bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com INTEGRATED WIRELESS POWER SUPPLY RECEIVER, Qi (WIRELESS POWER CONSORTIUM) COMPLIANT Check for Samples: bq51010, bq51011, bq51013 FEATURES 1 • • • • • • • • Integrated Wireless Power Receiver Solution with a 5V Regulated Supply – 93% Overall Peak AC-DC Efficiency – Full Synchronous Rectifier – WPC v1.0 Compliant Communication Control – Output Voltage Conditioning – Only IC Required Between RX coil and 5V DC Output Voltage Dynamic Rectifier Control for Improved Load Transient Response Supports 20-V Maximum Input Low-power Dissipative Rectifier Overvoltage Clamp (VOVP = 15V) Thermal Shutdown Single NTC/Control Pin for Optimal Safety and I/O Between Host Stand-alone Digital Controller 1.9 x 3mm DSBG or 4.5 x 3.5mm QFN Package APPLICATIONS • • • • • • Digital Cameras Portable Media Players Hand-held Devices DESCRIPTION The bq5101x is an advanced, integrated, receiver IC for wireless power transfer in portable applications. The device provides the AC/DC power conversion while integrating the digital control required to comply with the Qi v1.0 communication protocol. Together with the bq500210 transmitter controller, the bq5101x enables a complete contact-less power transfer system for a wireless power supply solution. By utilizing near-field inductive power transfer, the receiver coil embedded in the portable device receives the power transmitted by the transmitter coil via mutually coupled inductors. The AC signal from the receiver coil is then rectified and regulated to be used as a power supply for down-system electronics. Global feedback is established from the secondary to the transmitter in order to stabilize the power transfer process via back-scatter modulation. This feedback is established by using the Qi v1.0 communication protocol supporting up to 5W applications. The device integrates a low-impedance full synchronous rectifier, low-dropout regulator, digital control, and accurate voltage and current loops. The entire power stage (rectifier and LDO) utilize low resistive NMOS FET’s to ensures high efficiency and low power dissipation. WPC Compliant Receivers Cell Phones, Smart Phones Headsets th bqTESLA150LP: Receiver Integration 1/5 of the Area Savings Power AC to DC Drivers bq5101x Rectification Voltage Conditioning Load Communication Controller V/I Sense Controller bq500210 Transmitter Receiver Figure 1. Wireless Power Consortium (WPC or Qi) Inductive Power System 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION Part NO Marking Function Package bq51013 bq51013 bq51010 (1) (1) Quantity bq51013YFFR 3000 bq51013YFFT 250 bq51013RHLR 3000 DSBGA-YFF 5V Regulated Power Supply QFN-RHL (1) WAES bq51011 Ordering Number (Tape and Reel) bq51011 Current Limited Power Supply bq51010 7V Regulated Power Supply for Switch-Mode Charger Systems DSBGA-YFF DSBGA-YFF bq51013RHLT 250 bq51011YFFR 3000 bq51011YFFT 250 bq51010YFFR 3000 bq51010YFFT 250 Product Preview AVAILABLE OPTIONS Device Function VAD_OVP bq51013 5V Power Supply bq51011 5V Current Limited Power Supply bq51010 7V Power Supply none Communication Current Limit VRECT-OVP VRECT(REG) VOUT(REG) 15V Dynamic 5V None 15V Tracks VOUT 5V 400mA + Dynamic ILim 15V Dynamic 7V None ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) PARAMETER Input Voltage PIN VALUES UNITS MIN MAX AC1, AC2, RECT, COMM1, COMM2, OUT, CHG -0.3 20 AD, AD-EN -0.3 30 BOOT1, BOOT2 -0.3 26 V 1 A(RMS) V V Input Current AC1, AC2 Output Current OUT 1.5 A CHG 15 mA COMM1, COMM2 1 A Output Sink Current Junction temperature, TJ -40 150 °C Storage temperature, TSTG -65 150 °C ESD Rating (HBM) (100pF, 1.5KΩ) (1) (2) 2 All 2KV All voltages are with respect to the VSS terminal, unless otherwise noted. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com THERMAL INFORMATION THERMAL METRIC (1) RHL YFF 20 PiNS 28 PINS θJA Junction-to-ambient thermal resistance 37.7 58.9 θJCtop Junction-to-case (top) thermal resistance 35.5 0.2 θJB Junction-to-board thermal resistance 13.6 9.1 ψJT Junction-to-top characterization parameter 0.5 1.4 ψJB Junction-to-board characterization parameter 13.5 8.9 θJCbot Junction-to-case (bottom) thermal resistance 2.7 n/a (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) PINS MIN MAX UNITS Input voltage range, VIN PARAMETER RECT 4 10 V Input current, IIN RECT 1.5 A Output current, IOUT OUT 1.5 A Sink current, IAD-EN AD-EN 1 mA COMM sink current, ICOMM COMM 500 mA 125 ºC Junction Temperature, TJ 0 TYPICAL APPLICATION SCHEMATICS bq5101x System Load AD-EN AD OUT CCOMM1 C4 COMM1 CBOOT1 D1 BOOT1 RECT C1 AC1 VTSB R4 R2 C2 COIL C3 TS/CTRL AC2 CBOOT2 NTC BOOT2 HOST COMM2 CHG CLAMP2 EN1 Bi-State CLAMP1 EN2 Bi-State CCOMM2 CCLAMP2 C CLAMP1 R3 ILIM 3-State PGND R1 Figure 2. bq5101x Used as a Wireless Power Receiver and Power Supply for System Loads Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 3 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com System Load Q1 USB or AC Adapter Input bq5101x AD-EN AD OUT C COMM1 C4 COMM1 C5 C BOOT1 D1 BOOT1 RECT C1 AC1 COIL VTSB C3 R4 R2 C2 TS/CTRL AC2 C BOOT2 NTC HOST COMM2 CHG CLAMP2 EN1 Bi-State CLAMP1 EN2 Bi-State CCOMM2 C CLAMP2 CCLAMP1 R3 BOOT2 ILIM 3-State PGND R1 Figure 3. bq5101x Used as a Wireless Power Receiver and Power Supply for System Loads With Adapter Power-Path Multiplexing ELECTRICAL