case outline N only Address input capacitance 3/ CAD V = 0 V, f = 1.0 MHz, IN TA = +25° C V = 0 V, f = 1.0 MHz, IN TA = +25° C, Case outline N only Functional testing Functional tests See 4.3.1c See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Group A subgroups Conditions 1/ 2/ Symbol -55°C ≤ TC ≤+125°C unless otherwise specified Limits Device types Min Unit Max Read cycle AC timing characteristics Read cycle time tRC See figure 4 9,10,11 01 02 03 04 05 150 120 90 70 60 ns Address access time tACC See figure 4 9,10,11 01 02 03 04 05 150 120 90 70 60 ns Chip select access time tCE See figure 4 9,10,11 01 02 03 04 05 150 120 90 70 60 ns Output enable to output valid tOE See figure 4 9,10,11 01 02 03,04 05 55 50 35 30 ns Output hold from address, tOH See figure 4 9,10,11 All 0 ns CS or OE change, whichever is first Write/Erase/Program AC timing characteristics WE controlled Write cycle time tWC See figure 5 9,10,11 01 02 03 04 05 150 120 90 70 60 ns Chip select setup time tCS See figure 5 9,10,11 All 0 ns Write enable pulse width tWP See figure 5 9,10,11 01,02 03,04 05 50 45 40 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Group A subgroups Conditions 1/ 2/ Symbol -55°C ≤ TC ≤+125°C unless otherwise specified Limits Device types Min Unit Max Write/Erase/Program AC timing characteristics WE controlled - Continued. Address setup time tAS See figure 5 9,10,11 All 0 ns Data setup time tDS See figure 5 9,10,11 01,02 03,04 05 50 45 40 ns Data hold time tDH See figure 5 9,10,11 All 0 ns Address hold time tAH See figure 5 9,10,11 01,02 03,04 05 50 45 45 ns Write enable pulse high tWPH See figure 5 9,10,11 All 20 ns Chip erase time 9,10,11 All 120 s Sector erase time 9,10,11 All 30 s Programming time 9,10,11 All 50 s Write/Erase/Program AC timing characteristics CS controlled. Write cycle time tWC See figure 6 9,10,11 01 02 03 04 05 150 120 90 70 60 ns Write enable setup time tWS See figure 6 9,10,11 All 0 ns Chip select pulse width tCP See figure 6 9,10,11 01,02 03,04 05 50 45 40 ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 9 TABLE I. Electrical performance characteristics - Continued. Test Group A subgroups Conditions 1/ 2/ Symbol -55°C ≤ TC ≤+125°C unless otherwise specified Limits Device types Min Unit Max Write/Erase/Program AC characteristics controlled - Continued. Address setup time tAS See figure 6 9,10,11 All 0 ns Data hold time tDH See figure 6 9,10,11 All 0 ns Data setup time tDS See figure 6 9,10,11 01,02 03,04 05 50 45 40 ns Address hold time tAH See figure 6 9,10,11 01,02 03,04 05 50 45 45 ns Chip select pulse width high tCPH See figure 6 9,10,11 All 20 ns Chip erase time 9,10,11 All 120 s Sector erase time 9,10,11 All 30 s Programming time 9,10,11 All 50 s 1/ Unless otherwise specified, 4.5 V dc ≤ VCC ≤ 5.5 V dc and VSS = 0 V. 2/ Unless otherwise specified, the DC test conditions are as follows: Input pulse levels: V = V - 0.3 V and V = 0.3V. IH CC IL Unless otherwise specified, the AC test conditions are as follows: Input pulse levels: V = 0 V and V = 3.0 V. IL IH Input rise and fall times: 5 nanoseconds. Input and output timing reference levels: 1.5 V. Output load circuit as specified in figure 7. 