This product complies with the RoHS Directive (EU 2002/95/EC). DSC5001 Silicon NPN epitaxial planar type For general amplification Complementary to DSA5001 Features Package High forward current transfer ratio hFE with excellent linearity Eco-friendly Halogen-free package Code SMini3-F2-B Pin Name 1. Base 2. Emitter 3. Collector Packaging Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Collector-base voltage (Emitter open) VCBO 60 V Collector-emitter voltage (Base open) VCEO 50 V Emitter-base voltage (Collector open) VEBO 7 V Collector current IC 100 mA Peak collector current ICP 200 mA Collector power dissipation PC 150 mW Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Marking Symbol: C1 Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) VCBO IC = 10 mA, IE = 0 60 V Collector-emitter voltage (Base open) VCEO IC = 2 mA, IB = 0 50 V Emitter-base voltage (Collector open) VEBO IE = 10 mA, IC = 0 7 V Collector-base cutoff current (Emitter open) ICBO VCB = 20 V, IE = 0 0.1 mA Collector-emitter cutoff current (Base open) ICEO VCE = 10 V, IB = 0 100 mA Forward current transfer ratio * hFE VCE = 10 V, IC = 2 mA 460 0.3 V Collector-emitter saturation voltage VCE(sat) Transition frequency fT Collector output capacitance (Common base, input open circuited) Cob 210 IC = 100 mA, IB = 10 mA 0.13 VCE = 10 V, IC = 2 mA 150 MHz VCB = 10 V, IE = 0, f = 1 MHz 1.5 pF Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Rank classification Code R S 0 Rank R S No-rank hFE 210 to 340 290 to 460 210 to 460 Marking Symbol C1R C1S C1 Product of no-rank is not classified and have no marking symbol for rank. Publication date: November 2009 ZJC00440BED 1 This product complies with the RoHS Directive (EU 2002/95/EC). DSC5001 DSC5001_IC-VCE DSC5001_PC-Ta PC Ta VCE = 10 V 150 100 50 80 IB = 250 µA 200 µA 60 150 µA 40 100 µA 20 40 80 120 160 0 200 50 µA 0 2 4 8 10 VCE(sat) IC VCE = 10 V Collector current IC (mA) 1 0.1 Ta = 85°C 100 Ta = 85°C 60 2.0 40 1.0 0 0 0.2 0.4 0.6 DSC5001_fT-IC fT IC Transition frequency fT (MHz) 250 VCE = 10 V Ta = 25°C 150 100 50 1 10 100 3.0 −30°C 0.8 1.0 Base-emitter voltage VBE (V) Collector current IC (mA) 10 4.0 25°C 80 1 Collector current IC (mA) Cob VCB 25°C 0 0.1 0 0.1 DSC5001_Cob-VCB 20 −30°C 200 100 12 120 100 10 −30°C 200 IC VBE IC / IB = 10 1 25°C 300 DSC5001_IC-VBE DSC5001_VCEsat-IC 0.01 0.1 Ta = 85°C 400 Collector-emitter voltage VCE (V) Ambient temperature Ta (°C) 10 6 500 Collector output capacitance (Common base, input open circuited) Cob (pF) 0 Forward current transfer ratio hFE 100 200 Collector current IC (mA) Collector power dissipation PC (mW) 600 Ta = 25°C 0 Collector-emitter saturation voltage VCE(sat) (V) hFE IC 120 250 100 Collector current IC (mA) 2 DSC5001_hFE-IC IC VCE ZJC00440BED 1.2 0 1 10 100 Collector-base voltage VCB (V) This product complies with the RoHS Directive (EU 2002/95/EC). DSC5001 SMini3-F2-B Unit: mm 2.00 ±0.20 +0.05 0.30 −0.02 1 0.425 ±0.05 (5°) 2.10 ±0.10 1.25 ±0.10 3 2 (0.65) (0.65) +0.05 0.13 −0.02 (0.49) 1.30 ±0.10 0 to 0.10 0.90 ±0.10 (5°) ZJC00440BED 3 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805