CHARACTERISTICS over operating free-air temperature range, 0°C to 125°C (unless otherwise noted) PARAMETER UVLO VHYS VRECT TEST CONDITIONS Undervoltage lock-out VRECT: 0V → 3V Hysteresis on UVLO VRECT: 3V → 2V Hysteresis on OVP VRECT: 16V → 5V Input overvoltage threshold VRECT: 5V → 16V Dynamic VRECT Threshold 1 bq51011, bq51013 ILOAD < 100 mA (ILOAD rising) bq51010 Dynamic VRECT Threshold 2 bq51011, bq51013 100 mA < ILOAD < 200 mA (ILOAD rising) bq51010 Dynamic VRECT Threshold 3 bq51011, bq51013 200 mA < ILOAD < 400 mA (ILOAD rising) bq51010 Dynamic VRECT Threshold 4 bq51011, bq51013 ILOAD > 400 mA (ILOAD rising) bq51010 VRECT-REG (1) ILOAD ILOAD Hysteresis for dynamic VRECT thresholds ILOAD falling VRECT-TRACK Tracking VRECT regulation above VOUT VOUT = 3.5 V, IOUT = KILIM / RILIM > 250mA (1) 4 bq51011 MIN 2.6 TYP MAX 2.7 2.8 250 15 V mV 150 14.5 UNIT mV 15.5 V 7.08 9.05 6.28 8.25 V 5.53 7.50 5.11 7.08 40 mA 250 mV For the bq51011, VRECT-REG only applies when VRECT-TRACK is not active. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range, 0°C to 125°C (unless otherwise noted) PARAMETER IRECT-REG TEST CONDITIONS MIN TYP Percentage of ILIM at which bq51011 VRECT(REG) begins to track VOUT ILOAD rising 60% Hysteresis percentage of ILOAD at which VRECT(REG) halts tracking VOUT ILOAD falling 20% bq51011 VRECT-DPM Rectifier undervoltage protection, restricts IOUT at VRECT-DPM VRECT-REV Rectifier reverse voltage protection when a supply is present at VOUT 3 MAX UNIT 3.1 3.2 V VRECT-REV = VOUT - VRECT, VOUT = 10V 9 8 V ILOAD = 0mA, 0°C ≤ TJ ≤ 85°C 8 10 mA ILOAD = 300mA, 0°C ≤ TJ ≤ 85°C 2 2.5 mA VOUT = 5V, 0°C ≤ TJ ≤ 85°C 20 35 µA 120 Ω Quiescent Current IRECT Active chip quiescent current consumption from RECT IOUT Quiescent current at the output when wireless power is disabled (Standby) ILIM Short Circuit RILIM: 200Ω → 50Ω. IOUT latches off, cycle power to reset RILIM Highest value of ILIM resistor considered a fault (short). Monitored for IOUT > 100 mA tDGL Deglitch time transition from ILIM short to IOUT disable ILIM_SC ILIM-SHORT,OK enables the ILIM short comparator when IOUT is greater than this value ILOAD: 0 → 200mA IOUT Maximum output current limit, CL Maximum ILOAD that will be delivered for 1 ms when ILIM is shorted 1 90 105 ms 125 mA 2.4 A OUTPUT bq51011, ILOAD = 1000 mA bq51013 ILOAD = 1 mA VOUT-REG Regulated output voltage VDO Drop-out voltage, RECT to OUT ILOAD = 1A KILIM Current programming factor RLIM = KILIM / IILIM, ILOAD = 1 A IILIM Current limit programming range VOUT_SC OUT pin short-circuit detection/pre-charge threshold bq51011 VOUT: 3 V → 0.5 V, no deglitch VOUT_SC hysteresis bq51011 VOUT: 0.5 V → 3 V ICOMM (2) Current limit during WPC communication bq51011 ILOAD = IILIM IOUT_SC Source current to OUT pin during short-circuit detection bq51011 VOUT = 0V, 0°C ≤ TJ ≤ 85°C bq51010 ILOAD = 1 mA 4.85 4.95 5 4.95 5 5.05 6.9 280 0.7 V 7 7.1 110 190 300 320 AΩ 1500 mA 0.8 mV 0.9 V 100 365 mV 390 420 mA 15 25 mA 2.2 2.3 V 54 56 58 17 18 TS / CTRL VTS TS Bias Voltage ITS-Bias < 100µA (periodically driven see tTS/CTRL-Meas) ITS TS-Bias Short circuit protection VTS-Bias = 0V Rising threshold VTS: 50% → 60% Falling hysteresis VTS: 60% → 50% Falling threshold VTS: 20% → 15% Rising hysteresis VTS: 15% → 20% CTRL pin threshold for a high VTS/CTRL: 50 → 150mV 80 100 130 mV CTRL pin threshold for a low VTS/CTRL: 150 → 50mV 50 80 100 mV VCOLD VHOT VCTRL (2) 2.1 1 3 1 19 mA %VTS-Bias 1 Dynamic communication current limit enables the 400mA current limit only when the output current is equal to the programmed current limit (IILIM) for the bq51011. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 5 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range, 0°C to 125°C (unless otherwise noted) PARAMETER TEST CONDITIONS tTS/CTRL Time VTS-Bias is active when TS measurements occur tTS Deglitch time for all TS comparators MIN Synchronous to the communication period TYP MAX UNIT 24 ms 10 ms 155 °C 20 °C THERMAL PROTECTION Thermal shutdown temperature TJ Thermal shutdown hysteresis OUTPUT LOGIC LEVELS ON /CH VOL Open drain CHG pin ISINK = 5mA IOFF CHG leakage current when disabled VCHG = 20 V, 0°C ≤ TJ ≤ 85°C RDS(ON) Comm1 and Comm2 VRECT = 4V fCOMM Signaling frequency on COMM pin IOFF Comm pin leakage current 500 mV 1 µA COMM PIN Ω 1.5 2.00 VCOMM1 = 20V, VCOMM2 = 20V Kb/s 1 µA CLAMP PIN RDS(ON) Clamp1 and Clamp2 Ω 0.5 Adapter Enable VAD Rising threshold voltage. EN-UVLO VAD 0 → 5 V VAD-EN hysteresis, EN-HYS VAD 5 → 0 V IAD Input leakage current VRECT = 0V, VAD = 5V, 0°C ≤ TJ ≤ 85°C RAD Pull-up resistance from AD-EN to OUT when adapter mode is disabled and VOUT > VAD = 0, VOUT = 5 VAD, EN-OUT VAD Voltage difference between VAD and VAD-EN when adapter mode is enabled, EN-ON VAD-EN 3.5 3.6 3.8 400 V mV 55 μA 200 350 Ω VAD = 5V, 0°C ≤ TJ ≤ 85°C 3 4.5 5 VAD = 9V, 0°C ≤ TJ ≤ 85°C 3 6 7 200 225 250 V Synchronous Rectifier IOUT VHS-DIODE IOUT at which the synchronous rectifier enters half synchronous mode, SYNC_EN ILOAD 300 → 200mA Hysteresis for IOUT,RECT-EN (full-synchronous mode enabled) ILOAD 200 → 300mA High-side diode drop when the rectifier is in IAC-VRECT = 250mA half synchronous mode mA 40 mA 0.7 V EN1 and EN2 VIL Input low threshold for EN1 and EN2 VIH Input high threshold for EN1 and EN2 RPD EN1 and EN2 pull down resistance 