PLASTIC INFRARED LIGHT EMITTING DIODE QED221 QED222 QED223 PACKAGE DIMENSIONS 0.195 (4.95) REFERENCE SURFACE 0.305 (7.75) 0.040 (1.02) NOM 0.800 (20.3) MIN 0.050 (1.25) CATHODE 0.100 (2.54) NOM SCHEMATIC 0.240 (6.10) 0.215 (5.45) 0.020 (0.51) SQ. (2X) ANODE NOTES: CATHODE 1. Dimensions for all drawings are in inches (mm). 2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless otherwise specified. DESCRIPTION The QED22X is an 880nm AlGaAs LED encapsulated in clear, purple tinted, plastic T-1 3/4 package. FEATURES • != 880 nm • Chip material = AlGaAs • Package type: T-1 3/4 (5mm lens diameter) • Matched Photosensor: QSD122/123/124 • Medium Wide Emission Angle, 40° • High Output Power • Package material and color: Clear, purple tinted, plastic 2001 Fairchild Semiconductor Corporation DS300337 12/07/01 1 OF 4 www.fairchildsemi.com PLASTIC INFRARED LIGHT EMITTING DIODE QED221 QED222 ABSOLUTE MAXIMUM RATINGS QED223 (TA = 25°C unless otherwise specified) Parameter Symbol Rating Unit Operating Temperature TOPR -40 to +100 °C Storage Temperature TSTG -40 to +100 °C (2,3,4) TSOL-I 240 for 5 sec °C (2,3) TSOL-F 260 for 10 sec °C Continuous Forward Current IF 100 mA Reverse Voltage VR 5 V PD 200 mW IF(Peak) 1.5 A Soldering Temperature (Iron) Soldering Temperature (Flow) Power Dissipation (1) Peak Forward Current (5) ELECTRICAL / OPTICAL CHARACTERISTICS PARAMETER Peak Emission Wavelength (TA =25°C) TEST CONDITIONS SYMBOL MIN TYP MAX UNITS IF = 100 mA !PE — 880 — nm Emission Angle IF = 100 mA " — ±20 — Deg. Forward Voltage IF = 100 mA, tp = 20 ms VF — — 1.7 V Reverse Current VR = 5 V IR — — 10 µA Radiant Intensity QED221 IF = 100 mA, tp = 20 ms IE 10 — 20 mW/sr Radiant Intensity QED222 IF = 100 mA, tp = 20 ms IE 16 — 32 mW/sr Radiant Intensity QED223 IF = 100 mA, tp = 20 ms IE 25 — — mW/sr tr — 800 — ns tf — 800 — ns Rise Time Fall Time IF = 100 mA 1. Derate power dissipation linearly 2.67 mW/°C above 25°C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron 1/16” (1.6mm) minimum from housing. 5. Pulse conditions; tp = 100 µS, T = 10 ms. www.fairchildsemi.com 2 OF 4 12/07/01 DS300337 PLASTIC INFRARED LIGHT EMITTING DIODE QED221 QED222 QED223 Fig. 2 Coupling Characteristics of QED22X with QSD12X NORMALIZED COLLECTOR CURRENT NORMALIZED RADIANT INTENSITY Fig. 1 Normalized Radiant Intensity vs. Input Current 10 Normalized to: IF= 100 mA, TA = 25˚C Pulse Width = 100 µs 1 0.1 0.01 0.001 1 10 100 1000 1 Normalized to: Pulse Width = 100 µs Duty Cycle = 0.1% VCC = 5 V RL = 100 Ω TA = 25˚C IF = 100 mA 0.8 0.6 IF = 20 mA 0.4 0.2 0 0 2 1 3 4 5 6 LENS TIP SEPERATION (INCHES) IF - INPUT CURRENT (mA) Fig. 4 Normalized Radiant Intensity vs. Wavelength Fig. 3 Forward Voltage vs. Temperature 1.0 IF = 100 mA IF = 50 mA 2 1.5 1 IF = 10 mA 0.5 IF = 20 mA Pulse Width = 100 µs Duty Cycle = 0.1% 0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 NORMALIZED RADIANT INTENSITY VF - FORWARD VOLTAGE (V) 2.5 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 TA - TEMPERATURE (˚C) 775 800 825 850 875 900 925 950 λ (nm) Fig. 5 Forward Current vs. Forward Voltage Fig. 6 Radiation Pattern 1000 IF - FORWARD CURRENT (mA) TA = 25˚C 20 10 0˚ -10 -20 30 100 -30 40 -40 50 -50 60 10 -60 -70 70 80 -80 1 -90 90 100 1 2 3 80 60 40 20 0 20 40 60 80 100 4 VF - FORWARD VOLTAGE (V) DS300337 12/07/01 3 OF 4 www.fairchildsemi.com PLASTIC INFRARED LIGHT EMITTING DIODE QED221 QED222 QED223 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in a significant injury of the user. www.fairchildsemi.com 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 4 OF 4 12/07/01 DS300337