ELM-TECH ELM13409CA-S

Single P-channel MOSFET
ELM13407CA-S
■General description
■Features
ELM13407CA-S uses advanced trench technology to
provide excellent Rds(on), low gate charge and low gate
resistance.
•
•
•
•
Vds=-30V
Id=-4.1A (Vgs=-10V)
Rds(on) < 52mΩ (Vgs=-10V)
Rds(on) < 87mΩ (Vgs=-4.5V)
■Maximum absolute ratings
Parameter
Drain-source voltage
Gate-source voltage
Ta=25°C
Ta=70°C
Continuous drain current
Pulsed drain current
Ta=25°C
Ta=70°C
Power dissipation
Symbol
Vds
Vgs
Limit
-30
±20
Unit
V
V
Note
Id
-4.1
-3.5
A
1
Idm
-20
A
2
W
1
Pd
Junction and storage temperature range
Tj, Tstg
1.4
1.0
-55 to 150
°C
■Thermal characteristics
Parameter
Maximum junction-to-ambient
Symbol
t≤10s
Maximum junction-to-ambient
Maximum junction-to-lead
Steady-state
Steady-state
Rθja
Rθjl
■Pin configuration
Typ.
65
Max.
90
Unit
°C/W
85
43
125
60
°C/W
°C/W
1
2
1
3
■Circuit
SOT-23(TOP VIEW)
3
Note
D
Pin No.
1
Pin name
GATE
2
3
SOURCE
DRAIN
G
S
4- 1
Single P-channel MOSFET
ELM13407CA-S
■Electrical characteristics
Parameter
STATIC PARAMETERS
Symbol
Condition
Min.
Drain-source breakdown voltage
BVdss Id=-250μA, Vgs=0V
-30
μA
±100
nA
-1.8
-3.0
V
A
40.5
57.0
52.0
73.0
64.0
8.2
87.0
mΩ
S
Is=-1A, Vgs=0V
-0.77
-1.00
-2.2
V
A
840
Vgs=0V, Vds=-15V, f=1MHz
700
120
pF
pF
Vgs=0V, Vds=0V, f=1MHz
75
10
Idss
Vds=-24V
Vgs=0V
Gate-body leakage current
Igss
Vds=0V, Vgs=±20V
Tj=55°C
Gate threshold voltage
On state drain current
Vgs(th) Vds=Vgs, Id=-250μA
Id(on) Vgs=-4.5V, Vds=-5V
Static drain-source on-resistance
Vgs=-10V
Rds(on) Id=-4.1A
Gfs
Diode forward voltage
Max. body-diode continuous current
DYNAMIC PARAMETERS
Vsd
Is
Input capacitance
Output capacitance
Ciss
Coss
Reverse transfer capacitance
Gate resistance
SWITCHING PARAMETERS
Crss
Rg
Total gate charge (10V)
Total gate charge (4.5V)
Gate-source charge
Qg
Qg
Qgs
V
-1
-5
Zero gate voltage drain current
Forward transconductance
Typ.
Ta=25°C
Max. Unit
-1.0
-10
Tj=125°C
Vgs=-4.5V, Id=-3A
Vds=-5V, Id=-4A
5.5
15
pF
Ω
Vgs=-4.5V, Vds=-15V
Id=-4A
14.3
7.0
3.1
Gate-drain charge
Turn-on delay time
Turn-on rise time
Qgd
td(on)
tr
Vgs=-10V, Vds=-15V
3.0
8.6
5.0
nC
ns
ns
Turn-off delay time
Turn-off fall time
Body diode reverse recovery time
td(off) Rl=3.6Ω, Rgen=3Ω
tf
trr
If=-4A, dl/dt=100A/μs
Qrr
28.2
13.5
27
ns
ns
ns
Body diode reverse recovery charge
15
18.0
mΩ
36
nC
nC
nC
nC
NOTE :
1. The value of Rθja is measured with the device mounted on 1in² FR-4 board of 2oz. Copper, in still air environment
with Ta=25°C. The value in any given applications depends on the user’s specific board design, The current rating is
based on the t ≤ 10s themal resistance rating.
2. Repetitive rating, pulse width limited by junction temperature.
3. The Rθja is the sum of the thermal impedance from junction to lead Rθjl and lead to ambient.
4. The static characteristics in Figures 1 to 6 are obtained using 80μs pulses, duty cycle 0.5%max.
5. These tests are performed with the device mounted on 1in² FR-4 board with 2oz. Copper, in a still air environment
with Ta=25°C. The SOA curve provides a single pulse rating.
4- 2
Single P-channel MOSFET
ELM13407CA-S
■Typical electrical and thermal characteristics
20
-10V
10
-5V
-4.5V
10
-3.5V
5
Vgs=-3V
0
0.00
Vds=-5V
8
-4V
-Id (A)
-Id (A)
15
6
4
125°C
2
25°C
0
1.00
2.00
3.00
4.00
5.00
0
1
100
4
1.6
80
Normalized On-Resistance
Rds(on) (m� )
3
-Vgs (Volts)
Figure 2: Transfer Characteristics
-Vds (Volts)
Figure 1: On-Region Characteristics
Vgs=-4.5V
60
Vgs=-10V
40
20
Vgs=-4.5V
1.4
Vgs=-10V
1.2
1
Id=-2A
0.8
0
2
4
6
8
10
0
25
-Id (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1E+01
160
140
1E+00
Id=-2A
120
1E-01
100
1E-02
-Is (A)
Rds(on) (m� )
2
125°C
80
125°C
1E-03
25°C
1E-04
60
1E-05
25°C
40
1E-06
20
2
4
6
8
0.0
10
0.2
0.4
0.6
0.8
1.0
-Vsd (Volts)
Figure 6: Body-Diode Characteristics
-Vgs (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
4- 3
1.2
Single P-channel MOSFET
ELM13407CA-S
1000
10
Vds=-15V
Id=-4A
800
Capacitance (pF)
-Vgs (Volts)
8
6
4
2
Ciss
600
400
Coss
Crss
200
0
0
4
8
12
0
16
0
-Qg (nC)
Figure 7: Gate-Charge Characteristics
Tj(max)=150°C
Ta=25°C
0.1s
10ms
10s
0.1
DC
1
10
20
D=Ton/T
Tj,pk=Ta+Pdm.Z�ja.R�ja
R�ja=90°C/W
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
-Vds (Volts)
Z�ja Normalized Transient
Thermal Resistance
30
Tj(max)=150°C
Ta=25°C
0
0.001
100
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
10
25
10
1s
0.1
20
30
100�s 10�s
1ms
1
15
40
Rds(on)
limited
10
10
-Vds (Volts)
Figure 8: Capacitance Characteristics
Power (W)
-Id (Amps)
100
5
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
Pd
0.1
0.01
0.00001
Ton
T
Single Pulse
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
4- 4
100
1000