0.4 1.3 V V 200 kΩ ADC VRECT 6 Rectified power measurement 0W – 5W of rectified power Submit Documentation Feedback ±6% Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com DEVICE INFORMATION SIMPLIFIED BLOCK DIAGRAM I OUT VOUT,FB VREF,ILIM VILIM + _ VREF,IABS VIABS,FB + _ VIN,FB VIN,DPM + _ + _ RECT VOUT,REG ILIM AD + _ VREFAD,OVP BOOT2 + _ BOOT1 VREFAD,UVLO AD-EN AC1 AC2 Sync Rectifier Control VREF,TS-BIAS + _ COMM1 COMM2 DATA _ OUT ADC CLAMP1 CLAMP2 VBG,REF VIN,FB VOUT,FB VILIM VIABS,FB VIABS,REF VIC,TEMP TS_COLD TS_HOT VTSB + _ + _ TS/CTRL TS_DETECT + _ VREF_100MV Digital Control OVP CHG + _ VRECT VOVP,REF EN1 200kW EN2 200kW PGND Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 7 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com YFF Package (TOP VIEW) RHL Package (TOP VIEW) PGND 1 A1 PGND A2 PGND A3 PGND A4 PGND B1 AC2 B2 AC2 B3 AC1 B4 AC1 C1 C2 RECT C3 RECT C4 BOOT2 D1 OUT E1 COM2 D2 OUT AC1 2 AC2 19 BOOT1 3 RECT 18 OUT 4 BOOT2 17 CLMP1 5 CLMP2 16 COM1 6 COM2 15 /CHG 7 VTSB 14 /AD-EN 8 TS/ CTRL 13 AD 9 ILIM 12 BOOT1 D3 OUT D4 OUT E2 E3 CLMP2 CLMP1 E4 COM1 TS/CTRL F2 VTSB F3 AD-EN F4 CHG G1 ILIM G2 EN2 G3 EN1 G4 AD F1 PGND 20 EN1 10 EN2 11 PIN FUNCTIONS NAME YFF RHL I/O AC1 B3, B4 2 I AC2 B1, B2 19 I BOOT1 C4 3 O BOOT2 C1 17 O RECT C2, C3 18 O Filter capacitor for the internal synchronous rectifier. Connect a ceramic capacitor to PGND. Depending on the power levels, the value may be 4.7μF to 22μF. OUT D1, D2, D3, D4 4 O Output pin, delivers power to the load. O Open-drain output used to communicate with primary by varying reflected impedance. Connect through a capacitor to either AC1 or AC2 for capacitive load modulation (COM2 must be connected to the alternate AC1 or AC2 pin). For resistive modulation connect COM1 and COM2 to RECT via a single resistor; connect through separate capacitors for capacitive load modulation. O Open-drain output used to communicate with primary by varying reflected impedance. Connect through a capacitor to either AC1 or AC2 for capacitive load modulation (COM1 must be connected to the alternate AC1 or AC2 pin). For resistive modulation connect COM1 and COM2 to RECT via a single resistor; connect through separate capacitors for capacitive load modulation. COM1 E4 COM2 E1 6 15 O CLMP1, CLMP2 E2, E3 PGND A1, A2, A3, A4 8 5 16 1, 20 DESCRIPTION AC input power from receiver coil antenna. Bootstrap capacitors for driving the high-side FETs of the synchronous rectifier. Connect a 10nF ceramic capacitor from BOOT1 to AC1 and from BOOT2 to AC2. Open drain FETs which are utilized for a non-power dissipative over-voltage AC clamp protection. When the RECT voltage goes above 15 V, both switches will be turned on and the capacitors will act as a low impedance to protect the IC from damage. If used, CLMP1 is required to be connected to AC1, and CLMP2 is required to be connected to AC2 via 0.47µF capacitors. Power ground Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com PIN FUNCTIONS (continued) NAME YFF ILIM RHL G1 AD G4 AD-EN F3 I/O DESCRIPTION I/O 12 Programming pin for the over current limit. Connect external resistor to VSS. Size RILIM with the following equation: RILIM = 300 / I( max) where I(max) is the desired current limit for the power supply. 9 I Connect this pin to the wired adapter input. When a voltage is applied to this pin wireless charging is disabled and AD-EN is driven low. Connect to GND through a 1µF capacitor. If unused, capacitor is not required and should be grounded directly. O Push-pull driver for external PFET connecting AD and OUT. This node is pulled to the higher of OUT and AD when turning off the external FET. This voltage tracks approximately 4V below AD when voltage is present at AD and provides a regulated VSG bias for the external FET. Float this pin if unused. Must be connected to ground and pulled up to VTSB via two series resistors. If an NTC function is not desired, size R2 to be twice that of R3. As a CTRL pin pull to ground to send End Power/Temperature Fault message to the transmitter, pull-up to send End Power/Termination message to the transmitter. 8 TS/CTRL F1 13 I EN1 G3 10 I EN2 G2 11 I VTSB F2 14 O 2.2V LDO that periodically biases the TS/CTRL resistor network. Connect to TS/CTRL via a resistor CHG F4 7 O Open-drain output – active when output current is being delivered to the load (i.e. when the output of the supply is enabled). Inputs that allow user to enable/disable wireless and wired charging <EN1 EN2> <00> wireless charging is enabled unless the AD voltage is > 3.6 V. <01> AD mode is disabled, wireless charging enabled. <10> AD-EN pulled low, wireless charging disabled. <11> wired and wireless charging disabled. Spacer TYPICAL CHARACTERISTICS 100.0 100.0 90.0 90.0 Efficiency (%) Efficiency (%) Full Sync Mode Enabled 80.0 80.0 70.0 60.0 0.0 1.0 2.0 3.0 4.0 Output Power (W) Figure 4. Rectifier Efficiency 5.0 6.0 70.0 1.0 2.0 3.0 Output Power (W) 4.0 5.0 Figure 5. IC Efficiency from AC Input to DC Output Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 9 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) 1.2 7.5 Falling Rising RILIM=250 RILIM=400 RILIM=700 RILIM=300 1.1 1.0 7.0 Current Limit (A) Rectifier Voltage (V) 0.9 6.5 6.0 0.8 0.7 0.6 0.5 0.4 5.5 0.3 0.2 5.0 0.2 0.4 0.6 Load Current (A) 0.8 0.1 1.0 1.0 Figure 6. VRECT vs. ILOAD 2.0 3.0 Output Voltage (V) 4.0 5.0 Figure 7. VOUT Sweep (I-V Curve)(1) 100.0 5.01 90.0 5.00 Output Ripple (mV) Output Voltage (V) 80.0 4.99 4.98 4.97 70.0 60.0 50.0 4.96 40.0 4.95 0.2 0.4 0.6 0.8 Load Current (A) 1.0 Figure 8. ILOAD Sweep (I-V Curve) 10 1.2 30.0 0.0 0.2 0.4 0.6 Load Current (A) 0.8 1.0 Figure 9. Output Ripple vs. ILOAD (COUT = 1µF) Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) 5.004 Vout (V) 5.002 5.000 4.998 0 20 40 60 80 Temperature (°C) 100 120 Figure 10. VOUT vs Temperature Figure 11. 