3/ Parameters shall be tested as part of design characterization and after any design or process changes which may affect these parameters. Parameters shall be guaranteed to the limits specified in table I for all lots not specifically tested. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 10 Case outline A. FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 11 Case outline A - Continued. Symbol Millimeters Min Inches Max A Min Max 5.10 A1 1.37 b 0.33 B .200 .054 0.43 .013 0.25 TYP .017 .010 TYP c 0.23 0.30 .009 .012 D/E 24.9 25.4 .980 1.000 D1/E1 22.10 22.61 .870 .890 D2/E2 20.32 BSC .800 BSC e 1.27 BSC .050 BSC L 0.89 R 1.14 .035 0.25 TYP .045 .010 TYP NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Details of pin 1 identifier are optional, but must be located within the zone indicated. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 12 Case outline M. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 13 Case outline M - Continued. Symbol Millimeters Inches Min Max Min Max A 3.12 5.10 .123 .200 A1 2.30 4.72 .118 .186 A2 0.24 0.64 .005 .025 b 0.33 0.43 .013 .017 B c 0.25 REF 0.23 D/E .010 REF 0.30 .009 20.3 BSC .012 .800 BSC D1/E1 22.10 22.65 .870 .890 D2/E2 24.89 25.35 .980 1.000 D3/E3 23.75 24.28 .936 .956 e 1.27 BSC .050 BSC R 0.25 BSC .010 BSC L1 0.89 1.14 .035 .045 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. 3. Case outline M may be either a single or dual cavity package. Dimension A2 is measured between the lowest horizontal plane of the package and the seating plane of the lead(s). FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 14 Case outline N. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 15 Case outline N - Continued. Symbol Millimeters Inches Min Max Min Max A 2.92 5.10 .115 .200 A1 1.40 1.65 .055 .065 A2 1.14 1.40 .045 .055 b 0.30 0.46 .012 .018 c 0.23 0.31 .009 .012 D/E 63.63 66.42 2.505 2.615 D1/E1 39.24 40.01 1.545 1.575 D2/E2 73.28 84.20 2.885 3.315 e 1.14 1.40 .045 .055 e1 19.10 21.16 .750 .850 j 4.83 5.33 .190 .210 k 37.72 38.48 1.485 1.515 L 12.19 13.21 .480 .520 S1 9.45 9.86 .372 .388 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 16 Case outline T. FIGURE 1. Case outlines- Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 17 Case outline T - Continued. Symbol Millimeters Inches Min Max Min Max A 2.92 3.56 .115 .140 A1 1.40 1.65 .055 .065 A2 1.14 1.40 .045 .055 b 0.30 0.46 .012 .018 c 0.23 0.31 .009 .012 D/E 63.63 66.42 2.505 2.615 D1/E1 39.24 40.01 1.545 1.575 D2/E2 73.28 84.20 2.885 3.315 e 1.14 1.40 .045 .055 e1 19.10 21.16 .750 .850 j 4.83 5.33 .190 .210 k 37.72 38.48 1.485 1.515 L 12.19 13.21 .480 .520 S1 9.45 9.86 .372 .388 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 18 Case outlines U, X, and 4. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 19 Case outlines U and X - Continued. Symbol Millimeters Inches Min Max Min Max A 3.30 6.22 .130 .245 A1 0.13 0.89 .005 .035 θb 0.41 0.51 .016 .020 θb1 1.14 1.40 .045 .055 θb2 1.65 1.91 .065 .075 D/E 26.92 30.48 1.060 1.200 D1/E1 25.40 BSC 1.000 BSC D2 15.24 BSC .600 BSC D3 26.16 e 34.29 1.030 2.54 BSC 1.350 .100 BSC L 3.68 3.94 .145 .155 (case U) L 4.19 4.70 .165 .185 (case X) NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is identified by a .070 square pad. 3. Pin numbers are for reference only. 4. Case outline U has standoffs and case outline X does not have standoffs. 5. For case outline U, dimension A is measured from the top of the package to the bottom of the standoff. For case outline X, dimension A is measured from the top of the package to the bottom of the seating plane. 6. For case ouline U, dimension L is measured from the bottom of the standoff to the end of the lead. For case outline X, dimension L is measured from the bottom of the seating plane to the end of the lead. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 20 Case outline 4 - Continued. Symbol Millimeters Inches Min Max Min Max A 3.43 4.60 .135 .181 A1 0.64 0.89 .025 .035 θb 0.41 0.51 .016 .020 θb1 1.14 1.40 .045 .055 θb2 1.65 1.91 .065 .075 D/E 27.05 27.56 1.065 1.085 D1/E1 25.40 BSC 1.000 BSC D2 15.24 BSC .600 BSC D3 25.90 e L 26.92 1.020 2.54 BSC 3.35 1.060 .100 BSC 3.94 .132 .155 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is identified by a .070 square pad. 3. Pin numbers are for reference only. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 21 Case outline Y. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 22 Case outline Y - Continued. Symbol Millimeters Inches Min Max Min Max A 3.12 4.06 .123 .160 A1 0.13 0.64 .005 .025 B 0.25 REF .010 REF b 0.33 0.43 .013 .017 c 0.23 0.31 .009 .012 D/E 22.10 22.65 .870 .890 D1/E1 64.52 65.53 2.540 2.580 D2/E2 74.78 77.72 2.940 3.060 e 1.27 BSC .050 BSC e1 20.12 20.52 .792 .808 j 4.83 5.33 .190 .210 k 37.72 38.48 1.485 1.515 L 21.34 REF .840 REF R 0.25 TYP .010 TYP NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 23 Case outline Z. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 24 Case outline Z - Continued. Symbol Millimeters Inches Min Max Min Max A --- 3.56 --- .140 A2 0.36 0.71 .014 .028 b 0.33 0.43 .013 .017 c 0.23 0.30 .009 .012 D/E 20.32 BSC .800 BSC D1/E1 22.10 22.61 .870 .890 D2/E2 24.89 25.35 .980 1.000 e 1.27 TYP .050 TYP R 0.13 MIN .005 MIN L1 0.89 1.14 .035 .045 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 25 Case outlines B and 9. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 26 Case outline B - Continued Millimeters Symbol Min Inches Max Min Max A 4.06 .160 A1 2.79 .110 A2 1.12 1.42 .044 .056 b 0.33 0.43 .013 .017 C 0.15 0.25 .006 .010 D/E 20.32 BSC .800 BSC D1/E1 23.65 24.10 .931 .949 D2/E2 24.89 25.40 .980 1.000 e 1.27 BSC L1 0.51 1.14 .050 BSC .020 .045 Case outline 9 - Continued Millimeters Symbol Min Inches Max Min Max A 3.56 .140 A1 2.79 .110 A2 0.46 0.76 .018 .030 b 