1A Instantaneous Load Step(2) VRECT VOUT Figure 12. 1A Instantaneous Load Dump(2) Figure 13. 1A Load Step Full System Response Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 11 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) VRECT VRECT VOUT VOUT Figure 14. 1A Load Dump Full System Response Figure 15. Rectifier Overvoltage Clamp (fop = 110kHz) VTS/CTRL VRECT VRECT VOUT Figure 16. TS Fault Figure 17. Adapter Insertion (VAD = 10V) VAD VRECT VRECT VOUT Figure 18. Adapter Insertion (VAD = 10V) Illustrating Break-Before-Make Operation 12 Figure 19. On the Go Enabled (VOTG = 3.5V)(3) Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) IOUT IOUT VRECT VRECT VOUT VOUT Figure 20. bq51013 and bq51010 Typical Startup with a 1A System Load Figure 21. bq51011 Step Response with VOUT = 4.8V and ILOAD = IILIM IOUT VRECT VRECT VOUT VOUT Figure 22. bq51011 Output Voltage Transition (VOUT = 4.8V -> 3.5V) Illustrating VRECT-TRACK Figure 23. bq51011 Output Current Transition (ILOAD < IILIM ≥ ILOAD = IILIM) lIlustrating Dynamic Communication Current Limit (1) Curves illustrates the resulting ILIM current by sweeping the output voltage at different RILIM settings. ILIM current collapses due to the increasing power dissipation as the voltage at the output is decreased—thermal shutdown is occurring. (2) Total droop experienced at the output is dependent on receiver coil design. The output impedance must be low enough at that particular operating frequency in order to not collapse the rectifier below 5V. (3) On the go mode is enabled by driving EN1 high. In this test the external PMOS is connected between the output of the bq5101x IC and the AD pin, therefore any voltage source on the output is supplied to the AD pin. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 13 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com PRINCIPLE OF OPERATION th bqTESLA150LP: Receiver Integration 1/5 of the Area Savings Power AC to DC bq5101x Drivers Rectification Voltage Conditioning Load Communication V/I Sense Controller Controller bq500210 Transmitter Receiver Figure 24. WPC Wireless Power System Indicating the Functional Integration of the bq5101x A Brief Description of the Wireless System: A wireless system consists of a charging pad (transmitter or primary) and the secondary-side equipment (receiver or secondary). There are coils in the charging pad and in the secondary equipment which are magnetically coupled to each other when the equipment is placed on the portable device. Power is then transferred from the transmitter to the receiver via coupled inductors (e.g. an air-core transformer). Controlling the amount of power transferred is achieved by sending feedback (error signal) communication to the primary (e.g. to increase or decrease power). The receiver communicates with the transmitter by changing the load seen by the transmitter. This load variation results in a change in the transmitter coil current, which is measured and interpreted by a processor in the charging pad. The communication is digital - packets are transferred from the receiver to the transmitter. Differential Bi-phase encoding is used for the packets. The bit rate is 2-kbps. Various types of communication packets have been defined. These include identification and authentication packets, error packets, control packets, end power packets, and power usage packets. The transmitter coil stays powered off most of the time. It occasionally wakes up to see if a receiver is present. When a receiver authenticates itself to the transmitter, the transmiter will remain powered on. The receiver maintains full control over the power transfer using communication packets. 14 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com Using the bq5101x as a Wireless Power Supply: (See Figure 3) Figure 3 is the schematic of a system which uses the bq5101x as power supply while power multiplexing the wired (adapter) port. When the system shown in Figure 3 is placed on the charging pad, the receiver coil is inductively coupled to the magnetic flux generated by the coil in the charging pad which consequently induces a voltage in the receiver coil. The internal synchronous rectifier feeds this voltage to the RECT pin which has the filter capacitor C3. The bq5101x identifies and authenticates itself to the primary using the COM pins by switching on and off the COM FETs and hence switching in and out CCOMM. If the authentication is successful, the transmitter will remain powered on. The bq5101x measures the voltage at the RECT pin, calculates the difference between the actual voltage and the desired voltage VRECT-REG, (~7V for the bq51013 at no load) and sends back error packets to the primary. This process goes on until the input voltage settles at VIN-REG. During a load transient, the dynamic rectifier algorithm will set the targets specified by VRECT-REG thresholds 1, 2, 3, and 4. This algorithm enhances the transient response of the power supply. During power-up, the LDO is held off until the VRECT-REG threshold 1 converges. The voltage control loop ensures that the output voltage is maintained at VOUT-REG (~5V for the bq51013) to power the system. The bq5101x meanwhile continues to monitor the input voltage, and maintains sending error packets to the primary every 250ms. If a large transient occurs, the feedback to the primary speeds up to every 32ms in order to converge on an operating point in less time. Input Overvoltage If the input voltage suddenly increases in potential (e.g. a change in position of the equipment on the charging pad), the voltage-control loop inside the bq5101x becomes active, and prevents the output from going beyond VOUT-REG. The receiver then starts sending back error packets to the transmitter every 30ms until the input voltage comes back to the VRECT-REG target, and then maintains the error communication every 250ms. If the input voltage increases in potential beyond VOVP, the IC switches off the LDO and communicates to the primary to bring the voltage back to VRECT -REG. In addition, a proprietary voltage protection circuit is activated by means of CCLAMP1 and CCLAMP2 that protects the IC from voltages beyond the maximum rating of the IC (e.g. 20V). Adapter Enable Functionality and Enable1/Enable2 Control Figure 3 is an example application that shows the bq5101x used as a wireless power receiver that can power mutliplex between wired or wireless power for the down-system electronics. In the default operating mode pins EN1 and EN2 are low, which activates the adapter enable functionality. In this mode, if an adapter is not present the AD pin will be low, and AD-EN pin will be pulled to the higher of the OUT and AD pins so that the PMOS between OUT and AD will be turned off. If an adapter is plugged in and the voltage at the AD pin goes above 3.6 V then wireless charging is disabled and the AD-EN pin will be pulled approximately 4 V below the AD pin to connect AD to the secondary charger. The difference between AD and AD-EN is regulated to a maximum of 7V to ensure the VGS of the external PMOS is protected. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 15 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com The EN1 and EN2 pins include internal 200kΩ pull-down resistors, so that if these pins are not connected bq5101x defaults to AD-EN control mode. However, these pins can be pulled high to enable other operating modes as described in Table 1: Table 1. EN1 EN2 0 0 Adapter control enabled. If adapter is present then secondary charger will be powered by adapter, otherwise wireless charging will be enabled when wireless power is available. Result 0 1 Adapter is disabled. Wireless charging will be enabled when wireless power is present. 1 0 AD-EN is pulled low, whether or not adapter voltage is present. This feature can be used, e.g., for USB OTG applications. 1 1 Adapter and wireless charging are disabled, i.e., power will never be delivered by the OUT pin in this mode. As described in Table 1, pulling EN2 high disables the adapter mode and only allows wireless charging. In this mode the adapter voltage will always be blocked from the OUT pin. An application example where this mode is useful is when USB power is present at AD, but the USB is in suspend mode so that no power can be taken from the USB supply. Pulling EN1 high enables the off-chip PMOS regardless of the presence of a voltage. This function can be used in USB OTG mode to allow a charger connected to the OUT pin to power the AD pin. Finally, pulling both EN1 and EN2 high disables both wired and wireless charging. NOTE It is required to connect a back-to-back PMOS between AD and OUT so that voltage is blocked in both directions. Also, when AD mode is enabled no load can be pulled from the RECT pin as this could cause an internal device overvoltage in bq5101x. End Power Transfer Packet (WPC Header 0x02) The WPC allows for a special command for the receiver to terminate power transfer from the trasmitter termed End Power Transfer (EPT) packet. Table 2 specifies the v1.0 Reasons columb and their responding data field value. The Condition column corresponds to the values sent by the bq5101x for a given reason. Table 2. Reason Value Condition Unknown 0x00 AD > 3.6V Charge Complete 0x01 TS/CTRL = 1, or EN1 = 1, or <EN1 EN2> = <11> Internal Fault 0x02 TJ > 150°C or RILIM < 100Ω Over Temperature 0x03 TS < VHOT, TS > VCOLD, or TS/CTRL < 100mV Over Voltage 0x04 Not Sent Over Current 0x05 Not Sent Battery Failure 0x06 Not Sent Reconfigure 0x07 Not Sent No Response 0x08 VRECT target doesn't converge Status Outputs bq5101x has one status output, CHG. This output is an open-drain NMOS device that is rated to 20V. The open-drain FET connected to the CHG pin will be turned on whenever the output of the power supply is enabled. Please note, the output of the power supply will not be enabled if the VRECT-REG does not converge at the no-load target voltage. 