0.33 0.43 .013 .017 C 0.15 0.25 .006 .010 D/E 20.32 BSC .800 BSC D1/E1 23.65 24.10 .931 .949 D2/E2 24.89 25.40 .980 1.000 e L1 1.27 BSC 0.51 1.14 .050 BSC .020 .045 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 27 Device types All Device types All Device types All Device types All Case outlines A, B, M, Y, Z, 9 Case outlines A, B, M, Y, Z, 9 Case outlines A, B, M, Y, Z, 9 Case outlines A, B, M, Y, Z, 9 Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 GND 18 GND 35 OE 52 GND 2 CS3 19 I/O8 36 CS2 53 I/O23 3 A5 20 I/O9 37 A17 54 I/O22 4 A4 21 I/O10 38 WE 2 55 I/O21 5 A3 22 I/O11 39 WE 3 56 I/O20 6 A2 23 I/O12 40 WE 4 57 I/O19 7 A1 24 I/O13 41 A18 58 I/O18 8 A0 25 I/O14 42 NC 59 I/O17 9 NC 26 I/O15 43 NC 60 I/O16 10 I/O0 27 V 44 I/O31 61 V 11 I/O1 28 A11 45 I/O30 62 A10 12 I/O2 29 A12 46 I/O29 63 A9 13 I/O3 30 A13 47 I/O28 64 A8 14 I/O4 31 A14 48 I/O27 65 A7 15 I/O5 32 A15 49 I/O26 66 A6 16 I/O6 33 A16 50 I/O25 67 WE1 17 I/O7 34 CS1 51 I/O24 68 CS4 CC CC FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 28 Device types All Device types All Device types All Device types All Case outlines N,T Case outlines N,T Case outlines N,T Case outlines N,T Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 GND 18 GND 35 OE 52 GND 2 CS1 19 I/O8 36 CS4 53 I/O23 3 A5 20 I/O9 37 A17 54 I/O22 4 A4 21 I/O10 38 A18 55 I/O21 5 A3 22 I/O11 39 NC 56 I/O20 6 A2 23 I/O12 40 NC 57 I/O19 7 A1 24 I/O13 41 NC 58 I/O18 8 A0 25 I/O14 42 NC 59 I/O17 9 NC 26 I/O15 43 NC 60 I/O16 10 I/O0 27 V 44 I/O31 61 V 11 I/O1 28 A11 45 I/O30 62 A10 12 I/O2 29 A12 46 I/O29 63 A9 13 I/O3 30 A13 47 I/O28 64 A8 14 I/O4 31 A14 48 I/O27 65 A7 15 I/O5 32 A15 49 I/O26 66 A6 16 I/O6 33 A16 50 I/O25 67 WE 17 I/O7 34 CS2 51 I/O24 68 CS3 CC CC FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 29 Device type All Device type All Device type All Device type All Case outlines U, X, 4 Case outlines U, X, 4 Case outlines U, X, 4 Case outlines U, X, 4 Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 I/O8 18 A15 35 I/O25 52 WE 3 2 I/O9 19 V 36 I/O26 53 CS3 3 I/O10 20 CS1 37 A7 54 GND 4 A14 21 NC 38 A12 55 I/O19 5 A16 22 I/03 39 NC 56 I/O31 6 A11 23 I/015 40 A13 57 I/O30 7 A0 24 I/O14 41 A8 58 I/O29 8 A18 25 I/O13 42 I/O16 59 I/O28 9 I/O0 26 I/O12 43 I/O17 60 A1 10 I/O1 27 OE 44 I/O18 61 A2 11 I/O2 28 A17 45 V 62 A3 12 WE 2 29 WE1 46 CS4 63 I/O23 13 CS2 30 I/O7 47 WE 4 64 I/O22 14 GND 31 I/O6 48 I/O27 65 I/O21 15 I/O11 32 I/O5 49 A4 66 I/O20 16 A10 33 I/O4 50 A5 17 A9 34 I/O24 51 A6 CC CC FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 30 CS OE WE V V V IL V IH IL IH X X V V V V V V IL IL IH IH IH IL I/O MODE D Read High Z Standby OUT High Z D IN Output disable Write NOTES: 1. V 2. VIL = Low Logic Level 3. 4. X = Do not care (either high or low) High Z = High Impedance State IH = High Logic Level FIGURE 3. Truth table. FIGURE 4. Read cycle timing diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 31 FIGURE 5. Write/Erase/Program operations, WE controlled. FIGURE 6. Write/Erase/Program operations, CS controlled. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 32 FIGURE 7. Block diagram, case outlines N and T. FIGURE 7. Block diagram, case outlines A, B, M, U, X, Y, Z, 4, and 9. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 33 Parameter Typ. Unit Input pulse level 0 - 3.0 V Input rise and fall 5 ns Input and output reference level 1.5 V Output load capacitance 50 pF NOTES: 1. V is programmable from +2 V to +7 V. Z 2. I OL and IOH are programmable from 0 to 16 mA. 3. Tester impedance is Z0 = 75 ohms. 4. VZ is typically the midpoint of V and V . OL OH 5. IOL and IOH are adjusted to simulate a typical resistive load circuit. 6. ATE tester includes jig capacitance. FIGURE 8. Output load circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 34 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1,4,7,9 Final electrical parameters 1,2,3,4,7,8A,8B,9,10,11 Group A test requirements 1*,2,3,4,7,8A,8B,9,10,11 Group C end-point electrical parameters 1,2,3,4,7,8A,8B,9,10,11 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices Not applicable * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) (2) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. TA as specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table on figure 3. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 35 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) (2) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-94612 A REVISION LEVEL H SHEET 36 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 06-02-03 Approved sources of supply for SMD 5962-94612 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ 5962-9461201HAA 5962-9461201HAC 5962-9461201HAA 5962-9461201HAC 5962-9461201HMA 5962-9461201HMA 5962-9461201HMA 5962-9461201HMC 5962-9461201HMC 5962-9461201HMC 5962-9461201HNC 5962-9461201HTC 5962-9461201HUA 5962-9461201HUA 5962-9461201HUC 5962-9461201HUC 5962-9461201HXA 5962-9461201HXC 5962-9461201HYC 5962-9461201HZA 5962-9461201HZC 5962-9461201H4A 5962-9461201H4A 5962-9461201H4A 5962-9461201H4C 5962-9461201H4C 5962-9461201H4C 5962-9461201H9A 5962-9461201H9C 5962-9461201HBA 5962-9461201HBC Vendor CAGE number 0EU86 0EU86 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 88379 54230 88379 88379 88379 88379 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 54230 See Footnotes at end of table. 1 of 5 Vendor similar PIN 2/ AS8F512K32Q1-150/883C AS8F512K32Q1-150/883C WF512K32-150G2LQ5 WF512K32-150G2LQ5 AS8F512K32Q-150/883C WF512K32-150G2Q5 ACT-F512K32N-150F5Q AS8F512K32Q-150/883C WF512K32-150G2Q5 ACT-F512K32N-150F5Q WF512K32F-150G4Q5 WF512K32-150G4TQ5 WF512K32N-150HQ5 ACT-F512K32N-150P7Q WF512K32N-150HQ5 ACT-F512K32N-150P7Q ACT-F512K32N-150P3Q ACT-F512K32N-150P3Q ACT-F512K32N-150F5UQ WF512K32-150G2UQ5 WF512K32-150G2UQ5 ASF512K32P-150/883C WF512K32N-150H1Q5 ACT-F512K32A-150P7Q AS8F512K32P-150/883C WF512K32N-150H1Q5 ACT-F512K32A-150P7Q WF512K32-150G1UQ5 WF512K32-150G1UQ5 WF512K32-150G1TQ5 WF512K32-150G1TQ5 