16 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com Communication bq5101x provides two identical, integrated communication FETs which are connected to the pins COMM1 and COMM2. These FETs are used for modulating the secondary load current which allows bq5101x to communicate error control and configuration information to the transmitter. Figure 25 below shows how the COMM pins can be used for resistive load modulation. Each COMM pin can handle at most a 24Ω communication resistor. Therefore, if a COMM resistor between 12Ω and 24Ω is required COM1 and COM2 pins must be connected in parallel. bq5101x does not support a COMM resistor less than 12Ω. RECTIFIER 24W COMM1 24W COMM2 COMM_DRIVE Figure 25. Resistive Load Modulation In addition to resistive load modulation, the bq5101x is also capable of capacitive load modulation as shown in Figure 26 below. In this case, a capacitor is connected from COMM1 to AC1 and from COMM2 to AC2. When the COMM switches are closed there is effectively a 22nF capacitor connected between AC1 and AC2. Connecting a capacitor in between AC1 and AC2 modulates the impedance seen by the coil, which will be reflected in the primary as a change in current. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 17 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com AC1 AC2 22nF 22nF COMM1 COMM2 COMM_DRIVE Figure 26. Capacitive Load Modulation Synchronous Rectification The bq5101x provides an integrated, self-driven synchronous rectifier that enables high-efficiency AC to DC power conversion. The rectifier consists of an all NMOS H-Bridge driver where the backgates of the diodes are configured to be the rectifier when the synchronous rectifier is disabled. During the initial startup of the WPC system the synchronous rectifier is not enabled. At this operating point, the DC rectifier voltage is provided by the diode rectifier. Once VRECT is greater than UVLO, half synchronous mode will be enabled until the load current surpasses 250mA. Above 250mA the synchronous rectifier will stay enabled until the load current drops back below 250mA where half synchronous mode will be enabled instead. Rectifier Tracking Mode (Fold-Back) The bq51011 is a 5V power supply intended to run efficiently in current limit. In order to optimize the efficiency and power dissipation, the rectifier must track the output voltage within 250mV. This feature is termed VRECT-TRACK where the bq51011 monitors the status of the programmed current limit and the output voltage value. When the output current breaches the current limit of the power supply the controller sets the rectifier target voltage to the output voltage plus 250mV. This feature is illustrated in Figure 22. When the output current is equal to the current limit and the output voltage is transitioned from 4.8V to 3.5V the rectifier voltage will follow the transition. This is possible via the WPC system control loop where the bq51011 communicates to the Tx to adjust the operating point. This feature ensures that the internal LDO is always running near dropout for optimized efficiency when the output current is equal to the current limit of the power supply Communication Current Limit (Comm. ILIM) The bq51011 employs a 400mA current limit during the time it takes to send a communication packet to the Tx. This feature adds robustness to communication link between the Tx and Rx when the rectifier is in fold-back mode. Communication can be compromised while in fold-back mode because of less headroom (gain) across the internal LDO. When the current limit is reduced at a fixed operating frequency, the rectifier voltage increases (see Figure 22 where the output current reduces from the power supply current limit). This will increase the headroom across the LDO adding more gain between the output and the rectifier; therefore, increasing immunity to communication failure. 18 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com Dynamic Communication Current Limit (Dynamic ILIM) The bq51011 employs the dynamic communication current limit feature in order to enable the communication current limit only when the power supply is operating in current limit mode (IOUT = IILIM). This is illustrated in Figure 23 where the output current is transitioned from IOUT < IILIM to IOUT = IILIM. This allows for systems to startup without the current limit enabled in order to provide better system performance (e.g. during a dead battery condition). The current limit is used during rectifier tracking mode to ensure stability of the communication back to the WPC transmitter. This adds robustness to the communication link. Temperature Sense Resistor Network (TS) bq5101x includes a ratiometric external temperature sense function. The temperature sense function has two ratiometric thresholds which represent a hot and cold condition. An external temperature sensor is recommended in order to provide safe operating conditions for the receiver product. This pin is best utilized for monitoring the surface that can be exposed to the end user (e.g. place the NTC resistor closest to the user). Figure 27 allows for any NTC resistor to be used with the given VHOT and VCOLD thresholds. VTSB R2 TS / CTRL NTC R3 Figure 27. NTC Circuit Used for Safe Operation of the Wireless Receiver Power Supply The resistors R2 and R3 can be solved by resolving the system of equations at the desired temperature thresholds. The two equations are: %VCOLD %VHOT æ R3 R ö NTC TCOLD ÷ çç ÷÷ çç R3 + R ÷ø è NTC TCOLD ÷ = × 100 æ R3 R ö ÷ NTC TCOLD çç ÷÷ + R2 çç R3 + R ÷ø è NTC TCOLD ÷ (1) æ R3 R ö NTC THOT ÷ çç ÷÷ çç R3 + R ÷ø è NTC THOT ÷ = × 100 æ R3 R ö NTC THOT ÷ çç ÷÷ + R2 çç R3 + R ÷ø è NTC THOT ÷ (2) Where: RNTC TCOLD = RO e RNTC THOT = RO e ( ) β 1 -1 TCOLD To ( ) β 1 -1 THOT To (3) where, TCOLD and THOT are the desired temperature thresholds in degrees Kelvin. Ro is the nominal resistance and β is the temperature coefficient of the NTC resistor. An example solution for an NTC resistor with RO = 10KΩ and β = 4500 is: • R2 = 7.81kΩ Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 19 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 • www.ti.com R3 = 13.98kΩ where: • TCOLD = 0°C • THOT = 60°C • β = 4500 • RO = 10kΩ The plot of the percent VTSB vs. temperature is shown in Figure 28: 55 50 Vtsb Ratio (%) 45 40 35 30 25 20 0 10 20 30 40 Temperature (°C) 50 60 Figure 28. Example Solution for an NTC resistor with RO = 10KΩ and β = 4500 Figure 29 illustrates the periodic biasing scheme used for measuring the TS state. The TS_READ signal enables the TS bias voltage for 24ms. During this period the TS comparators are read (each comparator has a 10 ms deglitch) and appropriate action is taken based on the temperature measurement. After this 24ms period has elapsed, the TS_READ signal goes low, which causes the TS-Bias pin to become high impedance. During the next 35ms (priority packet period) or 235ms (standard packet period), the TS voltage is monitored and compared to 100mV. If the TS voltage is greater than 100mV then a secondary device is driving the TS/CTRL pin and a CTRL = ‘1’ is detected. 24ms 35 or 235ms TS_READ 10ms deglitch on all TS comps – read for TS fault. Hold TS_OPEN comp in reset. Hold TS comps in reset. Read TS_DRIVEN with 10-ms deglitch. Figure 29. Timing Diagram for TS Detection Circuit 20 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com Thermal Protection The bq5101x includes a thermal shutdown protection. If the die temperature reaches TJ(OFF), the LDO is shut off to prevent any further power dissipation. Series and Parallel Resonant Capacitor Selection Shown in Figure 2, the capacitors C1 (series) and C2 (parallel) make up the dual resonant circuit with the receiver coil. These two capacitors must be sized correctly per the WPC v1.0 specification. Figure 30 illustrates the equivalent circuit of the dual resonant circuit: C1 Ls’ C2 Figure 30. Dual Resonant Circuit with the Receiver Coil Section 4.2 (Power Receiver Design Requirements) in volume 1 of the WPC v1.0 specification highlights in detail the sizing requirements. To summarize, the receiver designer will be required take inductance measurements with a fixed test fixture. The test fixture is shown in Figure 31: Figure 31. WPC v1.0 Receiver Coil Test Fixture for the Inductance Measurement Ls’ (copied from System Description Wireless Power Transfer, volume 1: Low Power, Part 1 Interface Definition, Version 1.0.1, Figure 4-4) The primary shield is to be 50mm x 50mm x 1mm of Ferrite material PC44 from TDK Corp. The gap dZ is to be 3.4mm. The receiver coil, as it will be placed in the final system (e.g. the back cover and battery must be included if the system calls for this), is to be placed on top of this surface and the inductance is to be measured at 1-V RMS and a frequency of 100 kHz. This measurement is termed Ls’. The same measurement is to be repeated without the test fixture shown in Figure 9. This measurement is termed Ls or the free-space inductance. Each capacitor can then be calculated using Equation 4: Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 21 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 2 C1 = éê(fS × 2p) × L'S ùú ë û www.ti.com -1 é 1ù 2 ú C2 = ê(fD × 2p) × LS êë C1úû -1 (4) Where fS is 100 kHz +5/-10% and fD is 1 MHz ±10%. C1 must be chosen first prior to calculating C2. The quality factor must be greater than 77 and can be determined by Equation 5: Q= 2p × fD × LS R (5) where R is the DC resistance of the receiver coil. All other constants are defined above. Receiver Coil Load-Line Analysis When choosing a receiver coil, it is recommend to analyze the transformer characteristics between the primary coil and receiver coil via load-line analysis. This will capture two important conditions in the WPC system: 1. Operating point characteristics in the closed loop of the WPC system. 2. Instantaneous transient response prior to the convergence of the new operating point. A An example test configuration for conducting this analysis is shown in Figure 32: CP VIN CS LP L S CD CB V RL Figure 32. Load-Line Analysis Test Bench Where: • VIN is a square-wave power source that should have a peak-to-peak operation of 19V. • CP is the primary series resonant capacitor (i.e. 100nF for Type A1 coil). • LP is the primary coil of interest (i.e. Type A1). • LS is the secondary coil of interest. • CS is the series resonant capacitor chosen for the receiver coil under test. • CD is the parallel resonant capacitor chosen for the receiver coil under test. • CB is the bulk capacitor of the diode bridge (voltage rating should be at least 25V and capacitance value of at least 10µF) • V is a Kelvin connected voltage meter • A is a series ammeter • RL is the load of interest It is recommended that the diode bridge be constructed of Schottky diodes. The test