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued. DATE: 06-02-03 Standard microcircuit drawing PIN 1/ 5962-9461202HAA 5962-9461202HAC 5962-9461202HAA 5962-9461202HAC 5962-9461202HMA 5962-9461202HMA 5962-9461202HMA 5962-9461202HMC 5962-9461202HMC 5962-9461202HMC 5962-9461202HNC 5962-9461202HTC 5962-9461202HUA 5962-9461202HUA 5962-9461202HUC 5962-9461202HUC 5962-9461202HXA 5962-9461202HXC 5962-9461202HYC 5962-9461202HZA 5962-9461202HZC 5962-9461202H4A 5962-9461202H4A 5962-9461202H4A 5962-9461202H4C 5962-9461202H4C 5962-9461202H4C 5962-9461202H9A 5962-9461202H9C 5962-9461202HBA 5962-9461202HBC Vendor CAGE number 0EU86 0EU86 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 88379 54230 88379 88379 88379 88379 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 54230 2 of 5 Vendor similar PIN 2/ ASF512K32Q1-120/883C ASF512K32Q1-120/883C WF512K32-120G2LQ5 WF512K32-120G2LQ5 ASF512K32Q-120/883C WF512K32-120G2Q5 ACT-F512K32N-120F5Q ASF512K32Q-120/883C WF512K32-120G2Q5 ACT-F512K32N-120F5Q WF512K32F-120G4Q5 WF512K32-120G4TQ5 WF512K32N-120HQ5 ACT-F512K32N-120P7Q WF512K32N-120HQ5 ACT-F512K32N-120P7Q ACT-F512K32N-120P3Q ACT-F512K32N-120P3Q ACT-F512K32N-120F5UQ WF512K32-120G2UQ5 WF512K32-120G2UQ5 ASF512K32P-120/883C WF512K32N-120H1Q5 ACT-F512K32A-120P7Q ASF512K32P-120/883C WF512K32N-120H1Q5 ACT-F512K32A-120P7Q WF512K32-120G1UQ5 WF512K32-120G1UQ5 WF512K32-120G1TQ5 WF512K32-120G1TQ5 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued. DATE: 06-02-03 Standard microcircuit drawing PIN 1/ 5962-9461203HAA 5962-9461203HAC 5962-9461203HAA 5962-9461203HAC 5962-9461203HMA 5962-9461203HMA 5962-9461203HMA 5962-9461203HMC 5962-9461203HMC 5962-9461203HMC 5962-9461203HNC 5962-9461203HTC 5962-9461203HUA 5962-9461203HUA 5962-9461203HUC 5962-9461203HUC 5962-9461203HXA 5962-9461203HXC 5962-9461203HYC 5962-9461203HZA 5962-9461203HZC 5962-9461203H4A 5962-9461203H4A 5962-9461203H4A 5962-9461203H4C 5962-9461203H4C 5962-9461203H4C 5962-9461203H9A 5962-9461203H9C 5962-9461203HBA 5962-9461203HBC Vendor CAGE number 0EU86 0EU86 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 88379 54230 88379 88379 88379 88379 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 54230 3 of 5 Vendor similar PIN 2/ AS8F512K32Q1-90/883C AS8F512K32Q1-90/883C WF512K32-90G2LQ5 WF512K32-90G2LQ5 AS8F512K32Q-90/883C WF512K32-90G2Q5 ACT-F512K32N-090F5Q AS8F512K32Q-90/883C WF512K32-90G2Q5 ACT-F512K32N-090F5Q WF512K32F-90G4Q5 WF512K32-90G4TQ5 WF512K32N-90HQ5 ACT-F512K32N-090P7Q WF512K32N-90HQ5 ACT-F512K32N-090P7Q ACT-F512K32N-090P3Q ACT-F512K32N-090P3Q ACT-F512K32N-090F5UQ WF512K32-90G2UQ5 WF512K32-90G2UQ5 AS8F512K32P-90/883C WF512K32N-90H1Q5 ACT-F512K32A-090P7Q AS8F512K32P-90/883C WF512K32N-90H1Q5 ACT-F512K32A-090P7Q WF512K32-90G1UQ5 WF512K32-90G1UQ5 WF512K32-90G1TQ5 WF512K32-90G1TQ5 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued. DATE: 06-02-03 Standard microcircuit drawing PIN 1/ 5962-9461204HAA 5962-9461204HAC 5962-9461204HAA 5962-9461204HAC 5962-9461204HMA 5962-9461204HMA 5962-9461204HMA 