procedure is as follows • Supply a 19V AC signal to LP starting at a frequency of 210kHz • Measure the resulting rectified voltage from no load to the expected full load • Repeat the above steps for lower frequencies (stopping at 110kHz) 22 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com An example load-line analysis for the Vishay IWAS-4832FF-50 receiver coil is shown in Figure 33: Fs=175 Fs=160 Fs=150 Fs=140 Fs=135 Fs=130 Fs=125 Rectified Voltage (V) 10 8 6 4 0.2 Ping Voltage 0.4 0.6 Load Current (A) 1A Load Step Droop 0.8 1.0 1A Load Operating Point Figure 33. Vishay IWAS-4832FF-50 Load-Line Results What this plot conveys about the operating point is that a specific load and rectifier target condition consequently results in a specific operating frequency (for the type A1 TX). For example, at 1A the dynamic rectifier target is 5.15V. Therefore, the operating frequency will be between 150kHz and 160kHz in the above example. This is an acceptable operating point. If the operating point ever falls outside the WPC frequency range (110kHz – 205kHz), the system will never converge and will become unstable. In regards to transient analysis, there are two major points of interest: 1. Rectifier voltage at the ping frequency (175kHz). 2. Rectifier voltage droop from no load to full load at the constant operating point. In this example, the ping voltage will be ~5V. This is above the UVLO of the bq5101x and; therefore, startup in the WPC system can be ensured. If the voltage is near or below the UVLO at this frequency, then startup in the WPC system may not occur. If the max load step is 1A, the droop in this example will be ~1V with a voltage at 1A of ~5.5V (140kHz load-line). To analyze the droop locate the load-line that starts at 7V at no-load. Follow this load-line to the max load expected and take the difference between the 7V no-load voltage and the full-load voltage at that constant frequency. Ensure that the full-load voltage at this constant frequency is above 5V. If it descends below 5V, the output of the power supply will also droop to this level. This type of transient response analysis is necessary due to the slow feedback response of the WPC system. This simulates the step response prior to the WPC system adjusting the operating point. NOTE Coupling between the primary and secondary coils will worsen with misalignment of the secondary coil. Therefore, it is recommended to re-analyze the load-lines at multiple misalignments to determine where, in planar space, the receiver will discontinue operation. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 23 bq51010 bq51011 bq51013 SLVSAT9B – APRIL 2011 – REVISED AUGUST 2011 www.ti.com REVISION HISTORY Changes from Original (April 2011) to Revision A Page • Added device numbers bq51010 and bq51011 .................................................................................................................... 1 • Added Figure 20 through Figure 23 ...................................................................................................................................... 9 • Added section - Rectifier Tracking Mode (Fold-Back) ........................................................................................................ 18 • Added section - Communication Current Limit (Comm. ILIM ............................................................................................... 18 • Added section - Dynamic Communication Current Limit (Dynamic ILIM) ............................................................................ 19 Changes from Revision A (May 2011) to Revision B Page • Changed text in the DESCRIPTION From: Together with the bq500110 To: Together with the bq500210 ........................ 1 • Changed Figure 1 ................................................................................................................................................................. 1 • Changed Figure 24 ............................................................................................................................................................. 14 24 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): bq51010 bq51011 bq51013 PACKAGE OPTION ADDENDUM www.ti.com 11-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) BQ51010YFFR PREVIEW DSBGA YFF 28 3000 TBD Call TI Call TI BQ51010YFFT PREVIEW DSBGA YFF 28 250 TBD Call TI Call TI BQ51011YFFR ACTIVE DSBGA YFF 28 3000 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM BQ51011YFFT ACTIVE DSBGA YFF 28 250 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM BQ51013YFFR ACTIVE DSBGA YFF 28 3000 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM BQ51013YFFT ACTIVE DSBGA YFF 28 250 Green (RoHS & no Sb/Br) Call TI Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Aug-2011 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) BQ51011YFFR DSBGA YFF 28 3000 180.0 8.4 BQ51013YFFR DSBGA YFF 28 3000 180.0 BQ51013YFFT DSBGA YFF 28 250 180.0 2.01 3.14 0.81 4.0 8.0 Q1 8.4 2.01 3.14 0.81 4.0 8.0 Q1 8.4 2.01 3.14 0.81 4.0 8.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ51011YFFR DSBGA YFF 28 3000 210.0 185.0 35.0 BQ51013YFFR DSBGA YFF 28 3000 210.0 185.0 35.0 BQ51013YFFT DSBGA YFF 28 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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