5962-9461204HMC 5962-9461204HMC 5962-9461204HMC 5962-9461204HNC 5962-9461204HTC 5962-9461204HUA 5962-9461204HUA 5962-9461204HUC 5962-9461204HUC 5962-9461204HXA 5962-9461204HXC 5962-9461204HYC 5962-9461204HZA 5962-9461204HZC 5962-94612044HA 5962-9461204H4A 5962-9461204H4A 5962-9461204H4C 5962-9461204H4C 5962-9461204H4C 5962-9461204H9A 5962-9461204H9C 5962-9461204HBA 5962-9461204HBC Vendor CAGE number Vendor similar PIN 2/ 0EU86 0EU86 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 88379 54230 88379 88379 88379 88379 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 54230 AS8F512K32Q1-70/883C AS8F512K32Q1-70/883C WF512K32-70G2LQ5 WF512K32-70G2LQ5 AS8F512K32Q-70/883C WF512K32-70G2Q5 ACT-F512K32N-070F5Q AS8F512K32Q-70/883C WF512K32-70G2Q5 ACT-F512K32N-070F5Q WF512K32F-70G4Q5 WF512K32-70G4TQ5 WF512K32N-70HQ5 ACT-F512K32N-070P7Q WF512K32N-70HQ5 ACT-F512K32N-070P7Q ACT-F512K32N-070P3Q ACT-F512K32N-070P3Q ACT-F512K32N-070F5UQ WF512K32-70G2UQ5 WF512K32-70G2UQ5 AS8F512K32P-70/883C WF512K32N-70H1Q5 ACT-F512K32A-070P7Q AS8F512K32P-70/883C WF512K32N-70H1Q5 ACT-F512K32A-070P7Q WF512K32-70G1UQ5 WF512K32-70G1UQ5 WF512K32-70G1TQ5 WF512K32-70G1TQ5 See footnotes at end of table. 4 of 5 STANDARD MICROCIRCUIT DRAWING SOURCE APPROVAL BULLETIN - Continued. DATE: Standard microcircuit drawing PIN 1/ 5962-9461205HAA 5962-9461205HAC 5962-9461205HAA 5962-9461205HAC 5962-9461205HMA 5962-9461205HMA 5962-9461205HMA 5962-9461205HMC 5962-9461205HMC 5962-9461205HMC 5962-9461205HNC 5962-9461205HTC 5962-9461205HUA 5962-9461205HUA 5962-9461205HUC 5962-9461205HUC 5962-9461205HXA 5962-9461205HXC 5962-9461205HYC 5962-9461205HZA 5962-9461205HZC 5962-9461205H4A 5962-9461205H4A 5962-9461205H4C 5962-9461205H4C 5962-9461205H9A 5962-9461205H9C 5962-9461205HBA 5962-9461205HBC 1/ 2/ 06-02-03 Vendor CAGE number Vendor similar PIN 2/ 0EU86 0EU86 54230 54230 0EU86 54230 88379 0EU86 54230 88379 54230 54230 54230 88379 54230 88379 88379 88379 88379 54230 54230 54230 88379 54230 88379 54230 54230 54230 54230 AS8F512K32Q1-60/883C AS8F512K32Q1-60/883C WF512K32-60G2LQ5 WF512K32-60G2LQ5 AS8F512K32Q-60/883C WF512K32-60G2Q5 ACT-F512K32N-060F5Q AS8F512K32Q-60/883C WF512K32-60G2Q5 ACT-F512K32N-060F5Q WF512K32F-60G4Q5 WF512K32-60G4TQ5 WF512K32N-60HQ5 ACT-F512K32N-060P7Q WF512K32N-60HQ5 ACT-F512K32N-060P7Q ACT-F512K32N-060P3Q ACT-F512K32N-060P3Q ACT-F512K32N-060F5UQ WF512K32-60G2UQ5 WF512K32-60G2UQ5 WF512K32N-60H1Q5 ACT-F512K32A-060P7Q WF512K32N-60H1Q5 ACT-F512K32A-060P7Q WF512K32-60G1UQ5 WF512K32-60G1UQ5 WF512K32-60G1TQ5 WF512K32-60G1TQ5 The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor for its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number Vendor name and address 0EU86 Austin Seminconductor Incorporated 8701 Cross Park Drive Austin, TX 78754-4566 54230 White Electronic Designs Corporation 3601 East University Drive Phoenix, AZ 85034-7217 88379 Aeroflex Circuit Technology 35 South Service Road Plainview NY, 11803-4193 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 5 of 5